CN100424711C - 用于集成电路量度的形态精确化 - Google Patents
用于集成电路量度的形态精确化 Download PDFInfo
- Publication number
- CN100424711C CN100424711C CNB03808175XA CN03808175A CN100424711C CN 100424711 C CN100424711 C CN 100424711C CN B03808175X A CNB03808175X A CN B03808175XA CN 03808175 A CN03808175 A CN 03808175A CN 100424711 C CN100424711 C CN 100424711C
- Authority
- CN
- China
- Prior art keywords
- signal
- morphological
- precision
- morphological parameters
- diffraction spectra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K15/00—Anti-oxidant compositions; Compositions inhibiting chemical change
- C09K15/04—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Mathematical Physics (AREA)
- Databases & Information Systems (AREA)
- Data Mining & Analysis (AREA)
- Software Systems (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Image Analysis (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims (74)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/075,904 US6609086B1 (en) | 2002-02-12 | 2002-02-12 | Profile refinement for integrated circuit metrology |
US10/075,904 | 2002-02-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1646661A CN1646661A (zh) | 2005-07-27 |
CN100424711C true CN100424711C (zh) | 2008-10-08 |
Family
ID=27732454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB03808175XA Expired - Fee Related CN100424711C (zh) | 2002-02-12 | 2003-02-10 | 用于集成电路量度的形态精确化 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6609086B1 (zh) |
EP (1) | EP1483355A4 (zh) |
JP (1) | JP2005517903A (zh) |
KR (1) | KR100910003B1 (zh) |
CN (1) | CN100424711C (zh) |
AU (1) | AU2003215141A1 (zh) |
TW (1) | TWI221566B (zh) |
WO (1) | WO2003068889A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102918464A (zh) * | 2010-06-04 | 2013-02-06 | Asml荷兰有限公司 | 衬底上结构的测量 |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6785638B2 (en) * | 2001-08-06 | 2004-08-31 | Timbre Technologies, Inc. | Method and system of dynamic learning through a regression-based library generation process |
US7945393B2 (en) * | 2002-01-10 | 2011-05-17 | Chemimage Corporation | Detection of pathogenic microorganisms using fused sensor data |
US6785009B1 (en) * | 2002-02-28 | 2004-08-31 | Advanced Micro Devices, Inc. | Method of using high yielding spectra scatterometry measurements to control semiconductor manufacturing processes, and systems for accomplishing same |
US7136796B2 (en) * | 2002-02-28 | 2006-11-14 | Timbre Technologies, Inc. | Generation and use of integrated circuit profile-based simulation information |
US7330279B2 (en) * | 2002-07-25 | 2008-02-12 | Timbre Technologies, Inc. | Model and parameter selection for optical metrology |
US7092110B2 (en) * | 2002-07-25 | 2006-08-15 | Timbre Technologies, Inc. | Optimized model and parameter selection for optical metrology |
US6842261B2 (en) * | 2002-08-26 | 2005-01-11 | Timbre Technologies, Inc. | Integrated circuit profile value determination |
US20040090629A1 (en) * | 2002-11-08 | 2004-05-13 | Emmanuel Drege | Diffraction order selection for optical metrology simulation |
US7072049B2 (en) * | 2003-02-03 | 2006-07-04 | Timbre Technologies, Inc. | Model optimization for structures with additional materials |
US7394554B2 (en) * | 2003-09-15 | 2008-07-01 | Timbre Technologies, Inc. | Selecting a hypothetical profile to use in optical metrology |
US7224471B2 (en) * | 2003-10-28 | 2007-05-29 | Timbre Technologies, Inc. | Azimuthal scanning of a structure formed on a semiconductor wafer |
JP3892843B2 (ja) * | 2003-11-04 | 2007-03-14 | 株式会社東芝 | 寸法測定方法、寸法測定装置および測定マーク |
US7126700B2 (en) * | 2003-12-12 | 2006-10-24 | Timbre Technologies, Inc. | Parametric optimization of optical metrology model |
EP1709490B1 (en) | 2003-12-19 | 2010-08-04 | International Business Machines Corporation | Differential critical dimension and overlay metrology |
US7523076B2 (en) | 2004-03-01 | 2009-04-21 | Tokyo Electron Limited | Selecting a profile model for use in optical metrology using a machine learning system |
US7212293B1 (en) * | 2004-06-01 | 2007-05-01 | N&K Technology, Inc. | Optical determination of pattern feature parameters using a scalar model having effective optical properties |
KR100625168B1 (ko) * | 2004-08-23 | 2006-09-20 | 삼성전자주식회사 | 기판에 형성된 패턴의 검사방법 및 이를 수행하기 위한검사장치 |
US7280229B2 (en) * | 2004-12-03 | 2007-10-09 | Timbre Technologies, Inc. | Examining a structure formed on a semiconductor wafer using machine learning systems |
US7459100B2 (en) * | 2004-12-22 | 2008-12-02 | Lam Research Corporation | Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate |
US7421414B2 (en) * | 2005-03-31 | 2008-09-02 | Timbre Technologies, Inc. | Split machine learning systems |
US8112248B2 (en) * | 2005-06-09 | 2012-02-07 | Chemimage Corp. | Forensic integrated search technology with instrument weight factor determination |
US20090012723A1 (en) * | 2005-06-09 | 2009-01-08 | Chemlmage Corporation | Adaptive Method for Outlier Detection and Spectral Library Augmentation |
EP1902356A4 (en) * | 2005-06-09 | 2009-08-19 | Chemimage Corp | CRIMINOLOGICAL INTEGRATED SEARCH TECHNOLOGY |
US7355728B2 (en) * | 2005-06-16 | 2008-04-08 | Timbre Technologies, Inc. | Optical metrology model optimization for repetitive structures |
US8260446B2 (en) * | 2005-08-22 | 2012-09-04 | Applied Materials, Inc. | Spectrographic monitoring of a substrate during processing using index values |
US8392012B2 (en) * | 2008-10-27 | 2013-03-05 | Applied Materials, Inc. | Multiple libraries for spectrographic monitoring of zones of a substrate during processing |
US7305322B2 (en) * | 2006-03-31 | 2007-12-04 | Tokyo Electron Limited | Using a virtual profile library |
US7487053B2 (en) * | 2006-03-31 | 2009-02-03 | Tokyo Electron Limited | Refining a virtual profile library |
US7542859B2 (en) * | 2006-03-31 | 2009-06-02 | Tokyo Electron Ltd. | Creating a virtual profile library |
US20110237446A1 (en) * | 2006-06-09 | 2011-09-29 | Chemlmage Corporation | Detection of Pathogenic Microorganisms Using Fused Raman, SWIR and LIBS Sensor Data |
US7526354B2 (en) | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Managing and using metrology data for process and equipment control |
US7525673B2 (en) * | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Optimizing selected variables of an optical metrology system |
US7469192B2 (en) * | 2006-07-11 | 2008-12-23 | Tokyo Electron Ltd. | Parallel profile determination for an optical metrology system |
US7515283B2 (en) * | 2006-07-11 | 2009-04-07 | Tokyo Electron, Ltd. | Parallel profile determination in optical metrology |
WO2008027362A1 (en) * | 2006-08-28 | 2008-03-06 | Advanced Metrology Systems Llc | Measuring diffractive structures by parameterizing spectral features |
US20080074678A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Accuracy of optical metrology measurements |
US7763404B2 (en) * | 2006-09-26 | 2010-07-27 | Tokyo Electron Limited | Methods and apparatus for changing the optical properties of resists |
US20080077352A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Methods and apparatus for using an optically tunable soft mask profile library |
US7555395B2 (en) * | 2006-09-26 | 2009-06-30 | Tokyo Electron Limited | Methods and apparatus for using an optically tunable soft mask to create a profile library |
US20080074677A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | accuracy of optical metrology measurements |
US20080076046A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | accuracy of optical metrology measurements |
US7417750B2 (en) * | 2006-11-07 | 2008-08-26 | Tokyo Electron Limited | Consecutive measurement of structures formed on a semiconductor wafer using an angle-resolved spectroscopic scatterometer |
US7667858B2 (en) * | 2007-01-12 | 2010-02-23 | Tokyo Electron Limited | Automated process control using optical metrology and a correlation between profile models and key profile shape variables |
US7639351B2 (en) * | 2007-03-20 | 2009-12-29 | Tokyo Electron Limited | Automated process control using optical metrology with a photonic nanojet |
US7567353B2 (en) * | 2007-03-28 | 2009-07-28 | Tokyo Electron Limited | Automated process control using optical metrology and photoresist parameters |
US7949618B2 (en) * | 2007-03-28 | 2011-05-24 | Tokyo Electron Limited | Training a machine learning system to determine photoresist parameters |
US7511835B2 (en) * | 2007-04-12 | 2009-03-31 | Tokyo Electron Limited | Optical metrology using a support vector machine with simulated diffraction signal inputs |
US7483809B2 (en) * | 2007-04-12 | 2009-01-27 | Tokyo Electron Limited | Optical metrology using support vector machine with profile parameter inputs |
US7372583B1 (en) * | 2007-04-12 | 2008-05-13 | Tokyo Electron Limited | Controlling a fabrication tool using support vector machine |
US9151712B1 (en) * | 2007-05-30 | 2015-10-06 | Kla-Tencor Corporation | Rule checking for metrology and inspection |
TWI416096B (zh) * | 2007-07-11 | 2013-11-21 | Nova Measuring Instr Ltd | 用於監控圖案化結構的性質之方法及系統 |
US7460237B1 (en) | 2007-08-02 | 2008-12-02 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US20090275265A1 (en) * | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Endpoint detection in chemical mechanical polishing using multiple spectra |
US7761178B2 (en) * | 2008-06-18 | 2010-07-20 | Tokyo Electron Limited | Automated process control using an optical metrology system optimized with design goals |
WO2010062497A2 (en) * | 2008-10-27 | 2010-06-03 | Applied Materials, Inc. | Goodness of fit in spectrographic monitoring of a substrate during processing |
US8751033B2 (en) * | 2008-11-14 | 2014-06-10 | Applied Materials, Inc. | Adaptive tracking spectrum features for endpoint detection |
US8834229B2 (en) | 2010-05-05 | 2014-09-16 | Applied Materials, Inc. | Dynamically tracking spectrum features for endpoint detection |
CN106252220B (zh) * | 2010-05-05 | 2019-06-11 | 应用材料公司 | 用于终点检测的动态或适应性追踪光谱特征 |
US8954186B2 (en) | 2010-07-30 | 2015-02-10 | Applied Materials, Inc. | Selecting reference libraries for monitoring of multiple zones on a substrate |
EP2515168B1 (en) * | 2011-03-23 | 2021-01-20 | ASML Netherlands B.V. | Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures |
CN102289533B (zh) * | 2011-05-09 | 2013-01-09 | 江南大学 | 一种基于几何规划的大规模集成电路回归测试管理方法 |
US9760018B2 (en) | 2013-08-13 | 2017-09-12 | Asml Netherlands B.V. | Method and inspection apparatus and computer program product for assessing a quality of reconstruction of a value of a parameter of interest of a structure |
US9194692B1 (en) | 2013-12-06 | 2015-11-24 | Western Digital (Fremont), Llc | Systems and methods for using white light interferometry to measure undercut of a bi-layer structure |
NL2016614A (en) | 2015-05-07 | 2016-11-10 | Asml Netherlands Bv | Metrology method and apparatus, computer program and lithographic system. |
KR102124896B1 (ko) | 2015-10-12 | 2020-06-22 | 에이에스엠엘 네델란즈 비.브이. | 처리 파라미터의 간접 결정 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999045340A1 (en) * | 1998-03-06 | 1999-09-10 | Kla-Tencor Corporation | Measuring a diffracting structure, broadband, polarized, ellipsometric, and an underlying structure |
WO2001055669A1 (en) * | 2000-01-26 | 2001-08-02 | Timbre Technologies, Incorporated | Caching of intra-layer calculations for rapid rigorous coupled-wave analyses |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5607800A (en) * | 1995-02-15 | 1997-03-04 | Lucent Technologies Inc. | Method and arrangement for characterizing micro-size patterns |
US5864633A (en) * | 1996-05-17 | 1999-01-26 | Therma-Wave, Inc. | Method and apparatus for optical data analysis |
IL123727A (en) * | 1998-03-18 | 2002-05-23 | Nova Measuring Instr Ltd | Method and apparatus for measurement of patterned structures |
US6429943B1 (en) * | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
US6532076B1 (en) * | 2000-04-04 | 2003-03-11 | Therma-Wave, Inc. | Method and apparatus for multidomain data analysis |
JP2004507719A (ja) * | 2000-08-10 | 2004-03-11 | サーマ−ウェーブ・インコーポレイテッド | 回折微細構造の光学的測定のためのデータベース補間方法 |
IL140179A (en) * | 2000-12-07 | 2004-09-27 | Nova Measuring Instr Ltd | Method and system for measuring in patterned structures |
WO2002065545A2 (en) * | 2001-02-12 | 2002-08-22 | Sensys Instruments Corporation | Overlay alignment metrology using diffraction gratings |
US6856408B2 (en) * | 2001-03-02 | 2005-02-15 | Accent Optical Technologies, Inc. | Line profile asymmetry measurement using scatterometry |
US6785638B2 (en) * | 2001-08-06 | 2004-08-31 | Timbre Technologies, Inc. | Method and system of dynamic learning through a regression-based library generation process |
US6898596B2 (en) * | 2001-10-23 | 2005-05-24 | Therma-Wave, Inc. | Evolution of library data sets |
-
2002
- 2002-02-12 US US10/075,904 patent/US6609086B1/en not_active Expired - Lifetime
-
2003
- 2003-02-10 KR KR1020047012519A patent/KR100910003B1/ko not_active IP Right Cessation
- 2003-02-10 TW TW092102714A patent/TWI221566B/zh active
- 2003-02-10 CN CNB03808175XA patent/CN100424711C/zh not_active Expired - Fee Related
- 2003-02-10 JP JP2003568005A patent/JP2005517903A/ja active Pending
- 2003-02-10 AU AU2003215141A patent/AU2003215141A1/en not_active Abandoned
- 2003-02-10 EP EP03710958A patent/EP1483355A4/en not_active Withdrawn
- 2003-02-10 WO PCT/US2003/003955 patent/WO2003068889A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999045340A1 (en) * | 1998-03-06 | 1999-09-10 | Kla-Tencor Corporation | Measuring a diffracting structure, broadband, polarized, ellipsometric, and an underlying structure |
WO2001055669A1 (en) * | 2000-01-26 | 2001-08-02 | Timbre Technologies, Incorporated | Caching of intra-layer calculations for rapid rigorous coupled-wave analyses |
Non-Patent Citations (2)
Title |
---|
Specular spectroscopic scatterometry. XINHUI NIU et al.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING,Vol.14 No.2. 2001 |
Specular spectroscopic scatterometry. XINHUI NIU et al.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING,Vol.14 No.2. 2001 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102918464A (zh) * | 2010-06-04 | 2013-02-06 | Asml荷兰有限公司 | 衬底上结构的测量 |
CN102918464B (zh) * | 2010-06-04 | 2015-05-13 | Asml荷兰有限公司 | 衬底上结构的测量 |
US9977340B2 (en) | 2010-06-04 | 2018-05-22 | Asml Netherlands B.V. | Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods and apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWI221566B (en) | 2004-10-01 |
CN1646661A (zh) | 2005-07-27 |
EP1483355A4 (en) | 2007-05-16 |
AU2003215141A8 (en) | 2003-09-04 |
WO2003068889A8 (en) | 2003-11-13 |
JP2005517903A (ja) | 2005-06-16 |
KR100910003B1 (ko) | 2009-07-29 |
WO2003068889A1 (en) | 2003-08-21 |
TW200302971A (en) | 2003-08-16 |
US6609086B1 (en) | 2003-08-19 |
AU2003215141A1 (en) | 2003-09-04 |
EP1483355A2 (en) | 2004-12-08 |
KR20040081792A (ko) | 2004-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100424711C (zh) | 用于集成电路量度的形态精确化 | |
US7330279B2 (en) | Model and parameter selection for optical metrology | |
CN100559156C (zh) | 使用抽样衍射信号选择假想剖面用于光学计量的方法 | |
US7092110B2 (en) | Optimized model and parameter selection for optical metrology | |
US7126700B2 (en) | Parametric optimization of optical metrology model | |
TWI222148B (en) | Metrology diffraction signal adaptation for tool-to-tool matching | |
US7487053B2 (en) | Refining a virtual profile library | |
US7428060B2 (en) | Optimization of diffraction order selection for two-dimensional structures | |
CN102918464B (zh) | 衬底上结构的测量 | |
CN101413791B (zh) | 在光学计量中用近似和精细衍射模型确定结构的轮廓参数 | |
JP2005534192A5 (zh) | ||
TW201243738A (en) | Accurate and fast neural network training for library-based critical dimension (CD) metrology | |
CN106471353B (zh) | 用于光学计量的高度相关参数的相关性的动态移除 | |
US7542859B2 (en) | Creating a virtual profile library | |
CN1659574B (zh) | 用于集成电路的光学计量的波长选择方法 | |
KR101919628B1 (ko) | 계측용 와이드 프로세스 레인지 라이브러리 | |
US6842261B2 (en) | Integrated circuit profile value determination | |
Yau | Uncertainty analysis in geometric best fit | |
US7305322B2 (en) | Using a virtual profile library | |
CN101359612B (zh) | 晶片图案结构的检查装置及其计量数据管理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: TOKYO YILI KECHUANG USA INC. Free format text: FORMER OWNER: TEL TIMBRE TECHNOLOGY INC. Effective date: 20140423 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: TEL TIMBRE TECHNOLOGY INC. Free format text: FORMER NAME: TIMBRE TECHNOLOGIES, INC. |
|
CP01 | Change in the name or title of a patent holder |
Address after: California, USA Patentee after: TEL sound quality technology Address before: California, USA Patentee before: Timbre Technologies, Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140423 Address after: Texas, USA Patentee after: Tokyo Yili Kechuang company in the United States Address before: California, USA Patentee before: TEL sound quality technology |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081008 Termination date: 20170210 |
|
CF01 | Termination of patent right due to non-payment of annual fee |