CN102064157A - System encapsulation module of wireless local area network - Google Patents
System encapsulation module of wireless local area network Download PDFInfo
- Publication number
- CN102064157A CN102064157A CN2009102233768A CN200910223376A CN102064157A CN 102064157 A CN102064157 A CN 102064157A CN 2009102233768 A CN2009102233768 A CN 2009102233768A CN 200910223376 A CN200910223376 A CN 200910223376A CN 102064157 A CN102064157 A CN 102064157A
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- substrate
- wlan
- package module
- coupled
- flip chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The invention provides a system encapsulation module containing a substrate, which is used for a wireless local area network. A control unit is formed on the first surface of the substrate, a radio-frequency front end assembly which is in coupling with the control unit through the substrate is formed on the second surface, and a plurality of groups of inverted lugs are arranged on the first surface, are in coupling with the control unit and are mutually isolated to lower interference.
Description
Technical field
The present invention is relevant for WLAN (WLAN) module, particularly about being used for the system in package module of WLAN.
Background technology
In traditional semiconductor device fabrication processes, the semiconductor subassembly that some are unique, for example memory chip or microprocessor are manufactured on the semiconductor substrate as Silicon Wafer.After producing the required structure of each semiconductor subassembly, circuit and other feature on the semiconductor substrate, substrate can be cut usually to isolate other semiconductor subassembly.Can carry out various back processing procedures after the cutting semiconductor chip, these back processing procedures can be in order to giving the semiconductor subassembly required function, and whether decision other semiconductor subassembly meets the QC specification.
Then other semiconductor subassembly can be encapsulated.Comply with the semiconductor industry trend that the semiconductor subassembly size is dwindled to be increased with its density of texture, package dimension also constantly descends.At present, adopt the encapsulation technology of any kind integrated circuit package earlier and the wafer on the Silicon Wafer is cut into other wafer, the packaging and testing of the wafer that cut then.Owing to constantly repeat the packaging and testing of cutting crystal wafer, the cost that this encapsulation technology of being cut causes tediously long and complicated process and increases the packaging and testing of integrated circuit package before packaging and testing.
Summary of the invention
Main purpose of the present invention provides the system in package module that is used for WLAN and dispels the heat to eliminate its signal and to disturb and improve, and fine ratio of product also can be improved.
The present invention provides the system in package module that is used for WLAN, and this module comprises: a substrate; One control unit, control unit are formed on the first surface of substrate; At least one radio-frequency front-end assembly, radio-frequency front-end assembly are formed on the second surface of substrate and by substrate and are coupled in control unit; And plural groups flip chip bumps (bump), flip chip bumps be arranged on the first surface and with the control unit coupling, and isolate mutually to reduce to each other and disturb.The material of substrate comprises: silicon, glass, quartz, printed circuit board (PCB) or pottery.The plural groups flip chip bumps comprises: is used for first group of flip chip bumps of digital data bus signal transmission, is used for second group of flip chip bumps of high frequency simulation (radio frequency) signal transmission, and the 3rd group of flip chip bumps that is used for digital controlled signal.The system in package module that is used for WLAN provided by the invention more comprises: at least one band pass filter is coupled between control unit and the radio-frequency front-end assembly forming on the second surface; Be formed on the described second surface and be coupled in the memory body of described control unit; Be covered in the encapsulated layer on the described second surface.Formed internal memory and control unit coupling on the second surface.Formed oscillator is coupled in control unit on the second surface.
Another viewpoint of the present invention provides a system in package module, and this module comprises: a substrate; Formed first chip on the first surface of substrate; On the second surface of substrate, form and see through second chip of substrate and the coupling of first chip; And the flip chip bumps of at least the first group and second group, flip chip bumps is arranged on the first surface and is coupled in first chip, and wherein first group of flip chip bumps and second group of flip chip bumps are isolated mutually to reduce therebetween and are disturbed.First chip comprises a control strip; Second chip comprises a radio frequency front end chip.
Another viewpoint of the present invention provides a system in package module, and this module comprises: a substrate; At least one upside-down mounting assembly is formed at the lower surface of substrate; At least one radio-frequency front-end assembly is formed at the upper surface of substrate and is coupled in the upside-down mounting element by substrate; The plural groups projection is arranged at the lower surface of substrate and by substrate and the coupling of radio-frequency front-end assembly, wherein said plural groups projection is isolated mutually; And a printed circuit board (PCB), be coupled in substrate by the plural groups projection.Wherein, the plural groups projection subsides after being heated, and the upside-down mounting assembly is formed with printed circuit board (PCB) contact.
The technical solution of the present invention metal level is formed on the upper surface and lower surface of printed circuit board (PCB), and thus, the heat that the upside-down mounting assembly produced will be through the contact area of itself and printed circuit board (PCB) and is passed to metal level, to reach the purpose of heat radiation.In addition, the top of upside-down mounting assembly and below form the metallic conductor face, the noise that is produced with effective isolation upside-down mounting assembly.And solder bump separates and is isolated with the kind (as digital bus signals, radiofrequency signal or control signal etc.) of signal, and then the noise of isolated upside-down mounting assembly and printed circuit board (PCB).An encapsulated layer is covered on radio-frequency front-end assembly and the electronic component in a preferred embodiment, further reduces each interelement noise and disturbs.
Description of drawings
Fig. 1 is a schematic top plan view of the present invention.
Fig. 2 is an elevational schematic view of the present invention.
Fig. 3 is a cross-sectional schematic of the present invention.
Fig. 4 A is the schematic diagrames of one embodiment of the invention before carrying out back welding process.
Fig. 4 B is the schematic diagrames of one embodiment of the invention after carrying out back welding process.
Fig. 5 is that heat of the present invention passes analysis chart.
Embodiment
At the problem that prior art exists, for meeting tightr and frivolous demand as portable electronic devices such as numerical digit mobile phone, mobile computers, unique solutions is for becoming littler firmer.In response in this, very lagre scale integrated circuit (VLSIC) (VLSI) has made surprising microminiaturization come true recently, and the packaging density that improves assembly on the assembled plate makes progress.
In addition, encapsulation has advanced to complex types, this encapsulation is called system in package (SiP), and wherein passive device such as coil and other semiconductor chip are embedded in the intermediate layer of insulating barrier will be formed at re-wiring layer on the semiconductor substrate (chip) and are insulated and carry out wafer-level packaging.System in package can provide most semiconductor subassemblies and big capacity passive component such as decoupling capacitor etc. to be formed on the substrate.Utilize a plurality of integrated circuit (IC) chip and passive component to be assembled on the substrate and between the integrated circuit (IC) chip and interconnect, provide semiconductor and a kind of method for semiconductor of making also can reach expection with the improvement of satisfying high frequency characteristics and the demands such as microminiaturization of multi-chip modules by lead.
Therefore, the invention provides a kind of system in package module that is used for WLAN and tool novelty.
The present invention's this moment will carefully state some specific embodiment, yet, the present invention also can be understood by other embodiment does the broadest annotation except the clear and definite embodiment of these narrations, and scope of the present invention obviously be not limited to the present invention specific claim scope.
Secondly, accompanying drawing of the present invention does not show that various assemblies form scales, for clearly describing and showing that with the ratio that enlarges the insignificant parts of some sizes of associated component then do not do more clearly to explain orally.
The present invention comprises: medium access control (MAC), central processing unit, radio-frequency front-end module (FEM) assembly and the band pass filter of 2.4GHz radio, analog-digital converter and digital analog converter, fundamental frequency processor, many communications protocol.That the present invention can form is one high-effect, cost-effective, the solution of low-power consumption and compactness, this solution can be used for digital still camera, mobile phone/WLAN mobile phone, PDA(Personal Digital Assistant), the networking telephone (VoIP) mobile phone or music player (MP3/MP4), follow-up some primary clusterings will be described.The system in package module is supported the message transmission rate of all WLAN IEEE 802.11b/g and as the communications protocol of the wireless medium access control of WLAN 802.11i safety standard.Yet Fig. 1 only shows the spare part that it is main, and with reference to Fig. 1, this figure the present invention is directed to the schematic diagram of mobile phone in conjunction with the height conformability solution of Mobile Communications application.Control unit 100 in the system in package module is in order to controlling its data access and signal processing, and it should be noted that control unit 100 is formed at the reverse side on the surface at the following assembly of carrying place.Band pass filter (BPF) 102 is coupled between control unit 100 and the radio-frequency front-end assembly 104, respectively transmitter and receiver is filtered the frequency of not wanting.Typically radio-frequency front-end assembly 104 is used to handle receiving and transmitting signal, and is coupled in antenna 106.Please refer to Fig. 1 to Fig. 3, said modules is formed at substrate 10 times, and assembly is construed as so-called upside-down mounting (flip-chip) configuration.
As shown in Figure 1, an emplastic (not shown) is coated on the substrate (base material) 10.In one embodiment, emplastic sees through spin coat method (spin coating) or printing and is formed at substrate 10 surfaces.The material of substrate 10 is plastic cement, silicon, glass, quartz, pottery and printed circuit board (PCB) etc.With reference to Fig. 2, this figure shows that flip chip bumps can be shaped by scolding tin technology or so-called BGA Package (ball grid array) technology around the schematic diagram of the plural groups flip chip bumps of control unit 100.Many institutes know that solder(ing) paste is formed among the scolding tin cover pattern, by the tin cream reflow tin cream is changed into spherical scolding tin.For example, with scolding tin about 60 to 120 seconds of the preheating of going ahead of the rest, heated then about 30 to 50 seconds, its spike temperature is about 230 to 260 degree Celsius, and the slope of ascending temperature and decline temperature is about per second 10 and spends.It should be noted that flip chip bumps is divided at least three groups and is positioned at the Disengagement zone of substrate 10 lower surfaces, the upper surface of substrate 10 comprises above-mentioned passive component and other semiconductor subassembly.For fear of interference, aforementioned components is positioned at the reverse side on the surface at carrying control unit 100 and flip chip bumps place.First group of flip chip bumps 120 is positioned at substrate 10 upsides to be used for the transmission of digital data bus signal.Second group of flip chip bumps 122 be used for high frequency analog signals (radio frequency) and the right side that is positioned at control unit 100 to isolate first group of flip chip bumps from the transmission of digital data bus signal.In like manner, the 3rd group of flip chip bumps 124 is used for digital controlled signal, and the 3rd group of flip chip bumps 124 is arranged at substrate 10 downsides.It should be noted that aforesaid downside, upside and right positions all can select according to demand.For example, when first group of position with second group of flip chip bumps 120 and 124 changed mutually, the position of flip chip bumps 122 can be changed to the left side.Under this layout, high-speed digital signal and low speed control signal can be simulated (radio frequency) signal with high frequency and isolate fully, simultaneously, can eliminate its electromagnetic interference, and the signal transmission will can not interrupted by aforementioned high power transmission or low-power transmission.
With reference to shown in Figure 3, encapsulated layer (encapsulated layer) 130 optionally is formed at substrate 10 surfaces and goes up with the usefulness as protection.Another benefit of system in package module is arranged in its upper surface and may directly be exposed to air owing to some assemblies and makes its heat radiation be improved.
Fig. 4 A is the schematic diagrames of one embodiment of the invention before carrying out back welding process.As shown in the figure, upside-down mounting assembly 202 is formed at the lower surface of substrate 200, and radio-frequency front-end assembly 204 is formed at the upper surface of substrate 200 and is coupled in upside-down mounting assembly 202 by substrate 200 with other two groups of electronic building bricks 208.Plural groups solder bump 206 is arranged at the lower surface of substrate 200 and by substrate 200 and 204 couplings of radio-frequency front-end assembly, wherein each assembly welding tin projection and other assembly welding tin projection are isolated mutually.Printed circuit board (PCB) 210 is coupled with substrate 200 by plural groups solder bump 206.Be noted that in Fig. 4 A, upside-down mounting assembly 202 does not form with printed circuit board (PCB) 210 and contacts.
With reference to Fig. 4 B, it is the schematic diagram of one embodiment of the invention after carrying out back welding process.Back welding process by Pb-free solder can cause appropriateness to subside to solder bump 206, make suitable gap can be arranged between each solder bump 206 and upside-down mounting assembly 202 is directly formed with printed circuit board (PCB) 210 to contact, shown in Fig. 4 B.In this embodiment, the best of back welding process (or upper limit) fusing point is about 240 °, will cause solder bump 206 excessively to subside and makes solder bump 206 be stained with the sticking short circuit that forms mutually if surpass 240 °.
In a preferred embodiment, metal level 212 is formed on the upper surface and lower surface of printed circuit board (PCB) 210, thus, the heat that upside-down mounting assembly 202 produced will be through the contact area of itself and printed circuit board (PCB) 210 and is passed to metal level 212, to reach the purpose of heat radiation.In addition, can be in the top of upside-down mounting assembly 202 and the below form metallic conductor face (not being shown among the figure), the noise that is produced with effective isolation upside-down mounting assembly 202.And solder bump 206 separates and is isolated with the kind (as digital bus signals, radiofrequency signal or control signal etc.) of signal, and then the noise of isolated upside-down mounting assembly 202 and printed circuit board (PCB) 210.An encapsulated layer 214 is covered on radio-frequency front-end assembly 204 and the electronic component 208 in a preferred embodiment, further reduces each interelement noise and disturbs.
In some embodiment, upside-down mounting assembly 202 can comprise fundamental frequency processor, many communications protocol medium access (MAC) control assembly, radio frequency (RF) assembly or its combination, and the material of metal level 212 and metallic conductor face can be copper, tin, silver, gold, terne metal or gun-metal etc.In addition, electronic component 208 can be band pass filter, memory body, oscillator or its combination.
The heat energy analysis can be with reference to Fig. 5, and this figure shows that preferable heat passes analysis chart and its maximum temperature is lower than 58.5 degree Celsius.From cutaway view, most of assembly such as control unit 100, radio-frequency front-end assembly 104 or flash memory 108 are exposed in the air, and its heat passes area to be increased significantly, so, the invention provides and be used for the preferable heat energy solution of system in package module one.In addition, many between interelement signal interference compared to the past minimizing, use the use isolation mech isolation test, the signal transmission also will can not disturbed by its power line transmission.Therefore, the usefulness of the system in package module of WLAN is better than the designed usefulness of tradition.
Although above-mentioned specific embodiment accompanying drawing and described the present invention is known the knowledgeable usually for having in the technical field, the present invention clearly can have various modifications and variation, but not departing from the present invention's that claims define of aftermentioned spirit and category.
Claims (10)
1. a system in package module that is used for WLAN is characterized in that, comprising:
One substrate;
One control unit is formed on the first surface of described substrate;
At least one radio-frequency front-end assembly is formed on the second surface of described substrate and by described substrate and is coupled in described control unit; And
The plural groups flip chip bumps is arranged on the described first surface with described control unit coupling and isolates mutually.
2. the system in package module that is used for WLAN as claimed in claim 1 is characterized in that the material of described substrate comprises: silicon, glass, quartz, printed circuit board (PCB) or pottery.
3. the system in package module that is used for WLAN as claimed in claim 1, it is characterized in that described plural groups flip chip bumps comprises the first group of flip chip bumps that is used for the transmission of digital data bus signal, the 3rd group of flip chip bumps that is used for second group of flip chip bumps of high frequency analog signals (radio frequency) and is used for digital controlled signal.
4. the system in package module that is used for WLAN as claimed in claim 1 is characterized in that, more comprises:
One band pass filter is formed on the described second surface and is coupled between described control unit and the radio-frequency front-end assembly such as described;
One memory body is formed on the described second surface and is coupled in described control unit;
One encapsulated layer is covered on the described second surface; And
One oscillator is to be formed at described second surface and to be coupled in described control unit.
5. a system in package module that is used for WLAN is characterized in that, comprising:
One substrate;
One first chip is formed on the first surface of described substrate;
One second chip is formed on the second surface of described substrate;
And be coupled in described first chip by described substrate; And
The flip chip bumps of at least the first group and second group is arranged on the described first surface and is coupled in described first chip, and wherein, described first group of flip chip bumps and second group of flip chip bumps are isolated mutually.
6. the system in package module that is used for WLAN as claimed in claim 5 is characterized in that described first chip comprises a control strip; And described second chip comprises a radio frequency front end chip.
7. a system in package module that is used for WLAN is characterized in that, comprising:
One substrate;
At least one upside-down mounting assembly is formed at the lower surface of described substrate;
At least one radio-frequency front-end assembly is formed at the upper surface of described substrate and is coupled in described upside-down mounting assembly by described substrate;
The plural groups projection is arranged at the lower surface of described substrate and by described substrate and the coupling of described radio-frequency front-end assembly, wherein said plural groups projection is isolated mutually; And
One printed circuit board (PCB) is coupled in described substrate by described plural groups projection;
Wherein, described plural groups projection subsides after being heated, and described upside-down mounting assembly is formed with described printed circuit board (PCB) contact.
8. the system in package module that is used for WLAN as claimed in claim 7 is characterized in that, described upside-down mounting assembly comprises fundamental frequency processor, many communications protocol medium access control assembly, radio frequency component or its combination.
9. the system in package module that is used for WLAN as claimed in claim 7 is characterized in that, has more upper surface and lower surface that metal level is formed at described printed circuit board (PCB); And the metallic conductor face is formed at the top and the below of described upside-down mounting assembly.
10. the system in package module that is used for WLAN as claimed in claim 9 is characterized in that, the material of described metal level and metallic conductor face can be by selecting in copper, tin, silver, gold, terne metal or the gun-metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102233768A CN102064157A (en) | 2009-11-18 | 2009-11-18 | System encapsulation module of wireless local area network |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102233768A CN102064157A (en) | 2009-11-18 | 2009-11-18 | System encapsulation module of wireless local area network |
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| Publication Number | Publication Date |
|---|---|
| CN102064157A true CN102064157A (en) | 2011-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009102233768A Pending CN102064157A (en) | 2009-11-18 | 2009-11-18 | System encapsulation module of wireless local area network |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6255143B1 (en) * | 1999-08-04 | 2001-07-03 | St. Assembly Test Services Pte Ltd. | Flip chip thermally enhanced ball grid array |
| CN1731916A (en) * | 2005-08-22 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| CN101022103A (en) * | 2007-03-21 | 2007-08-22 | 威盛电子股份有限公司 | Chip package body |
| US20090046439A1 (en) * | 2007-08-15 | 2009-02-19 | Accton Technology Corporation | WLAN SIP module |
-
2009
- 2009-11-18 CN CN2009102233768A patent/CN102064157A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6255143B1 (en) * | 1999-08-04 | 2001-07-03 | St. Assembly Test Services Pte Ltd. | Flip chip thermally enhanced ball grid array |
| CN1731916A (en) * | 2005-08-22 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| CN101022103A (en) * | 2007-03-21 | 2007-08-22 | 威盛电子股份有限公司 | Chip package body |
| US20090046439A1 (en) * | 2007-08-15 | 2009-02-19 | Accton Technology Corporation | WLAN SIP module |
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Application publication date: 20110518 |