CN1630963A - 使用多级和空间填充形状元件的取样不足微带阵列 - Google Patents
使用多级和空间填充形状元件的取样不足微带阵列 Download PDFInfo
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Abstract
一种取样不足的微带阵列,使用基于分形振子几何结构的多级合空间填充形状的贴片元件,比使用传统元件如正方形或圆形贴片能够获得的方向性,在相同的电子区域内获得了相同的方向性。然而,对于基于分形振子阵列的元件数目不能降低馈电网络和整体网络的复杂性。可以降低互耦合以避免辐射图形的畸变。由于在馈电网络中小的复杂性,比在相同电子区使用传统贴片元件获得的增益,可以获得更高的增益。
Description
发明目标和背景
高方向性的微带阵列,因其较细的剖面和较低的机械复杂性[J.Huang.“Ka-带圆偏振高增益微带阵列天线”,IEEE Trans.Antennas and Propagation,vol.43,no.1,pp.113-116,1995年1月],正成为抛物线辐射器天线的一种选择。然而一个重要的问题是馈给大量元件的馈电网络的复杂性[E.Levine,G.Malamud,S.Shtrikman,D.Treves.“含有馈电网络的微带阵列天线研究”,IEEE Trans.Antennas and Propagation,vol.37,no.4,pp.426-434,1989年4月]。这样,馈电网络需要一较大的空间。此外,在相控阵中,换相器、放大器和其他的MMIC必须和馈电系统一起集成,这是一个很重大的集成问题。从这种意义上说,本发明提议了一种新颖的微带阵列方案,采用多级或空间填充形状的天线元件[“多级天线”,发明专利WO0122528],[“空间填充微型天线”,WO0154225]。在现有技术中已公认,天线设备的多级结构包括一个导电结构,包括一系列多边形,所有所述多边形具有相同数目的边,其中所述多边形通过电容耦合或欧姆接触的方式电磁耦合,其中在至少75%的所述多边形定义的所述导电多级结构中,直接相连的多边形之间的接触区域比所述多边形的周长窄50%。在多级结构的这种定义下,圆,椭圆也包括在内,因为它们可以理解为有许多(理想上无穷)数目边的多边形。天线当至少一部分成形为多级结构时就说它是多级天线。一个空间填充天线的空间填充曲线,如现有技术中,由至少10个扇形体组成,这些扇形体以一种方式连接从而每个扇形体和相邻的扇形体形成一个角度,也就是说,没有一对相邻的扇形体能定义一个更大的直的扇形体,其中如果而且只有周期是由非周期性曲线定义的,该曲线由至少十个相连的扇形体组成,没有一对所述相邻的和连接的扇形体能定义一个更直更大的扇形体,曲线才能任意地沿着空间一个固定的直的方向呈现周期性。此外,无论这种SFC的设计是什么,它除了初始点和终点以外不可能在任何一点和自己相交(即整个曲线可以排列成一个闭合的曲线或环,但是曲线的任何一个部分都不可以成为一个闭合的环)。本发明包括对一个天线阵列用一种新配置把这些元件中的几个连接起来,使得辐射元件的数目与现有技术相比减少了,但是天线的整体方向性得到保持。主要的优势是,当根据本发明设计阵列时,同现有技术的状态相比较需要的元件数目要少。图6示出了一个传统的二维阵列方法,使用了圆形贴片,元件之间的间隔在工作频率下小于0.9λ,λ为工作频率的波长。图7示出了一个二维阵列的新方案,采用了一个多级形状贴片,元件之间的间隔在工作频率下大于0.9λ。图8示出了另一个二维阵列的新方案,采用了一个空间填充形状的贴片,元素间隔在一个方向上大于0.9λ,而在垂直方向上小于0.9λ。图7和图8示出的新方案同图6传统的现有技术方案相比,元件数目较少。这种使用较少数目元件阵列的排列是新颖的,构成了本发明的核心。由于多级或空间填充形状的元件,这种微带阵列可以采用更少的元件。使用较少元件的一个优势是,例如,馈电系统的复杂性降低了,因此可以有更多的空间集成其他微波元件。此外它减少了天线的体积和重量,在成本上,例如卫星天线可以成为一个优势。
在本发明中作为天线辐射元件的这种多级和空间填充形状贴片元件以高方向性为特色。这种性能可以在现有技术中找到。[C.Borja,G.Font,S.Blanch,J.Romeu,“高方向性分形边界微带贴片天线”,IEEElectronic Letters.Vol.26,no9,pp.778-779,2000],[J.Anguera,C.Puente,C.Borja,R.Montero,J.Soler,“基于Sierpinski分形的小且高方向性蝴蝶结形贴片天线”,Microwave and Optical TechnologyLetters,vol.31,no3,pp.239-241,2001年11月]。这种多级和空间填充形状的贴片元件支持共振模式,根据声学领域继承的名称被称为分形振子和fractino。[B.Sapoval,Th.Gobron,A.Margolina“分形振子鼓的振动”,The American Physical Society,vol.67,no21,pp.2974-29771991年11月]。取决于天线的几何结构,天线支持分形振子或fractino模式:大体来讲,这种模式是一种具有比基本模式(最低共振频率)大的共振频率。当天线以一分形振子或fractino模式工作时,比在基本模式下工作的方向特性要强,它甚至保持了一个宽边辐射图形。
发明概述
本发明的关键点是在一个阵列环境中使用多级或空间填充贴片元件;这种贴片元素以分形振子或fractino模式工作。这种模式,如前面提到的,是比基本模式频率更高的共振模式,特点是呈现一种宽边辐射图形,方向特性比基本模式所得到的辐射图形更强。
当所述元件用于一种阵列环境中时,而且由于他们的强方向性,如果采用传统的欧几里得贴片元件(矩形,圆形,三角形的等),获得相同的方向性只需要较少数目的元件。换句话说,在一个给定区域,采用传统的贴片元件或多级/空间填充形状贴片元件,可以得到相同的方向性,但是在后者的情况下,元件数目可以减少。例如,在一些实施例中,通过采用多级或空间填充形状贴片元件可以至少比传统元件数目减少3个。如果在一个更高的分形振子或fractino模式下工作,方向性比以前的模式下的方向特性要强,元件可以大大减少,例如,在一个更高的分形振子或fractino模式下工作可以减少10个。这种元件数目上的减少表明了阵列环境中的一个优势,因为馈电系统的复杂性降低了:有更多的空间来放置其他的微波元件例如换相器,放大器,滤波器,匹配网络,同向双工器等。这种性能表明了一种优势,例如在卫星天线中,因为没有必要为上面提到的微波元件(放大器等)增加一个新的额外的模块,天线体积和重量可以减少。
由于这种多级和空间填充形状元件支持的分形振子/fractino模式的强方向性,在如图6所示采用14×13的传统现有技术的圆形贴片时,元件之间的元件间隔在工作频率下可以比典型的0.9λ要大。图7描绘了一种新的方案,有仅仅8×8的多级元件构成,元件之间的间隔在水平和垂直方向上比0.9λ要大。图8示出了和以前同样的概念但是采用了16×8的空间填充形状元件。在后一种情况下只有水平方向上呈现了大于0.9λ的元件间隔,而在垂直方向上,元件间隔小于0.9λ。图7和8所示的方案的优势在于他们使用了比使用传统贴片的传统现有技术方法更少的元件,如图6所描述,在相同的区域内获得了相同的方向性。图8所示的第二种方案,尽管比图7的方案使用了更多的元件,却提高了波束操纵能力。
本发明的另一个优势在于,在一些实施例中,元件之间的互耦合因为元件之间的距离的增大而减少。所以,对于采用传统贴片元件在基本模式下工作的传统方法,辐射图形畸变或波束操纵问题可以降低。
最后,另一个重要的优势是,T字形交叉和弯曲的数目减少了。例如,图9示出了一个16元件线性阵列的联合馈电网络,这在所述现有技术中是一个典型的排列。另一方面,图10示出了另一种8个多级形状元件线性阵列的联合馈电网络。两种阵列都获得了相同的方向性,但是图10使用的联合馈电网络却呈现较少的T字形交叉和弯曲。这种减少通常代表了天线效率和极化纯度的改进,这是从本发明获得的一个新优势。
附图简述
图1示出了一个微带贴片(1)的特殊实例,示出一个由Sierpinski分形几何结构激发的多级几何结构。天线被蚀刻到一个薄衬底(2)的顶端部分;接地面(3)在底部。在这个特殊情况下,天线是同轴馈给(4),这在所述现有技术中是熟知的馈给机制。
图2示出了图1相同的特殊几何结构。在这种情况下,天线被蚀刻到一个悬挂在空中的薄衬底(6)上。利用馈电和贴片之间的一个间隙(4)和一个电容耦合(5),天线被同轴馈给。应用于多级形状贴片的间隙机制是创新性的,构成了本发明的一个基本部分。
图3示出了由一个有源贴片(1)和一个寄生贴片(8)构成的一个叠层结构。两个结构都是由Sierpinski分形几何结构激发的多级贴片元件。有源贴片被蚀刻到一薄衬底(2)上,而且同轴馈给(4)。图3的叠层结构采用多级形状的元件,这是有创新性的,构成了本发明的一个基本部分。
图4描绘了基于分形科赫曲线的空间填充贴片上的布局图(9)。在这种情况下,贴片由两个同轴探头(10)馈给。两个馈给探头用于获得一个交叉或圆偏振天线。这种产生交叉和圆偏振微带天线的机制在现有技术中已经熟知。
图5描绘了另一个基于蝴蝶结形状的科赫曲线(19)基础之上的空间填充几何结构的实例。这种几何形状由于它的剖面而可以支持分形模式。这种贴片在微带阵列中的应用是独创性的,这样构成了本发明的一个基本部分。
图6示出了一个传统的矩形网格(11),使用了环形贴片,是现有技术描述的一个典型方案。
图7代表了一种新的矩形网格结构,使用了8×8元件(12)构成的多级形状贴片。
图8示出了一种新的矩形网格结构,使用了16×8元件(20)形成的空间填充形状的贴片。
图9示出了线性16个元件阵列的联合馈电网络的框图(13),使用了圆形贴片,是现有技术已知的一个典型排列。
图10示出了8个多级形状贴片元件线性阵列的联合馈电网络的框图(14),这是一个新配置。
图11示出了一个H形状(15)的阵列馈电结构的一个实例。该馈电网络可以使用已知的微带,带状线,以及其他例如光子带隙结构(PBG)来建构。这种网络馈给一个如图7(12)的8×8贴片元件的二维阵列。
图12示出了一个采用多级贴片元件的新的环形网格(16)。
图13示出了新的三角形(17)和圆形(18)的二维网格,采用了多级贴片。
优选实施例详述
图1示出了一个基本辐射多级元件(1)的实例,获得了一个比在相同频率(矩形,圆形形状等)工作下的传统欧几里得贴片元件更强方向性的宽边辐射模式。这种贴片可以例如印刷到一个电介质衬底(2)上,或者可以例如通过一个激光工艺进行整合。任何已知的印刷电路制造技术都可以被用来图形化电介质衬底上的多级或空间填充元件。所述电介质衬底可以是例如玻璃-纤维板,聚四氟乙烯基衬底(例如ClucladR)或其他标准的射频和微波衬底(例如Rogers 4003R或KaptonR)。图1示的天线性能已经发表在[[J.Anguera,C.Puente,C.Borja,R.Montero,J.Soler,“基于Sierpinski分形的小且高方向性蝴蝶结形贴片天线”,Microwave and Optical Technology Letters,vol.31,no3,pp.239-241,2001年11月]。
这种馈电方案可以用于现有技术中贴片天线的任何一种,例如,一个同轴电缆(4,7),其外部导线(7)连接到接地面,内部导线(4)以预定的输入阻抗点连接到有源贴片上。当然典型的修改包括贴片上围绕同轴连接(图2)点的一个电容间隔(5),或者连接到置于和贴片平行距离处的同轴的内部导线上的一个电容板,当然诸如此类的也可以采用。一个微带传输线,和有源贴片天线有相同的接地面,带状线电容耦合到有源贴片上,并位于所述有源贴片下面,或者在另一个实施例中,微带线置于接地面下面,而且通过一个隙缝耦合到有源贴片上,例如甚至也可以使用微带和有源贴片共面的微带传输线。所有这些机制在现有技术中是已知的,不构成本发明一个基本部分。
也可以使用另一个基于采用叠层结构(图3)的一个新配置的优选实施例,其中一个寄生贴片(8)置于一个有源贴片(1)之上。在图3中,一个采用多级形状元件的叠层结构的实例用于有源(1)和寄生(8)贴片。然而可以使用其他多级或空间填充形状的几何机构。图3中描述的结构是有独创性的,构成了本发明的一个基本部分。
对于双偏振或圆偏振微带阵列,可以使用一个空间填充形状贴片新的贴片几何图形。图4示出了两个馈电探头(10),适当地放置以获得双偏振或圆偏振特性。
图5示出了一个分形科赫线激发的新的空间填充形状的几何结构。这种几何结构呈现一种较细的剖面图,这在一些阵列应用中是有用的,例如宽度空间必须保持在一定限度内的线性阵列。
图6示出了现有技术中熟知的由14×13的圆形贴片构成的二维阵列,而图7示出了一个优选的实施例,使用了仅由8×8多级形状贴片构成的新的二维阵列图。在两种情况下,贴片都能在任何熟知的微波衬底上。图7所示的图是新的,而且代表了本发明的基本部分之一。
任何已知的现有技术中微带阵列地馈电结构都可以用来馈给贴片元件(联合,串连,H形状)。而且馈电网络可以蚀刻到和刻蚀贴片相同的层上,也可以例如刻蚀到一个分离的层上以避免馈电网络的干扰。
另一个优选的实施例如图8所示的一个8×16的空间填充形状的元件构成的二维阵列。这种新的方案适合提高波束操纵能力。为了减少元件之间的互耦合,例如可以采用光子带隙(PBG)衬底。特殊介质例如PBG、磁性衬底和其他的特殊材料的使用,为本领域的技术人员所熟知的,并不构成本发明的一个基本部分。
图9示出了现有技术由圆形贴片构成的16元件的线性阵列的联合馈电网络,图10是另一个优选的实施例,利用了8个元件线性阵列的联合馈电网络,根据本发明该阵列由多级元件构成。可以观察到尽管两者的方向性和模式是一样的,新公开的阵列需要一个更简单的结构。图11示出了一个H形状的馈电网络,馈给图7示的一个8×8阵列。所有这些馈给元件的机制在现有技术中是熟知的,不构成本发明的一个基本部分。
另一个优选的实施例如图12所示,其中示出了一个可以由多级形状或空间填充形状元件或两者结合构成的环形线性阵列。图13示出了另一个优选的实施例,由两种不同的阵列配置构成,其中(17)示出了一个三角形(18)是出了一个矩形排列。所述阵列可以例如由多级或空间填充形状的元件甚至两种几何结构结合而构成。
熟知的振幅渐变(Taylor,Chebychew等)和位相技术(遗传算法,模拟退火等)以及非等间距来合成一个特殊辐射图形(无填充,波束操纵等),既然他们是现有技术所熟知的,它们可以在本发明的范围内被采用或结合使用。
Claims (11)
1.一种天线阵列,以多级和/或空间填充形状贴片天线元件为特征,所述元件比波长的一半要大(提到的所述波长在所述贴片和它的混合接地面之内),所述多级和/或空间填充元件与最近的元件间距大于0.9λ,至少是其操作波长之一。
2.根据权利要求1的天线阵列,其中贴片元件以比基本频率高的频率模式工作,基本频率为代表最低共振频率的模式。
3.根据权利要求1或2的天线贴片阵列,其中元件沿线状排列形成线性阵列排列。
4.根据权利要求1或2的天线贴片阵列,其中贴片元件在一个矩形网格上排列。
5.根据权利要求1或2的天线贴片阵列,其中贴片元件在一个圆形网格上排列。
6.根据权利要求1、2、3、4或5的天线贴片阵列,元件之间的间隔是非均匀的。
7.根据权利要求1、2、3、4、5或6的天线贴片阵列,其中所述阵列以几个频率运行,在最低工作频率下元件之间的最低间隔大于0.9λ,λ为在所述最低工作频率下确定的波长。
8.根据权利要求1、2、3、4、5、6或7的天线贴片阵列,其中贴片多级或空间填充元件的数目比采用经典欧几里得贴片(矩形,环形等)的现有技术的贴片阵列数目少,但是却有相似的方向性。
9.根据权利要求1、2、3、4、5、6,7或8的天线贴片阵列,其中元件是至少两种不同多级或空间填充形状贴片元件的组合。
10.根据权利要求1、2、3、4、5、6、7、8或9的天线贴片阵列,其中至少一个元件是一个有源贴片形成的叠层结构,至少一个寄生贴片使用了多级或空间填充形状的几何结构。
11.根据权利要求1、2、4、5、6、7、8、9或10的天线贴片阵列,其中元件间隔在一个方向上大于0.9λ而在垂直方向上小于0.9λ,所述阵列由多级或空间填充形状贴片形成。
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- 2002-07-15 CN CNA028292111A patent/CN1630963A/zh active Pending
- 2002-07-15 EP EP02751139A patent/EP1522125A1/en not_active Withdrawn
- 2002-07-15 BR BR0215818-3A patent/BR0215818A/pt not_active Application Discontinuation
- 2002-07-15 WO PCT/EP2002/007835 patent/WO2004010535A1/en active Application Filing
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CN102804495A (zh) * | 2009-06-11 | 2012-11-28 | 阿尔卡特朗讯 | 天线辐射单元 |
CN101752666B (zh) * | 2010-02-23 | 2013-10-23 | 厦门大学 | 用于ku波段的康托尔分形微带阵列天线 |
CN101752666A (zh) * | 2010-02-23 | 2010-06-23 | 厦门大学 | 用于ku波段的康托尔分形微带阵列天线 |
CN104269614B (zh) * | 2014-09-12 | 2017-01-11 | 电子科技大学 | 基于时间反演的sierpinski分形MIMO天线 |
CN104269614A (zh) * | 2014-09-12 | 2015-01-07 | 电子科技大学 | 基于时间反演的sierpinski分形MIMO天线 |
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CN104966901A (zh) * | 2015-07-29 | 2015-10-07 | 哈尔滨工业大学 | 一种基于金属非均匀栅格化的双频段微带天线 |
CN109921198A (zh) * | 2017-12-12 | 2019-06-21 | 中国移动通信有限公司研究院 | 一种模数混合的天线阵列 |
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CN110649393A (zh) * | 2019-09-29 | 2020-01-03 | 厦门大学嘉庚学院 | 一种树形生长式阵列超宽频带天线 |
CN110649393B (zh) * | 2019-09-29 | 2021-03-02 | 厦门大学嘉庚学院 | 一种树形生长式阵列超宽频带天线 |
CN112307588A (zh) * | 2020-11-10 | 2021-02-02 | 西安工程大学 | 一种非均匀抛物线阵列天线设计方法 |
CN112307588B (zh) * | 2020-11-10 | 2024-02-06 | 西安工程大学 | 一种非均匀抛物线阵列天线设计方法 |
Also Published As
Publication number | Publication date |
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JP2005533446A (ja) | 2005-11-04 |
BR0215818A (pt) | 2005-06-07 |
AU2002368101A1 (en) | 2004-02-09 |
WO2004010535A1 (en) | 2004-01-29 |
EP1522125A1 (en) | 2005-04-13 |
US20050128148A1 (en) | 2005-06-16 |
US7310065B2 (en) | 2007-12-18 |
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