CN1644301A - Low melting point tin-zinc solder without lead and soldering paste - Google Patents
Low melting point tin-zinc solder without lead and soldering paste Download PDFInfo
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- CN1644301A CN1644301A CN 200510038181 CN200510038181A CN1644301A CN 1644301 A CN1644301 A CN 1644301A CN 200510038181 CN200510038181 CN 200510038181 CN 200510038181 A CN200510038181 A CN 200510038181A CN 1644301 A CN1644301 A CN 1644301A
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Abstract
A low-smelting-point non-lead SnZn-alloy solder is prepared from Zn (5-9 wt.%), Bi (0.5-4), Nd (0.01-0.5) and Sn (rest). Its solder paste features that the Sn or Sn-alloy particles are coated on the surface of each solder particle for high stability and high antioxidizing power.
Description
Technical field
The present invention relates to a kind of universal non-lead solder that is used for electronic devices and components welding and surface encapsulation, relate in particular to a kind of low melting point tin-zinc solder without lead and soldering paste thereof.
Background technology
In electronic industry, conventional solder is a base with tin lead (Sn-Pb) alloy all.Electronics that develops rapidly and information industry have caused electron wastes sharply to increase, and a large amount of vertical the connecing that these electron wastes decomposite threatens human health, and countries in the world are all considering that limiting this element by legislation uses in electronic product.China is the also plumbous use of legislation restriction at present, but as the big producing country of the various electronic products of consume electrons scolder, the high-performance Pb-free environment-friendly soldering of development of new is the important topic that China's electronics and information industry face at present.
The lead-free solder of research and development is divided into high temperature, middle gentle low temperature three individual system by fusing point both at home and abroad.The high temperature owner will be made up of Sn-Ag, Sn-Cu and three alloy systems of Sn-Sb, and their common feature is that fusing point is than traditional Sn-Pb scolder height.Wherein Sn-Ag is the every fundamental property of scolder, and especially its wettability is good, is one of focus of research at present, is the major obstacle of scolder development but higher production cost and welding temperature are Sn-Ag.Sn-Bi and Sn-In are that scolder is low excessively owing to fusing point in the low temperature system, and electron device generates heat in operational process and makes it be difficult to meet the demands on resistance toheat, can only be applied to the special occasions that minority requires low temperature welding.The most approaching traditional Sn-Pb scolder of fusing point of the Sn-Zn binary eutectic alloy that middle temperature is, and its cost is low, mechanical property good, be the most promising low-cost lead-free solder, but the wettability of binary Sn-Zn alloy is relatively poor, this is to restrict its bottleneck problem as the used for electronic packaging scolder at present.
On Sn-Zn eutectic alloy basis, ternary and multi-component leadless alloys such as Sn-Zn-In, Sn-Zn-Bi, Sn-Zn-Al, Sn-Zn-Ag and Sn-Zn-Re have been developed in recent years.With binary Sn-Zn alloy phase ratio; the wettability of these alloys improves to a certain extent; but still do not reach the level of Sn-Pb scolder or follow other performance of increase of alloying element significantly to worsen, and often require to use shielding gas or active scaling powder in the welding process.
Summary of the invention
The invention provides a kind of can be at the low melting point tin-zinc solder without lead and the soldering paste thereof that in atmospheric environment, directly weld use, the present invention can improve oxidation-resistance and stability, and can reduce cost.
The present invention adopts following technical scheme:
By Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 5～9%, and the weight percent content of Bi is 0.5～4%, and the weight percent content of Nd is 0.01～0.5%, all the other are Sn;
The soldering paste that low melting point tin-zinc solder without lead is made is covered with Sn or the Sn alloy of 0.1～10 μ m on the solder grain surface.
Compared with prior art, the present invention has following advantage:
1. do not contain noble metal element and high-melting-point elements such as Cu, Ni such as In, Ag, simplified the kind of alloying element, meeting or exceeding cost and the melting requirement that has reduced alloy when other Sn-Zn is solder performance.Do not have other high-meltiing alloy element except that the simple substance rare earth element nd, reduced the requirement to melting equipment on the one hand, simplified melting technology on the other hand, the composition range of alloy also can be controlled effectively.2. the interpolation by the simple substance rare earth element nd has reached multiple optimization effect, and the antioxidant property of Nd is apparently higher than other rare-earth elements La and Ce.Particularly improved oxidation-resistance, make this scolder can adopt in active scaling powder under the condition of nitrogen-less protection, weld.3. adopted the method for covering Sn or Sn alloy to improve the storage stability of this alloy soldering paste.4. fusing point is not higher than 200 ℃, and melting range is not more than 5 ℃.Need not during use equipment and electronic component are proposed more high heat resistance requirement; 5. can use halogen-containing lower middle active scaling powder, have excellent wetting capacity and weldability in the condition that need not nitrogen protection; 6. the scolder melting technology is simple, and composition range is easy to control; 7. unit elongation is not less than 15%, is easy to machine-shaping, low processing cost; 8. strength of alloy is not less than 60MPa (strain rate is not less than 10-3S-1), and welding joint is reliable and stable, satisfies industrial service requirements.9. can not only be used for wave soldering and manual welding, also can be made into soldering paste and be used for reflow welding, soldering paste has the stable characteristics of preserving.10. certain thickness Sn or Sn alloy clad are applied on the solder powder that obtains by the spraying processing, its objective is in order to improve the storage stability of the soldering paste that adopts this scolder formation.By such surface treatment, protected scolder to be in can to keep for a long time in the soldering flux stable and not with soldering flux generation electrochemical reaction, effectively raise the stability of soldering paste.
Description of drawings
Figure 1B i is to the wetting sex graphic representation of Sn-Zn alloy;
Fig. 2 Bi is to the graphic representation of Sn-Zn alloy melting point and melting range influence;
Fig. 3 Bi is to the graphic representation of Sn-Zn strength of alloy and unit elongation influence;
Fig. 4 Sn-Zn-Bi-Nd and Sn-Zn-Bi-La oxidation-resistance comparative graph;
Fig. 5 Sn-Zn-Bi-Nd and Sn-Zn-Bi-La wetting power comparative graph.
Embodiment
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 5～9%, and the weight percent content of Bi is 0.5～4%, and the weight percent content of Nd is 0.01～0.5%, all the other are Sn.
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and its proportioning is: the Zn that contains 6～9 weight %; 2～4 weight %Bi; 0.05～0.5 weight %Nd, all the other are Sn.
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and its proportioning is: the Zn that contains 6～8 weight %; 2～3.5 weight %Bi; 0.05～0.2 weight %Nd, all the other are Sn.
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and its proportioning is: the Sn or the Sn alloy that are covered with 0.1～10 μ m on the solder grain surface.
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 5%, and the weight percent content of Bi is 0.5%, and the weight percent content of Nd is 0.01%, all the other are Sn.
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 9%, and the weight percent content of Bi is 4%, and the weight percent content of Nd is 0.5%, all the other are Sn.
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 6.5%, and the weight percent content of Bi is 3.7%, and the weight percent content of Nd is 0.08%, all the other are Sn.
Embodiment 8
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 8.7%, and the weight percent content of Bi is 2.8%, and the weight percent content of Nd is 0.1%, all the other are Sn.
Embodiment 9
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 7.2%, and the weight percent content of Bi is 1.9%, and the weight percent content of Nd is 0.25%, all the other are Sn.
A kind of low melting point tin-zinc solder without lead, by Zn, Bi, Nd and Sn form, and wherein the weight percent content of Zn is 5.5%, and the weight percent content of Bi is 1%, and the weight percent content of Nd is 0.4%, all the other are Sn.
Claims (4)
1, a kind of low melting point tin-zinc solder without lead is characterized in that by Zn Bi, Nd and Sn form, and wherein the weight percent content of Zn is 5～9%, and the weight percent content of Bi is 0.5～4%, the weight percent content of Nd is 0.01～0.5%, and all the other are Sn.
2, low melting point tin-zinc solder without lead as claimed in claim 1 is characterized in that containing the Zn of 6～9 weight %; 2～4 weight %Bi; 0.05～0.5 weight %Nd, all the other are Sn.
3, low melting point tin-zinc solder without lead as claimed in claim 1 is characterized in that containing the Zn of 6～8 weight %; 2～3.5 weight %Bi; 0.05～0.2 weight %Nd, all the other are Sn.
4. soldering paste that utilizes the described low melting point tin-zinc solder without lead of claim 1 to make is characterized in that being covered with on the solder grain surface Sn or the Sn alloy of 0.1～10 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100381818A CN1313241C (en) | 2005-01-20 | 2005-01-20 | Low melting point tin-zinc solder without lead and soldering paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100381818A CN1313241C (en) | 2005-01-20 | 2005-01-20 | Low melting point tin-zinc solder without lead and soldering paste |
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| Publication Number | Publication Date |
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| CN1644301A true CN1644301A (en) | 2005-07-27 |
| CN1313241C CN1313241C (en) | 2007-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100381818A Expired - Fee Related CN1313241C (en) | 2005-01-20 | 2005-01-20 | Low melting point tin-zinc solder without lead and soldering paste |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101214586B (en) * | 2008-01-04 | 2010-06-02 | 东南大学 | Tin-zinc base lead-free solder and preparation thereof |
| CN102489893A (en) * | 2010-12-31 | 2012-06-13 | 广东中实金属有限公司 | SnZn-based lead-free brazing alloy |
| CN102489892A (en) * | 2010-12-31 | 2012-06-13 | 广东中实金属有限公司 | SnZn-based lead-free brazing filler metal containing Cr |
| CN102912278A (en) * | 2012-11-16 | 2013-02-06 | 戴国水 | Lead-free metal spraying material |
| CN104785949A (en) * | 2015-05-12 | 2015-07-22 | 昆山成利焊锡制造有限公司 | Solder powder doped with tin-plated alloyed powder and soldering paste containing solder powder |
| CN108311812A (en) * | 2014-04-02 | 2018-07-24 | 千住金属工业株式会社 | Solder alloy and use its method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69632866T2 (en) * | 1995-09-29 | 2005-07-14 | Matsushita Electric Industrial Co., Ltd., Kadoma | LEAD-FREE LOT |
| JP2000094181A (en) * | 1998-09-24 | 2000-04-04 | Sony Corp | Solder alloy composition |
| JP4138965B2 (en) * | 1998-10-01 | 2008-08-27 | 三井金属鉱業株式会社 | Lead-free solder powder and manufacturing method thereof |
| CN1169997C (en) * | 2002-04-29 | 2004-10-06 | 戴国水 | Lead-free material for spraying gold and its preparing process |
| CN1555960A (en) * | 2004-01-10 | 2004-12-22 | 大连理工大学 | Tin zinc copper leadless solder alloy |
-
2005
- 2005-01-20 CN CNB2005100381818A patent/CN1313241C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101214586B (en) * | 2008-01-04 | 2010-06-02 | 东南大学 | Tin-zinc base lead-free solder and preparation thereof |
| CN102489893A (en) * | 2010-12-31 | 2012-06-13 | 广东中实金属有限公司 | SnZn-based lead-free brazing alloy |
| CN102489892A (en) * | 2010-12-31 | 2012-06-13 | 广东中实金属有限公司 | SnZn-based lead-free brazing filler metal containing Cr |
| CN102912278A (en) * | 2012-11-16 | 2013-02-06 | 戴国水 | Lead-free metal spraying material |
| CN102912278B (en) * | 2012-11-16 | 2014-07-30 | 戴国水 | Lead-free metal spraying material |
| CN108311812A (en) * | 2014-04-02 | 2018-07-24 | 千住金属工业株式会社 | Solder alloy and use its method |
| CN104785949A (en) * | 2015-05-12 | 2015-07-22 | 昆山成利焊锡制造有限公司 | Solder powder doped with tin-plated alloyed powder and soldering paste containing solder powder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1313241C (en) | 2007-05-02 |
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