CN113764451A - Packaging structure, camera and manufacturing method of packaging structure - Google Patents
Packaging structure, camera and manufacturing method of packaging structure Download PDFInfo
- Publication number
- CN113764451A CN113764451A CN202111039051.1A CN202111039051A CN113764451A CN 113764451 A CN113764451 A CN 113764451A CN 202111039051 A CN202111039051 A CN 202111039051A CN 113764451 A CN113764451 A CN 113764451A
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- circuit board
- printed circuit
- conductive layer
- heat dissipation
- package structure
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 63
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000013461 design Methods 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910016347 CuSn Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 description 1
- TYYOGQJRDAYPNI-UHFFFAOYSA-N [Re].[Cu] Chemical compound [Re].[Cu] TYYOGQJRDAYPNI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- XPPWAISRWKKERW-UHFFFAOYSA-N copper palladium Chemical compound [Cu].[Pd] XPPWAISRWKKERW-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a packaging structure, a camera and a manufacturing method of the packaging structure, wherein the packaging structure comprises a printed circuit board, and the printed circuit board comprises a first surface and a second surface; a through hole penetrating the first surface and the second surface of the printed circuit board; a heat dissipating member fixed to the through hole; a conductive layer applied to a first surface of the printed circuit board; and the chip to be packaged is arranged on the upper side of the conductive layer. The packaging structure has better heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of component manufacturing, in particular to a packaging structure, a camera and a manufacturing method of the packaging structure.
Background
Chip On Board (COB) packages are commonly used in the testing and application of Complementary Metal Oxide Semiconductor (CMOS) image sensors (CIS). COB class product has heat dispersion relatively poor, and product property can receive the great problem of influence of temperature, consequently in the product design process, needs to promote the heat dissipation design of product.
At present, the heat dissipation path of the chip is to conduct the heat generated by the chip operation to the conductive layer (e.g. copper foil) connected to the chip, and then to the Printed Circuit Board (PCB). The printed circuit board then becomes the primary heat transfer carrier. Considering the limited heat dissipation capability of the printed circuit board, the prior art has also improved the heat dissipation performance of the printed circuit board by adding vias. The traditional heat dissipation method is not suitable for chips with small heat productivity, but the heat dissipation of the large-area array CIS and chips COB packaging with serious heat generation is not satisfactory, the heat dissipation solution is not good and has great influence on the CIS imaging quality and even the whole system product, and therefore a circuit board heat dissipation scheme capable of improving the heat dissipation efficiency is urgently needed to meet the heat dissipation requirements of the large-area array CIS and chips COB with serious heat generation.
Disclosure of Invention
The invention aims to provide a packaging structure, a camera and a manufacturing method of the packaging structure.
In a first aspect, an embodiment of the present invention provides a package structure, which includes a printed circuit board, where the printed circuit board includes a first surface and a second surface; a through hole penetrating the first surface and the second surface of the printed circuit board; a heat dissipation member fixed to the through hole; a conductive layer applied to a first surface of the printed circuit board; and the chip to be packaged is arranged on the upper side of the conductive layer.
The packaging structure has the beneficial effects that: in this embodiment, the heat dissipation member is fixed to the printed circuit board, and the heat dissipation member has good heat conduction capability, so that heat generated by the chip to be packaged can be quickly conducted away. For example, when the chip to be packaged is a CIS chip, the heat dissipation effect of the packaging structure is good, so that the imaging quality of the CIS is not affected.
In one possible design, the package structure further includes: a via hole penetrating the first surface and the second surface of the printed circuit board and the conductive layer; the grounding end of the conductive layer is connected with the grounding end of the second surface of the printed circuit board through a wire. The structure can improve the heat dissipation performance of the printed circuit board by increasing the via holes, and then enhance the heat dissipation effect by using the through holes.
In one possible design, the bottom of the heat dissipation member protrudes from the second surface of the printed circuit board, and the heat dissipation member is connected to the system housing or the heat sink via a wire. The structure can realize that the heat generated by the chip to be packaged is quickly conducted out.
In one possible design, the bottom of the heat dissipation member protrudes from the second surface of the printed circuit board, the bottom of the heat dissipation member is connected to the ground terminal of the second surface of the printed circuit board by soldering, and a conductive layer is coated on the second surface of the printed circuit board so that the bottom of the heat dissipation member and the conductive layer coated on the second surface of the printed circuit board are at the same level.
In one possible design, the through holes are cylindrical in shape, the heat dissipation members are copper cylinders, and the number of the through holes is one or more.
In one possible design, the area of the via is smaller than the area of the via.
In a second aspect, an embodiment of the present invention further provides a camera, which may include the above package structure.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a package structure, where the method includes:
plating a through hole on the printed circuit board, wherein the through hole penetrates through the first surface and the second surface of the printed circuit board; coating a conductive layer on a first surface of a printed circuit board; arranging a chip to be packaged on the conductive layer, and carrying out chip routing; the heat dissipation member is fixed to the through hole.
In one possible design, the method of making further comprises:
punching N through holes on the printed circuit board and the conductive layer, wherein N is a positive integer; the through hole penetrates through the first surface and the second surface of the printed circuit board, the conducting layer and the chip to be packaged; the grounding end of the conductive layer is connected with the grounding end of the second surface of the printed circuit board through a wire.
In one possible design, the method of making further comprises:
and connecting the heat dissipation part to the system shell or the heat dissipation plate through a lead, wherein the bottom of the heat dissipation part protrudes out of the second surface of the printed circuit board.
In one possible design, the method of making further comprises:
connecting the bottom of the heat dissipation part with the grounding end of the second surface of the printed circuit board in a welding mode, wherein the bottom of the heat dissipation part protrudes out of the second surface of the printed circuit board;
and coating a conductive layer on the second surface of the printed circuit board so that the bottom of the heat dissipation part is at the same level as the conductive layer coated on the second surface of the printed circuit board.
Advantageous effects of the above second and third aspects can be seen in the first aspect.
Drawings
Fig. 1 is a schematic cross-sectional view of a package structure according to an embodiment of the invention;
fig. 2 is a schematic top view of a package structure according to an embodiment of the invention;
fig. 3 is a schematic flow chart illustrating a manufacturing method of a package structure according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a manufacturing process according to an embodiment of the present invention;
fig. 5 is a bottom view of a package structure according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
To solve the problems of the prior art, an embodiment of the present invention provides a package structure, and fig. 1 is a cross-sectional view of the package structure 100. The package structure 100 includes a printed circuit board 101, a conductive layer 102, a chip to be packaged 103, a conductive layer 102', and a heat dissipation member 104. Wherein:
the printed circuit board 101 includes a first surface 1011 and a second surface 1012; three heat sink members 104 in fig. 1 are secured to three through holes of printed circuit board 101, with conductive layer 102' applied to second surface 1012 of printed circuit board 101 and conductive layer 102 applied to first surface 1011 of printed circuit board 101. The packaged chip 103 is disposed on the upper side of the conductive layer 102.
In this embodiment, the through hole in the printed circuit board 101 may penetrate through the first surface and the second surface of the printed circuit board, but not penetrate through the conductive layer 102, as shown in fig. 1. This allows the heat dissipation member to quickly conduct heat from the chip to be packaged, and the heat dissipation member does not penetrate the conductive layer 102, thereby ensuring the flatness of the conductive layer 102. The flatness of the conductive layer 102 can ensure the flatness of the bottom of the chip to be packaged on the upper side of the conductive layer 102, and the problem that the edge of the chip to be packaged is warped due to heating or damaged due to stress caused by uneven bottom is avoided. In another possible case, the through holes in the printed circuit board 101 may penetrate through the second and first surfaces of the printed circuit board and also through the conductive layer 102, which may enable a fast conduction of heat from the chip to be packaged with the heat sink. In another possible case, the through holes in the printed circuit board 101 may penetrate through the second surface of the printed circuit board, but not through the first surface, which still allows for a fast conduction of heat in the printed circuit board 101 using the heat dissipation member.
In this embodiment, the bottom of heat dissipation member 104 may protrude from second surface 1012 of printed circuit board 101, and the protruding bottom of heat dissipation member 104 may be connected to the system housing or the heat sink via wires without considering the flatness of the bottom of the package structure. In consideration of the flatness of the bottom of the package structure, the bottom of the heat dissipation member 104 may be connected to the bottom conductive layer 102' (i.e., the ground GND) of the second surface 1012 of the printed circuit board 101 by soldering, and when the conductive layer is coated on the second surface of the printed circuit board, the bottom of the heat dissipation member and the conductive layer coated on the second surface of the printed circuit board may be at the same level to ensure the flatness of the bottom.
In this embodiment, the heat dissipation member is fixed to the printed circuit board, and the heat dissipation member has good heat conduction capability, so that heat generated by the chip to be packaged can be quickly conducted away. For example, when the chip to be packaged is a CIS chip, the heat dissipation effect of the packaging structure is good, so that the imaging quality of the CIS is not affected.
It should be noted that in this embodiment, the number of the through holes in the printed circuit board 101 may be three, one or two, or three or more, the shape of the through holes in the printed circuit board 101 may be any shape, and in this embodiment, the through holes are preferably cylindrical, because the cylindrical shape is easier to manufacture during production and use for connection. The heat dissipation member may be a copper pillar or a copper alloy pillar, and the copper alloy may be at least one material of copper tin (CuSn), copper magnesium (CuMg), copper nickel (CuNi), copper zinc (CuZn), copper palladium (CuPd), copper gold (CuAu), copper rhenium (CuRe) or copper tungsten (CuW), tungsten (W), a tungsten alloy, nickel (Ni), ruthenium (Ru), and cobalt (Co). The number of the heat dissipation members fixed in the through holes of the printed circuit board may be determined according to the size of the package structure, the amount of heat generated from the chip to be packaged, and the like. The conductive layer 102 is also called a chip substrate or a bonding substrate, and the conductive layer 102 may be a copper foil.
In a possible embodiment, the heat dissipation performance of the printed circuit board can be improved by adding vias, and the heat dissipation effect can be enhanced based on the package structure shown in fig. 1. As shown in the top view of the package structure shown in fig. 2, the package structure 100 in this embodiment may further include a via 105 penetrating the first surface 1011 and the second surface 1012 of the printed circuit board 101 and the conductive layer 102; the ground terminal of the conductive layer 102 is connected to the conductive layer 102 '(the conductive layer 102' may also be referred to as ground terminal GND) on the second surface 1012 of the printed circuit board 101 through a wire.
In this embodiment, the method does not affect the wire bonding and routing of the chip to be packaged, and the routing of the chip to be packaged is the same as the conventional method. In the embodiment, on the basis that the heat dissipation performance of the printed circuit board is improved by adding the via hole in the original packaging structure, the heat dissipation effect is further enhanced by adding the heat dissipation component. A small part of heat generated by the chip to be packaged during working can be transmitted to the conductive layer 102' (such as copper foil) at the bottom layer of the printed circuit board through the through hole, meanwhile, most of heat generated by the chip to be packaged during working is transmitted through the heat dissipation part, can be transmitted to the copper foil at the bottom layer of the printed circuit board, and can also be connected to a shell of a system through a lead or other connecting bodies such as screws and soldering tin, and then the shell is dissipated.
Based on the package structure shown in fig. 1, the present embodiment further provides a manufacturing method for manufacturing the package structure shown in fig. 1, as shown in fig. 3, the manufacturing method includes the following steps.
S301, a through hole is plated on the printed circuit board 101. Wherein the through holes penetrate the first surface 1011 and the second surface 1012 of the printed circuit board 101.
Illustratively, as shown in fig. 4 (a), a mechanical hole 104 ' is plated through a bottom layer (i.e., conductive layer 102 ') of an area on the PCB where COB packaging is performed to an upper surface of the PCB, and the mechanical hole 104 ' does not penetrate through a top layer (i.e., conductive layer 102) of the upper surface of the PCB.
S302, the conductive layer 102 is coated on the first surface 1011 of the printed circuit board 101.
And S303, arranging the chip 103 to be packaged on the conductive layer 102, and carrying out chip routing.
Continuing with the above example, as shown in fig. 4 (b), the CIS chip is disposed on the conductive layer 102 of the PCB, and then bonding is performed.
S304, the heat dissipation member 104 is fixed to the through hole.
Continuing with the above example, illustratively, as shown in fig. 4 (c), a copper pillar corresponding to the mechanical hole shape is embedded in the mechanical hole 104' in the PCB.
In a possible implementation manner, the manufacturing method further includes S305: the printed circuit board 101 and the conductive layer 102 are punched with N via holes 105.
Continuing with the above example, as shown in fig. 4 (d), two vias are opened in the top layer (conductive layer 102) of the area where COB packaging is performed on the PCB and the top layer is connected to the ground of the bottom layer (i.e., conductive layer 102').
The above method may further include: heat sink 104 is connected to the system housing or heat sink by wires or welding. In one possible embodiment, when the second surface of the printed circuit board is coated with the conductive layer, the bottom of the heat dissipation component and the conductive layer coated on the second surface of the printed circuit board can be at the same level, so as to make the bottom of the semiconductor structure flat, thereby ensuring the stability of the device and facilitating the installation of the device. Illustratively, the bottom view of the package structure shown in fig. 5 can be obtained according to the manufacturing method shown in fig. 4.
The embodiment of the invention also provides a camera comprising the packaging structure, and the imaging quality of the camera is higher because the heat dissipation effect of the packaging structure is better.
Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (11)
1. A package structure, comprising:
a printed circuit board comprising a first surface and a second surface;
a via extending through the first and second surfaces of the printed circuit board;
a heat dissipating member fixed to the through hole;
a conductive layer applied to a first surface of the printed circuit board;
and the chip to be packaged is arranged on the upper side of the conductive layer.
2. The package structure of claim 1, further comprising:
n through holes penetrating through the first surface and the second surface of the printed circuit board and the conductive layer, wherein N is a positive integer; and the grounding end of the conductive layer is connected with the grounding end of the second surface of the printed circuit board through a wire.
3. The package structure of claim 1 or 2, wherein the bottom of the heat dissipation member protrudes from the second surface of the printed circuit board, and the heat dissipation member is connected to a system housing or a heat sink via a wire.
4. The package structure according to claim 1 or 2, wherein the bottom of the heat sink protrudes from the second surface of the printed circuit board, and the bottom of the heat sink is connected to the ground terminal of the second surface of the printed circuit board by soldering; and coating a conductive layer on the second surface of the printed circuit board so that the bottom of the heat dissipation part is at the same level as the conductive layer coated on the second surface of the printed circuit board.
5. The package structure according to claim 1 or 2, wherein the through holes are cylindrical in shape, the heat dissipation members are copper pillars, and the number of the through holes is one or more.
6. The package structure of claim 2, wherein the area of the via is smaller than the area of the through via.
7. A camera comprising the packaging structure of claim 1.
8. A method for fabricating a package structure, the method comprising:
plating a through hole on a printed circuit board, wherein the through hole penetrates through the first surface and the second surface of the printed circuit board;
fixing a heat dissipation component to the through hole;
coating a conductive layer on a first surface of the printed circuit board;
and arranging the chip to be packaged on the conductive layer, and carrying out chip routing.
9. The method of manufacturing according to claim 8, further comprising:
punching N through holes in the printed circuit board and the conductive layer, wherein N is a positive integer; wherein the via hole penetrates through the first surface and the second surface of the printed circuit board and the conductive layer; and the grounding end of the conductive layer is connected with the grounding end of the second surface of the printed circuit board through a lead.
10. The method of manufacturing according to claim 8 or 9, further comprising:
and the heat dissipation part is connected to the system shell or the heat dissipation plate through a lead, wherein the bottom of the heat dissipation part protrudes out of the second surface of the printed circuit board.
11. The method of manufacturing according to claim 8 or 9, further comprising:
connecting the bottom of the heat dissipation part with a grounding end of the second surface of the printed circuit board in a welding mode, wherein the bottom of the heat dissipation part protrudes out of the second surface of the printed circuit board;
and coating a conductive layer on the second surface of the printed circuit board so that the bottom of the heat dissipation part is at the same level as the conductive layer coated on the second surface of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111039051.1A CN113764451A (en) | 2021-09-06 | 2021-09-06 | Packaging structure, camera and manufacturing method of packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111039051.1A CN113764451A (en) | 2021-09-06 | 2021-09-06 | Packaging structure, camera and manufacturing method of packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN113764451A true CN113764451A (en) | 2021-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111039051.1A Pending CN113764451A (en) | 2021-09-06 | 2021-09-06 | Packaging structure, camera and manufacturing method of packaging structure |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5710459A (en) * | 1995-05-12 | 1998-01-20 | Industrial Technology Research Institute | Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
| CN1731916A (en) * | 2005-08-22 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| JP3176322U (en) * | 2012-04-04 | 2012-06-14 | 株式会社ナカヨ通信機 | Multilayer printed circuit board heat dissipation structure |
| US20140238729A1 (en) * | 2013-02-26 | 2014-08-28 | Mediatek Inc. | Printed circuit board structure with heat dissipation function |
| CN209787545U (en) * | 2018-12-19 | 2019-12-13 | 杭州嘉楠耘智信息科技有限公司 | Printed circuit board |
-
2021
- 2021-09-06 CN CN202111039051.1A patent/CN113764451A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5710459A (en) * | 1995-05-12 | 1998-01-20 | Industrial Technology Research Institute | Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
| CN1731916A (en) * | 2005-08-22 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| JP3176322U (en) * | 2012-04-04 | 2012-06-14 | 株式会社ナカヨ通信機 | Multilayer printed circuit board heat dissipation structure |
| US20140238729A1 (en) * | 2013-02-26 | 2014-08-28 | Mediatek Inc. | Printed circuit board structure with heat dissipation function |
| CN209787545U (en) * | 2018-12-19 | 2019-12-13 | 杭州嘉楠耘智信息科技有限公司 | Printed circuit board |
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