CN1646661A - 用于集成电路量度的形态精确化 - Google Patents
用于集成电路量度的形态精确化 Download PDFInfo
- Publication number
- CN1646661A CN1646661A CNA03808175XA CN03808175A CN1646661A CN 1646661 A CN1646661 A CN 1646661A CN A03808175X A CNA03808175X A CN A03808175XA CN 03808175 A CN03808175 A CN 03808175A CN 1646661 A CN1646661 A CN 1646661A
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- 238000000034 method Methods 0.000 claims abstract description 187
- 238000005457 optimization Methods 0.000 claims abstract description 18
- 238000004422 calculation algorithm Methods 0.000 claims abstract description 15
- 238000013459 approach Methods 0.000 claims abstract description 10
- 230000000877 morphologic effect Effects 0.000 claims description 363
- 238000001228 spectrum Methods 0.000 claims description 295
- 239000011159 matrix material Substances 0.000 claims description 74
- 238000005259 measurement Methods 0.000 claims description 70
- 230000004304 visual acuity Effects 0.000 claims description 53
- 239000013598 vector Substances 0.000 claims description 49
- 230000035945 sensitivity Effects 0.000 claims description 41
- 238000012937 correction Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 17
- 230000008859 change Effects 0.000 claims description 11
- 238000004088 simulation Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000009795 derivation Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000001427 coherent effect Effects 0.000 claims 9
- 238000006243 chemical reaction Methods 0.000 claims 5
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000006870 function Effects 0.000 abstract description 33
- 238000010206 sensitivity analysis Methods 0.000 abstract description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 13
- 230000000737 periodic effect Effects 0.000 description 10
- 230000009021 linear effect Effects 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 230000001373 regressive effect Effects 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- 230000009022 nonlinear effect Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
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- 230000006399 behavior Effects 0.000 description 2
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- 238000004836 empirical method Methods 0.000 description 2
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- 238000006467 substitution reaction Methods 0.000 description 2
- 241001269238 Data Species 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K15/00—Anti-oxidant compositions; Compositions inhibiting chemical change
- C09K15/04—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Data Mining & Analysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Databases & Information Systems (AREA)
- Mathematical Physics (AREA)
- Software Systems (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Analysis (AREA)
Abstract
Description
Claims (76)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/075,904 US6609086B1 (en) | 2002-02-12 | 2002-02-12 | Profile refinement for integrated circuit metrology |
US10/075,904 | 2002-02-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1646661A true CN1646661A (zh) | 2005-07-27 |
CN100424711C CN100424711C (zh) | 2008-10-08 |
Family
ID=27732454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB03808175XA Expired - Fee Related CN100424711C (zh) | 2002-02-12 | 2003-02-10 | 用于集成电路量度的形态精确化 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6609086B1 (zh) |
EP (1) | EP1483355A4 (zh) |
JP (1) | JP2005517903A (zh) |
KR (1) | KR100910003B1 (zh) |
CN (1) | CN100424711C (zh) |
AU (1) | AU2003215141A1 (zh) |
TW (1) | TWI221566B (zh) |
WO (1) | WO2003068889A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105452963A (zh) * | 2013-08-13 | 2016-03-30 | Asml荷兰有限公司 | 用于评价结构的所感兴趣的参数的值的重构品质的方法和检验设备以及计算机程序产品 |
Families Citing this family (65)
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US6785638B2 (en) * | 2001-08-06 | 2004-08-31 | Timbre Technologies, Inc. | Method and system of dynamic learning through a regression-based library generation process |
US7945393B2 (en) * | 2002-01-10 | 2011-05-17 | Chemimage Corporation | Detection of pathogenic microorganisms using fused sensor data |
US6785009B1 (en) * | 2002-02-28 | 2004-08-31 | Advanced Micro Devices, Inc. | Method of using high yielding spectra scatterometry measurements to control semiconductor manufacturing processes, and systems for accomplishing same |
US7136796B2 (en) * | 2002-02-28 | 2006-11-14 | Timbre Technologies, Inc. | Generation and use of integrated circuit profile-based simulation information |
US7330279B2 (en) * | 2002-07-25 | 2008-02-12 | Timbre Technologies, Inc. | Model and parameter selection for optical metrology |
US7092110B2 (en) * | 2002-07-25 | 2006-08-15 | Timbre Technologies, Inc. | Optimized model and parameter selection for optical metrology |
US6842261B2 (en) * | 2002-08-26 | 2005-01-11 | Timbre Technologies, Inc. | Integrated circuit profile value determination |
US20040090629A1 (en) * | 2002-11-08 | 2004-05-13 | Emmanuel Drege | Diffraction order selection for optical metrology simulation |
US7072049B2 (en) * | 2003-02-03 | 2006-07-04 | Timbre Technologies, Inc. | Model optimization for structures with additional materials |
US7394554B2 (en) * | 2003-09-15 | 2008-07-01 | Timbre Technologies, Inc. | Selecting a hypothetical profile to use in optical metrology |
US7224471B2 (en) * | 2003-10-28 | 2007-05-29 | Timbre Technologies, Inc. | Azimuthal scanning of a structure formed on a semiconductor wafer |
JP3892843B2 (ja) * | 2003-11-04 | 2007-03-14 | 株式会社東芝 | 寸法測定方法、寸法測定装置および測定マーク |
US7126700B2 (en) * | 2003-12-12 | 2006-10-24 | Timbre Technologies, Inc. | Parametric optimization of optical metrology model |
AU2003300005A1 (en) | 2003-12-19 | 2005-08-03 | International Business Machines Corporation | Differential critical dimension and overlay metrology apparatus and measurement method |
US7523076B2 (en) | 2004-03-01 | 2009-04-21 | Tokyo Electron Limited | Selecting a profile model for use in optical metrology using a machine learning system |
US7212293B1 (en) * | 2004-06-01 | 2007-05-01 | N&K Technology, Inc. | Optical determination of pattern feature parameters using a scalar model having effective optical properties |
KR100625168B1 (ko) * | 2004-08-23 | 2006-09-20 | 삼성전자주식회사 | 기판에 형성된 패턴의 검사방법 및 이를 수행하기 위한검사장치 |
US7280229B2 (en) * | 2004-12-03 | 2007-10-09 | Timbre Technologies, Inc. | Examining a structure formed on a semiconductor wafer using machine learning systems |
US7459100B2 (en) * | 2004-12-22 | 2008-12-02 | Lam Research Corporation | Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate |
US7421414B2 (en) * | 2005-03-31 | 2008-09-02 | Timbre Technologies, Inc. | Split machine learning systems |
US8112248B2 (en) * | 2005-06-09 | 2012-02-07 | Chemimage Corp. | Forensic integrated search technology with instrument weight factor determination |
US20090012723A1 (en) * | 2005-06-09 | 2009-01-08 | Chemlmage Corporation | Adaptive Method for Outlier Detection and Spectral Library Augmentation |
EP1902356A4 (en) * | 2005-06-09 | 2009-08-19 | Chemimage Corp | CRIMINOLOGICAL INTEGRATED SEARCH TECHNOLOGY |
US7355728B2 (en) * | 2005-06-16 | 2008-04-08 | Timbre Technologies, Inc. | Optical metrology model optimization for repetitive structures |
US8392012B2 (en) * | 2008-10-27 | 2013-03-05 | Applied Materials, Inc. | Multiple libraries for spectrographic monitoring of zones of a substrate during processing |
US8260446B2 (en) | 2005-08-22 | 2012-09-04 | Applied Materials, Inc. | Spectrographic monitoring of a substrate during processing using index values |
US7305322B2 (en) * | 2006-03-31 | 2007-12-04 | Tokyo Electron Limited | Using a virtual profile library |
US7542859B2 (en) * | 2006-03-31 | 2009-06-02 | Tokyo Electron Ltd. | Creating a virtual profile library |
US7487053B2 (en) * | 2006-03-31 | 2009-02-03 | Tokyo Electron Limited | Refining a virtual profile library |
US20110237446A1 (en) * | 2006-06-09 | 2011-09-29 | Chemlmage Corporation | Detection of Pathogenic Microorganisms Using Fused Raman, SWIR and LIBS Sensor Data |
US7525673B2 (en) * | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Optimizing selected variables of an optical metrology system |
US7526354B2 (en) | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Managing and using metrology data for process and equipment control |
US7469192B2 (en) * | 2006-07-11 | 2008-12-23 | Tokyo Electron Ltd. | Parallel profile determination for an optical metrology system |
US7515283B2 (en) * | 2006-07-11 | 2009-04-07 | Tokyo Electron, Ltd. | Parallel profile determination in optical metrology |
WO2008027362A1 (en) * | 2006-08-28 | 2008-03-06 | Advanced Metrology Systems Llc | Measuring diffractive structures by parameterizing spectral features |
US7763404B2 (en) * | 2006-09-26 | 2010-07-27 | Tokyo Electron Limited | Methods and apparatus for changing the optical properties of resists |
US20080074677A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | accuracy of optical metrology measurements |
US20080077352A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Methods and apparatus for using an optically tunable soft mask profile library |
US20080076046A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | accuracy of optical metrology measurements |
US7555395B2 (en) * | 2006-09-26 | 2009-06-30 | Tokyo Electron Limited | Methods and apparatus for using an optically tunable soft mask to create a profile library |
US20080074678A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Accuracy of optical metrology measurements |
US7417750B2 (en) * | 2006-11-07 | 2008-08-26 | Tokyo Electron Limited | Consecutive measurement of structures formed on a semiconductor wafer using an angle-resolved spectroscopic scatterometer |
US7667858B2 (en) * | 2007-01-12 | 2010-02-23 | Tokyo Electron Limited | Automated process control using optical metrology and a correlation between profile models and key profile shape variables |
US7639351B2 (en) * | 2007-03-20 | 2009-12-29 | Tokyo Electron Limited | Automated process control using optical metrology with a photonic nanojet |
US7567353B2 (en) * | 2007-03-28 | 2009-07-28 | Tokyo Electron Limited | Automated process control using optical metrology and photoresist parameters |
US7949618B2 (en) * | 2007-03-28 | 2011-05-24 | Tokyo Electron Limited | Training a machine learning system to determine photoresist parameters |
US7483809B2 (en) * | 2007-04-12 | 2009-01-27 | Tokyo Electron Limited | Optical metrology using support vector machine with profile parameter inputs |
US7511835B2 (en) * | 2007-04-12 | 2009-03-31 | Tokyo Electron Limited | Optical metrology using a support vector machine with simulated diffraction signal inputs |
US7372583B1 (en) * | 2007-04-12 | 2008-05-13 | Tokyo Electron Limited | Controlling a fabrication tool using support vector machine |
US9151712B1 (en) * | 2007-05-30 | 2015-10-06 | Kla-Tencor Corporation | Rule checking for metrology and inspection |
TWI416096B (zh) * | 2007-07-11 | 2013-11-21 | Nova Measuring Instr Ltd | 用於監控圖案化結構的性質之方法及系統 |
US7460237B1 (en) * | 2007-08-02 | 2008-12-02 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US20090275265A1 (en) * | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Endpoint detection in chemical mechanical polishing using multiple spectra |
US7761178B2 (en) * | 2008-06-18 | 2010-07-20 | Tokyo Electron Limited | Automated process control using an optical metrology system optimized with design goals |
WO2010062497A2 (en) * | 2008-10-27 | 2010-06-03 | Applied Materials, Inc. | Goodness of fit in spectrographic monitoring of a substrate during processing |
US8751033B2 (en) * | 2008-11-14 | 2014-06-10 | Applied Materials, Inc. | Adaptive tracking spectrum features for endpoint detection |
CN102884613B (zh) * | 2010-05-05 | 2016-08-31 | 应用材料公司 | 用于终点检测的动态或适应性追踪光谱特征 |
US8834229B2 (en) | 2010-05-05 | 2014-09-16 | Applied Materials, Inc. | Dynamically tracking spectrum features for endpoint detection |
NL2006700A (en) * | 2010-06-04 | 2011-12-06 | Asml Netherlands Bv | Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods & apparatus. |
US8954186B2 (en) | 2010-07-30 | 2015-02-10 | Applied Materials, Inc. | Selecting reference libraries for monitoring of multiple zones on a substrate |
EP2515168B1 (en) * | 2011-03-23 | 2021-01-20 | ASML Netherlands B.V. | Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures |
CN102289533B (zh) * | 2011-05-09 | 2013-01-09 | 江南大学 | 一种基于几何规划的大规模集成电路回归测试管理方法 |
US9194692B1 (en) | 2013-12-06 | 2015-11-24 | Western Digital (Fremont), Llc | Systems and methods for using white light interferometry to measure undercut of a bi-layer structure |
WO2016177548A1 (en) * | 2015-05-07 | 2016-11-10 | Asml Netherlands B.V. | Metrology method and apparatus, computer program and lithographic system |
US10359705B2 (en) | 2015-10-12 | 2019-07-23 | Asml Netherlands B.V. | Indirect determination of a processing parameter |
Family Cites Families (13)
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US5607800A (en) * | 1995-02-15 | 1997-03-04 | Lucent Technologies Inc. | Method and arrangement for characterizing micro-size patterns |
US5864633A (en) * | 1996-05-17 | 1999-01-26 | Therma-Wave, Inc. | Method and apparatus for optical data analysis |
US6483580B1 (en) * | 1998-03-06 | 2002-11-19 | Kla-Tencor Technologies Corporation | Spectroscopic scatterometer system |
IL123727A (en) * | 1998-03-18 | 2002-05-23 | Nova Measuring Instr Ltd | Method and apparatus for measurement of patterned structures |
CN1303397C (zh) * | 2000-01-26 | 2007-03-07 | 音质技术公司 | 为集成电路周期性光栅产生仿真衍射信号库的方法及系统 |
US6429943B1 (en) * | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
US6532076B1 (en) * | 2000-04-04 | 2003-03-11 | Therma-Wave, Inc. | Method and apparatus for multidomain data analysis |
JP2004507719A (ja) * | 2000-08-10 | 2004-03-11 | サーマ−ウェーブ・インコーポレイテッド | 回折微細構造の光学的測定のためのデータベース補間方法 |
IL140179A (en) * | 2000-12-07 | 2004-09-27 | Nova Measuring Instr Ltd | Method and system for measuring in patterned structures |
WO2002065545A2 (en) * | 2001-02-12 | 2002-08-22 | Sensys Instruments Corporation | Overlay alignment metrology using diffraction gratings |
KR100536646B1 (ko) * | 2001-03-02 | 2005-12-14 | 액센트 옵티칼 테크놀로지스 인코포레이티드 | 산란 측정법을 이용한 라인 프로파일 비대칭 측정 |
US6785638B2 (en) * | 2001-08-06 | 2004-08-31 | Timbre Technologies, Inc. | Method and system of dynamic learning through a regression-based library generation process |
US6898596B2 (en) * | 2001-10-23 | 2005-05-24 | Therma-Wave, Inc. | Evolution of library data sets |
-
2002
- 2002-02-12 US US10/075,904 patent/US6609086B1/en not_active Expired - Lifetime
-
2003
- 2003-02-10 JP JP2003568005A patent/JP2005517903A/ja active Pending
- 2003-02-10 AU AU2003215141A patent/AU2003215141A1/en not_active Abandoned
- 2003-02-10 KR KR1020047012519A patent/KR100910003B1/ko not_active IP Right Cessation
- 2003-02-10 TW TW092102714A patent/TWI221566B/zh active
- 2003-02-10 CN CNB03808175XA patent/CN100424711C/zh not_active Expired - Fee Related
- 2003-02-10 WO PCT/US2003/003955 patent/WO2003068889A1/en active Application Filing
- 2003-02-10 EP EP03710958A patent/EP1483355A4/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105452963A (zh) * | 2013-08-13 | 2016-03-30 | Asml荷兰有限公司 | 用于评价结构的所感兴趣的参数的值的重构品质的方法和检验设备以及计算机程序产品 |
CN105452963B (zh) * | 2013-08-13 | 2017-08-22 | Asml荷兰有限公司 | 用于评价结构的所感兴趣的参数的值的重构品质的方法和检验设备以及计算机程序产品 |
US9760018B2 (en) | 2013-08-13 | 2017-09-12 | Asml Netherlands B.V. | Method and inspection apparatus and computer program product for assessing a quality of reconstruction of a value of a parameter of interest of a structure |
Also Published As
Publication number | Publication date |
---|---|
WO2003068889A1 (en) | 2003-08-21 |
TWI221566B (en) | 2004-10-01 |
CN100424711C (zh) | 2008-10-08 |
KR20040081792A (ko) | 2004-09-22 |
AU2003215141A1 (en) | 2003-09-04 |
EP1483355A2 (en) | 2004-12-08 |
US6609086B1 (en) | 2003-08-19 |
WO2003068889A8 (en) | 2003-11-13 |
EP1483355A4 (en) | 2007-05-16 |
AU2003215141A8 (en) | 2003-09-04 |
JP2005517903A (ja) | 2005-06-16 |
TW200302971A (en) | 2003-08-16 |
KR100910003B1 (ko) | 2009-07-29 |
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