CN2603512Y - Radiation fin - Google Patents
Radiation fin Download PDFInfo
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- CN2603512Y CN2603512Y CN 02284963 CN02284963U CN2603512Y CN 2603512 Y CN2603512 Y CN 2603512Y CN 02284963 CN02284963 CN 02284963 CN 02284963 U CN02284963 U CN 02284963U CN 2603512 Y CN2603512 Y CN 2603512Y
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- fin
- chip
- heat
- carrier
- heat radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Provided is a heat dissipation sheet which is suitable for a chip packaging structure. The heat dissipation sheet which is designed into a thin board type similarly to a round is arranged with a heat dissipation surface. The utility model is provided even with a plurality of heat dissipation contacts which are positioned at the peripheral edges of the heat dissipation surface and protrude to the heat dissipation surface. The center of the heat dissipation contacts are all positioned on the same circumference.
Description
Technical field
The utility model relates to a kind of fin (heat spreader), relates in particular to a kind of fin that is applied to chip-packaging structure.
Background technology
In recent years along with integrated circuit (Integrated Circuit, IC) integrated level of the internal wiring of chip (integration) significantly improves, make the sectional area of wire of internal circuit of IC chip constantly reduce, so will significantly improve the interior resistance of the internal wiring of IC chip.Therefore, when the IC chip high speed operated, the interior resistance of its internal circuit produced heat energy with correspondence, so will cause the temperature of IC chip own to raise gradually.It should be noted that the phenomenon of operation mistake may take place the internal circuit of IC chip when in a single day the temperature of IC chip own exceeds its normal operating temperature range, or temporarily lost efficacy.Yet,, very likely damage the internal circuit of IC chip, thereby cause the internal circuit of IC chip permanently to lose efficacy when itself temperature of IC chip during considerably beyond its normal operating temperature range.
In order to remove IC chip (hereinafter to be referred as chip) its heat energy that is produced when the working at high speed rapidly, make that chip still can the long term maintenance normal operation when working at high speed, with regard to chip-packaging structure, prior art is to utilize the material with high heat dissipation characteristics, material such as metal for example, and be made into the fin of rectangular thin plate shape, and when chip package process, fin is equipped on the inside of the sealing (molding compound) of chip-packaging structure, or the surface of fin is directly contacted the back side of tube core (die), make fin can promptly absorb the heat energy that chip is produced when working at high speed, and apace with the surface of thermal energy transfer to chip-packaging structure, again via a radiator (Heat Sink that bigger area of dissipation can be provided, HS), the heat energy that will stem from tube core is dissipated to extraneous atmospheric environment.
Please refer to Fig. 1, it illustrates existing a kind of generalized section of using the chip-packaging structure of fin.Chip-packaging structure 100 mainly comprises carrier (carrier) 110, chip (die) 120, lead 130 (wire), fin 140 and sealing 150.At first, carrier 110 for example is one to have the substrate (substrate) of built-in circuit, and carrier 110 has a load-bearing surface 112, a plurality of carrying contact 116a and a plurality of carrying contact 116b, and these carrying contact 116a and carrying contact 116b all are disposed at load-bearing surface 112.In addition, chip 120 has one active surperficial 122 and a corresponding back side 124, and have a plurality of chip welding spots (die pad) 126, and these chip welding spots 126 all are disposed at active surperficial 122, the one side with active element (activecomponent) of wherein active surperficial 122 general reference chips 120.In addition, the two ends of these leads 130 are connected to one of one of these chip welding spots 126 and pairing these carrying contacts 116a thereof.And, 140 of fin shroud in the top of chip 120, wherein fin 140 has a heat-delivery surface 142 and a corresponding heat-delivery surface 144, and fin 140 has more a plurality of heat radiation contacts 146, it is positioned at the periphery of heat-delivery surface 142, and outstanding from heat-delivery surface 142, and these heat radiation contacts 146 are connected to these carrying contacts 116b respectively.And sealing 150 coats carrying contact 116a, carrying contact 116b, chip welding spot 126, lead 130 and fin 140, but exposes the heat-delivery surface 144 of part.
Please also refer to Fig. 2 A, 2B, wherein Fig. 2 A illustrates the vertical view of existing a kind of fin, and the fin of Fig. 2 B pictorial image 2A is along the generalized section of A-A line.Existing fin 140 is rough rectangular lamellar, and fin 140 has a plurality of heat radiation contacts 146, its outstanding heat-delivery surface 142 from fin 140, and lay respectively at four corners of heat-delivery surface 142, in order to be connected to the carrying contact 116b of Fig. 1 respectively.In addition, shown in Fig. 2 A, fin 140 has more the long and narrow runner 149 of multiple tracks, and these long and narrow runners 149 run through fin 140 respectively, and symmetry be distributed on the fin 140, its role is to allow the sealing 150 of Fig. 1 can flow into easily between fin 140 and the chip 120.In addition, the middle body structure of fin 140 can form a heat radiation convex surface 148, it is outstanding from heat-delivery surface 144, and and carrier 110 between common form bigger accommodation space, in order to hold chip 120 and lead 130 etc., and the heat-delivery surface 144 of the part that above-mentioned sealing 150 is exposed, be the heat radiation convex surface 148 the local surfaces away from chip 120.
Please in regular turn with reference to figure 1,3, wherein Fig. 3 illustrates the schematic diagram of the surface wiring of existing a kind of carrier.Surface wiring that it should be noted that the carrier of Fig. 3 is at (Wire Bonding WB) comes packaged chip 120 and designed with lead key closing process.At first, as shown in Figure 1, in order to make full use of the plane routing space of carrier 110, prior art is chip 120 to be disposed at the central authorities of the load-bearing surface 112 of carrier 110, and utilizes the two ends of lead 130 to connect the chip welding spot 126 of chip 120 and the carrying contact 116a of carrier 110 respectively.Then, as shown in Figure 3, carrying contact 116a (being the carrying contact 116a of Fig. 1) stretches out via the surface wiring of carrier respectively again.It should be noted that because the surface wiring in four corners of carrier is comparatively estranged, make four corners of carrier can provide enough plane spaces to dispose passive components (passive component) such as resistance, inductance and electric capacity.In addition, because the fin 140 of existing Fig. 2 A is rectangular lamellar, make fin 140 have directivity, so in design must be respectively corresponding carrying contact 116b that is connected to four corners of carrier of the heat radiation contact 146 in four corners of fin 140, yet, so will cause the surface wiring in four corners of carrier to become very crowded, thereby significantly increase the design difficulty of the surface wiring of carrier, and particularly increase its design difficulty of surface wiring in four corners of carrier.
The utility model content
Therefore, the purpose of this utility model is to provide a kind of fin, it is applicable to a chip-packaging structure, make the interconnective carrying contact of heat radiation contact of a plurality of original and fin, not only can corresponding be equipped on four corners of carrier, also can corresponding be equipped on four lateral margins of carrier, so can effectively utilize the plane space of the surface wiring of carrier, and the surface wiring in four corners of carrier also can provide enough plane spaces to set passive components such as resistance, inductance and electric capacity.
Based on above-mentioned purpose of the present utility model, the utility model provides a kind of fin, it is applicable to a chip-packaging structure, this fin is rough rounded lamellar, and have a heat-delivery surface, and fin has more a plurality of heat radiation contacts, and it is positioned at the periphery of this heat-delivery surface, and outstanding heat-delivery surface since then, and the center of these heat radiation contacts all is positioned on the same circumference.
Based on above-mentioned purpose of the present utility model, the utility model also provides a kind of chip-packaging structure equally, and it has a carrier, a chip, many leads, a fin and sealings at least.At first, carrier has a load-bearing surface, a plurality of first carrying contact and a plurality of second carrying contact, and wherein these first carrying contacts and these second carrying contacts all are disposed at the load-bearing surface of carrier.In addition, chip has an active surface and a corresponding back side, and its chips is disposed at the load-bearing surface of carrier with the back side, and chip has more a plurality of chip welding spots, and it is disposed at the active surface of chip.In addition, the two ends of these leads connect one of one of these chip welding spots and pairing these first carrying contacts thereof respectively.And, fin is rough rounded lamellar, and shroud top in chip, and fin has one first heat-delivery surface and one second corresponding heat-delivery surface, and fin has more a plurality of heat radiation contacts, it is positioned at the periphery of fin, and outstanding from first heat-delivery surface, and at least one heat radiation contact correspondence is connected to one of these second carrying contacts.And, these first carrying contacts of sealant covers, these second carrying contacts, these chip welding spots, these leads and fin, but expose second heat-delivery surface of the fin of part.
Based on above-mentioned purpose of the present utility model, the utility model proposes a kind of chip-packaging structure again equally, and it has a carrier, a chip, a plurality of projection and a fin at least.At first, carrier has a load-bearing surface, a plurality of first carrying contact and a plurality of second carrying contact, and these first carrying contacts and these second carrying contacts all are disposed at this load-bearing surface.In addition, chip has an active surface and a corresponding back side, and has a plurality of chip welding spots, and these chip welding spots all are disposed at this active surface.In addition, these projections (bump) dispose respectively between one of one of these chip welding spots and pairing these first carrying contacts thereof.And, fin is rough rounded lamellar, and shroud top in chip, wherein fin has one first heat-delivery surface and one second corresponding heat-delivery surface, and fin has more a plurality of heat radiation contacts, it is positioned at the periphery of first heat-delivery surface, and outstanding from first heat-delivery surface, and at least one heat radiation contact correspondence is connected to one of these second carrying contacts.
Description of drawings
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail as follows:
Fig. 1 illustrates existing a kind of generalized section of using the chip-packaging structure of fin;
Fig. 2 A illustrates the vertical view of existing a kind of fin;
The fin of Fig. 2 B pictorial image 2A is along the generalized section of A-A line;
Fig. 3 illustrates the schematic diagram of the surface wiring of existing a kind of carrier;
Fig. 4 illustrates the fin of preferred embodiment of the present utility model, the generalized section of the chip-packaging structure of its bonding kenel that is applied to go between;
Fig. 5 A illustrates the vertical view of a kind of fin of preferred embodiment of the present utility model;
The fin of Fig. 5 B pictorial image 5A is along the generalized section of B-B line;
Fig. 6 illustrates the fin of preferred embodiment of the present utility model, and its heat radiation contact is distributed in a kind of schematic diagram of surface wiring of carrier; And
Fig. 7 illustrates the fin of preferred embodiment of the present utility model, and it is applied to the generalized section of the chip-packaging structure of flip chip bonding kenel.
Description of reference numerals in the accompanying drawing is as follows:
100:(lead-in wire bonding kenel) chip-packaging structure
110: carrier 112: load-bearing surface
116a: carrying contact 116b: carrying contact
120: chip 122: active surface
124: the back side 126: chip welding spot
130: lead 140: fin
142: heat-delivery surface 144: heat-delivery surface
146: heat radiation contact 148: the heat radiation convex surface
149: long and narrow runner 150: sealing
200:(lead-in wire bonding kenel) chip-packaging structure
202:(flip chip bonding kenel) chip-packaging structure
210: carrier 212: load-bearing surface
216a: carrying contact 216b: carrying contact
220: chip 222: active surface
224: the back side 226: chip welding spot
230: lead 232: projection
240: fin 242: heat-delivery surface
244: heat-delivery surface 246: the heat radiation contact
248: heat radiation convex surface 249: long and narrow runner
250: sealing 260: passive component
L1～L3: circular curve
Embodiment
Please refer to Fig. 4, it illustrates the fin of preferred embodiment of the present utility model, the generalized section of the chip-packaging structure of its bonding kenel that is applied to go between.At first, chip-packaging structure 200 mainly comprises carrier 210, chip 220, lead 230, fin 240 and sealing 250.Wherein, carrier 210 for example is one to have substrate, lead frame (lead-frame) or the flexible PCB etc. of built-in circuit, wherein graphic carrier 210 is to be example with the substrate, and carrier 210 has a load-bearing surface 212, a plurality of carrying contact 216a and a plurality of carrying contact 216b, and carrying contact 216a and carrying contact 216b all are disposed at load-bearing surface 212.In addition, chip 220 has one active surperficial 222 and a corresponding back side 224, and chip 220 is disposed at load-bearing surface 212 with the back side 224, and chip 220 has more a plurality of chip welding spots 226, and that these chip welding spots 226 all are disposed at is active surperficial 222, the one side with active element of wherein active surperficial 222 general reference chips 220.In addition, the two ends of these leads 230 then connect one of one of chip welding spot 226 and pairing these carrying contacts 216a thereof respectively.And, fin 240 is rough rounded lamellar, and shroud in the top of chip 220, and fin 240 has a heat-delivery surface 242 and a corresponding heat-delivery surface 244, and fin 240 has more a plurality of heat radiation contacts 246, its outstanding heat-delivery surface 242, and be positioned at the periphery of this heat-delivery surface 242 from fin 240, and these heat radiation contacts 246 optionally correspondence be connected to these carrying contacts 216b.And, sealing 250 coats carrying contact 216a, carrying contact 216b, chip welding spot 226, lead 230 and fin 240, but expose the heat-delivery surface 244 of part, and can directly contact a circumscribed radiator (not shown), dissipate to extraneous atmospheric environment in order to the heat energy that will stem from chip 220.
Please also refer to Fig. 5 A, 5B, wherein Fig. 5 A illustrates the vertical view of a kind of fin of preferred embodiment of the present utility model, and the fin of Fig. 5 B pictorial image 5A is along the generalized section of B-B line.Fin 240 is rounded lamellar, and fin 240 is to utilize the material of high heat dissipation characteristics made, for example the good metals of thermal conductivity such as copper, aluminium or these alloys.In addition, fin 240 has more a plurality of heat radiation contacts 246, and it is positioned at the periphery of heat-delivery surface 242, and outstanding from heat-delivery surface 242, in order to the carrying contact 216b of the carrier 210 that is connected to Fig. 4 respectively.Shown in Fig. 5 A, it should be noted that centers of these heat radiation contacts 246 all are positioned on the same circumference, but and symmetry ground be distributed in the periphery of heat-delivery surface 242 (or heat-delivery surface 244), and these ends that dispel the heat contacts 246 can be positioned at same plane.In addition, fin 240 has more the long and narrow runner 249 of multiple tracks, and these long and narrow runners 249 run through fin 240 respectively, but and symmetry be distributed on the fin 240, its function is to allow the sealing 250 in Fig. 4 can flow in easily between fin 240 and the chip 220.
Refer again to Fig. 5 B, the part-structure of the periphery of fin 240 can form a plurality of flanges via mold pressing (moldpressing), and it is outstanding from heat-delivery surface 242, in order to respectively as these heat radiation contacts 246.In addition, the part-structure of the periphery of fin 240 can form a plurality of pins (not shown) equally via mold pressing, and it is outstanding from heat-delivery surface 242, in order to respectively as these heat radiation contacts 246.In addition, the part-structure of the central authorities of fin 240 also can form a heat radiation convex surface 248 via mold pressing, it is outstanding from heat-delivery surface 244, make and to form bigger accommodation space jointly between fin 240 and the carrier 210, in order to hold chip 220 and lead 230 etc., and the part heat-delivery surface 244 that above-mentioned sealing 250 is exposed, be the heat radiation convex surface 248 the local surfaces away from chip 220.
Please in regular turn with reference to figure 4,6, wherein Fig. 6 illustrates the fin of preferred embodiment of the present utility model, and its heat radiation contact is distributed in a kind of schematic diagram of surface wiring of carrier.Surface wiring that it should be noted that the carrier of Fig. 3 is at coming packaged chip 220 with lead key closing process (WB) and being designed.At first, as shown in Figure 4, in order to make full use of the plane routing space of carrier 210, chip 220 can be disposed at the central authorities of the load-bearing surface 212 of carrier 210, and utilize the two ends of lead 230 to connect the chip welding spot 226 of chip 220 and the carrying contact 216a of carrier 210 respectively.Then, as shown in Figure 6, because fin of the present utility model is rounded lamellar, make fin 240 not have directivity, and the center of the heat radiation contact 246 of fin all is positioned on the same circumference, circular curve L2 for example, or be positioned at circular curve L1 or circular curve L2, so center that can carrier (or chip) is that the center of circle rotates fin, and adjust the position of these heat radiation contacts 246 relatively, and the center of the carrying contact (as the carrying contact 216b of Fig. 4) of carrier can be positioned on the same circumference with 246 designs of heat radiation contact haply.Therefore, the formed carrying contact of the surface wiring of carrier except being positioned at four corners (being the periphery in four corners of chip) of carrier in corresponding design, also can correspondingly design four lateral margins (being the periphery of four lateral margins of chip) that are positioned at carrier, and corresponding center with these carrying contacts is designed haply and is positioned on the same circumference, distinguish corresponding heat radiation contact in order to connect it respectively, so can make the surface wiring of carrier will be more flexible and changeable in the utilization of the design on its plane space.
From the above, when 246 designs of heat radiation contact are positioned at four lateral margins (being the periphery of four lateral margins of chip) of carrier, four corners of carrier (being the periphery in four corners of chip) can provide more plane space to dispose passive components (as the passive component 260 of Fig. 4) such as resistance, inductance and electric capacity, make the surface wiring in four corners of carrier with unlikely too crowded simultaneously, thereby reduce its difficult design degree of surface wiring in four corners of carrier relatively.In addition, as shown in Figure 4, between the configurable load-bearing surface 212 and the heat-delivery surface 242 of fin 240 in carrier 210 of these passive components 260, so heat-delivery surface 242 its distances with respect to the load-bearing surface 212 of carrier 210 of fin 240 must be greater than its height with respect to the load-bearing surface 212 of carrier 210 of end face of passive component 260.In addition, when the material of fin 240 is electric conducting material, fin 240 also can be used as shares ground connection, when the carrying contact 216b of carrier 210 all is designed to ground contact, this body structure of fin 240 can connect the carrying contact 216b (being ground contact) that does not exist together that is positioned at carrier via a plurality of heat radiation contacts 246 of fin 240, so will can be used as the shared ground connection of carrier 210.
Please also refer to Fig. 5 A, 6, shown in Fig. 5 A.The gabarit of fin 240 can be circular curve L1, circular curve L2 or the circular curve L3 of Fig. 6, and the center of these heat radiation contacts 246 then can be positioned on circular curve L1, circular curve L2 or the circular curve L3.For example, when the gabarit of fin 240 is circular curve L1, and these heat radiation contacts 246 be centered close to circular curve L2 when going up, these heat radiation contacts 246 will protrude in the heat-delivery surface 242 of fin 240 with the kenel of flange, shown in Fig. 4 or 5B.In addition, when the gabarit of fin 240 is circular curve L2, and centers of these heat radiation contacts 246 are when also being positioned at circular curve L2 and going up, and these heat radiation contacts 246 will protrude in the heat-delivery surface 242 of fin 240 with the kenel of semi-convex edge and half pin.In addition, when the gabarit of fin 240 is circular curve L3, and centers of these heat radiation contacts 246 are when still being positioned at circular curve L2 and going up, and these heat radiation contacts 246 will protrude in the heat-delivery surface 242 of fin 240 with the kenel of pin.In any case yet, fin 240 is still rounded lamellar haply, and centers of these heat radiation contacts 246 are designed haply and are positioned on the same circumference, and with the center of the carrying contact (as the carrying contact 216b of Fig. 4) of carrier haply also design be positioned on the same circumference.
Please refer to Fig. 7, it illustrates the fin of preferred embodiment of the present utility model, and it is applied to the generalized section of the chip-packaging structure of flip chip bonding kenel.The fin 240 of preferred embodiment of the present utility model also can be applicable to flip chip bonding kenel (Flip Chip, chip-packaging structure FC), chip-packaging structure 201 for example shown in Figure 7 except the chip-packaging structure of the bonding kenel that can be applicable to go between.It should be noted that, both different of the chip-packaging structure 202 of Fig. 7 and the chip-packaging structure of Fig. 4 200 are in the electric connection mode between chip 220 and carrier 210 and the configuration mode of chip 220, so other structure relevant for chip-packaging structure 202, please refer to the chip-packaging structure 200 of Fig. 4 and related description above, no longer giving unnecessary details after the appearance more.
Please equally with reference to figure 7, with regard to the chip-packaging structure 202 of flip chip bonding kenel, chip-packaging structure 202 is that a plurality of projections 232 are disposed respectively between carrying contact 216a and chip welding spot 226, in order to be electrically connected chip welding spot 226 and carrying contact 216a.It should be noted that, fin 240 herein is the back side 224 of contact chip 220 directly, or coming the back side 224 of contact chip 220 indirectly via a soft heat conduction thin layer (not shown), the heat energy that makes chip 220 be produced when working at high speed can be passed to the surface of chip-packaging structure 202 via fin 240.In addition, but the space that sealing 250 fillings are surrounded between carrier 210 and chip 220, but the also space that between carrier 210 and fin 240, surrounded of filling, more can utilize sealing 250 to coat fin 240, but expose the part heat-delivery surface 244 of fin 240, and can it directly contact a circumscribed radiator (not shown), dissipate to extraneous atmospheric environment in order to the heat energy that will stem from chip 220.
In sum, fin of the present utility model is mainly made with the material of high heat dissipation characteristics, and has an outward appearance of circular sheet shape, and can utilize modes such as mold pressing etc. is mechanical-moulded, periphery at fin forms flange or pin, in order to heat radiation contact, make the center of these heat radiation contacts all be positioned on the same circumference simultaneously, in order to connect a plurality of carrying contacts that are positioned at carrier respectively as fin.Therefore, when the central authorities with carrier or chip are that the center is when rotating fin of the present utility model, the center of the heat radiation contact of its periphery will still be positioned on the same circumference, so the formed carrying contact of the surface wiring of carrier can correspondingly design four corners (being the periphery in four corners of chip) that are positioned at carrier, also can correspondingly design four lateral margins (being the periphery of four lateral margins of chip) that are positioned at carrier, and corresponding center with these carrying contacts is designed haply and is positioned on the same circumference, distinguish corresponding heat radiation contact in order to connect it respectively, so can make the surface wiring of carrier will be more flexible and changeable in the utilization of the design on its plane space.
From the above, be positioned at four lateral margins (being the periphery of four lateral margins of chip) of carrier when the Position Design of the carrying contact of carrier, and when not being positioned at four corners (being the periphery in four corners of chip) of carrier, four corners of carrier (being the periphery in four corners of chip) can provide more plane space to set passive components such as resistance, inductance and electric capacity, and make the surface wiring in four corners of carrier with unlikely too crowded.It should be noted that, fin of the present utility model can be applicable to the to go between chip-packaging structure of bonding kenel, flip chip bonding kenel or other kenel, for example leaded bonding welded ball array kenel (WB/Ball Grid Array, BGA), lead-in wire bonding pin grid array kenel (WB/Pin Grid Array, PGA), flip chip bonding welded ball array kenel (FC/BGA) and flip chip bonding pin grid array kenel chip-packaging structures such as (FC/PGA).
Though the utility model with a preferred embodiment openly as above; but it is not in order to limit the utility model; in not breaking away from spirit and scope of the present utility model; those skilled in the art can do a little change and retouching, and therefore protection range of the present utility model is when being as the criterion so that appended claim is defined.
Claims (8)
1. a fin is applicable to a chip-packaging structure, it is characterized in that, this fin is rough rounded lamellar, and this fin has a heat-delivery surface, and this fin has more a plurality of heat radiation contacts, it is positioned at the periphery of this heat-delivery surface, and outstanding from this heat-delivery surface.
2. fin as claimed in claim 1 is characterized in that, the center of those heat radiation contacts all is positioned on the same circumference.
3. fin as claimed in claim 1 is characterized in that, is distributed in to those heat radiation contact symmetry the periphery of this heat-delivery surface.
4. fin as claimed in claim 1 is characterized in that, the end of those heat radiation contacts is positioned at same plane.
5. fin as claimed in claim 1 is characterized in that the part-structure of the periphery of this fin forms a plurality of flanges, and it is outstanding from this heat-delivery surface, and those heat radiation contacts are made of those flanges respectively.
6. fin as claimed in claim 1 is characterized in that the part-structure of the periphery of this fin forms a plurality of pins, and it is outstanding from this heat-delivery surface, and those heat radiation contacts are made of those pins respectively.
7. fin as claimed in claim 1 is characterized in that, the part-structure of the central authorities of this fin forms a heat radiation convex surface, and it is outstanding from this heat-delivery surface.
8. fin as claimed in claim 1 is characterized in that, its material is a kind of material in the group formed of copper, aluminium and those alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02284963 CN2603512Y (en) | 2002-11-08 | 2002-11-08 | Radiation fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02284963 CN2603512Y (en) | 2002-11-08 | 2002-11-08 | Radiation fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2603512Y true CN2603512Y (en) | 2004-02-11 |
Family
ID=34150900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02284963 Expired - Lifetime CN2603512Y (en) | 2002-11-08 | 2002-11-08 | Radiation fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2603512Y (en) |
-
2002
- 2002-11-08 CN CN 02284963 patent/CN2603512Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20121108 Granted publication date: 20040211 |