CN1661400A - 光电集成电路装置、光电集成电路系统及传输方法 - Google Patents
光电集成电路装置、光电集成电路系统及传输方法 Download PDFInfo
- Publication number
- CN1661400A CN1661400A CN200510008950XA CN200510008950A CN1661400A CN 1661400 A CN1661400 A CN 1661400A CN 200510008950X A CN200510008950X A CN 200510008950XA CN 200510008950 A CN200510008950 A CN 200510008950A CN 1661400 A CN1661400 A CN 1661400A
- Authority
- CN
- China
- Prior art keywords
- input
- light signal
- output
- circuit device
- optoelectronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 366
- 230000005540 biological transmission Effects 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 119
- 238000006243 chemical reaction Methods 0.000 claims abstract description 84
- 239000004065 semiconductor Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000008054 signal transmission Effects 0.000 claims description 20
- 239000011159 matrix material Substances 0.000 claims description 7
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 claims description 7
- 230000008676 import Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005622 photoelectricity Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1818—Means for removing cut-out material or waste by pushing out
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
- H04Q2011/0052—Interconnection of switches
- H04Q2011/0058—Crossbar; Matrix
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Optical Integrated Circuits (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Optical Communication System (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004051131 | 2004-02-26 | ||
JP2004051131A JP2005244560A (ja) | 2004-02-26 | 2004-02-26 | 光電子集積回路装置、光電子集積回路システム及び伝送方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1661400A true CN1661400A (zh) | 2005-08-31 |
CN100410706C CN100410706C (zh) | 2008-08-13 |
Family
ID=34747495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200510008950XA Expired - Fee Related CN100410706C (zh) | 2004-02-26 | 2005-02-25 | 光电集成电路装置、光电集成电路系统及传输方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7224859B2 (zh) |
EP (1) | EP1569495A1 (zh) |
JP (1) | JP2005244560A (zh) |
KR (1) | KR100738865B1 (zh) |
CN (1) | CN100410706C (zh) |
TW (1) | TWI253677B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8335434B2 (en) | 2007-10-23 | 2012-12-18 | Hewlett-Packard Development Company, L.P. | All optical fast distributed arbitration in a computer system device |
WO2015157993A1 (zh) * | 2014-04-18 | 2015-10-22 | 华为技术有限公司 | 互连系统、装置和数据传输方法 |
CN113642725A (zh) * | 2021-10-13 | 2021-11-12 | 清华大学 | 用于消息散列算法的消息扩展的光电集成电路 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009034600A1 (ja) * | 2007-09-10 | 2009-03-19 | Fujitsu Limited | 集積回路およびノイズ測定方法 |
FR2981477B1 (fr) * | 2011-10-14 | 2014-05-23 | Thales Sa | Systeme d'au moins un ensemble comprenant au moins un circuit integre, lesdits circuits integres etant interconnectes selon une architecture matricielle, muni d'au moins une interconnexion optique |
CN106134116B (zh) * | 2014-04-25 | 2018-06-26 | 华为技术有限公司 | 采用pic交换机的可扩展光分组结构的装置与方法 |
US10359565B2 (en) | 2017-02-07 | 2019-07-23 | Nokia Of America Corporation | Optoelectronic circuit having one or more double-sided substrates |
US10914895B2 (en) * | 2018-09-18 | 2021-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and manufacturing method thereof |
JP2020052269A (ja) * | 2018-09-27 | 2020-04-02 | 沖電気工業株式会社 | 光チップ、光集積回路及び光モジュール |
US11800266B2 (en) * | 2021-05-19 | 2023-10-24 | Mellanox Technologies, Ltd. | Hybrid optoelectrical switches |
CN115378886B (zh) * | 2021-05-19 | 2024-06-07 | 迈络思科技有限公司 | 混合光电交换机 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2986140B2 (ja) | 1993-12-24 | 1999-12-06 | 日本電気株式会社 | マルチチップモジュール |
US5731887A (en) * | 1995-12-22 | 1998-03-24 | Mci Communications Corporation | System and method for photonic facility and line protection switching |
US6845184B1 (en) | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
US6611635B1 (en) * | 1998-10-09 | 2003-08-26 | Fujitsu Limited | Opto-electronic substrates with electrical and optical interconnections and methods for making |
JP4529194B2 (ja) | 1998-10-13 | 2010-08-25 | ソニー株式会社 | 光電子集積回路装置 |
US6148124A (en) * | 1998-11-20 | 2000-11-14 | Lucent Technologies | Wavelength division multiplexed optical networks |
DE69837009T2 (de) * | 1998-12-28 | 2007-11-15 | Stmicroelectronics S.R.L., Agrate Brianza | Optische Querverbindungsarchitektur für WDM-Telekommunikationssysteme |
US6647208B1 (en) * | 1999-03-18 | 2003-11-11 | Massachusetts Institute Of Technology | Hybrid electronic/optical switch system |
EP1116973A1 (en) * | 2000-01-11 | 2001-07-18 | Corning Incorporated | Athermalized integrated optical waveguide devices |
US6690847B2 (en) * | 2000-09-19 | 2004-02-10 | Newport Opticom, Inc. | Optical switching element having movable optically transmissive microstructure |
US6490393B1 (en) | 2000-11-27 | 2002-12-03 | Advanced Interfaces, Llc | Integrated optical multiplexer and demultiplexer for wavelength division transmission of information |
CN1191481C (zh) * | 2001-05-25 | 2005-03-02 | 李志扬 | 阵列波导干涉器 |
US6847787B2 (en) * | 2001-09-07 | 2005-01-25 | Redfern Broadband Networks Inc. | WDM network node module |
KR100523143B1 (ko) * | 2003-08-07 | 2005-10-19 | 주식회사 팬택앤큐리텔 | 배터리 충전 제어 기능을 가진 이동통신 단말기 및 충전방법 |
-
2004
- 2004-02-26 JP JP2004051131A patent/JP2005244560A/ja active Pending
-
2005
- 2005-02-21 TW TW094105024A patent/TWI253677B/zh not_active IP Right Cessation
- 2005-02-22 EP EP05250983A patent/EP1569495A1/en not_active Withdrawn
- 2005-02-23 US US11/062,663 patent/US7224859B2/en not_active Expired - Fee Related
- 2005-02-25 CN CNB200510008950XA patent/CN100410706C/zh not_active Expired - Fee Related
- 2005-02-25 KR KR1020050015785A patent/KR100738865B1/ko not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8335434B2 (en) | 2007-10-23 | 2012-12-18 | Hewlett-Packard Development Company, L.P. | All optical fast distributed arbitration in a computer system device |
CN101911288B (zh) * | 2007-10-23 | 2012-12-26 | 惠普开发有限公司 | 计算机系统设备中的全光学快速分布式仲裁 |
WO2015157993A1 (zh) * | 2014-04-18 | 2015-10-22 | 华为技术有限公司 | 互连系统、装置和数据传输方法 |
US9712901B2 (en) | 2014-04-18 | 2017-07-18 | Huawei Technologies Co., Ltd. | Interconnection system, apparatus, and data transmission method |
CN113642725A (zh) * | 2021-10-13 | 2021-11-12 | 清华大学 | 用于消息散列算法的消息扩展的光电集成电路 |
CN113642725B (zh) * | 2021-10-13 | 2022-03-08 | 清华大学 | 用于消息散列算法的消息扩展的光电集成电路 |
Also Published As
Publication number | Publication date |
---|---|
JP2005244560A (ja) | 2005-09-08 |
TWI253677B (en) | 2006-04-21 |
TW200534356A (en) | 2005-10-16 |
US7224859B2 (en) | 2007-05-29 |
CN100410706C (zh) | 2008-08-13 |
EP1569495A1 (en) | 2005-08-31 |
KR20060042231A (ko) | 2006-05-12 |
KR100738865B1 (ko) | 2007-07-16 |
US20050191004A1 (en) | 2005-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090313 Address after: Tokyo, Japan Co-patentee after: Sharp Corp. Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa Co-patentee before: Sharp Corp. Patentee before: FUJITSU Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: FUJITSU MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: FUJITSU LIMITED Effective date: 20090313 |
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C56 | Change in the name or address of the patentee |
Owner name: FUJITSU SEMICONDUCTOR CO., LTD. Free format text: FORMER NAME: FUJITSU MICROELECTRON CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Japan's Kanagawa Prefecture Yokohama Co-patentee after: Sharp Corp. Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Japan's Kanagawa Prefecture Yokohama Co-patentee before: Sharp Corp. Patentee before: Fujitsu Microelectronics Ltd. |
|
CP02 | Change in the address of a patent holder |
Address after: Japan's Kanagawa Prefecture Yokohama Co-patentee after: Sharp Corp. Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Tokyo, Japan Co-patentee before: Sharp Corp. Patentee before: Fujitsu Microelectronics Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160224 Address after: Yokohama City, Kanagawa Prefecture, Japan Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Yokohama City, Kanagawa Prefecture, Japan Patentee before: FUJITSU MICROELECTRONICS Ltd. Patentee before: Sharp Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080813 Termination date: 20180225 |
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CF01 | Termination of patent right due to non-payment of annual fee |