CN106847370A - New PCB/CCL castoff regeneratives resistance slurry and preparation method thereof - Google Patents
New PCB/CCL castoff regeneratives resistance slurry and preparation method thereof Download PDFInfo
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- CN106847370A CN106847370A CN201710021786.9A CN201710021786A CN106847370A CN 106847370 A CN106847370 A CN 106847370A CN 201710021786 A CN201710021786 A CN 201710021786A CN 106847370 A CN106847370 A CN 106847370A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/18—Conductive material dispersed in non-conductive inorganic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
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- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention discloses a kind of new PCB/CCL castoff regeneratives resistance slurry and preparation method thereof, the new PCB castoff regeneratives resistance slurry includes conductive phase, Binder Phase and organic carrier, wherein, conductive phase includes graphite, superfine metal alloyed powder alloy and PP, substrate mixed dust, Binder Phase includes inorganic filler, phenolic resin and benzoguanamine, and organic carrier is including rilanit special etc..PCB/CCL enterprises rim charge substitutes the raw material in existing product after processing and crushing, and carries out the recycling of resource, meets China for solid waste reducing, the developing direction of innoxious and resource state basic policy.
Description
Technical field
The present invention relates to PCB/CCL reclaimings field, and in particular to a kind of new PCB/CCL castoff regeneratives resistance slurry
And preparation method thereof.
Background technology
Abandoned printed circuit board as electronic waste significant components, on the one hand both containing lead, cadmium, igelite,
, there is potential environmental pollution in the various heavies such as brominated flame retardant and harmful substance；On the other hand copper, gold, silver etc. are contained again
Various common metals and rare precious metal, are worth with recycling higher.Selection is suitable to reclaim and cycling and reutilization technique,
Both limited resources can be saved, the environmental problem of mishandling generation can be avoided again.With the reality of China's strategy of sustainable development
Apply, propose requirement higher to environmental protection, the recovery of electronic waste with using the thorny problem faced as majority state.
At present, China has turned into the production and consumption big country of household electrical appliance, is only calculated with scrapping renewal 2% year, annual 4 superseded major classes
Household electrical appliance add and popularize the update cycle for using in the whole society and only have the computer of 2-4, mobile phone contour just up to 20,000,000
Tech electronic product, and the novel household appliance product of high quality and at a reasonable price for continuing to bring out so that the actual annual report of China's household electrical appliance
Useless renewal has been up to more than 25,000,000.Printed circuit board (PCB)（PCB）Used as the critical component in discarded household electrical appliances, it reclaims and provides
Source problem has turned into the hot issue for being badly in need of solving.Abandoned printed circuit board is glass fiber reinforced plastics and various metals
Mixture, belongs to typical electron wastes, a large amount of corners that discarded circuit board growing day by day is produced plus production wiring board
Waste material, if not dealing carefully with and locating Ge, can not only cause a large amount of losses of useful resources, and environment can be produced serious
Harm.The method that tradition is stacked or filled, a large amount of spaces, and contained heavy metal such as mercury, chromium, cadmium etc. and high score are not only taken up
Sub- organic matter is difficult degraded under field conditions (factors), and harmful components can enter environment, can give human health by water, air, soil
Potential, long-term and expendable harm is caused with ecological environment.Recycle at present and be mainly in recovery train plate
Copper and other rare precious metals, the substrate for accounting for PCB substantial volumes but seldom consider.PCB substrate material mainly contains asphalt mixtures modified by epoxy resin
The hybrid resin that 3 kinds of fat, phenolic resin, unsaturated polyester (UP) or more, wherein paper, glass fibre and aramid fiber are used as enhancing
Material, epoxy resin, unsaturated polyester (UP) etc. are used as insulation adhesive material, its discarded amount and very important to the pollution of environment.
At present, treatment of the China to same with thermosetting compound material discarded object is mainly taken landfill and is burned.In principle, at landfill
Reason selection is taken and is buried nearby in gully or wasteland, also some units, and this method can cause the destruction of soil and a large amount of soils
Waste.Burning disposal is typically using directly burning, and this method is fairly simple, does not result in land wastage, but due to burning
It is middle to produce a large amount of poison gases, environmental pollution can be caused.Result of study in recent years shows that thermosetting plastics can be made compound again
Material, can carry out separate pulverization process according to the difference of discarded circuit board substrate raw materials, select new resin matrix, most
The various composites of lifelong output, i.e. composite material of waste.Composite material of waste is the regeneration of various discarded objects processes and answers
A kind of new resources formed after conjunction, according to the different performance of composite, can be made multiple product and apply in extensive field
In, as Dai Mu, Dai Gang, for modeling, for ceramic products, so having obvious social benefit.Their cost than by adopting,
The first resource cost that choosing, smelting are obtained is much lower, and solves the problem of environmental pollution that solid waste is brought, and saves again
First resource, reduces manufacturing cost, is that one kind possesses environment association with obvious environment, society, economic 3 big benefits
The material of tonality.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of new PCB/CCL castoff regeneratives resistance slurry.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of new PCB/CCL castoff regeneratives resistance slurry, the new PCB castoff regeneratives resistance slurry includes following weight percent
Compare component：
a）Conductive phase 9%-13%,
b）Binder Phase 34%-48%,
c）Organic carrier 40.3%-55.8%.
Further, described conductive phase includes the material of following weight portion：Graphite 33-43.5%, carbon black 33-
43.5%, super fine silver powder 13-34%.Conductive phase of the present invention be for controlling resistance value, with certain conducting function, can
Controlled with addition.
Further, described Binder Phase includes the material of following weight portion：Phenolic resin 55-70%, benzene is for melamine
Amine 5-20%, glass dust 10-24%, mixed powder 5-12%.Binder Phase of the present invention is the carrier of resistance slurry, and Main Function is
Conductive phase, firm resistive element are bonded, possessing certain adjustment resistance improves performance, improves the effect of film adhesion.
Further, described organic carrier includes the material of following weight portion：Rilanit special 20-30%, propane diols
Methyl ether 65-80%, silane defoamer 0.5-2%.Organic carrier of the present invention can adjust the viscosity of resistance slurry, improve conductive
Mutually distributing homogeneity in the carrier, adjusts the plasticity of carrier.
Further, described mixed powder is the PP dust of generation in PCB/CCL process or scraps copper-clad plate, rim charge
And copper-clad plate enterprise produce PP and the post-processing of substrate edge recycling obtain.
The present invention also provides a kind of preparation method of new PCB/CCL castoff regeneratives resistance slurry, it is characterised in that including
Following steps：
（1）Prepare mixed powder：By in PCB/CCL process produce PP dust or scrap copper-clad plate, rim charge and copper-clad plate enterprise
Crushed after component removal on the PP and substrate rim charge of industry generation, by cyclonic separation after fine gtinding, obtain plexiglas
Fiber dust and containing copper powders, will obtain plexiglas fiber dust after gained electrostatic separation containing copper powders, integrate above-mentioned steps
The plexiglas fiber dust for obtaining obtains mixed powder by fine gtinding again；
（2）Graphite, carbon black and super fine silver powder are weighed by proportioning, is tentatively mixed, obtain conductive phase；
（3）Phenolic resin, benzoguanamine, glass dust, mixed powder are weighed by proportioning, Binder Phase is tentatively mixed to get；
（4）Rilanit special, propylene glycol monomethyl ether, silane defoamer are tentatively mixed to get organic carrier；
（5）Above-mentioned conductive phase, Binder Phase, organic carrier are mixed, new PCB/CCL castoff regeneratives resistance is obtained
Slurry.
When preparing mixed powder, copper powder enrichment can be also carried out after copper powders electrostatic separation will be contained, be recovered to copper powder, further expanded
Big recycling benefit of the invention.
At present, nearly all printing board PCB/copper-clad plate CCL enterprises volume insulating substrate is by relatively thin prepreg
（PP）Cut according to required size, pressing is formed.Dust, PP rim charges are produced when PP, substrate cut and copper back plate edge is reclaimed
Material and mender, can be as the raw material of technique.
The present invention has the advantages that：The present invention recycles PCB/CCL enterprise's rim charges and is replaced after processing and crushing
For part inorganic filler in existing product, the recycling of resource is carried out, reduce production cost, and meet China for solid
The minimizing of body discarded object, the developing direction of innoxious and resource state basic policy.Meanwhile, formula of the present invention combines conduction
Phase, Binder Phase and organic carrier, stable performance is starched with the resistance that preferred each component is produced, and electric conductivity is controllable, and adhesive force is good,
Plasticity is good.
Specific embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
Embodiment 1
A kind of new PCB/CCL castoff regeneratives resistance slurry, including following weight percent composition:
Graphite 4%,
Carbon black 4%,
Super fine silver powder 1.7%,
Phenolic resin 20%,
Benzoguanamine 2%,
Glass dust 8%,
Mixed powder 4%,
Rilanit special 15%,
Propylene glycol monomethyl ether 40%,
Silane defoamer 0.3%.
A kind of preparation method of new PCB/CCL castoff regeneratives resistance slurry, it is characterised in that comprise the following steps：
（1）Prepare mixed powder：By in PCB/CCL process produce PP dust or scrap copper-clad plate, rim charge and copper-clad plate enterprise
Crushed after component removal on the PP and substrate rim charge of industry generation, by cyclonic separation after fine gtinding, obtain plexiglas
Fiber dust and containing copper powders, will obtain plexiglas fiber dust after gained electrostatic separation containing copper powders, integrate above-mentioned steps
The plexiglas fiber dust for obtaining obtains mixed powder by fine gtinding again；
（2）Graphite, carbon black and super fine silver powder are weighed by proportioning, is tentatively mixed, obtain conductive phase；
（3）Phenolic resin, benzoguanamine, glass dust, mixed powder are weighed by proportioning, Binder Phase is tentatively mixed to get；
（4）Rilanit special, propylene glycol monomethyl ether, silane defoamer are tentatively mixed to get organic carrier；
（5）Above-mentioned conductive phase, Binder Phase, organic carrier are mixed, new PCB/CCL castoff regeneratives resistance is obtained
Slurry.
Embodiment 2
A kind of new PCB/CCL castoff regeneratives resistance slurry, including following weight percent composition:
Graphite 5%,
Carbon black 5%,
Super fine silver powder 3%,
Phenolic resin 25%,
Benzoguanamine 6%,
Glass dust 4%,
Mixed powder 2%,
Rilanit special 10%,
Propylene glycol monomethyl ether 39.2%,
Silane defoamer 0.8%.
A kind of preparation method of new PCB/CCL castoff regeneratives resistance slurry, it is characterised in that comprise the following steps：
（1）Prepare mixed powder：By in PCB/CCL process produce PP dust or scrap copper-clad plate, rim charge and copper-clad plate enterprise
Crushed after component removal on the PP and substrate rim charge of industry generation, by cyclonic separation after fine gtinding, obtain plexiglas
Fiber dust and containing copper powders, will obtain plexiglas fiber dust after gained electrostatic separation containing copper powders, integrate above-mentioned steps
The plexiglas fiber dust for obtaining obtains mixed powder by fine gtinding again；
（2）Graphite, carbon black and super fine silver powder are weighed by proportioning, is tentatively mixed, obtain conductive phase；
（3）Phenolic resin, benzoguanamine, glass dust, mixed powder are weighed by proportioning, Binder Phase is tentatively mixed to get；
（4）Rilanit special, propylene glycol monomethyl ether, silane defoamer are tentatively mixed to get organic carrier；
（5）Above-mentioned conductive phase, Binder Phase, organic carrier are mixed, new PCB/CCL castoff regeneratives resistance is obtained
Slurry.
Embodiment 3
A kind of new PCB/CCL castoff regeneratives resistance slurry, including following weight percent composition:
Graphite 3%,
Carbon black 3%,
Super fine silver powder 2.5%,
Phenolic resin 25%,
Benzoguanamine 5%,
Glass dust 6%,
Mixed powder 3%,
Rilanit special 12%,
Propylene glycol monomethyl ether 40%,
Silane defoamer 0.5%.
A kind of preparation method of new PCB/CCL castoff regeneratives resistance slurry, it is characterised in that comprise the following steps：
（1）Prepare mixed powder：By in PCB/CCL process produce PP dust or scrap copper-clad plate, rim charge and copper-clad plate enterprise
Crushed after component removal on the PP and substrate rim charge of industry generation, by cyclonic separation after fine gtinding, obtain plexiglas
Fiber dust and containing copper powders, will obtain plexiglas fiber dust after gained electrostatic separation containing copper powders, integrate above-mentioned steps
The plexiglas fiber dust for obtaining obtains mixed powder by fine gtinding again；
（2）Graphite, carbon black and super fine silver powder are weighed by proportioning, is tentatively mixed, obtain conductive phase；
（3）Phenolic resin, benzoguanamine, glass dust, mixed powder are weighed by proportioning, Binder Phase is tentatively mixed to get；
（4）Rilanit special, propylene glycol monomethyl ether, silane defoamer are tentatively mixed to get organic carrier；
（5）Above-mentioned conductive phase, Binder Phase, organic carrier are mixed, new PCB/CCL castoff regeneratives resistance is obtained
Slurry.
Claims (6)
1. the present invention discloses a kind of new PCB/CCL castoff regeneratives resistance slurry, and the new PCB castoff regeneratives resistance slurry includes
Following weight percent composition：
a）Conductive phase 9%-13%,
b）Binder Phase 34%-48%,
c）Organic carrier 40.3%-55.8%.
2. new PCB/CCL castoff regeneratives resistance according to claim 1 is starched, it is characterised in that described conductive phase
Include following weight percent composition：Graphite 33-43.5%, carbon black 33-43.5%, super fine silver powder 13-34%.
3. new PCB/CCL castoff regeneratives resistance according to claim 1 is starched, it is characterised in that described Binder Phase
Include following weight percent composition：Phenolic resin 55-70%, benzoguanamine 5-20%, glass dust 10-24%, mixed powder
5-12%。
4. new PCB/CCL castoff regeneratives resistance according to claim 1 is starched, it is characterised in that described having is airborne
Body includes following weight percent composition：Rilanit special 20-30%, propylene glycol monomethyl ether 65-80%, silane defoamer 0.5-
2%。
5. new PCB/CCL castoff regeneratives resistance according to claim 3 is starched, it is characterised in that described mixed powder
For the PP dust produced in PCB/CCL process or scrap copper-clad plate, the PP that rim charge and copper-clad plate enterprise produce and substrate side
Material reclaims what post-processing was obtained.
6. a kind of preparation method that new PCB/CCL castoff regeneratives resistance according to claim 1 is starched, its feature exists
In comprising the following steps that：
（1）Prepare mixed powder：By in PCB/CCL process produce PP dust or scrap copper-clad plate, rim charge and copper-clad plate enterprise
Crushed after component removal on the PP and substrate rim charge of industry generation, by cyclonic separation after fine gtinding, obtain plexiglas
Fiber dust and containing copper powders, will obtain plexiglas fiber dust after gained electrostatic separation containing copper powders, integrate above-mentioned steps
The plexiglas fiber dust for obtaining obtains mixed powder by fine gtinding again；
（2）Graphite, carbon black and super fine silver powder are weighed by proportioning, is tentatively mixed, obtain conductive phase；
（3）Phenolic resin, benzoguanamine, glass dust, mixed powder are weighed by proportioning, Binder Phase is tentatively mixed to get；
（4）Rilanit special, propylene glycol monomethyl ether, silane defoamer are tentatively mixed to get organic carrier；
（5）Above-mentioned conductive phase, Binder Phase, organic carrier are mixed, new PCB/CCL castoff regeneratives resistance is obtained
Slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710021786.9A CN106847370A (en) | 2017-01-12 | 2017-01-12 | New PCB/CCL castoff regeneratives resistance slurry and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710021786.9A CN106847370A (en) | 2017-01-12 | 2017-01-12 | New PCB/CCL castoff regeneratives resistance slurry and preparation method thereof |
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| CN106847370A true CN106847370A (en) | 2017-06-13 |
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| CN201710021786.9A Pending CN106847370A (en) | 2017-01-12 | 2017-01-12 | New PCB/CCL castoff regeneratives resistance slurry and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107705878A (en) * | 2017-10-11 | 2018-02-16 | 武汉配斯特科技有限公司 | A kind of carbon electric slurry and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1676298A (en) * | 2005-02-03 | 2005-10-05 | 上海交通大学 | Method for manufacturing regenerative board from base board material granule of waste printed circuit board |
| CN101275013A (en) * | 2008-04-23 | 2008-10-01 | 北京正康创智科技发展有限公司 | Composite material with reinforced fiberglass from waste printed circuit board and preparation thereof |
| CN101642765A (en) * | 2009-09-04 | 2010-02-10 | 北京航空航天大学 | Recycling method of discarded circuit board |
| CN103013226A (en) * | 2012-12-26 | 2013-04-03 | 赵婕 | Conductive ink composition and preparation method thereof |
| CN103113648A (en) * | 2013-01-25 | 2013-05-22 | 北京交通大学 | Method for manufacturing environment-friendly board by using waste PCB (Printed Circuit Board) |
| CN103834100A (en) * | 2013-12-05 | 2014-06-04 | 江苏理工学院 | Reinforced resin-plastic compound plate prepared from waste printed circuit board (PCB) powder and preparation method thereof |
-
2017
- 2017-01-12 CN CN201710021786.9A patent/CN106847370A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1676298A (en) * | 2005-02-03 | 2005-10-05 | 上海交通大学 | Method for manufacturing regenerative board from base board material granule of waste printed circuit board |
| CN101275013A (en) * | 2008-04-23 | 2008-10-01 | 北京正康创智科技发展有限公司 | Composite material with reinforced fiberglass from waste printed circuit board and preparation thereof |
| CN101642765A (en) * | 2009-09-04 | 2010-02-10 | 北京航空航天大学 | Recycling method of discarded circuit board |
| CN103013226A (en) * | 2012-12-26 | 2013-04-03 | 赵婕 | Conductive ink composition and preparation method thereof |
| CN103113648A (en) * | 2013-01-25 | 2013-05-22 | 北京交通大学 | Method for manufacturing environment-friendly board by using waste PCB (Printed Circuit Board) |
| CN103834100A (en) * | 2013-12-05 | 2014-06-04 | 江苏理工学院 | Reinforced resin-plastic compound plate prepared from waste printed circuit board (PCB) powder and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107705878A (en) * | 2017-10-11 | 2018-02-16 | 武汉配斯特科技有限公司 | A kind of carbon electric slurry and preparation method thereof |
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Application publication date: 20170613 |
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