CN1624190A - Multi particle jewel adhesive method and equipment - Google Patents
Multi particle jewel adhesive method and equipment Download PDFInfo
- Publication number
- CN1624190A CN1624190A CN 200310115562 CN200310115562A CN1624190A CN 1624190 A CN1624190 A CN 1624190A CN 200310115562 CN200310115562 CN 200310115562 CN 200310115562 A CN200310115562 A CN 200310115562A CN 1624190 A CN1624190 A CN 1624190A
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- Prior art keywords
- jewel
- sieve plate
- motherboard
- many
- sieve
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- Adhesives Or Adhesive Processes (AREA)
Abstract
An equipment for adhering multiple jade particles is composed of a sieving plate with multiple sieving holes for holding jade particle in each hole, a turning-over unit reciplocating on said sieving plate for turning the jade particles over by friction, a mother board coated by adhesive and an adhering unit for closing the sieving plate with mother board and embedding the jade particles in the adhesive on mother board. Its method includes such steps as filling jade particles in the holes on sieving plate, providing adhesive mother board, and adhering.
Description
Technical field
The present invention relates to a kind of method of working gemstones and equipment, particularly a kind of before carrying out technique for vacuum coating with jewel with caking agent bonding all-in-one-piece method and apparatus.
Background technology
For jewel hard mass particularly, vacuum plating is a procedure of its key, is to plate one deck decorating film at the back side of jewel.
In the existing technique for vacuum coating,,, use special mould clamp usually, directly workpiece is fixed on the rotating disk of coating equipment and realizes its coating process as plating on anti-reflection film, the cutter plating superhard film etc. on the ophthalmic lens for bigger workpiece.
But,, be impracticable with above-mentioned traditional method for jewel that in batches big, geometrical shape is little work piece such as hard mass particularly.
Summary of the invention
The purpose of this invention is to provide the integrated method of a kind of employing, promptly little workpiece is integrated on the bigger stamper, clean then, the jewel adhesive method and the equipment of plated film and operation such as spray paint.
To achieve the above object, technical scheme of the present invention is as follows:
A kind of many jewel adhesive methods comprise the steps:
Jewel is decided face and is filled into the sieve plate step, many jewels is inserted in each sieve aperture in the sieve plate, and made in the point of each jewel faces, and planar end surface outwardly;
Bonding motherboard preparation step evenly is coated in caking agent the surface of motherboard;
Bonding step closes up the one side of the filling jewel of sieve plate and one side that motherboard is coated with caking agent and compresses, and makes the planar end surface of jewel embed in the caking agent and bonding being integral.
Described many jewel adhesive methods, wherein, described jewel is decided face and is filled in the sieve plate step, jewel divided equably be sprinkling upon on the sieve plate, through tilt and vibration with soft hairbrush cleaning, unnecessary jewel is got rid of outside the sieve plate, make and only be filled with a jewel in each sieve aperture on the sieve plate; Will be some all over utilizing friction upset jewel with reciprocally swinging device to-and-fro movement on sieve plate that the soft rubber pressing mold is made.
Described many jewel adhesive methods, wherein, described motherboard is made with ordinary plate glass.
Described many jewel adhesive methods, wherein, described caking agent adopts the bicomponent normal temperature cure silicone rubber, determines the silicon rubber amount according to the size of jewel, and silicon rubber is coated on the motherboard uniformly.
Described many jewel adhesive methods, wherein, sieve aperture on the described sieve plate runs through sieve plate, in described bonding step, bleed from the one side of sieve aperture, each jewel is sucked in sieve aperture, deflector screen 180 is spent then, motherboard is docked with sieve plate close up, stop to bleed, make jewel all drop in the caking agent on motherboard and bonding being integral.
A kind of many jewel bonding apparatus, the sieve plate that comprises the sieve aperture which is provided with a plurality of ccontaining jewels, can be on sieve plate the turning device of to-and-fro movement utilization friction upset jewel, evenly be coated with the motherboard of caking agent on it, the butt joint of sieve plate and motherboard is closed up make jewel embed the adhering device in the caking agent on the motherboard.
Described many jewel bonding apparatus wherein, are that the sieve aperture on the described sieve plate runs through sieve plate.
Described many jewel bonding apparatus, wherein, described turning device is provided with the reciprocally swinging device made from the soft rubber pressing mold.
Described many jewel bonding apparatus, wherein, described caking agent adopts the bicomponent normal temperature cure silicone rubber, determines the silicon rubber amount according to the size of jewel, and silicon rubber is coated on the motherboard uniformly.
Described many jewel bonding apparatus, wherein, described adhering device comprises fixed screen deck and can carry out the mounting plate of 180 degree upsets, fixing motherboard and be subjected to the cylinder control can be to the bolster that moves near the direction of mounting plate can be to the vacuum fan of bleeding in the sieve aperture.
Owing to adopt above-mentioned method and apparatus; adopt integrated method; promptly little workpiece is integrated on the bigger stamper; make many jewels link into an integrated entity by caking agent; and jewel to be processed show outside at caking agent and the face that must not process by the caking agent shielding protection; clean then, plated film and operation such as spray paint, help realizing industrialized mass.
Description of drawings
Fig. 1 is the schematic appearance of jewel;
Fig. 2 places the synoptic diagram of the sieve aperture of sieve plate before overturning for jewel;
Fig. 3 places synoptic diagram after the sieve aperture of sieve plate overturns for jewel;
Fig. 4 to Fig. 7 carries out working state schematic representation when bonding for the adhering device in many jewel bonding apparatus of the present invention.
Embodiment
Adopt integrated method, promptly little workpiece is integrated on the bigger stamper, clean then, plated film and operation such as spray paint, could realize suitability for industrialized production.
In addition, as shown in Figure 1, plate decorating film on the jewel 1, just a face at jewel 1 is to carry out on the tip surface 11, and another face is that planar end surface 12 then must protect with shielding material.This is another major reason that need stick on jewel stamper.The shielding material here must be a strippability, considers the operation under the vacuum and the condition of high temperature simultaneously, select high temperature resistant and the less shielding material of discharge quantity.The bicomponent normal temperature cure silicone rubber is the ideal shielding material.
But, jewel that will be very little how, according to same towards (tip surface 11 up) uniformly ornaments on the stamper that the bicomponent normal temperature cure silicone rubber constitutes, be that many jewels are bonded in key point on the stamper.
Many jewel method of attaching of the present invention can be divided into following several steps:
Prepare motherboard in advance, motherboard can be made with ordinary plate glass.
Determine silicon rubber amount (quantitatively extruding) according to the size of jewel 1, silicon rubber 5 is coated on the motherboard 3 uniformly with special-purpose spreadometer.
As shown in Figure 4, sieve plate 2 is moved on the mounting plate 41 of sticker, lock with securing gear; Simultaneously motherboard 3 is moved on the bolster 42 of sticker; Spacer pin 43 location can be placed in the edge of motherboard 3.
Start vacuum fan, the bleeding point on the mounting plate 41 44 is bled, make that jewel 1 is sucked in the sieve aperture of sieve plate 2, mounting plate 180 degree that overturn then, as shown in Figure 5.
Open cylinder 6, make to move on the bolster 42 and dock with mounting plate 41.
As shown in Figure 6, close vacuum fan, stop to bleed, at this moment jewel 1 all drops on motherboard 3, and tip surface 11 all up, and planar end surface 12 is encased by silicon rubber 5.
As shown in Figure 7, shifter cylinder 6 makes bolster 42 be displaced downwardly to original position.
Take out motherboard 3, treat silicon rubber 5 completely solidified after, be about to many jewels and be bonded on the stamper, enter down and go on foot filming process.
Under the normal circumstances, whole process was finished in 2～5 minutes, each 3000～5700 jewels of Pasting, and the different size jewel, it is different that it pastes speed.
As known by the technical knowledge, the present invention can realize by other the embodiment that does not break away from its spirit or essential feature.Therefore, above-mentioned disclosed embodiment with regard to each side, all just illustrates, and is not only.All within the scope of the invention or the change in being equal to scope of the present invention all be included in the invention.
Claims (10)
1, a kind of many jewel adhesive methods comprise the steps:
Jewel is decided face and is filled into the sieve plate step, many jewels is inserted in each sieve aperture in the sieve plate, and made in the point of each jewel faces, and planar end surface outwardly;
Bonding motherboard preparation step evenly is coated in caking agent the surface of motherboard;
Bonding step closes up the one side of the filling jewel of sieve plate and one side that motherboard is coated with caking agent and compresses, and makes the planar end surface of jewel embed in the caking agent and bonding being integral.
2, many jewel adhesive methods according to claim 1, it is characterized in that described jewel decides face and be filled in the sieve plate step, jewel divided equably be sprinkling upon on the sieve plate, clear away through tilt and vibration with soft hairbrush, unnecessary jewel is got rid of outside the sieve plate, made and only be filled with a jewel in each sieve aperture on the sieve plate; Will be some all over utilizing friction upset jewel with reciprocally swinging device to-and-fro movement on sieve plate that the soft rubber pressing mold is made.
3, many jewel adhesive methods according to claim 1 is characterized in that described motherboard makes with ordinary plate glass.
4, many jewel adhesive methods according to claim 1 is characterized in that described caking agent adopts the bicomponent normal temperature cure silicone rubber, determine the silicon rubber amount according to the size of jewel, and silicon rubber is coated on the motherboard uniformly.
5, many jewel adhesive methods according to claim 1, it is characterized in that the sieve aperture on the described sieve plate runs through sieve plate, in described bonding step, bleed from the one side of sieve aperture, each jewel is sucked in sieve aperture, and deflector screen 180 degree make motherboard dock with sieve plate and close up then, stop to bleed, make jewel all drop in the caking agent on motherboard and bonding being integral.
6, a kind of many jewel bonding apparatus, it is characterized in that: the sieve plate that comprises the sieve aperture which is provided with a plurality of ccontaining jewels, can be on sieve plate the turning device of to-and-fro movement utilization friction upset jewel, evenly be coated with the motherboard of caking agent on it, the butt joint of sieve plate and motherboard is closed up make jewel embed the adhering device in the caking agent on the motherboard.
7, many jewel bonding apparatus according to claim 6 is characterized in that the sieve aperture on the described sieve plate runs through sieve plate.
8, many jewel bonding apparatus according to claim 6 is characterized in that described turning device is provided with the reciprocally swinging device made from the soft rubber pressing mold.
9, many jewel bonding apparatus according to claim 6 is characterized in that described caking agent adopts the bicomponent normal temperature cure silicone rubber, determine the silicon rubber amount according to the size of jewel, and silicon rubber is coated on the motherboard uniformly.
10, according to claim 6 or 7 described many jewel bonding apparatus, it is characterized in that the mounting plate that described adhering device comprises fixed screen deck and can carry out 180 degree upsets, fixing motherboard and be subjected to the cylinder control can be to the bolster near the direction motion of mounting plate can be to the vacuum fan of bleeding in the sieve aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101155622A CN100432280C (en) | 2003-12-02 | 2003-12-02 | Multi particle jewel adhesive method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101155622A CN100432280C (en) | 2003-12-02 | 2003-12-02 | Multi particle jewel adhesive method and equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1624190A true CN1624190A (en) | 2005-06-08 |
| CN100432280C CN100432280C (en) | 2008-11-12 |
Family
ID=34760487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101155622A Expired - Fee Related CN100432280C (en) | 2003-12-02 | 2003-12-02 | Multi particle jewel adhesive method and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100432280C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513895A (en) * | 2011-10-29 | 2012-06-27 | 重庆川仪自动化股份有限公司 | Method for adhering and turning over two end faces of small-volume jewel components |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08205914A (en) * | 1994-11-25 | 1996-08-13 | Leo Enterp:Kk | Jewel of shape formed by inserting precious stone or design parts into transparent precious stone or semi-precious stone and its production |
| CN2230654Y (en) * | 1995-07-08 | 1996-07-10 | 何明成 | Precious Stone binder |
-
2003
- 2003-12-02 CN CNB2003101155622A patent/CN100432280C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513895A (en) * | 2011-10-29 | 2012-06-27 | 重庆川仪自动化股份有限公司 | Method for adhering and turning over two end faces of small-volume jewel components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100432280C (en) | 2008-11-12 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081112 Termination date: 20100104 |