CN1660528A - 用于传热的装置及其制造方法 - Google Patents

用于传热的装置及其制造方法 Download PDF

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Publication number
CN1660528A
CN1660528A CN2005100525142A CN200510052514A CN1660528A CN 1660528 A CN1660528 A CN 1660528A CN 2005100525142 A CN2005100525142 A CN 2005100525142A CN 200510052514 A CN200510052514 A CN 200510052514A CN 1660528 A CN1660528 A CN 1660528A
Authority
CN
China
Prior art keywords
binding agent
powder
stream
sintered body
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2005100525142A
Other languages
English (en)
Chinese (zh)
Inventor
任允赫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN1660528A publication Critical patent/CN1660528A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G19/00—Table service
    • A47G19/22—Drinking vessels or saucers used for table service
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G19/00—Table service
    • A47G19/22—Drinking vessels or saucers used for table service
    • A47G2019/2277—Drinking vessels or saucers used for table service collapsible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2005100525142A 2004-02-27 2005-02-28 用于传热的装置及其制造方法 Pending CN1660528A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040013427A KR100609014B1 (ko) 2004-02-27 2004-02-27 박막 히트 스프레더 및 그의 제조 방법
KR13427/2004 2004-02-27

Publications (1)

Publication Number Publication Date
CN1660528A true CN1660528A (zh) 2005-08-31

Family

ID=34880320

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005100525142A Pending CN1660528A (zh) 2004-02-27 2005-02-28 用于传热的装置及其制造方法

Country Status (4)

Country Link
US (1) US20050189093A1 (ko)
JP (1) JP2005244243A (ko)
KR (1) KR100609014B1 (ko)
CN (1) CN1660528A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615278A (zh) * 2011-01-26 2012-08-01 新光电气工业株式会社 制造金属复合材料的方法、金属复合材料、制造散热部件的方法以及散热部件
CN105823357A (zh) * 2016-04-18 2016-08-03 张平 全流道磁化淋浴热量回收板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752794B1 (ko) * 2006-12-12 2007-08-29 세일전자 주식회사 방열판 및 그 제조방법
US9417013B2 (en) 2010-11-12 2016-08-16 Toyota Motor Engineering & Manufacturing North America, Inc. Heat transfer systems including heat conducting composite materials

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582687A (ja) * 1991-09-20 1993-04-02 Nikki Denso Kk 発熱素子の冷却装置
US5380179A (en) * 1992-03-16 1995-01-10 Kawasaki Steel Corporation Binder system for use in the injection molding of sinterable powders and molding compound containing the binder system
JP3210199B2 (ja) * 1995-01-27 2001-09-17 株式会社東芝 平形半導体素子の冷却体
KR100211058B1 (ko) * 1995-12-23 1999-07-15 이계철 멀티칩 모듈의 냉각장치 및 방법
US6271585B1 (en) * 1997-07-08 2001-08-07 Tokyo Tungsten Co., Ltd. Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
US6569380B2 (en) * 2001-08-27 2003-05-27 Advanced Materials Technologies Pte, Ltd. Enclosure for a semiconductor device
US6935022B2 (en) * 2001-08-28 2005-08-30 Advanced Materials Technologies Pte, Ltd. Advanced microelectronic heat dissipation package and method for its manufacture
US6939505B2 (en) * 2002-03-12 2005-09-06 Massachusetts Institute Of Technology Methods for forming articles having very small channels therethrough, and such articles, and methods of using such articles
JP3452059B1 (ja) 2002-05-15 2003-09-29 松下電器産業株式会社 冷却装置とそれを備えた電子機器
JP2004067828A (ja) * 2002-08-05 2004-03-04 Nippon Perunotsukusu Kk エポキシ樹脂粉体塗料

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615278A (zh) * 2011-01-26 2012-08-01 新光电气工业株式会社 制造金属复合材料的方法、金属复合材料、制造散热部件的方法以及散热部件
CN102615278B (zh) * 2011-01-26 2015-10-14 新光电气工业株式会社 制造金属复合材料的方法、金属复合材料、制造散热部件的方法以及散热部件
CN105823357A (zh) * 2016-04-18 2016-08-03 张平 全流道磁化淋浴热量回收板

Also Published As

Publication number Publication date
US20050189093A1 (en) 2005-09-01
KR20050087554A (ko) 2005-08-31
KR100609014B1 (ko) 2006-08-03
JP2005244243A (ja) 2005-09-08

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication