CN1718391A - Method of treating bamboo floor using plasma - Google Patents
Method of treating bamboo floor using plasma Download PDFInfo
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- CN1718391A CN1718391A CN 200510040861 CN200510040861A CN1718391A CN 1718391 A CN1718391 A CN 1718391A CN 200510040861 CN200510040861 CN 200510040861 CN 200510040861 A CN200510040861 A CN 200510040861A CN 1718391 A CN1718391 A CN 1718391A
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- bamboo
- bamboo chip
- plasma treatment
- hot pressing
- plasma
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- Chemical And Physical Treatments For Wood And The Like (AREA)
Abstract
A method for treating bamboo floor boards by plasma includes such steps as drying bamboo strips, plasma treating to make its surface wet angle less than 25 deg, coating resin, laminating and hot pressing.
Description
Technical field
What the present invention relates to is a kind of method with plasma treatment bamboo floor, and the bamboo floor after plasma treatment is a kind of floor of high bonding strength.Belong to the flooring material technical field.
Background technology
The bamboo floor is to be the pavement that raw material is made with the bamboo wood, because bamboo has attractive in appearance, nice and cool characteristics such as durable are subjected to consumer's favor deeply.But because the moistened surface angle of the surf green of bamboo and tabasheer is big, wettability is poor, is difficult for gluing and covering with paint, causes floor surface covering with paint performance bad poor with glue performance.If remove surf green and tabasheer fully in the floor strip process, then hollow, the wall owing to bamboo is thin, so will cause a large amount of waste of bamboo chip for removing surf green and tabasheer when being processed into floor strip.Therefore, there are problems such as production cost height, glue performance instability and top finishing poor performance in the bamboo floor.
Summary of the invention
The objective of the invention is by bamboo chip is carried out plasma treatment, the surf green on bamboo chip surface and the angle of wetting of tabasheer are reduced, improve the surface wettability of bamboo chip, thereby effectively overcome problems such as bamboo chip glue performance that prior art exists and top finishing poor performance.
Technical solution of the present invention: with the method on plasma treatment bamboo floor, its processing step divides one, drying; Two, plasma treatment; Three, gluing assembly; Four, hot pressing.
Described drying process step 1 is that bamboo chip is dried under the condition of 60～80 ℃ of temperature, makes bamboo chip moisture content＜4%.
Described plasma treatment process step 2 is to handle the running parameter of plasma: power output 20W by cold plasma; Reflection power 0～1W; Vacuum 2～3Pa; Working gas O
2Processing time 10min makes bamboo chip moistened surface angle＜25 °.
Described gluing assembly processing step three is bamboo floors that three layers of structures or individual layer side are pieced together structure, its bamboo chip glue-spread, 300～350g/m
2Described three-decker is made up of three layers of vertical bamboo chip.Described individual layer side is pieced together structure and is formed to bamboo chip by individual layer is upright.
Described heat pressing process step 4 is hot press hot pressing to be passed through on the bamboo floor after gluing assembly technology, its hot pressing temperature: 110～125 ℃, and hot pressing time: 1.1min/mm, pressure: 2～3MPa/cm
2, make slab become floor strip.
Advantage of the present invention
Because bamboo chip has carried out plasma treatment, make the angle of wetting on bamboo chip surface reduce to 25 ° from 70 °, improved the wetability of bamboo chip greatly to adhesive, make bamboo chip also can glue together well with urea-formaldehyde resin adhesive, the glue performance coefficient of variation under the condition that surf green and tabasheer are arranged reduces to 12.4% from 115%; The glue performance coefficient of variation also can reduce to 9% from 39% under the condition of no surf green and tabasheer, thereby reaches the uniformity that improves whole bamboo floor bonding quality, improves the purpose of bonding strength and surface wettability, improves the utilization rate of bamboo wood.
Description of drawings
Accompanying drawing 1 is the bamboo floor panel structure schematic diagram that three layers of vertical bamboo chip are formed
Accompanying drawing 2 is the upright bamboo floor panel structure schematic diagrames formed to bamboo chip of individual layer
Among the figure 1 is vertical bamboo chip, the 2nd, and be upright to bamboo chip.
The specific embodiment
Embodiment 1
Bamboo chip is dried under the condition of 60 ℃ of temperature, bamboo chip moisture content 3%.
Dried bamboo chip is by plasma treatment, the running parameter of plasma: power output 20W; Reflection power 0W; Vacuum 2Pa; Working gas O
2Processing time 10min makes 24 ° at bamboo chip moistened surface angle.
Bamboo chip after plasma treatment enters gluing assembly processing step, and the bamboo blank plate that its three-decker is made up of three layers of vertical bamboo chip, bamboo chip are coated with urea-formaldehyde resin adhesive (model NQTRH), glue-spread 300g/m
2
Will be through the bamboo blank plate after the gluing assembly technology by hot press hot pressing, hot pressing temperature: 110 ℃, hot pressing time: 1.1min/mm, pressure: 2MPa/cm
2
Bamboo floor bonding strength after the hot pressing can improve 30%.
Embodiment 2
Bamboo chip is dried under the condition of 80 ℃ of temperature, makes bamboo chip moisture content 3.5%.
Dried bamboo chip is by plasma treatment, the running parameter of plasma: power output 20W; Reflection power 1W; Vacuum 3Pa; Working gas O
2Processing time 10min makes 23 ° at bamboo chip moistened surface angle.
Bamboo chip after plasma treatment enters gluing assembly processing step, and its structure is by the upright bamboo blank plate of forming to bamboo chip of individual layer, and bamboo chip is coated with urea-formaldehyde resin adhesive (model NQTRH), glue-spread 350g/m
2
Bamboo blank plate behind coating technique passes through hot press hot pressing, hot pressing temperature: 125 ℃, and hot pressing time: 1.1min/mm, pressure: 3MPa/cm
2
Bamboo floor bonding strength after the hot pressing can improve 30%.
Claims (2)
1, with the method on plasma treatment bamboo floor, the processing step that it is characterized in that it divides one, drying; Two, plasma treatment; Three, gluing assembly; Four, hot pressing;
Described drying process step 1 is that bamboo chip is dried under the condition of 60～80 ℃ of temperature, makes bamboo chip moisture content＜4%;
Described plasma treatment process step 2 is by plasma treatment, the running parameter of plasma: power output 20W; Reflection power 0～1W; Vacuum 2～3Pa; Working gas O
2Processing time 10min makes bamboo chip moistened surface angle＜25 °;
Described gluing assembly processing step three is bamboo floors of three layers of structures or single layer structure, and its bamboo chip is coated with urea-formaldehyde resin adhesive, glue-spread 300～350g/m
2
Described heat pressing process step 4 is the bamboo blank plate after gluing assembly technology to be passed through hot press hot pressing, hot pressing temperature: 110～125 ℃, and hot pressing time: 1.1min/mm, pressure: 2～3MPa/cm
2
2, the method with plasma treatment bamboo floor according to claim 1 is characterized in that three-decker is made up of three layers of vertical bamboo chip, and the individual layer side is pieced together structure and formed to bamboo chip by individual layer is upright.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100408613A CN1296186C (en) | 2005-07-01 | 2005-07-01 | Method of treating bamboo floor using plasma |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100408613A CN1296186C (en) | 2005-07-01 | 2005-07-01 | Method of treating bamboo floor using plasma |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1718391A true CN1718391A (en) | 2006-01-11 |
| CN1296186C CN1296186C (en) | 2007-01-24 |
Family
ID=35930393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100408613A Expired - Fee Related CN1296186C (en) | 2005-07-01 | 2005-07-01 | Method of treating bamboo floor using plasma |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1296186C (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528893A (en) * | 2012-03-09 | 2012-07-04 | 江西康替龙竹业有限公司 | Method for preparing environment-friendly bamboo recombinant material |
| CN104608210A (en) * | 2015-02-10 | 2015-05-13 | 国际竹藤中心 | Manufacturing method for plywood bamboo nail plates |
| CN104608209A (en) * | 2015-02-10 | 2015-05-13 | 国际竹藤中心 | Manufacturing method for universal bending glued bamboo laminate board |
| CN105500487A (en) * | 2015-12-28 | 2016-04-20 | 南京林业大学 | Manufacturing method of paint-free water-proof blade of wood curtain |
| CN107336322A (en) * | 2017-08-07 | 2017-11-10 | 安徽温禾新材料科技股份有限公司 | A kind of production technology of the bamboo flooring base material of cold plasma processing |
| CN107775758A (en) * | 2017-09-08 | 2018-03-09 | 安徽至信竹业科技有限公司 | A kind of processing method for improving bamboo clappers surface bonding performance |
| CN109177631A (en) * | 2018-09-14 | 2019-01-11 | 广德竹之韵工艺品厂 | A kind of production method of bamboo-root carving |
| WO2020155155A1 (en) * | 2019-02-02 | 2020-08-06 | 海宁优腾建材科技有限公司 | Bonding member for use in flooring, flooring, and method for manufacturing flooring |
| CN114571552A (en) * | 2022-03-09 | 2022-06-03 | 阜南佳利工艺品股份有限公司 | Bamboo gluing forming process for improving gluing strength of bamboo |
| CN116442331A (en) * | 2023-04-11 | 2023-07-18 | 千年舟新材科技集团股份有限公司 | Super-strong plate and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1093314A (en) * | 1993-04-08 | 1994-10-12 | 陈瑞晃 | The production method of bamboo plywood and prepared product |
| JP3658596B2 (en) * | 1997-04-30 | 2005-06-08 | タキロン株式会社 | Flooring |
| CN1189292C (en) * | 2002-05-24 | 2005-02-16 | 浙江省林业科学研究院 | Production process of recombined bamboo-gluing board |
| CN100341685C (en) * | 2004-11-30 | 2007-10-10 | 米仕明 | Method for producing bamboo floor and decorative plate |
-
2005
- 2005-07-01 CN CNB2005100408613A patent/CN1296186C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528893A (en) * | 2012-03-09 | 2012-07-04 | 江西康替龙竹业有限公司 | Method for preparing environment-friendly bamboo recombinant material |
| CN104608210A (en) * | 2015-02-10 | 2015-05-13 | 国际竹藤中心 | Manufacturing method for plywood bamboo nail plates |
| CN104608209A (en) * | 2015-02-10 | 2015-05-13 | 国际竹藤中心 | Manufacturing method for universal bending glued bamboo laminate board |
| CN105500487A (en) * | 2015-12-28 | 2016-04-20 | 南京林业大学 | Manufacturing method of paint-free water-proof blade of wood curtain |
| CN107336322A (en) * | 2017-08-07 | 2017-11-10 | 安徽温禾新材料科技股份有限公司 | A kind of production technology of the bamboo flooring base material of cold plasma processing |
| CN107775758A (en) * | 2017-09-08 | 2018-03-09 | 安徽至信竹业科技有限公司 | A kind of processing method for improving bamboo clappers surface bonding performance |
| CN109177631A (en) * | 2018-09-14 | 2019-01-11 | 广德竹之韵工艺品厂 | A kind of production method of bamboo-root carving |
| WO2020155155A1 (en) * | 2019-02-02 | 2020-08-06 | 海宁优腾建材科技有限公司 | Bonding member for use in flooring, flooring, and method for manufacturing flooring |
| CN112888754A (en) * | 2019-02-02 | 2021-06-01 | 海宁优腾建材科技有限公司 | Adhesive part for floor, floor and manufacturing method of floor |
| CN114571552A (en) * | 2022-03-09 | 2022-06-03 | 阜南佳利工艺品股份有限公司 | Bamboo gluing forming process for improving gluing strength of bamboo |
| CN114571552B (en) * | 2022-03-09 | 2023-01-24 | 阜南佳利工艺品股份有限公司 | Bamboo gluing forming process for improving bamboo gluing strength |
| CN116442331A (en) * | 2023-04-11 | 2023-07-18 | 千年舟新材科技集团股份有限公司 | Super-strong plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1296186C (en) | 2007-01-24 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yixing Lion-King Timber Industry Co., Ltd. Assignor: Nanjing Forestry University Contract fulfillment period: 2008.3.20 to 2014.3.19 contract change Contract record no.: 2009320000245 Denomination of invention: Method of treating bamboo floor using plasma Granted publication date: 20070124 License type: Exclusive license Record date: 2009.3.6 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.3.20 TO 2014.3.19; CHANGE OF CONTRACT Name of requester: YIXING LION-KING TIMBER INDUSTRY CO.,LTD Effective date: 20090306 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070124 Termination date: 20140701 |
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| EXPY | Termination of patent right or utility model |