CN1648802A - Synchronous sintering process for electronic beam selection zone and three dimension layered producing device - Google Patents
Synchronous sintering process for electronic beam selection zone and three dimension layered producing device Download PDFInfo
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Abstract
The present invention relates to technology and apparatus with high energy beam to sinter or melt and deposit material successively to realize laminated solid manufacture. The present invention features that the electronic beam scan controller controls the electronic beam to scan fast in pattern projection mode for heating powder homogeneously. Each scanning of the electronic beam has short time in the selected area, so that the scan initiating point has no great temperature change generated during the whole scanning course. Through one or several frames of scanning, the material in the forming area has temperature synchronously raised to reach the sintering or re-melting temperature for deposition onto the forming area before synchronous cooling. The present invention has greatly reduced heat stress and raised forming precision and quality.
Description
Technical field
The present invention relates to a kind of high energy beam current that utilizes, material according to layer sintering or melt deposition, is realized technology and device that laminated solid body is made.
Background technology
The layering manufacturing of part or the rapid-result shape of expressing one's gratification are to solve single-piece, quick, the low-cost effective ways of making of short run function part.Present main technique is to utilize high energy laser beam or electron beam to carry out pointwise scanning successively, with deposite metal particulate, stack shaping.Concrete grammar is two kinds of constituency sintering and claddings.Typical process is selective laser sintering (Journal of MaterialsProcessing Technology, 2003,141 (1)) and laser engineeringization (the Proceedings of The 10thSolid Freeform Fabrication Symposium that closely is shaped, University of Texas Austin, August 9-11,1999).And adopt electron beam electron-beam melting (Rapid Prototyping Journal, 2,004 10 (1)) technology arranged.
Based on the Rapid Prototyping technique of electron beam with compare based on the Rapid Prototyping technique of laser have energy conversion rate and absorptivity height, operating cost is low, the characteristics such as vacuum environment that help the metal material sintering, electron beam scanning noninertia particularly can thousands of hertz, the velocity sweeping of tens of meters of per seconds.
In aforesaid Rapid Prototyping technique, immediate with the application is above-mentioned electron-beam melting technology.It also is the technology of a kind of constituency sintering.Earlier at shaped region layer overlay material powder, scan on the shaped region xsect of part is disposable with electron beam (is exactly laser for other technology), pointwise or subregion, powder sintered and the deposition of the local material that electron beam focus scanning is arrived, after the whole part cross section has been scanned, the height of a bed thickness of worktable decline, spread new material powder layer, the scanning of following one deck part section at shaped region.Finish up to the whole part sintered deposit so repeatedly.The characteristics of this method are that (as 1 second) electron beam (or laser) only heats a part in the whole shaped region in an ofer short duration time, and material powder is finished sintering successively with moving of electron beam (or laser) focus and is deposited in the shaped region.Owing to be subjected to the restriction of energy density and material sintering characteristic, above-mentioned layering manufacturing process is in order to finish the sintered deposit of material by single pass, the sweep velocity of electron beam or laser is restricted, can only pointwise or the subregion heating, material powder also can only pointwise or subregion be sintered deposition.Therefore the homogeneity of heating is relatively poor, and efficient is lower.Because it is inhomogeneous that material is heated, sintering process produces bigger thermal stress.After machining, part memory is in bigger unrelieved stress.These stress all have harmful effect to part precision and mechanical property.Particularly the thermal stress of sintering process can cause part warpage, cracking when serious.
Summary of the invention
The purpose of this invention is to provide a kind of three-dimensional layering manufacturing equipment that can realize the synchronous sintering process in electron beam constituency, realize the projection scanning in any complex curve/zone, make the powder thermally equivalent in the scanning area, heat up synchronously, sintering, cooling synchronously synchronously, reduce the inhomogeneous and internal stress that produces of Yin Wendu and sintering.
The objective of the invention is to be achieved through the following technical solutions: the three-dimensional layering manufacturing equipment of the synchronous sintering in a kind of electron beam constituency, comprise vacuum chamber, be located at the electron gun at vacuum chamber top, respectively the vacuum system that links to each other with vacuum chamber with electron gun and be the high-voltage power supply of electron gun each several part power supply and the control computer of each ingredient of control; In described vacuum chamber, be provided with shop powder platform, be arranged on powder shop pressure device and the piston type moulding cylinder at powder platform center, shop and the powder feeding device that is located at powder platform top, shop on the powder platform of shop; In described electron gun, be provided with the scanning magnetic lens from bottom to up successively, focus on magnetic lens, anode and bunching electrode, it is characterized in that: this equipment also comprises the control circuit that is used to realize the scanning of electron beam projection formula, described scan control circuit is by constituting with the lower part: the controller that is connected in control computer by the steering order transmission line, pass through data bus, address bus and control bus are connected in the storer of controller, the electron gun that is connected with controller by data bus scans the magnetic lens driving circuit, by the electron gun bunching electrode voltage regulating and controlling circuit that data bus is connected with controller, the frequency of operation control circuit that links to each other with a voltage signal output end of control computer; Described frequency of operation control circuit also links to each other with controller, electron gun scanning magnetic lens driving circuit, electron gun bunching electrode voltage regulating and controlling circuit by its output signal circuit; Described electron gun scanning magnetic lens driving circuit includes the latch that is in the input end position and links to each other by data bus with controller, the digital to analog converter that links to each other with the latch output terminal, and the power amplifier that links to each other with the digital to analog converter output terminal; Described electron gun bunching electrode voltage regulating and controlling circuit comprises the latch that is in the input end position and links to each other by data bus with controller, the digital to analog converter that links to each other with the latch output terminal, the voltage amplifier that links to each other with the digital to analog converter output terminal, the voltage that links to each other with bunching electrode initial setting voltage with digital to analog converter output terminal stack element; Described frequency of operation control circuit comprises a voltage-frequency translation components.
Three-dimensional layering manufacturing equipment of the present invention, it is characterized in that: this equipment also comprises the device that makes the dusty material preheating, described device comprises and is located at the outer temp controlled meter of vacuum chamber, is arranged in the powder feeding device and the temperature sensor that links to each other with temp controlled meter and be arranged in the powder feeding device and the resistance heating wire who links to each other with temp controlled meter.
A kind of process that realizes the synchronous sintering in electron beam constituency provided by the invention is characterized in that this method may further comprise the steps:
1) control computer is called Z axle control subprogram according to predefined master routine, and the piston of control piston formula formation cylinder is spread height of powder platform decline relatively, and this highly equals predefined shop powder thickness;
2) master routine calls for shop powder control subprogram, the control powder feeding device transfers out through preheating and the predefined powder of total amount, control then powder shop pressure device deliver to powder in the described piston type moulding cylinder upper space and pave, compacting, subsequently unnecessary powder is pushed the clout collection box;
3) master routine calls scanning pattern and generates subroutine, read the outline line information in a cross section of part C AD model, generate one group of scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine call instruction again generates subroutine, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, controlling electron beam is carried out a frame or a few frame projection in the powder surface zone corresponding to part section, to the shaped region preheating, make the temperature of material powder be elevated to predefined value synchronously;
4) master routine calls scanning pattern again and generates subroutine, according to the outline line information that has read, generate another group scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine instructs the generation subroutine again, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, described control circuit carries out a frame or a few frame projection in the powder surface zone corresponding to part section, powder in the shaped region is carried out little sintering, be fixed, prevent its disengaging configuration in scanning step subsequently;
5) master routine calls scanning pattern again and generates subroutine, according to the outline line information that has read, generate another group scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine call instruction again generates subroutine, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, described control circuit carries out a frame or a few frame projection in the powder surface zone corresponding to part section, powder to shaped region carries out sintering or fusing, make that powder consolidation is a synusia in the shaped region, and and previous adjacent lamina between also take place fixed;
6) master routine calls scanning pattern and generates subroutine, according to the outline line information that has read, generate another group scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine call instruction again generates subroutine, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, described control circuit carries out a frame or a few frame projection in the powder surface zone corresponding to part section, temperature-fall period to material layer in the shaped region is controlled, and makes its speed cooling with expectation;
7) master routine repeats above 1 to the next cross section of part C AD model)～6) individual step, until all the aspect completion of processing that need process, promptly obtain the shape of 3 d part.
Above-mentioned steps 1～6 is finished heating, sintering or the remelting in one deck shaping constituency and the process of deposition and is called a synusia fabrication cycles.In the above-mentioned steps 1～2 constitutes a powder and handles circulation, and 3～6 promptly constitute an electron beam projection formula scan cycle.
In method of the present invention, the shape of projection each time equals current part section figure in the electron beam projection formula scan cycle.Described each frame projection is made up of one group of scanning pattern, and this group path is one group of parallel lines or one group of bias curve, the perhaps mixing of the two, and every paths is made of discrete point; Scanning pattern is overlapping on diametric(al) top at Width or discrete point, and overlapping part is 0%～100% of described width or a diameter.
After adopting the said equipment and process, it is short that electron beam scans the time compole of selected shaped region (being the constituency) each time, because sweep velocity is exceedingly fast, so that when bigger variation does not also take place in the temperature of scan start point, whole shaped region has just scanned to be finished, and therefore is called the projection scan mode.Through a frame or multiframe scanning, the material staged heats up synchronously in the shaped region, reaches the required temperature of sintering or remelting jointly, deposits to together on the shaped region, then synchronously cooling.Because material intensification synchronously, sintering, deposition and cooling in the monolithic molding zone, therefore the thermal stress that produces can reduce greatly, improves the precision and the quality of part forming.Powder preheating device improves the initial temperature of projection scanning simultaneously, helps reducing thermograde, accelerates the speed of projection scanning.
Description of drawings
Fig. 1 represents that the system of three-dimensional layering manufacturing installation among the present invention constitutes.
Fig. 2 represents powder shop pressure device and piston type moulding cylinder.
Fig. 3 represents the arrangement of powder preheating device.
Fig. 4 represents several projection patterns that projection scanning the time can be adopted that carry out.
Fig. 5 is the formation block diagram of electron beam projection formula scan control circuit among the present invention.
Fig. 6 represents the control program process flow diagram of electron beam projection formula scan control circuit.
Fig. 7 represents to generate the program flow diagram of the required instruction of projection scan cycle.
The process flow diagram of Fig. 8 indication equipment technology controlling and process master routine.
Embodiment
Three-dimensional layering manufacturing equipment provided by the present invention mainly comprises following a few part: a shop powder platform 14 is used for retraining powder in shop powder process; Piston type moulding cylinder 20 is located at powder platform center, shop, and liftable piston is arranged in the cylinder, and piston is spread the powder platform relatively and descended behind the predefined height, and the narrow space with setting height is promptly formed at described moulding cylinder top; The height in space equals the thickness of the layer of desire structure; Powder shop pressure device 12 is located on the powder platform of shop, can the inswept shop of level powder platform the powder that carries is filled in the moulding cylinder upper space and with its pave, compacting, and unnecessary powder sent into the clout retracting device; Powder feeding device 11 is located at powder platform top, shop, is used to deposit and supply with powder; Powder recovering device is suspended on powder platform two ends, shop, is used to reclaim each shop powder residual powder; Vacuum chamber 16 surrounds into said apparatus, and the vacuum processing environment is provided; Electron gun 4 is located at the vacuum chamber top, is used for divergent bundle the powder bed that is laid in succession in the moulding cylinder is carried out sintering or fusing; Electron beam projection formula scan control circuit, the scanning pattern of controlling electron beam and beam intensity; Vacuum system 5 and 6 is operated under the suitable vacuum tightness electron gun and vacuum chamber; Control computer 10 stores the three-dimensional CAD model that desire makes up 3 d part; High-voltage power supply 19 and the control circuit 7 that is used to realize the scanning of electron beam projection formula for the power supply of electron gun each several part.
Electron beam projection formula scan control circuit 7 is instruction sequences of a response control computer, controlling electron beam is carried out the position of sintering at powder surface, the beam intensity of while controlling electron beam, thereby make electron beam realize the device of projection scanning, mainly comprise with the lower part: controller 23, accept computer instruction, the entire circuit each several part is controlled; Electron gun scanning magnetic lens driving circuit 24,25 is converted into the drive current of scanning magnetic lens with the control signal of controller, and controlling electron beam is in the position of powder surface incidence point; Electron gun bunching electrode voltage regulating and controlling circuit 26 is converted into the control signal of controller a voltage signal and is superimposed upon on the bunching electrode initial setting voltage beam intensity of controlling electron beam; Frequency of operation control circuit 27, under the control of control computer, send the consecutive pulses signal, other parts of controlling electron beam projection sweep circuit are worked under the frequency of operation of appointment, and this frequency of operation is set at any time as requested by control computer and changed; Storer, storage space in the storer and electron beam constitute mapping relations in the maximum scan zone of powder surface, promptly in this scanning area, select some nodes, address space in the unique corresponding stored device of the two-dimensional coordinate of each node, deposit two values in this storage space, X value and Y value, these two values just make electron beam equal this node at the incidence point of powder surface after driving circuit 24,25 conversion output.
Control computer each instruction in the instruction sequence that electron beam projection formula scan control circuit sends comprises two parts: the part of beam intensity when specifying the part of electron beam incident point two-dimensional coordinate and specifying electron beam in this position.Described control circuit incides the point that powder surface is in corresponding coordinate according to the instruction control electron beam with the beam intensity that requires.
The operation scanning pattern generates subroutine in the control computer, this program is at first read in the outline line information of a 2 dimensional region, and in outline line, fill with scanning pattern, the spacing of adjacent scan paths is less than the diameter of predefined beam spot, and the spacing of outline line and adjacent with it scanning pattern is less than the beam spot radius; Afterwards program with every scanning pattern discrete be one group of equidistant point, the distance of per two consecutive point is less than the diameter of default beam spot, program is stored in these in control computer according to putting in order on scanning pattern afterwards.
Operating instruction generates subroutine in the control computer, this program reads the two-dimensional points coordinate that is generated and stored by above-mentioned steps in regular turn, additional beam intensity control signal behind each coordinate, generate instruction and send to electron beam projection formula scan control circuit, the result that described control circuit is carried out these instructions in succession is electron beam inswept successively these points in the corresponding 2 dimensional region of powder surface.And the foundation instruction is controlled every electron beam beam intensity.Because per two consecutive point spacings are all less than the diameter of beam spot, make powder in this 2 dimensional region all by electron beam heating, sintering or fusing.
The outline line of 2 dimensional region is corresponding to the outline line that is stored in a cross section of 3 d part in the control computer in the said process.Said process is the process of a frame projection in the projection scanning.
The speed of beam spot is an inswept curve of powder surface is in fact by the frequency of operation decision of electron beam projection formula scan control circuit, the frequency of operation of employing 1MHz can be finished the scanning of 1,000,000 points in a second, therefore heating, sintering or the fusing of powder in electron beam projection formula scan control circuit can controlling electron beam be finished a 2 dimensional region in the extremely short time were as 0.1 second.
With energy (a collection of energy is imported in each frame projection) input dusty material layer in batches, all finish rapidly by the high-velocity scanning of electron beam, makes the powder bed temperature even by every batch of energy input under the mode of projection scanning for electron beam; The energy input makes the rising of temperature staged, this strategy help temperature field and the uniform sintering effect that makes powder obtain changing comparatively mitigation in batches, and the 3 d part internal stress level of final feasible structure reduces.
Constitute the powder operating control with the lower part in this equipment: shop powder platform; Piston type moulding cylinder; Powder feeding device; Powder shop pressure device; The clout retracting device.Powder art operating control each several part all is controlled by control computer, realizes powder manipulation circulation according to predefined program.
Powder preheating device comprises temperature sensor, is used to detect the temperature of dusty material; Heating element is used for dusty material is heated; Temperature control component is used for the temperature of powder is carried out closed-loop control.The effect of this device is to make powder to have higher temperature before electron beam scanning, and this helps sintering or melting powder material faster, can obtain littler temperature gradient distribution in the 3 d part that makes up simultaneously; Make the synchronous sintering process in constituency obtain even more ideal effect.
In the synchronous sintering process in electron beam of the present invention constituency, control computer is controlled powder operating control and electron beam projection formula scan control circuit respectively according to preset program, on piston type moulding cylinder, sprawl one deck powder particle in the shaped region, and make it to take place sintering or clinkering, thereby obtain a fixed synusia with electron beam projection scanning; On this synusia, lay another layer powder and carry out the scanning of new round projection with electron beam, the thickness of powder bed must be less than the thickness of a key, to such an extent as to can make the portion of energy of electron beam adjacent synusia and make described synusia upper surface fusing below arriving, the then new synusia that makes up will form metallurgical binding solidifying the back with preceding continuous synusia.When the shape of the layer of sintering or fusing in succession during corresponding to the shape of a part at the corresponding height upper section, then the product that obtains of this method has the shape of described 3 d part.
In the electron beam projection formula scan cycle, realize different scanning effect (preheating, little sintering, sintering, cooling control) in the above-mentioned steps by control to filling curve spacing, electron beam beam intensity and beam scan velocity.
The zone of electron beam scanning also becomes shaped region.Because sweep velocity is exceedingly fast, so that the temperature of scan start point is not when bigger variations also takes place, whole shaped region has just scanned to be finished, so is called the projection scan mode.And complete each time projection promptly scans the shaped region in whole part cross section, is called a frame.
In the described electron beam projection formula scanning, each frame projection is made up of one group of scanning pattern, behind inswept fast successively this group scanning pattern of electron beam, has promptly finished the projection of this frame.
In the described electron beam projection formula scanning, the scanning pattern that each frame projection is comprised satisfies following the requirement: after electron beam was finished described projection according to preset parameters, the material in the view field all was subjected to heating, sintering or fusing, and did not omit the zone.
The shape of each frame figure institute overlay area of described electron beam projection formula scanning is equal to the current cross section figure of part, and in this figure everywhere the energy density of electron beam look forming technology and need change to some extent or be consistent.This variation or be consistent is being controlled according to predefined requirement in the process that is being generated instruction by master routine.
The width of scanning pattern promptly equals beam spot was heated or was melted the zone behind inswept straight line or curve on the powder surface width, or beam spot irradiation powder surface point was heated after a period of time or the diameter in the zone of melting; Adjacent scan paths does not have maybe on diametric(al) and can overlap at Width or discrete point, and overlapping part is 0%～100% of described width or a diameter.
The present invention is described further below in conjunction with accompanying drawing.
Figure 1 shows that the three-dimensional layering manufacturing equipment that to realize the synchronous sintering process in electron beam constituency.Electron gun 4 is positioned at vacuum forming chamber 16 tops, and the two can be separated fully or be communicated with by isolation valve 9.Gun chamber air pressure is maintained near 10 by vacuum system 5
-4Pa, vacuum forming chamber 16 air pressure maintain 10 by vacuum system 6
-3The Pa magnitude.Power supply 19 provides power supply for the filament in the electron gun 41, bunching electrode 2, anode 3 and focusing magnetic lens 17 under the control of control computer 10.And control computer is by adjusting intensity, focusing and the switch etc. of electron beam to power supply 19.Scanning magnetic lens 18 produces the scanning of magnetic field controlling electron beam of two quadratures and variation and then realization to the control of beam spot scanning area shape, position and sweep velocity on powder surface 15 under the control of control computer 10.Control computer 10 is controlling electron beam projection scan control circuit 7 at first, and the output energy of described circuit excites the magnetic field of both direction in the scanning magnetic lens respectively, thereby realizes the control of electron beam in both direction upper deflecting and scanning.The indoor shop powder platform 14 that is provided with of vacuum forming, shop powder platform 14 center arrangement have piston type moulding cylinder 20, and piston 22 (shown in Figure 2) top in the moulding cylinder makes up three-dimensional product.Powder shop pressure device 12 can on shop powder platform 14, move horizontally and in piston type moulding cylinder powder filler and pave, compacting.For the height that makes the electron beam projection plane constant, described piston can vertical movement, it moves downward certain distance and can be in the moulding cylinder spreads at every turn for powder shop pressure device provide the powder space, shop of corresponding height, powder shop pressure device that the height of powder surface all equates behind the powder.
In the present embodiment, equipment also comprises a cover powder preheating device.Powder preheating device comprises temp controlled meter 52, temperature sensor 51, resistance heating wire 50 and the composition of the line between them.Resistance heating wire 50 and temperature sensor 51 all are located in the powder feeding device 11, and the two is all with ceramic coat and dusty material insulation.Temp controlled meter 52 is located at outside the vacuum chamber 16, obtains Current Temperatures from temperature sensor, and the duty of controlling resistance heater strip 50.
In the present embodiment, the temperature of 52 pairs of dusty materials of temp controlled meter is carried out thermostatic control, being about to powder temperature is controlled between predefined ceiling temperature and the lower limit temperature, when the detected temperature of temperature sensor is lower than lower limit temperature, then temp controlled meter makes resistance heating wire's power supply conducting, and resistance heating wire's temperature raises and dusty material is on every side heated; When powder temperature was higher than ceiling temperature, then the feed circuit of temp controlled meter off resistance heater strip made the dusty material natural cooling.
In the present embodiment, powder art preheating device only carries out temperature control to the powder art at powder feeding device dust outlet place, to reduce power demand and temperature sensor, resistance heating wire's quantity.
In the embodiment of a recommendation, powder shop pressure device 12 is not realized paving and compacting function dusty material by secondary hopper 40 and 41 on press-powder roller.As shown in Figure 2, secondary hopper 40 bottoms have straight trough, and powder can leak.Press-powder roller 41 also rotates with a fixed angular speed under the stepper motor (not shown) drives, with loose powder pressing in translation.Between secondary hopper 40 and press-powder roller 41 and the working face 14 slight distance is arranged.Distance between press-powder roller 41 and the working face is less than the distance between secondary hopper 40 and the working face 14, with the further requirement of compacted powder behind the powder of satisfied shop.
Store 3 d part in the control computer according to the cross section profile information of arranging in regular turn from low to high, section thickness information and filling calibration curve information.The master routine that moves in the control computer calls the various piece of a series of subroutine opertaing devices, realizes the synchronous sintering process in constituency, and the program implementation process will describe in detail in the back.
Fig. 4 is several path embodiment of electron beam projection formula scanning.The shadow region is the zone that needs sintering or fusing among Fig. 4 a, corresponding to the cross section figure of part on current height.Enumerated the scanning pattern of electron beam in several projection scannings among Fig. 4.Wherein, scheme with have b, c, d, g, the h among Fig. 4 of one group of parallel lines as scanning pattern.The path is a vertical parallel lines among Fig. 4 b, and the path is the dip-parallel line among Fig. 4 c, and the path is the horizontal line among Fig. 4 d, and the spacing in path increases among Fig. 4 g, increases electron beam focus bundle spot simultaneously, to reduce the intensity of electron beam scanning; Path separation further increases among Fig. 4 h, and further reduces beam intensity, with promptly by spacing that changes scanning pattern and the exposure intensity that the energy input density is adjusted electron beam.This scan mode path generates simple, if but be used for sintering, melting powder then the product mechanical property that obtains has directivity.
Fig. 4 e scans the monolithic molding zone for the bias curve with one group of part section profile.This scan mode can improve the surface accuracy and the smooth finish of part, and the product mechanical property do not have directivity, but path generating mode complexity, total path is longer, thereby can reduce the speed of a projection.Fig. 4 f represents to adopt the scan mode of parallel lines and the mixing of contour offset curve, promptly adopt contour offset curved scanning 1～10 circle in part near profile, adopt the parallel line sweeping path at remainder, the comprehensive use of dual mode can improve piece surface precision and smooth finish, can improve the speed of projection again.
In each synusia fabrication cycles, can carry out projection scanning according to above-mentioned one or more scan mode combinations.In one embodiment, the 1st～3 frame projection scanning is used for the preheating shaped region, the dusty material temperature is raise gradually and keeps the homogeneity of temperature.The scanning of the 4th frame projection is used for little thermal sintering zone, makes the material powder on surface that little molten or little sintering take place, so that remain on original position in follow-up sintering or reflow process.The scanning of the 5th frame projection is then with abundant sintering of certain thickness metal powder or fusing in the shaped region, and deposition.6th, 7 frame projections scanning is used to control the cooling rate of the material layer of firm sintering, and its speed with expectation is evenly reduced.
In other embodiments, can change the frame number of the projection scanning of various uses according to actual conditions.
Fig. 5 is an embodiment of electron beam projection formula scan control circuit.10 is control computer among the figure, and the part except that 10 constitutes electron beam projection formula scan control circuit.Circuit comprises controller 23, is connected with control computer 10 by the instruction transmission line, accepts the control computer instruction, analysis instruction, and the running of control entire circuit; Electron gun scanning magnetic lens driving circuit 24,25 is connected with controller 23 by data transmission link, respectively the deflection of controlling electron beam X, Y both direction; Electron gun bunching electrode voltage regulating and controlling circuit 26 is connected with control computer 10 by another group data transmission link, can adjust predefined bunching electrode voltage, changes the beam intensity of electron beam in technology as requested; Frequency of operation control circuit 27, comprise a voltage-frequency translation components, link to each other with a voltage signal output end of control computer 10, the voltage signal that control computer is sent here converts the square-wave pulse of some frequencies to, exports the work schedule pulse as circuit of controller 23, electron gun scanning magnetic lens driving circuit 24,25, electron gun bunching electrode voltage regulating and controlling circuit 26 to; Storer, storage space in the storer and electron beam constitute mapping relations in the maximum scan zone of powder surface, promptly in this scanning area, select some nodes, address space in the unique corresponding stored device of the two-dimensional coordinate of each node, deposit two values in this storage space, X value and Y value, these two values are through driving circuit 24, be used for controlling electron beam X after 25 the conversion, the deflection of Y direction, two values on each memory address are through such setting, to such an extent as to these two values are through 24, output makes that the incoming position at powder surface just in time equals the pairing node of its memory address behind the electron beam deflecting after the 25 circuit conversion.
In the present embodiment, control computer 10 is to the voltage signal of 0～5 volt of frequency of operation control circuit output, and the square-wave pulse of frequency of operation control circuit output 0～1000Hz is as the work schedule pulse of entire circuit.
Fig. 6 is the workflow of electron beam projection formula scan control circuit, program of operation in the controller 23 is according to the control of this program, in step 43, this program judges the residing duty of circuit according to service frequency signal, whether should receive the instruction of control computer 10; If judged result is for being then to enter next step.In the step 44, program is at first extracted the two-dimensional coordinate part in the instruction, after the mapping relations conversion, in storage space, seek the address, at this moment there are two kinds of situations to take place, step 44a judges both of these case: a kind of is that two-dimensional coordinate just in time obtains an address value after conversion, and this illustrates the just in time corresponding and node of this two-dimensional coordinate; To this situation, program execution in step 45 is promptly directly extracted this X value and Y value; Another situation is to can not get an address value after the conversion, and this illustrates that this two-dimensional coordinate falls into the middle zone of four nodes; To this situation, program enters step 46, extracts the X value and the Y value of four adjacent nodes, carries out interpolation arithmetic, and calculated result is as the X value and the Y value of needs; Step 45,46 back programs all enter step 47, promptly extract electron beam beam intensity controlling value in the instruction, obtain output valve after the conversion as requested; In the step 48, program repeat inquiry working pulse state, judge whether opportunity is suitable, execution in step 48a then in the time of suitable, in step 48a, program is sent these three values respectively to the port of 24,25,26 3 circuit, these three values are exported the operation of controlling electron beam simultaneously in the suitable time under the control of service frequency signal; In the step 49, program judges whether to finish the output of all signals according to the command signal state of control computer 10, if then EOP (end of program) if not, then goes back to execution in step 43.
Wherein the control of working pulse generation circuit is realized by control computer 10, the frequency of operation of control projection sweep circuit in technological process, thereby the speed of change electron beam projection.
In the present embodiment, electron beam projection formula scan control circuit can also comprise another electronic circuit, and controlling electron beam focuses on the magnetic lens focusing current, adjusts the focus level of electron beam in technological process as required.
In the present embodiment, before step 28, must there be the three-dimensional CAD model for the treatment of finished parts in the generative process of the required instruction of each projection scan cycle as shown in Figure 7 in control computer 10, can be by the mode that makes up or import; In step 28, peak or minimum point from model, the every reduction (from peak) or (from minimum point) the predefined height that raises are just gathered the profile information of this model corresponding height xsect, and all cross-sectional profiles information and elevation information are stored in the control computer in regular turn.
In the step 29, control computer reads the profile information of waiting to make xsect, and according to predefined projection number of times, in this profile, carry out the filling of corresponding number of times with scanning pattern, and scanning pattern carried out discretize, each scanning pattern of filling all generates according to different patterns with requirement (preheating, little sintering, sintering, cooling) according to the different purposes of this time projection, then all these projection informations is stored in the control computer 10 in regular turn.Fig. 2 can example the information of all projections of being comprised of complete projection scan cycle of explanation, comprise 7 projections in the example shown in the figure.
In the step 30, control computer reads the projection of code to be generated, characteristic according to its purposes and requirement and desire agglomerated material, determine the parameter of electron beam scanning, and at each bar scanning pattern information, generate one section control routine, control computer 10 can make electron beam realize this one scan by carrying out these code control projection scan control circuits and electron gun; The final code that generates contained all scanning patterns of this projection.
In the step 31, judge whether to generate all projection codes that this projection scan cycle is comprised, if not, then continue execution in step 30, until the code of all projections of this projection scan cycle all to generate.
In the step 32, judge whether that the code that need carry out next xsect generates, if then change and go execution in step 29; If not, then this process finishes.On behalf of this process, step 42 finish.
In one embodiment, equipment is realized technological process as shown in Figure 8.In the step 33, the control computer master routine brings into operation, and to device initialize, makes each several part be in suitable original state and position.In the step 34, equipment is finished a shop powder circulation according to the bed thickness of setting, and this cycles through the Z axle control subprogram of moving in the control computer and send instruction for shop powder subroutine to the powder operating control and realizes.
In the step 35, control computer reads corresponding instruction according to the part section of desire processing, and this group code is formed and stored in the control computer by step shown in Figure 5.
In the step 36, the master routine of control computer reads a group (corresponding projection) in the electron beam projection formula scan control circuit steering order, according to preset parameters, generate the steering order of projection scan control circuit and electron gun, and carry out this group and instruct, make electron beam every scanning pattern of inswept this projection successively, its effect is that electron beam has been imported energy evenly and rapidly to the powder of scanning area, according to the difference of instruction, might make powder temperature rising or sintering or fusing to parameter setting.
In the step 37, master routine has judged whether to finish all projections that belong to this cross section, if then enter next step; If not, then return step 36 and point to next the group control routine.
In the step 38, master routine has judged whether to finish all cross sections of desiring processing parts, if, then enter step 39, finish this process; If not, then returning step 34 carries out.
Claims (5)
1. the three-dimensional layering manufacturing equipment of the synchronous sintering in an electron beam constituency, comprise vacuum chamber (16), be located at the electron gun (4) at vacuum chamber top, respectively the vacuum system (5,6) that links to each other with vacuum chamber with electron gun and be the high-voltage power supply (19) of electron gun each several part power supply and the control computer (10) of controlling each ingredient; In described vacuum chamber, be provided with shop powder platform (14), be arranged on powder shop pressure device (12) and the piston type moulding cylinder (20) at powder platform center, shop and the powder feeding device (11) that is located at powder platform top, shop on the powder platform of shop; In described electron gun, be provided with scanning magnetic lens (18) from bottom to up successively, focus on magnetic lens (17), anode (3) and bunching electrode (2), it is characterized in that: this equipment also comprises the control circuit that is used to realize the scanning of electron beam projection formula, described scan control circuit is by constituting with the lower part: the controller (23) that is connected in control computer (10) by the steering order transmission line, pass through data bus, address bus and control bus are connected in the storer of controller (23), the electron gun that is connected with controller (23) by data bus scans magnetic lens driving circuit (24,25), by the electron gun bunching electrode voltage regulating and controlling circuit (26) that data bus is connected with controller (23), the frequency of operation control circuit (27) that links to each other with a voltage signal output end of control computer (10); Described frequency of operation control circuit also links to each other with controller (23), electron gun scanning magnetic lens driving circuit (24,25), electron gun bunching electrode voltage regulating and controlling circuit by its output signal circuit; Described electron gun scanning magnetic lens driving circuit (24,25) includes the latch that is in the input end position and links to each other by data bus with controller (23), the digital to analog converter that links to each other with the latch output terminal, and the power amplifier that links to each other with the digital to analog converter output terminal; Described electron gun bunching electrode voltage regulating and controlling circuit (26) comprises the latch that is in the input end position and links to each other by data bus with controller (23), the digital to analog converter that links to each other with the latch output terminal, the voltage amplifier that links to each other with the digital to analog converter output terminal, the voltage that links to each other with bunching electrode initial setting voltage with digital to analog converter output terminal stack element; Described frequency of operation control circuit (27) comprises a voltage-frequency conversion element.
2, according to the described three-dimensional layering manufacturing equipment of claim 1, it is characterized in that: this equipment also comprises the device that makes the dusty material preheating, described device comprises and is located at the outer temp controlled meter (53) of vacuum chamber, is arranged in the powder feeding device and the temperature sensor that links to each other with temp controlled meter (51) and be arranged in the powder feeding device and the resistance heating wire who links to each other with temp controlled meter (50).
3, a kind of utilization according to claim 1 equipment realize the process of the synchronous sintering in electron beam constituency it is characterized in that this method may further comprise the steps:
1) control computer is called Z axle control subprogram according to predefined master routine, and the piston of control piston formula formation cylinder is spread height of powder platform decline relatively, and this highly equals predefined shop powder thickness;
2) master routine calls for shop powder control subprogram, the control powder feeding device transfers out through preheating and the predefined powder of total amount, control then powder shop pressure device deliver to powder in the described piston type moulding cylinder upper space and pave, compacting, subsequently unnecessary powder is pushed the clout collection box;
3) master routine calls scanning pattern and generates subroutine, read the outline line information in a cross section of part C AD model, generate one group of scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine call instruction again generates subroutine, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, controlling electron beam is carried out a frame or a few frame projection in the powder surface zone corresponding to part section, to the shaped region preheating, make the temperature of material powder be elevated to predefined value synchronously;
4) master routine calls scanning pattern again and generates subroutine, according to the outline line information that has read, generate another group scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine instructs the generation subroutine again, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, described control circuit carries out a frame or a few frame projection in the powder surface zone corresponding to part section, powder in the shaped region is carried out little sintering, be fixed, prevent its disengaging configuration in scanning step subsequently;
5) master routine calls scanning pattern again and generates subroutine, according to the outline line information that has read, generate another group scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine call instruction again generates subroutine, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, described control circuit carries out a frame or a few frame projection in the powder surface zone corresponding to part section, powder to shaped region carries out sintering or fusing, make that powder consolidation is a synusia in the shaped region, and and previous adjacent lamina between also take place fixed;
6) master routine calls scanning pattern and generates subroutine, according to the outline line information that has read, generate another group scanning pattern, and according to the coordinate that obtains a series of two-dimensional points of arranging in regular turn after the predefined mode discretize, be stored in the computing machine, master routine call instruction again generates subroutine, read coordinate and additional electron beam beam intensity controlling value of these points successively, generating instruction sends to electron beam projection formula control circuit, described control circuit carries out a frame or a few frame projection in the powder surface zone corresponding to part section, temperature-fall period to material layer in the shaped region is controlled, and makes its speed cooling with expectation;
7) master routine repeats above 1 to the next cross section of part C AD model)～6) individual step, until all the aspect completion of processing that need process, promptly obtain the shape of 3 d part.
4, in accordance with the method for claim 3, it is characterized in that: the shape of projection each time equals current part section figure in the electron beam projection formula scan cycle.
5, in accordance with the method for claim 3, it is characterized in that: each frame projection is made up of one group of scanning pattern, and this group path is one group of parallel lines or one group of bias curve, the perhaps mixing of the two, and every paths is made of discrete point; Scanning pattern is overlapping on diametric(al) top at Width or discrete point, and overlapping part is 0%～100% of described width or a diameter.
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