CN1731407A - Power distribution system analysis method and related technology - Google Patents
Power distribution system analysis method and related technology Download PDFInfo
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- CN1731407A CN1731407A CN 200510099032 CN200510099032A CN1731407A CN 1731407 A CN1731407 A CN 1731407A CN 200510099032 CN200510099032 CN 200510099032 CN 200510099032 A CN200510099032 A CN 200510099032A CN 1731407 A CN1731407 A CN 1731407A
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Abstract
The invention provides a power allocation system analyzing method, which uses single active, multiply active or synchronically switches noise to analysis to evaluate a power allocation system of a chip. The chip is connected with the power allocation system by a power port which is formed by a plurality of pads. It can fetch the biased voltage and current from each power port. The single active analysis is that it leads the given current to each power port and uses the voltage of each power port to analysis the equivalent resistance of each power port. The multiply analysis is that it gives a power port leading current and measures the voltage of other power ports to evaluate the connection between the given power port and other power ports. The synchronically switches noise analysis is that it analyzes the synchronically leading current of different numbers power port and uses the result to evaluate the equivalent resistance of power allocation system at different conditions.
Description
Technical field
The present invention relates to a kind of analytical approach and correlation technique of power distribution system, particularly relate to and a kind ofly can effectively reflect each power port in the power distribution system the intercouple analytical approach and the correlation technique of situation.
Background technology
In modern information society, various data, data, audio and video information can both transmit apace, handle and store in the mode of electric signal, therefore the electronic circuit that is used for handling electric signal of all kinds also just becomes one of most important hardware foundation of advanced information society.
As well known for one of skill in the art, Xian Dai electronic circuit is formed on the semi-conductor chip with semiconductor technology; But, the mechanical property of semi-conductor chip itself is comparatively fragile, so semi-conductor chip will be packed/be attached in the suitable encapsulation and/or circuit board, could protect semi-conductor chip.For make chip itself can with other chip/circuit switching electric signal in the external world, can be provided with the signal wiring on the encapsulation/circuit board, these signal wirings internally can be connected in chip, externally then can be connected to other chip/circuit, with the approach as chip and extraneous exchange message.In like manner, also can be distributed with power-supply wiring on encapsulation and the circuit board; These power-supply wirings internally can be connected in chip, externally then can be connected to extraneous power supply and (similarly be voltage stabilizer, regulator), operate required bias voltage and electric current so that chip itself can draw from extraneous power supply; And these power-supply wirings on encapsulation/circuit board just can be considered the power distribution system of chip.
Ideally, the power-supply wiring of power distribution system is perfect conductor, extraneous power supply fully can be transferred in the chip.Yet, in fact, have stray inductance and dead resistance on these power-supply wirings, also have the coupling of electrical properties between power-supply wiring, more than these undesirable factors all can influence the ability and the characteristic of power distribution system transferring electric power, allow power distribution system the electric power of external power supply can't be transferred to chip fully.For example, as well known to the skilled person, during the sub-signal of power transformation, the output driving circuit in the chip must will draw the output that bias current drives electric signal when chip will be exported; Signal content transforming along with electric signal, the needed bias current of output driving circuit also can change, and power system also should be according to the demand of output driving circuit accordingly will the time bias current that becomes transfer to output driving circuit in the chip via power-supply wiring.But, during the bias current that becomes in when transmission, owing to be distributed with parasitic equivalent inductance on the power-supply wiring of power distribution system, so when becoming bias current at that time and flowing through power-supply wiring, will on power-supply wiring, cause pressure drop, and then influence the bias voltage that power-supply wiring can transmit, make the chip actual reception to bias voltage be not the voltage that extraneous power supply is supplied.If the bias voltage that chip receives is undesirable, also can influences the bias voltage running of each interlock circuit in the chip jointly, even cause misoperation.In modern chip, because chip can be handled the data of (multidigit) in a large number with high speed, high running clock, so regular meeting has many output driving circuits can switch the sub-signal of power transformation when exporting at one time synchronously in the chip, and these synchronous switchings can make total bias current acutely change jointly, so also will be more obvious because of the pressure drop that equivalent stray inductance produced on the power-supply wiring; Concerning power distribution system, these have just formed the Switching Noise in the bias voltage (SSN, simultaneous switching noise) because of the pressure drop that non-ideal factor caused.
In order to control the non-ideal factor in the power distribution system, the primary crucial non-ideal factor of will analyzing quantitatively exactly/estimate in the power distribution system is to the influence degree of substrate bias electric power; Like this, the chip designer could suitably improve the circuit design in the chip, or improves the design of power distribution system, adds that the suitable compensation circuit (similarly is a decoupling capacitor, decoupling capacitor), to reduce the negative effect that non-ideal factor was caused in the power distribution system.
In existing power distribution system analytical approach, be that the equivalent inductance with single connection pad is that benchmark is estimated the bias voltage pressure drop that undesirable factor was caused in the power distribution system.As well known to the skilled person, can be provided with a plurality of positive connection pads (power pad) and a plurality of ground connection pad (ground pad) on the chip, be connected to the anode and the ground end of grid bias power supply respectively via the power-supply wiring in the power distribution system.Suppose in single a pair of positive connection pad and ground connection pad (can be considered a winding pad group or a power port), total synparasitism is gone up in the corresponding power wiring that each connection pad connects equivalent inductance Leff, then align connection pad bias current I will be drawn with the ground connection pad from corresponding power-supply wiring the time when this, will on power-supply wiring, form pressure drop Vd, and this pressure drop Vd just can be expressed as Vd=Leff* (dI/dt); That is to say that pressure drop Vd can be proportional to the inductance value of equivalent inductance and the time variability of electric current.If total total N connection pad group in the chip, existing analytical approach will be directly estimated the pressure drop that causes because of undesirable factor in the power distribution system with N*Leff* (dI/dt).In other words, in the existing power distribution system analytical approach, be to estimate the equivalent inductance of power distribution system on single connection pad group earlier, directly continue to use this equivalent inductance again and come the summation effect of all connection pad groups on the chip estimate, assess power distribution system because of pressure drop that non-ideal factor was caused with this.
Yet above-mentioned existing analytical approach also has shortcoming.One of its shortcoming, existing exactly analytical approach is not considered the coupling between each power-supply wiring.In power distribution system, power-supply wiring on single connection pad group can form the equivalent inductance Leff because of self-induction (self-inductance), also have the mutual inductance (mutual inductance) and the stray capacitance of mutual coupling in fact between the pairing different electrical power wiring of different connecting pad group, these factors all can influence the characteristic and the performance (similarly being pressure drop) of power distribution system.And existing analytical approach obviously can't reflect the influence of above-mentioned these mutual coupling factors to power distribution system only with the self-induction phase Calais assessment power distribution system of N connection pad group, certain also just can't be effectively, the accurately performance of qualitative assessment power distribution system.
Summary of the invention
Therefore, the invention provides a kind of analytical approach of mutual coupling situation between each power-supply wiring that can effectively reflect in the power distribution system, to overcome the shortcoming of prior art, assist chip designer's quantitative test more accurately in power distribution system by the influence that non-ideal factor caused, and make the deviser can design better correlative compensation mechanism (similarly being decoupling capacitor).In addition, but the present invention can also provide simplification accurate corresponding equivalent electrical circuit at different synchronous switching situations respectively, to assist the operation situation of chip designer's understanding/emulation power distribution system when transmitting substrate bias electric power.
Include three main routine analyzers in the analytical approach of the present invention: single sharp analysis, many sharp analyses and the Switching Noise analysis.The electric power transfer that extraneous power supply is provided from a plurality of power ports (connection pad group) at an energy is to the power distribution system of chip, single sharp system that analyzes is at each different power port, make one of them power port begin to transmit a given bias current (other power port then not transmission current) at every turn, and measure the bias voltage that this power port can provide, with the voltage that relatively this bias voltage and extraneous power supply was provided; Difference between two voltages is exactly because of pressure drop that non-ideal factor caused on the single supply port.According to pressure drop and this given bias current size, just can estimate equiva lent impedance and equivalent inductance on this power port.Estimate equiva lent impedance and the equivalent inductance that it is corresponding respectively at different power ports, can tentatively understand the factors such as self-induction on each power port, and understand which power port be weak in the power distribution system, be easier to the power port that influenced by non-ideal factor.
Many sharp analyses can be carried out at a certain given power port.Swash to analyze make this given power port begin to transmit a given bias current (other power port then not transmission current), and measure the bias voltage that this power port and other power port can provide.These many sharp analyses can be used to understand the mutual coupling situation of each power port.For instance, when carrying out swashing analysis more, if the bias voltage that a certain power port provided is close with the bias voltage that this given power port is provided, just represent the electrical couplings between this power port and this given power port stronger, relatively may interact.Otherwise, if bias voltage that another power port provided differs bigger with the bias voltage that this given power port is provided, then represent between this power port and this given power port electrical couplings a little less than, be not easy to interact.In other words, after carrying out many sharp analyses, just can provide further analytical information to the coupling situation between the different electrical power port.
The Switching Noise analysis also can be carried out at a given power port in the power distribution system.When carrying out the Switching Noise analysis, can make the given bias current of power port (can comprise this given power port itself) conducting simultaneously of different numbers at every turn, and measure the bias voltage that this given power port can provide, estimate equiva lent impedance and equivalent inductance on this given power port with total bias current size according to bias voltage and conducting.When the power port that makes different numbers conducting simultaneously electric current, just simulate different synchronous switching situations; And on behalf of this given power port, equiva lent impedance and the equivalent inductance calculated respectively at the turn-on power port of different numbers also just distinguish corresponding equiva lent impedance and equivalent inductance in that different synchronous switching situations is following.And but these equiva lent impedance, equivalent inductances of analyzing gained just can provide the chip designer a simple accurate circuit model; Synchronous switching situation when the chip designer can be at the chip practical application is selected corresponding equivalent inductance for use, understands non-ideal factor in (emulation) power distribution system more accurately to the influence of chip running with this equivalent inductance.
In one embodiment of this invention, can be earlier with single swash to analyze find out the higher power port of self-induction in the power distribution system and be used as the power port of bad situation, and swash when analyzing with the Switching Noise analysis more, just this most bad power port can be used as given power port, assess coupling between this given power port and other power port at this given power port, and estimate this given power port pairing equiva lent impedance, equivalent inductance under different synchronous switching situations.
In preferred embodiment of the present invention, above-mentioned Dan Ji, swash with the Switching Noise analysis carry out in the numerical simulation mode when encapsulation (and/or circuit board) design.When making a certain power port conducting bias current, can simulate the situation of polyphone one current source on this power port; And when the bias voltage that a certain power port of measurement provides, available calculation mode estimates the voltage swing on this power port.In other words, but the present invention can the package design stage just simulation analysis go out the operation situation of power distribution system, the improvement that the deviser can be designed at the weakness of power distribution system for example is distribution that improves power-supply wiring in the package design or the like.Simultaneously, the chip designer also can utilize the present invention to analyze the result of gained, when emulation chip operates the characteristic of power distribution system is taken into account in the lump, guarantees that the running of chip can not be limited by the non-ideal factor of power distribution system.
Description of drawings
What Fig. 1 illustrated is the corresponding relation of chip and power distribution system.
What Fig. 2 illustrated is typical power distribution system analytical approach.
Fig. 3 is the process flow diagram of analytical approach of the present invention.
What Fig. 4 illustrated is single situation of carrying out that swashs analysis among Fig. 3.
What Fig. 5 illustrated is the situations of carrying out that swash analysis among Fig. 3 more.
Fig. 6 signal be among Fig. 3 the Switching Noise analysis carry out situation.
Fig. 7 is with the single result who swashs analysis of instance data signal.
Fig. 8 is with the instance data signal results that swash analysis more.
The the 9th to Figure 10 is to switch the result who analyzes synchronously with the instance data signal.
To come with single shared equivalent inductance be the situation that power distribution system is set up equivalent-circuit model to Figure 11 for the present invention.
The reference numeral explanation
12 power distribution systems
100 flow processs
The 102-118 step
P1-PN, Pn, Pk-PK, Pm-PM, P1-P10, p1-p32 power port
V, Vs, Vd voltage
I, I_k-I_K, I_m-I_M, I_n, Id electric current
The Leff equivalent inductance
The Z equiva lent impedance
Embodiment
Please refer to Fig. 1; What Fig. 1 illustrated is the situation of describing the encapsulation/circuit board of a chip correspondence with power distribution system.Shown in the drawing left of Fig. 1, semi-conductor chip is installed on encapsulation and/or the circuit board, can be provided with a plurality of positive connection pads and a plurality of ground connection pad on the chip; These positive connection pads and ground connection pad are connected in the power-supply wiring in encapsulation/circuit board, so that the electric power transfer that extraneous power supply (similarly be voltage stabilizer, or the power port on the circuit board) is supplied operates necessary bias voltage and electric current to chip as chip.For instance, when the core circuit of master control computing in the chip will export electric signal to the external world, these electric signals were exported via the driving of driving circuit; And these driving circuits promptly are bias voltage and electric currents required when drawing its running by positive connection pad with the ground connection pad.
Example with practical application, connection pad on the chip can be connected in the trace (trace) in the encapsulation via the mode of closing line (bonding wire), and these traces can be connected in the conductive connecting pin (pin) of encapsulation, to be connected to extraneous power supply via these pins.And closing line-trace-pin just can be considered the power-supply wiring among Fig. 1.In addition, some integrated circuit encapsulates in flip chip (flip chip) mode, and it is positive that the connection pad on the chip can be connected to encapsulation via projection (bump), is connected to the conduction ball seat (ball) at the encapsulation back side again via the interconnect layer in the encapsulation; And projection-interconnect layer-ball seat just can be considered the power-supply wiring in the encapsulation.Except encapsulation, power-supply wiring also can comprise the cabling on the circuit board.For instance, chip also can be connected on circuit board or the motherboard, usually to be connected to the voltage stabilizer as extraneous power supply via circuit board after being encapsulated as integrated circuit.If want the whole substrate bias electric power transmission of complete consideration by way of, also the cabling on circuit board/motherboard can be included in the power-supply wiring in Fig. 1.
For equivalent chip to the power-supply wiring situation between external power supply, the pairing encapsulation of chip/integrated description to the circuit board idea, shown in the figure right side of Fig. 1 with a power distribution system model.Encapsulation/circuit board is connected the power port that part (just just/ground connection pad) promptly can be considered this power distribution system with chip; Each power port can be corresponding to a pair of connection pad group, just a positive connection pad and a ground connection pad.In other words, this power distribution system can be integrated each power-supply wiring and the approach of being electrically connected in the representative encapsulation/circuit board; Chip promptly is to draw its running required bias voltage and electric current through a power distribution system thus from extraneous power supply.And one of purpose of the present invention, a kind of systematized analysis process will be proposed exactly, with the power distribution system of chip is done more accurate qualitative/quantitative test, assist the chip designer more to understand the characteristic of power distribution system, also can assist to encapsulate/board design person improves the design of encapsulation/circuit board, to reduce the power supply noise that causes because of non-ideal factor in the power distribution system.
Please refer to Fig. 2.What Fig. 2 illustrated is the analytical approach that is used for analyzing power distribution system in the typical technology.In order to analyze the pressure drop that power distribution system is caused because of non-ideal factor (similarly being the stray inductance on the power-supply wiring), typical analytical technology is to estimate the behavior of all power ports according to the behavior of single power supply port.If parasitic equivalent inductance Leff is arranged between single power supply port and extraneous power supply, when this power port will transmit bias current I, this equivalence inductance will cause the pressure drop (Vd=Leff*dI/dt) of Vd, make this power port institute actual transmissions Vs-Vd only be arranged to the bias voltage V of chip, but not the voltage Vs that extraneous power supply can provide.
In the time will estimating/predict the general performance of power distribution system, the canonical analysis method among Fig. 2 is directly to estimate general performance according to the behavior of single power supply port.Suppose that having N power port in power distribution system at one time will transmit bias current I simultaneously, the canonical analysis method will be directly estimated in the whole power distribution system pressure drop because of non-ideal factor was caused with (Vd=N*Leff*dI/dt).
Yet the canonical analysis method among Fig. 2 also has shortcoming.One of shortcoming that it is main has been ignored intercoupling between the different electrical power port exactly.Between the different electrical power wiring of power distribution system, the coupling of electrical properties can be arranged mutually, the general performance of these coupling meeting actual influence power distribution systems can not be ignored easily.So one of fundamental purpose of the present invention is to propose a kind of preferable systematization analysis process,, and overcome the shortcoming of typical case/existing analytical approach with the situation that reflects that effectively each power port intercouples in the power distribution system.
Please refer to Fig. 3 and Fig. 4 to Fig. 6.Fig. 3 signal be systematic analysis method of the present invention carry out flow process 100; Fig. 4 to Fig. 6 has then illustrated the mode of carrying out of each key step in the flow process 100 respectively.In preferred embodiment of the present invention, analytical approach of the present invention is that the technology with numerical simulation realizes when package design, understand the characteristic of power distribution system to assist package designer, also can assist simultaneously the non-ideal factor in chip designer's emulation power distribution system, understand these non-ideal factors to the issuable influence of chip running to assist the chip designer.As shown in Figure 3, the following step is arranged in the flow process 100 of the present invention:
Step 102: pre-treatment step.After the design of finishing encapsulation (and/or circuit board), can be earlier according to the encapsulating structure of encapsulation (and/or circuit board) and the circuit model that material behavior is set up power distribution system.For example, be that the conductive material with which kind of electrical conductivity comes the framework power-supply wiring in the encapsulation, and the distance between the geometric distributions of power-supply wiring, length, width, power-supply wiring or the like, all can influence the general performance and the characteristic of power distribution system.And in this step, just can set up the circuit model of power distribution system according to these parameters, to make things convenient for the carrying out of subsequent analysis.
Step 104: carry out list and swash analysis.Swash in the analysis at list of the present invention, at each power port in the power distribution system, make the given electric current of a power port conducting one at every turn, and measure the voltage that this power port can provide, to calculate parasitic equiva lent impedance and the equivalent inductance on this power port according to bias voltage that this power port was transmitted and electric current.In order to further specify the mode of carrying out of this step, please in the lump with reference to figure 4; The single mode of carrying out that swashs analysis among the present invention that is of Fig. 4 signal.
Shown in the example of Fig. 4, suppose to carry out the power port P1 to PN in the power distribution system now list and swash analysis, just can make power port P1 conducting one given electric current I (similarly being to make its conducting electric current I) earlier with a current source, and measure power port P1 its just/the voltage V (being designated as V@P1 among Fig. 4) that provided between the ground connection pad; Other power port then can be kept suspension (floating) or high impedance (highimpedance) state and not need the conducting electric current.Comparative voltage V and extraneous power source voltage Vs, according to the size of electric current I, just can go out parasitic equiva lent impedance Z and equivalent inductance Leff (representing these parameters corresponding to power port P1 with Z@P1 and Leff@P1 among Fig. 1) on the power port P1 according to a preliminary estimate again.
Next, just can change and make the given electric current I of power port P2 conducting, and estimate the parasitic equiva lent impedance Z@P2 and the Leff@P2 of power port P2 correspondence according to the voltage V that power port P2 can provide.The same time, other power port does not then need the conducting electric current.By that analogy, when proceeding to power port PN, also be to make power port PN conducting electric current I (other then not conducting of power port), estimate pairing parasitic equiva lent impedance Z@PN of power port PN and equivalent inductance Leff@PN with voltage and electric current according to power port PN.So, just can finish single sharp analysis to power port P1 to PN.
When making each tested power port conducting electric current with current source, can utilize the time time-dependent current of direct current or interchange, assess the pairing impedance operator of each power port respectively carrying out that list swash to be analyzed.When in the given DC current of a power port conducting (when just making current source among Fig. 4 be DC current source), can analyze the resistive impedance of this power port.If (when just making current source among Fig. 4 be the resonance ac current source) then can estimate the inductive impedance of this power port under this given frequency when making the resonance alternating current of a certain given frequency of this power port conducting, given amplitude of vibration.In addition, the electric current that also can make this power port conducting have given time domain waveform, for example be to have pulse (impulse), step level (step) or the electric current of periodic square wave waveform, analyzing of the effect of the parasitic equiva lent impedance of this power port at time domain (time-domain), and to the instantaneous influence of voltage.
Single sharp analysis can be carried out one by one at all power ports in the power distribution system, and some specific power port of also can taking a sample out in all power ports swashs analysis to carry out list of the present invention at these specific power ports; For example, suppose to have in the power distribution system 100 power ports, 10 the representative power ports of can only taking a sample carry out list and swash analysis.Generally speaking, when the list of finishing this step swashs analysis, should can have gained some understanding to the characteristic out of the ordinary of power port out of the ordinary, can estimate parasitic equiva lent impedance and equivalent inductance Leff on the power port out of the ordinary.
Step 106: in step 104 to a plurality of power ports carried out single swash analyze after, just can find out a poorest power port of performance, with the most bad situation of understanding power distribution system at pairing equiva lent impedance of these power ports and equivalent inductance.For example, can sort according to the parasitic equivalent inductance of each power port (sort), if the equivalent inductance maximum on a certain power port, then just to can be considered be a most bad power port to this power port; Because its inductance maximum when its conducting electric current, also can cause maximum pressure drop on the voltage that extraneous power supply provided, cause having maximum deviation and noise between its bias voltage that can provide and extraneous power source voltage.Find out after the most bad power port, just can check whether the performance of this power port has violated relevant specification.For example, can limit the stray inductance upper limit of each power port in some electrical specification of chip packing-body; The specification of some chip may standard this chip patient bias noise of institute and error.If the performance of bad power port can further proceed to step 110 by relevant specification; If not, then can proceed to step 108.
Step 108: attempt to revise the design of encapsulation (and/or circuit board), or suitably adding decoupling capacitor on the power port,, pull over again, carry out list at the power distribution system after improving again and swash analysis to step 104 to improve the performance of bad power port.
Step 110: completing steps 104,106 and carry out step 110 so far, represent the initial circuit design to finish.So from step 110, just can analyze at the coupling situation between each power port, and the overall operation situation of assessment power distribution system, integrate checking to carry out power supply.At first, in step 110, can carry out the analyses that swash earlier more.When carrying out at a certain given power port swashing analysis more, can make this given power port begin conducting electric current (other not conducting of power port electric current), and measure the bias voltage that this given power port and other power port can provide, to understand between the different electrical power port degree of coupling mutually.The situation of carrying out about step 110 is please in the lump with reference to figure 5; Being the present invention and swashing more and analyze the situation of carrying out of Fig. 5 signal.
As shown in Figure 5, when carrying out at given power port Pn swashing analysis more, can make power port Pn conducting one given electric current I (similarly being to come the conducting electric current I to constant current source), measure the voltage V (being labeled as V@Pn, V@Pk to V@PK, V@Pm to V@PM among Fig. 5 respectively) that power port Pn and other each power port Pk to PK, Pm to PM can provide respectively simultaneously with one.So, just can understand the situation that intercouples between each power port quantitatively.For instance, when carrying out swashing analysis more, if the voltage of the voltage of a certain power port and given power port Pn is close, just represent the coupling that height is arranged between this power port and the given power port Pn, both may influence each other and height correlation in the performance in power distribution system.In like manner, not close as if the voltage of a certain power port and given power port Pn under many sharp analyses, just represent both degree of coupling lower, interactive degree is also less.
Be similar to single swash analyze, swash when analyzing carrying out more, also can be direct current or the electric current that becomes when exchanging to the electric current of conducting on the constant current source, with influencing each other between each power port under the analysis different situations.In preferred embodiment of the present invention, swash analysis more and the most bad power port can be used as given power port, carry out the analyses that swash at this most bad power port, to analyze other power port degree of coupling between the most bad power port therewith more.In addition, when carrying out swashing analysis, except given power port, also, not necessarily to measure the voltage of all power ports as long as in all the other power ports, choose some representative power port more.For instance, if having 100 power ports in certain power distribution system, 9 power ports of can taking a sample out in these power ports are to analyze the coupling situation between a certain given power port and this 9 power ports.
Step 112: after finishing the how sharp analysis of step 110, can check whether the performance of power distribution system meets relevant specification according to the results that swash analysis more; If not, then get back to step 108; If detect by specification, then can proceed to step 114.
Step 114: carry out Switching Noise (SSN) analysis.As discussed earlier, if many output driving circuits simultaneously will be when a plurality of power ports draw bias current in the chip, in power distribution system, will significantly change and cause Switching Noise in the bias voltage because of the moment of bias current.So when carrying out the Switching Noise analysis, can make a plurality of power ports conducting simultaneously electric currents, measure the voltage on a certain given power port again, the performance of switching this given power port under the situation with emulation synchronously.In order to simulate different synchronous switching situations, also can change conducting electric current on a different numbers power port, to analyze different performances of switching this given power port under the situation synchronously.About the carrying out of this step 114, please in the lump with reference to figure 6; The present invention that is of Fig. 6 signal carries out the situation of Switching Noise when analyzing.
When carrying out the Switching Noise analysis at a certain given power port Pn, can make a plurality of power port Pk to the PK given electric current I _ k to I_K of conducting (but also conducting electric current I of power port Pn _ n) respectively itself earlier, make other not conducting of power port electric current, and the voltage V of measurement power port Pn (is denoted as V@Pn@N1 among Fig. 6; N1 represents the total electricity of conducting); According to the total current of conducting in this voltage V and the power distribution system, just can be power port Pn and calculate at N1 and switch equiva lent impedance and equivalent inductance under the situation synchronously.In addition, also can change the power port number of conducting, to simulate different synchronous switching situations.For example, except original power port Pk to PK, also can additionally make power port Pm to PM also distinguish conducting electric current I _ m to I_M simultaneously, and the voltage V of measurement power port I_n (is denoted as V@P1@N2 among Fig. 6; N2 represents the total electricity of conducting), and estimate power port Pn in view of the above and switch parasitic equiva lent impedance and equivalent inductance under the situation synchronously at N2.It should be noted that, because the present invention makes a plurality of power port conducting electric currents simultaneously, so equiva lent impedance of calculating in this case and inductance can reflect the mutual coupling situation between each power port effectively, so that can describe power distribution system more accurately in synchronous characteristic and performance of switching under the situation.In preferred embodiment of the present invention, this given power port Pn can be the most bad power port of selecting in the step 106.
Be similar to aforesaid Dan Ji/many sharp analyses, when carrying out the Switching Noise analysis, the electric current that the electric current of each power port conducting becomes in the time of also can being direct current or interchange.And when carrying out the Switching Noise analysis, can decide according to the situation of chip actual operation to make which power port conducting, and determine the size of current (amplitude) of these power port conductings, with the synchronous situation of switching of simulation more accurately.For example, in a certain power distribution system, suppose that each power port can be 4 driving circuit supply bias currents in the chip, and each driving circuit can draw bias current Id when driving.Therefore, when the situation of wanting 3 driving circuits of emulation to switch simultaneously, can make the electric current (other power port does not need conducting) of a certain power port conducting 3*Id, and estimate that according to the voltage on this power port this power port is in synchronous equiva lent impedance and the equivalent inductance of switching under the situation of this kind.In like manner, when the situation of wanting 8 driving circuits of emulation to switch simultaneously, just can make 2 power ports electric current of conducting 4*Id separately, in the time of so just analyzing 8 driving circuits and switch simultaneously to the influence of power distribution system, and each power port equiva lent impedance and equivalent inductance in this case.By that analogy, the situation of 32 driving circuits of emulation to switch simultaneously just can make 8 power ports electric current of conducting 4*Id respectively, and when analyzing 32 driving circuits and switch synchronously according to the voltage on the given power port to the influence of power distribution system.
Sum up step 114 as can be known, the present invention can more accurately reflect the influence that power port intercouples in Switching Noise when carrying out the Switching Noise analysis.That is to say that when analyzing Switching Noise, the present invention can take into account the power port factor of intercoupling comparatively truly.Simultaneously, the present invention also can be different synchronous switching situations different equiva lent impedance and equivalent inductances is provided; The chip designer can select corresponding equivalent inductance for use according to the practical situation (similarly being to have several driving circuits to switch simultaneously) of chip running, so that can simulate the influence that power system operates chip under switching synchronously more accurately.
Step 116: after finishing the Switching Noise analysis of step 114, can check once more whether the performance of power distribution system meets relevant specification according to analysis result; If not, then get back to step 108; If detect by specification, then can proceed to step 118.
Step 118: design and the power supply of finishing encapsulation/circuit board are integrated checking.
In above-mentioned flow process of the present invention 100, the how sharp analysis of step 110 and the Switching Noise analysis of step 114 not necessarily will be carried out many sharp analyses earlier according to the order among Fig. 3 and switch analysis more synchronously.The carrying out order of these two kinds of analyses can be exchanged, or parallel carrying out.In preferred embodiment of the present invention, flow process 100 is carried out with numerical simulation, that is to say, is carrying out Dan Ji/swash or Switching Noise when analyzing more, if will measure the voltage of a certain power port, be actually with numerical simulation and calculate voltage on this power port.But, flow process 100 among Fig. 3 also can be carried out at the power distribution system of entity, (similarly be the function generator of more vairable just with real current source, functiongenerator) make the power port conducting, and measure the voltage on each power port with measuring instrument (similarly being voltmeter, oscillograph or network analyzer, network analyzer).In addition, control hardware or firmware that also can built-in above-mentioned analysis in chip; , still can itself control and to make those power port conductings, those not conductings of power port, after forming integrated circuit when chip is packaged in the encapsulation to carry out the every analysis among the present invention by the chip in the integrated circuit.
For further specifying the situation that every analysis is carried out in the flow process 100 of the present invention, below will be with the resulting every data instance of practice of the present invention, illustrate that the present invention is when the encapsulation of actual analysis one given model, Dan Ji, many sharp situations of carrying out with the Switching Noise analysis, analyze getable result to understand these, and how these results assist the deviser to assess a power distribution system.Please refer to Fig. 7 to Figure 10; Fig. 7 to Figure 10 signal be the present invention's resulting every related data when reality is carried out flow process 100 to the encapsulation of a given model.The encapsulation of this given model can be considered a power distribution system 12; And illustrated in Figure 7 be the present invention and this power distribution system 12 is carried out list swash resulting every data and chart when analyzing; What Fig. 8 illustrated then is to swash resulting related data and chart when analyzing the present invention carries out this power distribution system 12 more; Fig. 9 to Figure 10 has illustrated that then the present invention carries out situation and each the related data/chart that Switching Noise is analyzed to power distribution system 12.
At first, as shown in Figure 7, power distribution system 12 is formed by the encapsulation of a given model, and a plurality of power ports of arranging all around along encapsulation are arranged on it; And this power distribution system 12 is being carried out list when swash analyzing, can be along the both sides of encapsulation and 10 the power port P1 to P10 that in these power ports, take a sample out, and carry out list at these power ports and swash analysis (can once again with reference to figure 4).That is to say, when carrying out the sharp analysis of list, can make power port P1 conducting electric current (other each not conducting of power port electric current) earlier, and measure the voltage that power port P1 can provide, try to achieve the pressure drop that power distribution system 12 forms according to the voltage that the voltage that measures and extraneous power supply can provide on power port P1, and calculate the parasitic equiva lent impedance and the equivalent inductance at power port P1 place according to the electric current of this pressure drop and conducting.Next, make power port P2 conducting electric current (other not conducting of power port electric current) again, the voltage that can provide according to power port P2 (voltage that is provided with extraneous power supply) is obtained equiva lent impedance and the equivalent inductance of power distribution system 12 on power port P2.Carry out above-mentioned steps at each power port in regular turn, just can obtain each power port P1 to P10 other equiva lent impedance and equivalent inductance.
More particularly, a certain power port is being carried out list when swash analyzing, time-dependent current in the time of can making the resonance that this power port conducting one has given frequency; Suppose this power port transmission this time can cause the pressure drop of Vd during time-dependent current, (wherein, w represents angular frequency just can be in frequency domain to calculate the equiva lent impedance Z of this power port under this given frequency with the equation of Z (w)=Vd (w)/I (w); Vd (w) and I (w) then are respectively voltage, the electric current under the frequency domain).In general, this equivalent impedance is mainly an inductive impedance, so under frequency domain, can further utilize the equation of Z (w)=j*w*Leff (w) to calculate the equivalent inductance Leff (wherein, j is-1 square root) of this power port under this given frequency.The frequency of time-dependent current just can calculate this given power port pairing equiva lent impedance and equivalent inductance under different frequency when changing resonance.And in Fig. 7, chart 7A and 7B promptly illustrated respectively single swash analyze under the equiva lent impedance of each power port and inductance with the situation of frequency change.The transverse axis of chart 7A, 7B is that (unit is GHz to frequency, and 1GHz is 10
9Hz), the longitudinal axis of chart 7A is that (unit is Ohm to impedance magnitude, and Ao Mu), then (unit is pH to the longitudinal axis of chart 7B, and H is Henry, 1pH=10 for the inductance size
-12H).Shown in chart 7A, swash under the analysis single, the equiva lent impedance size of each power port can present inductive high pass trend, the equiva lent impedance maximum of power port P1; The equiva lent impedance of power port P2 is then taken second place.The equiva lent impedance of power port P3 to P10 is then very close.After utilizing equiva lent impedance to calculate equivalent inductance among the chart 7B, the equivalent inductance that can find each power port almost presents certain value (and not with frequency shift), and the equivalent inductance maximum of power port P1, the equivalent inductance of power port P2 is taken second place, and the equivalent inductance of power port P3 to P10 is then very close.
The power port P1 to P10 in the power distribution system 12 is carried out single swash analyze and after drawing out chart 7A, 7B among Fig. 7, can find out that by these two charts the equiva lent impedance of power port P1 and equivalent inductance all are maximum.This has also just represented, and power port P1 can cause maximum pressure drop when the transmission substrate bias electric power; In other words, in power port P1 to P10, power port P1 is that characteristic is the worst, can be considered the most bad power port step 106 of flow process 100 among the figure 3 (can be once again with reference to).Through analyzing thus, the deviser of encapsulation/circuit board can learn the weakness (the most bad power port just) of power distribution system, also could improve at this weakness effectively, to control the characteristic of whole power distribution system.
The example of continuity Fig. 7 please continue with reference to figure 8.As shown in Figure 8, the present invention can continue to use the power port P1 to P10 that takes a sample among Fig. 7 carry out swash analyze (can be in the lump with reference to how sharp analysis of the figure 5).Swash when analyzing carrying out, be to be a given power port with the most bad power port P1 more, makes power port P1 conducting electric current (other not conducting of power port electric current), and measure the voltage of each power port P1 to P10.These many sharp analyses can be understood the mutual coupling relation between other power port P2 to P10 and power port P1.Because intercoupling between each power port, though the equal conducting electric current not of power port P2 to P10, but still have voltage, this voltage is exactly the power port P1 coupling by conducting.Therefore, measure the voltage of each power port P2 to P10, just can be qualitative/understand the degree of coupling between each power port and power port P1 quantitatively.According to the voltage of each power port (P2 to P10) and the electric current of power port P1 conducting, also can calculate equiva lent impedance and equivalent resistance that each power port causes under the mutual coupling situation.In Fig. 8, chart 8A, 8B have just illustrated equiva lent impedance and the equivalent inductance that each power port caused under the mutual coupling situation respectively; The transverse axis of chart 8A, 8B is a frequency, and the longitudinal axis of chart 8A is an impedance magnitude, and the longitudinal axis of chart 8B is represented the inductance value size.In addition, chart 8C then tabular go out each power port at 400MHz (1MHz=10
6Hz) the mutual coupling situation under the frequency; As 100% benchmark, then the degree of coupling between power port P2 and power port P1 can be calculated as 24% with the self-induction of power port P1; Degree of coupling between power port P3 and power port P1 then is 16%, by that analogy.By chart 8C as can be known, in power port P2 to P10, between power port P2 and power port P1 maximum mutual coupling is arranged.This may be because the position of power port P2 and power port P1 is close, or the power-supply wiring of power port P2 and power port P1 has bigger electrical couplings or how much connections.This has also represented, and the characteristic of power port P2 can be subjected to the influence of power port P1 to a certain degree; Because power port P1 is the most bad power port, the characteristic of power port P2 also can be influenced jointly.Relatively, if can improve the characteristic of power port P1 when the transmission substrate bias electric power, the characteristic of power port P2 just might also can be improved thereupon.
The example of continuity Fig. 7, Fig. 8 please continue with reference to figure 9, Figure 10.In Fig. 9, Figure 10, the present invention goes out power port p1 to p32 at a side-draw sample that encapsulates in addition, to carry out the Switching Noise analysis at these power ports.The power port that Switching Noise makes different numbers is the conducting electric current simultaneously, to simulate different synchronous switching situation (can be once again with reference to figure 6 Switching Noise synoptic diagram).In the example of Fig. 9, Figure 10, each the power port p1 to p32 in the power distribution system 12 can be respectively 4 driving circuit supply substrate bias electric powers (bias voltage and bias current); If there be N driving circuit will draw bias current simultaneously, just can be considered the synchronous switching of number N.And power supply noise and equivalent inductance that power distribution system 12 is caused under the synchronous switching of different numbers promptly are illustrated among the chart 9A of Fig. 9; This power supply noise and equivalent inductance are to be that benchmark is measured, calculated with power port p1 (it can be the most bad power port P1 among Fig. 7, Fig. 8).The transverse axis of chart 9A is the number that switches synchronously, the left side longitudinal axis represents power supply noise (just because bias current switches the pressure drop that changes and caused in power distribution system, be so-called delta-I noise) size, its unit is mV (V for volt, 1mV=10^ (3) V); The right longitudinal axis is then represented the size of equiva lent impedance, and its unit is pH.Sign has the curve of SSN then to be used for representing the variation situation of power supply noise, and its tolerance needs with reference to the left longitudinal axis; Sign has the curve of Leff then to be used for representing the variation situation of equivalent inductance Leff, and its tolerance needs with reference to the right longitudinal axis.
Cooperate the chart 9A among Fig. 9, in the chart 10A of Figure 10, then tabulation has been illustrated under the different switching numbers, equivalent inductance and related data in frequency domain (frequency is 400MHz) and time domain.Shown in chart 10A, when the number of synchronous switching is 1, be to come 1 bias current that driving circuit was drawn of emulation with power port p1 conducting 1 unitary current Id.When the number of synchronous switching is 2,3,4, then be that conducting 2*, 3*, 4*Id simulate 2,3,4 driving circuits draw drive current simultaneously in power port p1 situation respectively respectively with power port p1; So, when synchronous switching number 1 to 4 the time, the power port number of conducting is similarly 1.When the number of synchronous switching is 5, power port p1 conducting 4*Id electric current, power port p2 is conducting 1*Id electric current then; Because it is 4 driving circuit supply of current that same power port is used for, so, 5 driving circuits of emulation to draw the situation of bias current simultaneously, just can make two power ports distinguish the electric current of conducting 4*Id and 1*Id.In like manner, be under 6 the situation switching synchronously number, then can make power port p1 conducting 4*Id electric current, power port p2 conducting 2*Id electric current, draw the situation of drive current simultaneously with 6 driving circuits of emulation.By that analogy, when synchronous switching number is 32, will make power port p1 to the p8 electric current of conducting 4*Id simultaneously, to simulate the situation of 32 driving circuits when drawing bias current simultaneously.
In other words, in Switching Noise is analyzed, with different electrical power port conducting corresponding current, just can simulate different synchronous switching numbers, and can measure, calculate various synchronous switching situations following each self-corresponding power supply noise and equivalent inductance.Shown in chart 9A, along with the number of synchronous switching increases, power supply noise (curve S SN is just in the pressure drop of power port p1) also increases gradually.SN can observe out by curve S, when synchronous switching number 1 to 4 the time, power supply noise is linear rising.This be because, when the number of synchronous switching less than 5 the time, all be to supply bias current, so power supply noise can be according to the linear regularly rising of the characteristic of same power port by same power port.But, when synchronous switching number equaled (or greater than) 5, the ascendant trend of curve S SN will present violent change, and this has just reflected the mutual coupling situation between power port.Because, when synchronous switching number more than or equal to 5 the time, have a plurality of power ports and want transferring electric power simultaneously; If each power port mutual between not coupling, the ascendant trend of curve S SN should be unable to change so, the ascendant trend (just switching number synchronously less than 5 o'clock) when its ascendant trend should be with the conducting of single power supply port is consistent.Yet, can find out by chart 9A, when synchronous switching number more than or equal to 5 the time, the ascendant trend of curve S SN eases up, this has also just reflected between each power port can influence power supply noise because of intercoupling.
According to the total current of the pressure drop on the power port p1 (power supply noise), just can calculate the equivalent inductance Leff among Fig. 9 with each power port conducting.In like manner, the equivalent inductance among Figure 10 is also so calculated.As discussed earlier, when making power port conducting electric current, the time time-dependent current of available resonance is carried out frequency-domain analysis, also can utilize the time time-dependent current with specific time domain waveform to carry out time-domain analysis.The equivalent inductance of gained when the tabulation among Figure 10 has shown the equivalent inductance of time-domain analysis gained and frequency-domain analysis simultaneously.Be stressed that, just shown in chart 9A, ask the equivalent inductance that calculates to reflect coupled characteristic between power port like this, so can more accurately describe the characteristic of power distribution system.And carrying out the equivalent inductance that this switches synchronously gained when analyzing, and just can be used for simplifying the model of power distribution system, the assistance chip designer comes the non-ideal characteristic of emulation power distribution system with the circuit model of more simplifying (but not losing correctness).About this situation, please refer to Figure 11.Figure 11 signal be the present invention sets up circuit model for power distribution system situation.
Shown in the drawing left of Figure 11, power port P1, the P2 to PN in the power distribution system can be respectively 4 driving circuit transmission substrate bias electric powers.Because the non-ideal factor of power distribution system has parasitic equivalent self-induction Leff@P1, Leff@P2 to Leff@PN respectively on each power port, also have impedance Z c1, Zc2 to ZcN of mutual coupling or the like each other.That is to say, must be with the impedance network of complexity, the characteristic of ability emulation power distribution system.Therefore, when the chip designer will consider the non-ideal factor of power distribution system in chip design, the impedance network model that will use this complexity is emulation power distribution system characteristic comparatively intactly, far and away, this will make the work of chip design/emulation more complicated, also more difficult carrying out also can increase the time and the cost of chip design.
In comparison, utilize Switching Noise analysis of the present invention, the characteristic that the chip designer just can utilize right-hand simplification circuit model of Figure 11 to come the emulation power distribution system, as long as in chart 10A (Figure 10), choose suitable inductance value according to the characteristic of chip running, just can describe whole power distribution system equivalently with single shared inductance L eff simply.For instance, if a certain chip has the bias current that 16 driving circuits draw frequency 400MHz simultaneously when running, just can in chart 10A, select for use 534pH (chart 10A, frequency analysis hurdle, the corresponding row that switch number 16 synchronously) to be used as right-hand shared inductance value of Figure 11.In like manner, if the running characteristic of chip has 32 driving circuits and draws the drive current with specific time domain waveform simultaneously, just can choose the inductance value that 612pH (time-domain analysis hurdle, the corresponding row that switch number 32 synchronously) is used as sharing inductance L eff according to chart 10A.Emphasize once again, by the discussion of Fig. 9, Figure 10 as can be known, the inductance value among chart 9A, the 10A has all contained the mutual coupling factor between power port, so, even the present invention has only used single shared inductance L eff, also can accurately reflect the overall permanence of power distribution system.One share the ball bearing made using model that inductance is set up according to this, the chip designer just can be fast, convenient, intuitively when design chips, include the characteristic of power distribution system in consideration, so that the circuit in the chip can coordinate mutually with power distribution system, make the running of whole integrated circuit can not be limited by the non-ideal factor of power distribution system.
Generally speaking, in existing/typical analytical approach, the quantitative test of a globality Dan Ji among the present invention, swashs the characteristic that can more accurately reflect power distribution system with the Switching Noise analysis, will be done simultaneously because of reciprocal effect that mutual coupling was caused and comprehensive Switching Noise between the self-induction of single power supply port, different electrical power port more.Encapsulation/board design person can utilize analytical approach of the present invention to find out the weakness of power distribution system, and is compensated at the quantitative performance of this weakness.Therefore, the present invention can assist to encapsulate/blind spot when board design person is lowered design, and then preferable design criteria is provided; Simultaneously, the present invention also can assist the deviser effectively to assess decoupling power supply place and necessity.On the other hand, the present invention also can analyze and assess at comprehensive Switching Noise, makes chip designer's effect of emulation power distribution system more simply, to carry out the control of system power supply budget (budget) effectively.Every analysis of the present invention can realize with the form of hardware or software program code; For example, every analysis available software program code of the present invention is realized; When carrying out this software program code, just can assist relevant design person to analyze the characteristic of given power distribution system with computing machine.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (11)
1. method of analyzing power distribution system is to analyze the pairing power distribution system of a chip; This power distribution system can be connected in this chip via a plurality of connection pad groups, and arbitrary connection pad group comprises a positive connection pad and a ground connection pad, so that electric power that an extraneous power supply was provided is transmitted this chip via this positive connection pad and these ground connection pads respectively; And this method includes:
Carry out single sharp an analysis, obtain the pairing equiva lent impedance of a connection pad group of this power distribution system;
Repeat this list and swash analysis, with the equiva lent impedance of at least two connection pad groups under single sharp analysis in the described connection pad group that obtains this power distribution system;
The more described connection pad group of learning is in single equiva lent impedance that swashs under analyzing, to select a most bad connection pad group; And
Carry out a synchronous switching noise analysis, calculate the equiva lent impedance of this most bad connection pad group under a plurality of driving circuits of this chip switch synchronously.
2. the method for claim 1, wherein this list swashs analysis package and contains the following step:
Be directed in a plurality of connection pad groups of this power distribution system and select a connection pad group, make conducting one given electric current between positive connection pad in this connection pad group and ground connection pad; And
Measure the positive connection pad of this connection pad group and the voltage between the ground connection pad, calculate a equiva lent impedance with this given galvanometer corresponding to this connection pad group with voltage according to this measurement gained.
3. the method for claim 1 also comprises the following step:
Carry out more than one and swash analysis, assess a mutual coupling of this most bad connection pad group and other connection pad group; Contained the following step and should swash analysis package more:
At a given connection pad group, make in this given connection pad group positive connection pad and ground connection pad between conducting one given electric current;
Measure the positive connection pad of this given connection pad group and the voltage between the ground connection pad;
Measure the positive connection pad of at least one other connection pad group and the voltage between the ground connection pad; And
According to the voltage of this given connection pad group and the voltage of this other connection pad group, assess the mutual coupling degree of this given connection pad group and other connection pad group.
4. method as claimed in claim 3 wherein swashs when analyzing in carrying out this more, the step of the voltage between this positive connection pad that measures at least one other connection pad group and ground connection pad, be measure whole described other connection pad groups positive connection pad and the voltage between connection pad.
5. the method for claim 1, wherein this Switching Noise analysis package contains the following step:
In the described connection pad group of this power distribution system, select a plurality of conducting connection pad groups, and make simultaneously in the described conducting connection pad group positive connection pad and ground connection pad between the conducting electric current, wherein each conducting connection pad group has a given electric current, and this power distribution system has the sum total that a total electricity is this given electric current of described conducting connection pad group;
At a given connection pad group, measure the positive connection pad of this connection pad group and the voltage between the ground connection pad; And
According to the given electric current and the voltage that measures of this given connection pad resistance, estimate the equiva lent impedance of this given connection pad group under this total electricity.
6. method as claimed in claim 5, wherein, when carrying out this Switching Noise analysis, should in the described connection pad group of this power distribution system, select a plurality of conducting connection pad groups, and make the step of conducting electric current between positive connection pad in the described conducting connection pad group and ground connection pad simultaneously, be the time time-dependent current that conducting one has given time domain waveform, in the hope of equiva lent impedance under the time domain and degree of coupling.
7. method of analyzing power distribution system is to analyze the pairing power distribution system of a chip; This power distribution system has a plurality of power ports and is connected in this chip, with voltage that bias voltage is used and current delivery to this chip; And this method includes:
Carry out a synchronous switching noise analysis, it includes the following step:
Select a plurality of turn-on power ports in the described power port of this power distribution system, and make described turn-on power port transmission electric current in order to drive a plurality of driving circuits of this chip simultaneously, wherein each turn-on power port has a transmission current;
At a given power port, measure the voltage that this given power port can transmit; And
According to the voltage that the transmission current of each turn-on power port and the measurement of this given power port are arrived, calculate the equiva lent impedance of this given power port under the switching synchronously of described driving circuit.
8. method as claimed in claim 7, it also includes:
Carry out single sharp an analysis, it includes the following step:
In the described power port of this power distribution system, select a power port to be measured, make this power port to be measured transmit a given electric current;
Measure the voltage that this power port to be measured can transmit, calculate a equiva lent impedance with this given galvanometer corresponding to this power port to be measured with voltage according to this measurement gained.
9. method as claimed in claim 8, it also includes:
Repeat this list and swash to analyze, with the equiva lent impedance of the described power port that obtains this power distribution system; And
The equiva lent impedance of more described power port correspondence to select a most bad power port, when carrying out this Switching Noise analysis, is as this given power port with this most bad power port wherein.
10. method as claimed in claim 7, it also includes:
Carry out more than one and swash analysis, it includes the following step:
At a given power port, make this given power port transmit a given electric current;
Measure the voltage that this given power port can transmit;
Measure the voltage that other power port transmitted of this power distribution system; And
According to the voltage of this given power port and the voltage in other power port, assess the degree of coupling of this given power port and other power port.
11. method as claimed in claim 7, when wherein carrying out this Switching Noise analysis, also comprise a step: in the described connection pad group of this power distribution system, select another a plurality of conducting connection pad groups, the conducting electric current that makes described conducting connection pad group is with the different driving circuit that drives this chip, repeat between this positive connection pad of measuring this given connection pad group and ground connection pad voltage steps, this calculates the equiva lent impedance step of this given connection pad under the switching synchronously of described driving circuit.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2009036702A1 (en) * | 2007-09-19 | 2009-03-26 | Huawei Technologies Co., Ltd. | A methode and device for modeling power supply noise |
| CN101153978B (en) * | 2006-09-29 | 2010-05-12 | 胜华科技股份有限公司 | Matching table forming method of inside and outside joint cushion and its matching method |
| CN103080938A (en) * | 2010-07-09 | 2013-05-01 | 阿尔特拉公司 | Method and apparatus for simultaneous switching noise optimization |
| CN106026031A (en) * | 2016-06-24 | 2016-10-12 | 重庆小目科技有限责任公司 | Power supply management system for multi-port machine |
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| JP2001125943A (en) * | 1999-10-28 | 2001-05-11 | Nec Corp | Method for designing power supply decoupling circuit and design aiding system |
| TW522295B (en) * | 2000-08-24 | 2003-03-01 | Via Tech Inc | Control circuit and chipset for cutting down terminal resistance on mainboard and method thereof |
| US20030088395A1 (en) * | 2001-11-05 | 2003-05-08 | Roland Frech | Method and system for quantifying dynamic on-chip power disribution |
| JP2004054522A (en) * | 2002-07-18 | 2004-02-19 | Fujitsu Ltd | Method for evaluating simultaneous switching noise of semiconductor device |
| TW591781B (en) * | 2003-05-26 | 2004-06-11 | Advanced Semiconductor Eng | Substrate for measuring simultaneous switch noise |
| CN1305127C (en) * | 2003-09-12 | 2007-03-14 | 清华大学 | Quick method for implementing noise optimization of integrated circuit supply network using decoupling capacitor |
| JP4065242B2 (en) * | 2004-01-06 | 2008-03-19 | 松下電器産業株式会社 | Design method of semiconductor integrated circuit with reduced power noise |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101153978B (en) * | 2006-09-29 | 2010-05-12 | 胜华科技股份有限公司 | Matching table forming method of inside and outside joint cushion and its matching method |
| WO2009036702A1 (en) * | 2007-09-19 | 2009-03-26 | Huawei Technologies Co., Ltd. | A methode and device for modeling power supply noise |
| CN101394453B (en) * | 2007-09-19 | 2011-06-22 | 华为技术有限公司 | Power source noise model establishing method and apparatus thereof |
| CN103080938A (en) * | 2010-07-09 | 2013-05-01 | 阿尔特拉公司 | Method and apparatus for simultaneous switching noise optimization |
| CN103080938B (en) * | 2010-07-09 | 2016-10-05 | 阿尔特拉公司 | The method optimized for simultaneous switching noise |
| CN106026031A (en) * | 2016-06-24 | 2016-10-12 | 重庆小目科技有限责任公司 | Power supply management system for multi-port machine |
| CN106026031B (en) * | 2016-06-24 | 2019-01-29 | 重庆小目科技有限责任公司 | A kind of multiport electromechanics management system |
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