CN1676298A - Method for manufacturing regenerative board from base board material granule of waste printed circuit board - Google Patents
Method for manufacturing regenerative board from base board material granule of waste printed circuit board Download PDFInfo
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- CN1676298A CN1676298A CN 200510023786 CN200510023786A CN1676298A CN 1676298 A CN1676298 A CN 1676298A CN 200510023786 CN200510023786 CN 200510023786 CN 200510023786 A CN200510023786 A CN 200510023786A CN 1676298 A CN1676298 A CN 1676298A
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Abstract
The present invention relates to a production method of baseplate material granule regenerated plate material of waste and old printed circuit board. Said method includes the following steps: firstly, uniformly mixing the baseplate material granules of waste and old printed circuit board and solidifying agent, placing them into a forming mould and compacting, in which the solidifying agent adopts urea-formaldehyde molding powder, waste and old polyethylene plastics or their mixture, in the mixed material of baseplate material granules and solidifying agent the weight percentage of baseplate material granules is 90-100%, and the weight percentage of solidifying agent is 0-10%, then in the course of heating mould progressively increasing pressure, heat-insulating for 10-15 min under the pressure of 20-70 MPa, switching off power supply, cooling to below 100 deg.C, releasing pressure and demoulding so as to obtain the invented product.
Description
Technical field
The present invention relates to a kind of manufacture method of regenerated plates, the baseplate material of waste and old printed circuit board is carried out recycling, the sheet material of preparation can be used as insulating materials, furniture and building and ornament materials.Belong to trade waste processing, resource technology field in the environmental protection technical field.
Background technology
Novel solid discarded object-electron wastes appears in the high speed development along with electronic information industry: comprise electronic instrument that various waste computers, communication equipment, television set, refrigerator, washing machine and unit eliminate etc.Estimate that according to the expert surplus the electrical equipment about 2800 such as the refrigerator that China scraps present every year, washing machine, computer, air-conditioning ten thousand, waste electronic electrical equipment total amount reaches 1,000,000 tons, and wherein printed circuit board (PCB) accounts for 4% of total amount greatly.
Contain tens kinds of metals that recovery value is higher such as copper, gold, silver, palladium in the waste and old printed circuit board (PCB).As containing copper (Cu), gold (Au), silver (Ag), palladium valuable metals such as (Pd) in the waste mobile phone circuit board, its content is: contain golden 280g/t, silver-colored 2kg/t, copper 1000g/t, palladium 100g/t.The gold content grade of gold mine is low to moderate 3g/t also extraction value, even the concentrate that obtains through ore dressing also has only about 70g/t.The average grade of China platinum group metal has only 0.4g/t, the grade 0.6-23g/t of world's platinum-group metal ores, and copper mine, silver ore do not reach above-mentioned content yet.
In printed circuit board (PCB), the content of metal is up to 40%, and the rich ore tenor of occurring in nature 3-5% only.Maximum is copper, also has gold, aluminium, nickel, lead, silicon metal etc. in addition, wherein is no lack of rare metal.Have statistics to show, gold content reaches about 1000 grams in the waste and old circuit board per ton.Now, along with technological level improves, cost reduces, and still can extract the gold about 300 grams in the useless circuit board per ton, and market price is roughly equal to about 30,000 yuan.Therefore, " electronic waste ", the metal that wherein contains are tens times even hundred times of natural mineral reserve.At present, the emphasis of researcher research is mainly to concentrate in the recovery of rare in the waste and old printed circuit board, noble metal and valuable metal, and ignores the recovery and reuse problem of nonmetallic materials.
At present, metal and the nonmetallic materials that adopt in the broken method separation printed circuit board (PCB) mainly be the metal that reclaims wherein, and the baseplate material particle of waste and old printed circuit board are lost as rubbish more.Because the baseplate material of printed circuit board (PCB) (PCB), be difficult to fusing and dissolving as a kind of same with thermosetting compound material (SMC), on the other hand, comprise a large amount of inorganic constituents such as glass fibre in the same with thermosetting compound material, calorific value is lower, can't use the method for burning to handle.Landfill is the extensive at present main method of handling the waste and old printed circuit board substrate, loses but substrate is used as rubbish, can cause a large amount of wastings of resources and environmental pollution.Document " pyrolysis of printed circuit board waste and product analysis thereof " (Sun Lushi, Lu Jidong etc., " chemistry of fuel journal " the 3rd phase in 2002) and document " the pyrolysis experimental study of substrate for printed circuit board " (Peng Ke etc., " Techniques and Equipment for Environmental Pollution Control " 2004 the 5th phases) introduced with method for pyrolysis and handled waste and old printed circuit board.This method mainly is to make the macromolecular material in the printed circuit board (PCB) be cracked into little molecule alkane, can do fuel and industrial chemicals use after rationally reclaiming; Simultaneously inorganic matter such as glass fibre scarcely changes in the printed circuit board (PCB), still exists with the solid waste form.Owing in printed circuit board (PCB), contain a spot of macromolecule organic material, and in pyrolytic process, produce a lot of pernicious gases (can generate many bromos dibenzo dioxanes and PBDF) as PBDEs.Therefore, this method exists cost height, complex process, causes problems such as secondary environmental pollution, is not the optimal method of handling the baseplate material of waste and old printed circuit board.
Summary of the invention
The objective of the invention is at the deficiencies in the prior art; a kind of manufacture method of base plate material granules regeneration plate of waste and old printed circuit board is provided, and technology is simple, and is with low cost; the sheet material that makes has multiple practical value, realizes environmental protection and resource reutilization.
For realizing such purpose, the present invention adopts the hot extrusion technology to make the baseplate material particle thermosetting of waste and old printed circuit board turn to sheet material from regeneration and these two angles of environmental protection of resource.
In the method for the present invention, at first baseplate material particle and the curing agent with waste and old printed circuit board mixes, and is placed on compacting in the mould.Wherein, curing agent adopts urea-formaldehyde moulding powder, waste polyethylene plastics or their mixture, and the baseplate material grain diameter is 1mm-0.06mm, in the mixed material of baseplate material particle and curing agent, the percentage by weight of baseplate material particle is 90～100%, and the percentage by weight of curing agent is 0～10%.With mold heated to 150 ℃-300 ℃, increase pressure in the heating process gradually then, under 20～70Mpa pressure, be incubated 10～15 minutes, turn off power supply, make it cooling.To be cooled to below 100 ℃, unloading pressure, molding obtain desired regenerated plates.
The inventive method technology is simple, realizes that the regenerated plates for preparing can be used to make compoboard, floor tile, ornament materials, insulating materials, furniture, construction material etc., and is with low cost, economical and practical, has broad application prospects easily.Method of the present invention makes the baseplate material of waste and old printed circuit board reclaim becomes possibility, and environmental protection and resource reutilization are played a positive role.
The specific embodiment
Below further describe technical scheme of the present invention by specific embodiment.
Embodiment 1:
The baseplate material particle that with particle diameter is the waste and old printed circuit board of 1mm-0.06mm mixes.Then, be placed in the mould compacting.The heating-up temperature of mould is 250 ℃.Increase pressure in heating process gradually, insulation is 15 minutes under the pressure of 70Mpa, turns off power supply, begins to cool down.To be cooled to below 100 ℃, unloading pressure, molding.
Embodiment 2:
Be that the baseplate material particle of 90% waste and old printed circuit board and percentage by weight are that 10% urea-formaldehyde moulding powder mixes with percentage by weight, be placed on compacting in the mould then.The heating-up temperature of mould is 200 ℃.Increase pressure in heating process gradually, insulation is 10 minutes under the pressure of 50Mpa, turns off power supply, begins to cool down.To be cooled to below 100 ℃, unloading pressure, molding.
Embodiment 3:
Be that the baseplate material particle of 90% waste and old printed circuit board and percentage by weight are that 10% waste polyethylene plastics mix with percentage by weight, be placed on compacting in the mould then.The heating-up temperature of mould is 280 ℃.Increase pressure in heating process gradually, insulation is 15 minutes under the pressure of 60Mpa, turns off power supply, begins to cool down.To be cooled to below 100 ℃, unloading pressure, molding.
Embodiment 4:
Be that the baseplate material particle of 90% waste and old printed circuit board and percentage by weight are that 5% urea-formaldehyde moulding powder and percentage by weight are that 5% waste polyethylene plastics mix with percentage by weight, be placed on compacting in the mould then.The heating-up temperature of mould is 220 ℃.Increase pressure in heating process gradually, insulation is 13 minutes under the pressure of 65Mpa, turns off power supply, begins to cool down.To be cooled to below 100 ℃, unloading pressure, molding.
The sheet material of embodiment of the invention preparation has enough intensity and toughness, can make building and ornament materials such as furniture, compoboard, floor tile, also can be used as insulating materials.
Claims (1)
1, a kind of manufacture method of base plate material granules regeneration plate of waste and old printed circuit board, it is characterized in that at first the baseplate material particle and the curing agent of waste and old printed circuit board are mixed, be placed on compacting in the mould, wherein curing agent adopts urea-formaldehyde moulding powder, waste polyethylene plastics or their mixture, the baseplate material particle grain size is 1mm-0.06mm, in the mixed material of baseplate material particle and curing agent, the percentage by weight of baseplate material particle is 90～100%, and the percentage by weight of curing agent is 0～10%; With mold heated to 150 ℃-300 ℃, increase pressure in the heating process gradually then, be incubated 10～15 minutes under 20～70Mpa pressure, turn off power supply, to be cooled to below 100 ℃, unloading pressure, molding obtain regenerated plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510023786XA CN100467247C (en) | 2005-02-03 | 2005-02-03 | Method for manufacturing regenerative board from base board material granule of waste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510023786XA CN100467247C (en) | 2005-02-03 | 2005-02-03 | Method for manufacturing regenerative board from base board material granule of waste printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1676298A true CN1676298A (en) | 2005-10-05 |
| CN100467247C CN100467247C (en) | 2009-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB200510023786XA Active CN100467247C (en) | 2005-02-03 | 2005-02-03 | Method for manufacturing regenerative board from base board material granule of waste printed circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101250315B (en) * | 2008-03-18 | 2010-06-23 | 上海大学 | Utilization and processing method for substrate material of waste and old printed circuit board |
| CN101555356B (en) * | 2009-05-15 | 2010-07-28 | 宋金有 | Carbonized environment-friendly type sheet synthesized by waste PCB powder and resin fiber |
| CN101570626B (en) * | 2009-06-08 | 2011-03-30 | 清华大学深圳研究生院 | Composite materials manufactured by using non-metal materials recovered from waste circuit boards |
| CN102225414A (en) * | 2011-03-31 | 2011-10-26 | 广州市万绿达集团有限公司 | Method for reinforcing waste polyethylene plastics by waste printed circuit board nonmetal powder |
| CN103113648A (en) * | 2013-01-25 | 2013-05-22 | 北京交通大学 | Method for manufacturing environment-friendly board by using waste PCB (Printed Circuit Board) |
| CN106847370A (en) * | 2017-01-12 | 2017-06-13 | 惠州新联兴实业有限公司 | New PCB/CCL castoff regeneratives resistance slurry and preparation method thereof |
-
2005
- 2005-02-03 CN CNB200510023786XA patent/CN100467247C/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101250315B (en) * | 2008-03-18 | 2010-06-23 | 上海大学 | Utilization and processing method for substrate material of waste and old printed circuit board |
| CN101555356B (en) * | 2009-05-15 | 2010-07-28 | 宋金有 | Carbonized environment-friendly type sheet synthesized by waste PCB powder and resin fiber |
| CN101570626B (en) * | 2009-06-08 | 2011-03-30 | 清华大学深圳研究生院 | Composite materials manufactured by using non-metal materials recovered from waste circuit boards |
| CN102225414A (en) * | 2011-03-31 | 2011-10-26 | 广州市万绿达集团有限公司 | Method for reinforcing waste polyethylene plastics by waste printed circuit board nonmetal powder |
| CN103113648A (en) * | 2013-01-25 | 2013-05-22 | 北京交通大学 | Method for manufacturing environment-friendly board by using waste PCB (Printed Circuit Board) |
| CN103113648B (en) * | 2013-01-25 | 2015-05-13 | 北京交通大学 | Method for manufacturing environment-friendly board by using waste PCB (Printed Circuit Board) |
| CN106847370A (en) * | 2017-01-12 | 2017-06-13 | 惠州新联兴实业有限公司 | New PCB/CCL castoff regeneratives resistance slurry and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100467247C (en) | 2009-03-11 |
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Owner name: SHANGHAI XINJINQIAO ENVIRONMENTAL CO., LTD. Free format text: FORMER OWNER: SHANGHAI JIAO TONG UNIVERSITY Effective date: 20110819 |
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Free format text: CORRECT: ADDRESS; FROM: 200240 MINHANG, SHANGHAI TO: 201206 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20110819 Address after: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1755 Bridge Patentee after: Shanghai Xinjinqiao Environmental Co., Ltd. Address before: 200240 Dongchuan Road, Shanghai, No. 800, No. Patentee before: Shanghai Jiao Tong University |