CN1719181A - Heat pipe seat and its manufacturing method - Google Patents
Heat pipe seat and its manufacturing method Download PDFInfo
- Publication number
- CN1719181A CN1719181A CNA2005100412159A CN200510041215A CN1719181A CN 1719181 A CN1719181 A CN 1719181A CN A2005100412159 A CNA2005100412159 A CN A2005100412159A CN 200510041215 A CN200510041215 A CN 200510041215A CN 1719181 A CN1719181 A CN 1719181A
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- heat pipe
- coating
- pipe seat
- face
- seat according
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000009833 condensation Methods 0.000 claims abstract description 25
- 230000005494 condensation Effects 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims description 92
- 239000011248 coating agent Substances 0.000 claims description 90
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 abstract 2
- 238000001704 evaporation Methods 0.000 abstract 2
- 238000005452 bending Methods 0.000 description 31
- 230000000694 effects Effects 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- 230000000875 corresponding effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 235000013372 meat Nutrition 0.000 description 2
- 230000004060 metabolic process Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a heat pipe seat and making method thereof. It is used for mounting heat pipe. Said heat pipe has at least an evaporation part and at least a condensation part connected with said evaporation part, and heat pipe seat includes at least a covering seat body with a covering channel. Besides, said invention also provides the concrete structure of said heat pipe and said heat pipe seat.
Description
Technical field
The present invention relates to a kind of heat pipe seat, be meant heat pipe seat and manufacture method thereof that a kind of heat conduction efficiency is high especially.
Background technology
Heat pipe is present a kind of heat-conduction component that applies in a large number on the electronic component, generally speaking inside heat pipe is filled with good fluidity, heat of vaporization height, boiling point is lower and chemical property is stable heat-conduction medium, for example water, ethanol and acetone etc., and the internal face of heat pipe is formed with the capillary structure that majority is burr shape projection usually.When reality is used, a wherein end of heat pipe is to be connected with a heat pipe seat that is installed on the electronic component as evaporator section, the other end of heat pipe then is can to install for most radiating fins as condensation segment, so, when the evaporator section of heat pipe is heated, a large amount of heats of vaporization can be vaporized and absorb to heat-conduction medium in heat pipe evaporator section promptly, and the temperature of heat pipe seat is reduced, then when this heat-conduction medium diffuses to heat pipe condenser section with steam state, this heat-conduction medium can be attached on these capillary structures and be condensed into liquid state and reflux towards heat pipe evaporator section, simultaneously and use these radiating fins a large amount of heat of liquefactions are distributed.
As shown in Figure 1, be known a kind of heat-pipe radiating apparatus, comprise one and can be installed in the heat pipe 2 that heat pipe seat 1, on the electronic component (figure do not show) is the U font, and most radiating fins 3.This heat pipe 2 have one be flat and be welded in evaporator section 201 on this heat pipe seat 1, two can be for the condensation segment 202 of these radiating fins 3 installings, and two bending segments 203 that are connected between this evaporator section 201 and these condensation segments 202.
Though this kind heat-pipe radiating apparatus changes by the vapour that fills in the heat-conduction medium in this evaporator section 201, liquid binary states, can produce radiating effect to this electronic component,, in actual fabrication, when using, this heat-pipe radiating apparatus but has following defective:
One, this evaporator section 201 can only lean on the pressing area of fraction to contact with this heat pipe seat 1, and therefore, its heat-conductive characteristic is not good.
Two; because the restriction of computer inner space; this heat pipe 2 has the size restrictions L of a maximum usually; in addition; because these bending segments 203 also have the restriction (usually minimum bend radius R equals 2～3 times of heat pipe caliber) of minimum bend radius R; therefore; in fact this evaporator section 201 only has size restrictions L to deduct the size (being W=L-2R) of twice minimum bend radius R with the straight line contact range W of this heat pipe seat 1; so; not only can cause the area of this evaporator section 201 to be subjected to the restriction of minimum bend radius R; more can cause the area of the area of this evaporator section 201, and be unfavorable for heat conducting circulative metabolism much smaller than these condensation segments 202.
Three, this evaporator section 201 is to be squeezed into flat, thereby can destroy the capillary structure of these heat pipe 2 inside, and then has influence on the backflow effect after this heat-conduction medium liquefaction, causes the heat-conductive characteristic of this heat pipe 2 not good.
Four, this heat-conduction medium must just can diffuse to these condensation segments 202 or be back to this evaporator section 201 by these bending segments 203 of intimate 90 degree of bending angle, therefore, heat-conduction medium can meet with sizable flow resistance by these bending segments 203 time, and R is more little for crooked process radius, flow resistance is big more, and is unfavorable for the heat conduction.
Five, this heat pipe 2 more needs could form this bending segment 203 via twice bending operation except need flatten this evaporator section 201.
As shown in Figure 2, be known another kind of heat-pipe radiating apparatus, comprise one and can be installed in the heat pipe 5 that heat pipe seat 4, two on the electronic component (figure do not show) is the U font, and most radiating fins 6.This heat pipe seat 4 has two can be for the straight-line groove 401 of these heat pipe 5 installings, these heat pipes 5 have an evaporator section 501, two that can be fixedly arranged in these straight-line grooves 401 respectively can reach two bending segments 503 that are connected between this evaporator section 501 and these condensation segments 502 for the condensation segment 502 of these radiating fin 6 installings.Though this kind heat-pipe radiating apparatus can slightly increase the contact area of these evaporator sections 501 and this heat pipe seat 4 by the setting of these straight-line grooves 401, and avoid these evaporator sections 501 destruction capillary structure that is crushed, yet, in addition, this kind heat-pipe radiating apparatus also can produce the defective identical with above-mentioned heat-pipe radiating apparatus, and be unfavorable for heat conduction, for example the straight line contact range of these evaporator sections 501 and this heat pipe seat 4 also can be subject to the minimum bend radius of these bending segments 503, heat-conduction medium also can suffer from sizable flow resistance by these bending segments 503 time, and these heat pipes 5 also need could form these bending segments 503 or the like via twice bending operation.
As shown in Figure 3, be known another kind of heat-pipe radiating apparatus, comprise heat pipe seat 7, two heat pipes 8 that can be installed on the electronic component (figure does not show), and most radiating fins 9.This heat pipe seat 7 has two and is the groove 701 that is horizontally disposed with and can supplies these heat pipes 8 to install, these heat pipes 8 have one respectively and are and are horizontally disposed with and can be fixedly arranged on evaporator section 801 in these straight-line grooves 701, two and be vertical setting and can be for the condensation segment 802 of these radiating fins 9 installings with respect to this evaporator section 801, and the two bent angle sections 803 that are connected between this evaporator section 801 and these condensation segments 802.
Though this kind heat-pipe radiating apparatus also can increase the contact area of these evaporator sections 801 and this heat pipe seat 7 by the setting of these grooves 701, and avoid these evaporator sections 801 destruction capillary structure that is crushed, yet in addition, this kind heat-pipe radiating apparatus but has following defective:
One, these condensation segments 802 are folder 90 degree angles with respect to this evaporator section 801, and form these bent angle sections 803, therefore, capillaries fabricated in these bent angle sections 803 often also can be destroyed because of violent bending distortion, and then have influence on the backflow effect that this heat-conduction medium liquefies, cause the heat-conductive characteristic of these heat pipes 8 not good.
Two, heat-conduction medium must by bending angle be 90 the degree these bent angle sections 803 just can diffuse to these condensation segments 802 or be back to this evaporator section 801, therefore, heat-conduction medium can meet with bigger flow resistance by these bending angles 803 time, and is unfavorable for the heat conduction.
Three, these heat pipes 8 more need just can make these condensation segments 802 perpendicular to this evaporator section 801 via twice bending operation except being bent to form this evaporator section 801.
Four, this heat pipe seat 4 must be offered symmetrically and be horizontally disposed these grooves 701, comes to set firmly for being horizontally disposed these evaporator sections 801, and therefore, this heat pipe seat 7 can take bigger area and space.
Summary of the invention
The object of the invention is to provide the manufacture method of the high heat pipe seat of the high heat pipe seat of a kind of heat conduction efficiency and a kind of heat conduction efficiency.
Technical scheme of the present invention is: a kind of heat pipe seat, be can be for heat pipe installing, this heat pipe has at least one evaporator section, and at least one condensation segment that is connected with this evaporator section, this evaporator section has at least one bend, an and caliber, this bend has a radius of curvature, this heat pipe seat comprises at least one coating pedestal, this coating pedestal has one and is parallel to a vertical plane of reference and coating groove that can ccontaining this evaporator section in fact, this coating groove has at least one correspondence in this radius of curvature and be parallel to the coating radius of curvature of this vertical plane of reference in fact, and a groove width corresponding to this caliber.
The manufacture method of heat pipe seat of the present invention comprises: one, prepare a workpiece.Two, cut this workpiece, make this workpiece form a coating groove that has at least one radius of curvature and be parallel to a vertical plane of reference in fact.
The present invention compared with prior art, has following advantage: one, because the coating radius of curvature and the groove width of this coating groove are radius of curvature and this calibers that corresponds respectively to this evaporator section, and the gash depth of this coating groove is more than or equal to this caliber, therefore, in the time of in this evaporator section is installed in this coating groove, the contact area of this evaporator section and this coating groove can reach maximization, and can significantly promote heat-conductive characteristic.
Two, heat pipe compared to known technology can form the bending segment that can't contact with these heat pipe seats and also can't supply these radiating fins installings, the coating groove of heat pipe seat of the present invention is the whole bending radian that can coat this evaporator section, therefore, the whole length of this heat pipe all can the generation effect, can't not contact and also can't supply the invalid bending segment of radiating fin installing with heat pipe seat and can not produce fully, in addition, because this evaporator section letter covers all bending parts of this heat pipe, therefore, the length of this evaporator section and area can't be limited by the minimum bend radius of bending segment as known technology, so, this evaporator section and these condensation segments can not produce area difference apart from excessive problem, and help heat conducting circulative metabolism.
Three, the evaporator section of the heat pipe that is used with heat pipe seat of the present invention need not flatten, and under identical heat radiation size restrictions, the radius of curvature of this evaporator section can reach maximum, and can not produce as the too small bending segment of known technology radius of curvature, or as the continuous bent angle section of known technology on two orthogonal planes, therefore, the capillary structure of this inside heat pipe is subjected to bending the destruction minimum that processing procedure produces, the radius of curvature of this evaporator section is obviously greater than the radius of curvature of known bending segment or bent angle section again, be with, can directly flow to these condensation segments after the heat-conduction medium vaporization from this evaporator section, also can directly flow to this evaporator section after the heat-conduction medium liquefaction simultaneously from these condensation segments, therefore, heat-conduction medium can't meet with excessive flow resistance when mobile, and helps the heat conduction.
Four, the evaporator section of the heat pipe that is used with heat pipe seat of the present invention need not flatten, and need not be bent to form known bending segment or bent angle section between this evaporator section and these condensation segments, therefore, compared to the heat pipe of known technology, this heat pipe only needs to form this evaporator section and can finish making through bending operation together.
Five, the coating groove of heat pipe seat of the present invention is to be parallel to this vertical plane of reference and to be formed on this coating pedestal, is not to be to be horizontally disposed with, and therefore, heat pipe seat of the present invention does not more take up space, and helps the arrangement of computer inner space.
In addition, what deserves to be mentioned is, when heat pipe seat of the present invention and known heat pipe were used, certainly, this coating groove also can form the two curved arc sections corresponding to these bending segments, an and flat segments corresponding to this evaporator section, only, compared to known technology, this coating groove is except can coating this evaporator section, still can further coat these bending segments, and produce preferable thermal conduction effect.
Description of drawings
Accompanying drawing 1 is the schematic side view of known a kind of heat-pipe radiating apparatus;
Accompanying drawing 2 is schematic perspective views of known another kind of heat-pipe radiating apparatus;
Accompanying drawing 3 is perspective exploded view of known another kind of heat-pipe radiating apparatus;
Accompanying drawing 4 is one first preferred embodiment of heat pipe seat of the present invention and the perspective exploded view of a heat pipe;
The solid combination schematic diagram of accompanying drawing 5 these first preferred embodiments and this heat pipe;
The combination cross-sectional schematic of accompanying drawing 6 these first preferred embodiments and this heat pipe;
Accompanying drawing 7 is a kind of manufacturing process schematic diagrames of this first preferred embodiment;
Accompanying drawing 8 is that the another kind of this first preferred embodiment is made schematic diagram;
Accompanying drawing 9 is one second preferred embodiment of heat pipe seat of the present invention and the solid combination schematic diagram of a heat pipe;
Accompanying drawing 10 is one the 3rd preferred embodiment of heat pipe seat of the present invention and the solid combination schematic diagram of number heat pipe;
Accompanying drawing 11 is one the 4th preferred embodiment of heat pipe seat of the present invention and the solid combination schematic diagram of number heat pipe;
Accompanying drawing 12 is one the 5th preferred embodiment of heat pipe seat of the present invention and the solid combination schematic diagram of a heat pipe;
Wherein: 1, heat pipe seat; 2, heat pipe; 201, evaporator section; 202, condensation segment; 203, bending segment; 3, radiating fin; L, size restrictions; R, crooked process radius; W, contact range; 4, heat pipe seat; 401, straight-line groove; 5, heat pipe; 501, evaporator section; 502, condensation segment; 503, bending segment; 6, radiating fin; 7, heat pipe seat; 701, groove; 8, heat pipe; 801, evaporator section; 802, condensation segment; 803, bent angle section; 9, radiating fin; 200, heat pipe; 210, evaporator section; 220, condensation segment; 230, radiating fin; D, caliber; R1, radius of curvature; 300, workpiece; 310, partly; 400, circular saw blade; 10, coat pedestal; 11, coat groove; 12, end face; 13, contact baseplane; 20, base body; 21, end face; 22, contact baseplane; 30, base body; 31, end face; 32, contact baseplane; 40, coating unit; 41, coat pedestal; 411, involutory surface; 412, contact baseplane; 42, groove; X, the vertical plane of reference; R2, coating radius of curvature; W, groove width; Z, gash depth;
The specific embodiment
About addressing other technologies content, characteristics and effect before the present invention, in the following detailed description that cooperates with reference to five graphic preferred embodiments, can clearly understand.
Before proposing detailed description, be noted that in the following description similar elements is to represent with identical numbering.
Referring to accompanying drawing 4-accompanying drawing 6, one first preferred embodiment for heat pipe seat of the present invention, this heat pipe seat is can be for a heat pipe 200 installings, this heat pipe 200 has an evaporator section 210 that is filled with heat-conducting substance, and two is connected with this evaporator section 210 and the condensation segment 220 that can install for the radiating fin 230 of majority, and this evaporator section 210 is to be made of a bend, and has a caliber D and a radius of curvature R 1, this heat pipe seat comprises: one coats pedestal 10, and a base body 20.
This coating pedestal 10 has one and is parallel to a vertical plane of reference X and coating groove 11 that can ccontaining this evaporator section 210 in fact, this coating groove 11 has one corresponding to this radius of curvature R 1 and be parallel to coating radius of curvature R 2, the groove width W corresponding to this caliber D of this vertical plane of reference X in fact, and a gash depth Z of 1/2nd who is not less than this caliber D.In the present embodiment, this gash depth Z is more than or equal to this caliber D.
This base body 20 has an end face 21, and a contact baseplane 22 that can be installed in contrast to this end face 21 on the electronic component (figure does not show).In the present embodiment, this coating pedestal 10 is to be integrally formed on the end face 21 of this base body 20, and certainly, this coats pedestal 10 also can separate making with this base body 20, and then is fixed on the end face 21 of this base body 20.
Referring to accompanying drawing 7, the preferred embodiment of the manufacture method of heat pipe seat of the present invention is to comprise following steps:
One, prepare a workpiece 300, in the present embodiment, this workpiece 300 is to extrude shaping with copper material, and this workpiece 300 has this base body 20, and is formed at the coating pedestal 10 on the end face 21 of this base body 20.
Two, this workpiece 300 is cut into predetermined length.
Three, cut this workpiece 300, make this workpiece 300 form this coating groove 11 with this coating radius of curvature R 2, in the present embodiment, be an end face 12 that utilizes a circular saw blade 400 these coating pedestals 10 of cutting, and make this coating pedestal 10 form this coating groove 11.
Four, it is thick at the meat of these coating groove 11 both sides the radian that should coat groove 11 to be excised this coating pedestal 10.
In addition, as shown in Figure 8, heat pipe seat of the present invention also can be made by following manufacture method:
One, prepares the rectangular workpiece 300 in a cross section.
Two, this workpiece was cut into predetermined length in 300 years.
Three, cut this workpiece 300, make this workpiece 300 form this coating groove 11.
Four, excise the part 310 of this workpiece 300, make this workpiece 300 form this base body 20 and this coating pedestal 10 in these coating groove 11 both sides.
Five, it is thick at the meat of these coating groove 11 both sides the radian that should coat groove 11 to be excised this coating pedestal 10.
Whereby, shown in accompanying drawing 4-accompanying drawing 6, this heat pipe 200 only needs to form this evaporator section 210 that is the Curved Continuous arcuation through bending operation together, can be used with heat pipe seat of the present invention, and in this evaporator section 210 is installed in this coating groove 11 time, because the coating radius of curvature R 2 and the groove width W of this coating groove 11 are the radius of curvature R 1 and this caliber D that correspond respectively to this evaporator section 210, and the gash depth Z of this coating groove 11 is more than or equal to this caliber D, therefore, this evaporator section 210 can reach maximization with the contact area of this coating groove 11, and can effectively promote heat-conductive characteristic.
As shown in Figure 9, be one second preferred embodiment of the present invention, this second preferred embodiment is similar this first preferred embodiment, and its difference part is:
This second preferred embodiment only comprises this coating pedestal 10, and this coating pedestal has a contact baseplane 13 that can be installed in contrast to this coating groove 11 on the electronic component (figure does not show).So, this second preferred embodiment more can further reduce institute and take up space except can reaching purpose and effect identical with above-mentioned first preferred embodiment.
As shown in Figure 10, be one the 3rd preferred embodiment of the present invention, the 3rd preferred embodiment is to be similar to this first preferred embodiment, and its difference part is:
The 3rd preferred embodiment is to comprise number to coat pedestal 10, and a base body 30.This base body 30 has an end face 31, and a contact baseplane 32 that can be installed in contrast to this end face 31 on the electronic component (figure does not show), and these coat pedestals 10 is to be arranged at intervals on the end face 31 of this base body 30.So, the 3rd preferred embodiment also can reach purpose and the effect identical with above-mentioned first preferred embodiment.
As shown in Figure 11, be one the 4th preferred embodiment of the present invention, the 4th preferred embodiment is to be similar to this first preferred embodiment, and its difference part is:
The 4th preferred embodiment is to comprise number and the coating pedestal 10 that is close together and these to coat pedestal 10 be to have a contact baseplane 13 that can be installed in contrast to this coatings groove 11 on the electronic component (scheming not show) respectively.So, the 4th preferred embodiment also can reach purpose and the effect identical with above-mentioned first preferred embodiment.
Shown in accompanying drawing 12,13, be one the 5th preferred embodiment of the present invention, the 5th preferred embodiment is to be similar to this first preferred embodiment, its difference part is:
The 5th preferred embodiment comprises a coating unit 40, and this coating unit 40 has two and coats pedestals 41, and one can ccontaining this evaporator section 210 coating groove 42.These coat pedestals 41 have one respectively can be to the involutory surface 411 that lumps together, an and contact baseplane 412 that can be installed in contrast to this coatings groove 42 on the electronic component (scheming not show).This coating groove 42 is to be formed between these involutory surfaces 411, and also has a coating radius of curvature R 2 corresponding to this radius of curvature R 1, and a groove width W corresponding to this caliber D.
So, because this coating groove 42 can coat this evaporator section 210 fully, therefore, the 5th preferred embodiment more can produce better heat-conductive characteristic except can reaching purpose and effect identical with above-mentioned first preferred embodiment.
In addition, the configuration variation that the 5th preferred embodiment also can be correlated with as above-mentioned first and third, four preferred embodiments certainly, for example this coating unit 40 is arranged on the base body, or several coating units 40 are arranged at intervals on the base body, also or with several coating units 40 and be close together.
Conclude above-mentionedly, the present invention's heat pipe seat and manufacture method thereof not only have good heat-conductive characteristic, more can effectively improve many disappearances of known heat pipe, so can reach the purpose of invention really.
The above person of thought, only for the present invention's preferred embodiment, when the scope that can not limit the invention process with this, promptly the simple equivalent of being done according to the present patent application claim and invention description content generally changes and modifies, and all still belongs in the scope that patent of the present invention contains.
Claims (22)
1, a kind of heat pipe seat, this heat pipe has at least one evaporator section, and the condensation segment that is connected with this evaporator section at least, this evaporator section has at least one bend, an and caliber, this bend has radius of curvature, it is characterized in that: this heat pipe seat comprises: at least one coating pedestal, have one and be parallel to a vertical plane of reference and coating groove that can ccontaining this evaporator section in fact, this coating groove has at least one correspondence in this radius of curvature and be parallel to the coating radius of curvature of this vertical plane of reference in fact, and a groove width corresponding to this caliber.
2, heat pipe seat according to claim 1 is characterized in that: this coating groove has more a gash depth of 1/2nd that is not less than this caliber.
3, heat pipe seat according to claim 1 is characterized in that: more comprise a base body, this base body has an end face, and a contact baseplane in contrast to this end face, and this coating pedestal is to be arranged on this end face.
4, heat pipe seat according to claim 3 is characterized in that: this coating pedestal is to be integrally formed on the end face of this base body.
5, heat pipe seat according to claim 1 is characterized in that: this coating pedestal has more a contact baseplane in contrast to this coating groove.
6, heat pipe seat according to claim 1 is characterized in that: comprise number and coat pedestal.
7, heat pipe seat according to claim 6 is characterized in that: more comprise a base body, this base body has an end face, and a contact baseplane in contrast to this end face, and these coat pedestal is to be arranged on the end face of this base body.
8, heat pipe seat according to claim 7 is characterized in that: these coat pedestal is to be arranged at intervals on the end face of this base body.
9, heat pipe seat according to claim 6 is characterized in that: these coating pedestals are and are close together, and these coating pedestals have a contact baseplane in contrast to this coating groove more respectively.
10, a kind of manufacture method of heat pipe seat comprises:
(A) prepare a workpiece; And
(B) cut this workpiece, make this workpiece form a coating groove that has at least one radius of curvature and be parallel to a vertical plane of reference in fact.
11, the manufacture method of heat pipe seat according to claim 10 is characterized in that: in step (A), this workpiece is to extrude shaping with copper material, and this workpiece has a base body, and a coating pedestal that is formed on the end face of this base body.
12, the manufacture method of heat pipe seat according to claim 11 is characterized in that: in step (B), cut an end face of this coating pedestal, make this coating pedestal form this coating groove.
13, the manufacture method of heat pipe seat according to claim 12 is characterized in that: in step (B), utilize a circular saw blade to cut the end face of this coating pedestal, make this coating pedestal form this coating groove.
14, the manufacture method of heat pipe seat according to claim 10 is characterized in that: more comprise a step (A1) between step (A), (B), in step (A1), this workpiece is cut into predetermined length.
15, the manufacture method of heat pipe seat according to claim 10 is characterized in that: more comprise one in step (B) step (C) afterwards, in step (C), excise the part of this workpiece in these coating groove both sides.
16, a kind of heat pipe seat is can be for heat pipe installing, and this heat pipe has at least one evaporator section, and at least one condensation segment that is connected with this evaporator section, this evaporator section has at least one bend, and a caliber, this bend has a radius of curvature, it is characterized in that: this heat pipe seat comprises:
At least one coating unit, have two and coat pedestal, and one can ccontaining this evaporator section the coating groove, these coating pedestals have one respectively can be to the involutory surface that lumps together, this coating groove is to be formed between these involutory surfaces, and have the coating radius of curvature of at least one correspondence in this radius of curvature, reach a groove width corresponding to this caliber.
17, heat pipe seat according to claim 16 is characterized in that: these coat pedestal and have a contact baseplane in contrast to this coating groove more respectively.
18, heat pipe seat according to claim 16 is characterized in that: more comprise a base body, this base body has an end face, and a contact baseplane in contrast to this end face, and this coating unit is to be arranged on this end face.
19, heat pipe seat according to claim 16 is characterized in that: comprise several coating units.
20, heat pipe seat according to claim 19 is characterized in that: more comprise a base body, this base body has an end face, and a contact baseplane in contrast to this end face, and these coating units are to be arranged on the end face of this base body.
21, heat pipe seat according to claim 20 is characterized in that: these coating units are to be arranged at intervals on the end face of this base body.
22, heat pipe seat according to claim 19 is characterized in that: these coating units are and are close together, and the coating pedestal of these coating units has a contact baseplane in contrast to this coating groove more respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100412159A CN100368756C (en) | 2005-07-25 | 2005-07-25 | Heat pipe seat and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100412159A CN100368756C (en) | 2005-07-25 | 2005-07-25 | Heat pipe seat and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1719181A true CN1719181A (en) | 2006-01-11 |
| CN100368756C CN100368756C (en) | 2008-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100412159A Expired - Fee Related CN100368756C (en) | 2005-07-25 | 2005-07-25 | Heat pipe seat and its manufacturing method |
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| Country | Link |
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| CN (1) | CN100368756C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3225946A1 (en) * | 2016-03-31 | 2017-10-04 | Hoya Candeo Optronics Corporation | Heat radiating apparatus and light illuminating apparatus with the same |
| CN112344779A (en) * | 2020-11-12 | 2021-02-09 | 上海卫星装备研究所 | Ultra-small bending radius channel heat pipe and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101817103B (en) * | 2010-04-09 | 2012-06-27 | 上海锐迈重工有限公司 | Tube base machining method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE29806082U1 (en) * | 1998-04-02 | 1998-06-18 | Ideal Electronics Inc., San Chung, Taipei | Cooling device for a central processing unit |
| TW510532U (en) * | 2001-07-25 | 2002-11-11 | Wen-Chen Wei | Flexible heat tube structure |
| CN1492298A (en) * | 2002-10-24 | 2004-04-28 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe type radiator and its producing method |
| CN2605665Y (en) * | 2003-02-18 | 2004-03-03 | 鸿富锦精密工业（深圳）有限公司 | Heat-tube radiating device |
| CN2641700Y (en) * | 2003-09-09 | 2004-09-15 | 大同股份有限公司 | Radiator |
| CN2664184Y (en) * | 2003-11-17 | 2004-12-15 | 鸿富锦精密工业（深圳）有限公司 | Heat sink |
| DE202004016243U1 (en) * | 2004-10-20 | 2005-04-14 | Chen, Shyh-Ming, Shulin | Heat distributor, to spread the exhaust heat at central computer units and electronic appliances, has ribs supported on heat conductive tubes in grooves at the seat by concave units at their bottom edges |
-
2005
- 2005-07-25 CN CNB2005100412159A patent/CN100368756C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3225946A1 (en) * | 2016-03-31 | 2017-10-04 | Hoya Candeo Optronics Corporation | Heat radiating apparatus and light illuminating apparatus with the same |
| US10119759B2 (en) | 2016-03-31 | 2018-11-06 | Hoya Candeo Optronics Corporation | Heat radiating apparatus and light illuminating apparatus with the same |
| CN112344779A (en) * | 2020-11-12 | 2021-02-09 | 上海卫星装备研究所 | Ultra-small bending radius channel heat pipe and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100368756C (en) | 2008-02-13 |
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