KR20220025863A - Pick and place machine cleaning system and method - Google Patents

Abstract

A device, mechanism, and method are disclosed for regular and consistent cleaning of vacuum holes, nozzles and contact surfaces of pick-and-place apparatus and pick-up tools of automatic or manual semiconductor devices and die handling machines. The cleaning material may include a cleaning pad layer having one or more intermediate layers having predetermined properties, regular geometric features, and/or irregular surface morphologies.

Description

Pick and place machine cleaning system and method

claim priority

All these PCT applications are U.S. Patent Application Serial No. 16/460,877, filed July 2, 2019, entitled "PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD" Priority is claimed to No. 16/460,918, filed on February 2, 16/460,929, filed on July 2, 2019, and 16/794,068, filed on February 18, 2020.

Field

The present disclosure particularly applies to devices, mechanisms and methods for regular and consistent cleaning of orifices, nozzles and contact surfaces of pick-and-place apparatus and pick-up tools of automatic or manual semiconductor devices and die handling machines. possible, and the present disclosure will be described in this context. The cleaning material may include a cleaning pad layer having one or more intermediate layers having predetermined properties, regular geometric features, and/or irregular surface morphologies.

A pick and place apparatus transfers semiconductor devices, dies or electronic components from one holding tray to another, and transfers semiconductor devices or dies from one holding tray or wafer tape to a die attach lead frame, and It is used in robotic machines used to transfer from holding trays to test sockets for electrical testing and back to holding trays, or from holding trays for mounting onto printed circuit boards for electronic components. These apparatuses are used for high-speed, high-precision pickup and placement of a wide range of semiconductor devices and dies. Downtime of this equipment for unscheduled maintenance will have a significant impact on lost productivity and throughput.

The pick and place apparatus includes a plurality of suction cups, a suction inlet, a vacuum collet, a nozzle, and a vacuum pickup tool for picking up a semiconductor device from a device holding tray via a vacuum force. Suction of a vacuum force is created by a vacuum mechanism having up and down movement to pick up an electronic device from one holding tray and place the device in a test socket, lead frame or other holding tray or on a printed circuit board at a predefined location. do. Mishandling due to vacuum faults can cause device damage and require troubleshooting to restore performance. Moreover, vacuum-related issues and excessive downward pressure on the pick-up collet are major causes of die breakage.

To maintain proper suction and reliably pick and place the semiconductor device, a contact seal is required between the pick and place apparatus and the semiconductor device being handled. Debris in the vacuum hole, device vacuum nozzle, vacuum inlet/outlet, or on the contact surface of the suction device will affect the vacuum strength. Over time, the orifices of pick and place devices, pick-up tools, suction devices, and tips can become clogged or contaminated with various materials that can reduce vacuum strength and cause vacuum defects. In order to clean and maintain the pick-and-place apparatus, the IC device handling machine must be taken offline, and various pick-and-place apparatuses are cleaned manually. During an offline cleaning operation, it can be difficult to clean or remove material that may have accumulated in the nozzle of the pickup tool or that may have been compressed in or on the surface of the nozzle. Regular preventive cleaning and debris removal can be effective to control build-up and prevent build-up of sticky contaminants. Regular preventive cleaning and debris removal will extend the average time before maintenance and improve equipment uptime.

Cleaning of the pick and place device is performed by removing the vacuum pick-up tool or suction pick-up tool from the equipment to be cleaned and/or retrofitted. Cleaning and retrofitting pick and place devices consists of a wet-wipe-down and scrubbing process using solvents or other cleaning solutions. Additionally, the vacuum port of the pickup tool may be manually cleaned using mechanical motion to remove accumulated debris. However, manual handling and cleaning of the pick-up tool poses a risk of damage.

This typical cleaning process for pick and place apparatus and vacuum pickup requires that the semiconductor device handling function be stopped while the pick and place assembly is being cleaned and retrofitted. Moreover, wet chemical processes and mechanical scrubbing processes can damage vacuum pick-up tools. To maximize performance and maintain uptime for high throughput, pick-and-place equipment for semiconductor device handling machines without removing pick-and-place equipment, vacuum pick-up tools, or suction pick-up tools, and without wet chemical processes or mechanical scrubbing processes. It is desirable to be able to clean the assembly.

Some embodiments are shown by way of example and not limited by the drawings in the accompanying drawings in which like reference numbers may refer to like elements:
1A, 1B, and 1C are manual, semi-automatic with a pick and place assembly that uses a vacuum and suction pickup tool to “pick up” a semiconductor device with various contaminants and debris on the surface of the “pick up” side of the semiconductor device. or tools used in automatic semiconductor device handling machines.
2A, 2B and 2C show a pick and place assembly in which various contaminants and debris from the surface of the "pick up" side of the semiconductor device are glued or attached to a vacuum and suction pickup tool used to "pick up" the semiconductor device; A tool used in a manual, semi-automatic or automatic semiconductor device handling machine is shown.
3A, 3B, and 3C illustrate tools used in manual, semi-automatic or automatic semiconductor handling machines having pick and place assemblies during a cleaning operation in which various types of pick-up tools are moved into contact with the surface of the elastomeric cleaning material.
4A, 4B and 4C illustrate a method for cleaning and removing adhesive debris and contaminants from various vacuum and suction pick-up tools used in manual, semi-automatic or automatic semiconductor device handling machines with pick and place assemblies. .
5 shows an example of a method for cleaning various vacuum and suction pick-up tools used in manual, semi-automatic or automatic semiconductor device handling machines with pick and place assemblies.
6A is a plan view of a cleaning device having a cleaning pad applied to a carrier for use in a manual, semi-automatic or automatic semiconductor device handling machine.
6B is a cross-sectional view of a typical cleaning device having a cleaning pad applied to a substrate surface for use in a manual, semi-automatic or automatic semiconductor device handling machine.
6B is a cross-sectional view of a typical cleaning device having a cleaning pad applied to an IC package or semiconductor device for use in a manual, semi-automatic or automatic semiconductor device handling machine.
7A is a cross-sectional view of a second embodiment of a cleaning medium having one or more intermediate flexible material layers under a cleaning pad layer.
7B is a cross-sectional view of a second embodiment of a cleaning medium having one or more layers of intermediate rigid material beneath a layer of cleaning pad of predetermined properties;
7C is a cross-sectional view of a second embodiment of a cleaning medium having one or more layers of moderately rigid and flexible material under a cleaning pad layer of predetermined properties;
7D is a cross-sectional view of a second embodiment of a cleaning medium having one or more alternating layers of intermediate rigid and flexible material under a cleaning pad layer of predetermined properties;
8A is a cross-sectional view of a third embodiment of a cleaning material having uniformly spaced micro columns of a predetermined geometry constructed on one or more layers of material of predetermined properties;
8B is a cross-sectional view of a fourth embodiment of a cleaning material having uniformly spaced micro columns of a predetermined geometry constructed from a combination of one or more layers of intermediate rigid and flexible material of predetermined properties;
9A is an enlarged cross-sectional view of the uniformly spaced micro-columns shown in FIG. 8B constructed from a combination of one or more intermediate material layers to achieve consistent cleaning efficacy within the contact area of the vacuum and suction pickup tool of the pick and place assembly;
9B is an enlarged cross-sectional view of a fifth embodiment of a cleaning material having uniformly spaced micro pyramids constructed from a combination of one or more intermediate material layers to achieve consistent cleaning efficacy within the contact area of a vacuum and suction pickup tool of a pick and place assembly. .
10A is a cleaning illustrating portions of micro-features isolated from one another using an array of “streets” for a resulting second area or moment of inertia to control resistance to flex. A top view of a sixth embodiment of the material.
10B is a seventh implementation of a cleaning material showing portions of micro-features separated from one another using an array of “avenues” for the resulting second area or moment of inertia to control resistance to bending; This is an example floor plan.
10C is a plan view of an eighth embodiment of a cleaning material showing portions of micro-features separated from each other using an array of diagonals for a second area or moment of inertia to control resistance to bending.
11A, 11B and 11C are cross-sectional views of a cleaning material having the carrier substrate of FIG. 6A for cleaning the side, interior and contact areas of a vacuum and suction pickup tool of a pick and place assembly;
12A, 12B and 12C are cross-sectional views of cleaning material having the micro columns of FIGS. 8B and 9A for cleaning the side, interior and contact areas of a vacuum and suction pickup tool of a pick and place assembly;
13A, 13B and 13C are cross-sectional views of cleaning material with the micro pyramid of FIG. 9B for cleaning the interior and contact areas of a vacuum and suction pickup tool of a pick and place assembly;
14A is an example of a vacuum collet prior to cleaning using a cleaning device.
14B is an example of a vacuum collet after cleaning using a cleaning device.

The present disclosure is particularly applicable to devices, mechanisms and methods for regular and consistent cleaning of orifices, nozzles and contact surfaces of pick-and-place apparatus and pick-up tools of automatic or manual semiconductor device handling machines, and the present disclosure relates in this context will be explained in However, the devices, mechanisms and methods may be used to clean any device having holes, nozzles, and contact surfaces that become clogged or soiled with various materials over time, and may be used to clean other pick-up tools of automatic or manual semiconductor device handling machines. It will be appreciated that it may also be used for cleaning or retrofitting, and that the devices, mechanisms and methods have greater practicality as they may be implemented using variations of the embodiments disclosed below that still fall within the scope of the present disclosure. . For example, the cleaning devices and methods disclosed below are used for cleaning the pick and place apparatus of a surface mount technology (SMT) component placement machine used to place a wide variety of electronic components such as capacitors, resistors, and integrated circuits on a PCB. may be used. Moreover, the cleaning material used for the cleaning may be the embodiments described below, but may also be other variations of the cleaning device that will fall within the scope of the present disclosure.

In one exemplary use, a pick-and-place device, vacuum pick-up tool, or suction pick-up tool predictably cleans vacuum holes and maintains performance, as well as maintaining the required cleanliness of contact surfaces for maximum vacuum force during pickup. It may be periodically cleaned with a viscous elastomeric cleaning material (generally the cleaning material in various embodiments described below) installed on a carrier in the tool, at a designated location within the tool, on a surrogate device, various substrates, or on a tool, which may be used for cleaning. Contact parts of tools/machines (pick-up tools or pick-and-place devices or pick-and-place devices for SMT parts or pick-and-place devices for packaged devices) that come into contact with parts/devices/ICs, etc. handled, such as contact elements/parts For example, cleaning may be performed using a cleaning material, which may be one or more vacuum holes, one or more nozzles, one or more suction cups, one or more suction inlets, one or more vacuum collets, and a vacuum pickup tool coupled to a semiconductor device handling machine. In addition to the above pick and place apparatus, the cleaning device and method may also be used for pick and place assembly of a die attach machine or flip-chip bonder machine. The cleaning materials, devices, mechanisms and methods can be used to retrofit pick and place equipment within manual, semi-automatic and automatic semiconductor device handling machines without requiring unscheduled downtime for maintenance. An example of a vacuum collet prior to cleaning debris on the collet contact surface is shown in FIG. 14A and described below, and an example of the same vacuum collet after cleaning using the disclosed cleaning device is shown in FIG. 14B and described below.

1A-1C show known automatic or manual semiconductor device handling machines having different types of pickup tools 101 , 102 , 103 used to "pick up" a surface mount device 107, such as an electronic device or semiconductor device. (100) is shown.

1A shows a portion of the machine 100 , in particular a conical vacuum pickup tool 101 of the machine having an inlet/outlet positioned proximate the semiconductor device 107 for picking up and placing the semiconductor device 107 . ), and FIG. 1B shows a suction cup pickup tool 102 having an inlet/outlet and a flexible pad positioned proximate the semiconductor device 107 for picking up and placing the semiconductor device 107 . 1C shows a multi-sided vacuum collet pickup tool 103 having an inlet/outlet positioned proximate to the semiconductor device 107 for picking up and placing the semiconductor device 107 . The vacuum pick-up tools 101 , 102 , 103 are removably attached to a semiconductor device handling machine such that the pick-up tools may be removed periodically for cleaning and/or retrofitting. The vacuum pickup tools 101 , 102 , 103 are lowered towards the semiconductor device 107 until contact is made and a vacuum can be applied to the surface of the device. The contact surface of the pick-up tool may also be of any shape or size and may be made of a variety of different materials, such as actual debris, particles or contaminants, as indicated by black dashes along the surface of the semiconductor device for illustrative purposes. Any debris, particles, or contaminants 104 (collectively “debris”) present in the phase are contacted and vacuum aspirated. For example, debris on a device picked and placed can be metal flakes, mold compound fragments, solder residue, residual solder flux, particles from other devices, dust generated during handling, and the like.

2A-2C show a known automatic or manual semiconductor device handling machine 100 having different types of pick-up tools 101 , 102 , 103 after picking and placing a semiconductor device at a predefined location. When the semiconductor device 107 is picked up by the tools 101 , 102 , 103 , debris, particles or contaminants 104 from the semiconductor device 107 are picked up by a different pickup tool ( ) than the contact surface as shown in the figure. 101, 102, 103) are attached to the inlet/outlet. For example, FIG. 2A shows a conical vacuum pick-up tool 101 having debris closing the vacuum inlet/outlet, and FIG. 2B a suction cup with debris adhered to a flexible pad and blocking the vacuum inlet/outlet. A pick-up tool 102 is shown, and FIG. 2C shows a multi-faceted vacuum collet pick-up tool 103 having debris blocking the vacuum inlet/outlet as well as being inside and outside the collet. Adhesive debris, particles, or contaminants 104 are vacuumed for repeatable, consistent, and repeatable pickup of device 107 from a location without dropping or mishandling the device and placing the device in a second predefined location. It will reduce the amount of suction available for the mechanism. Excessive downward pressing force of the pick-up tools 101-103 (caused by reduced suction due to adhesive debris, particles, or contaminants 104 that the pick-up tool may press harder to achieve the desired suction) is well known and It is a major cause of die breakage.

3 and 4 show a first implementation of a method for cleaning the contact surface and inlet/outlet of different pick-up tools (101 in FIGS. 3A and 4A , 102 in FIGS. 3B and 4B , 103 in FIGS. 3C and 4C ). An example is shown. Different pick up tools 101 , 102 , 103 with adhesive contaminants 104 using the new cleaning method do not need to be removed from the vacuum mechanism in contrast to traditional cleaning methods. The cleaning material 110 may be installed on a cleaning substrate, a surrogate package, or on a cleaning block or station at a predefined location. The cleaning process may be manual, with a human positioning the cleaning material 110 adjacent the inlet/outlet and the contact surface of the pick-up tool 101 , 102 , 103 ; a semi-automatic manner in which a human instructs the handling machine to position the pick-up tool (101, 102, 103) in the vicinity of the cleaning material (110); or in a different manner, which may include an automatic way for the handling machine to move and position the cleaning material or cleaning agent 104 under the pickup tool 101 , 102 , 103 when cleaning is required or at periodic cleaning cycles. can When the cleaning method is initiated manually, semi-automatically or automatically, the machine moves the pick-up tool and the pick-up tool is inserted into the cleaning material or brought into contact with the surrogate cleaning device. 4 illustrates how debris, particles, or contaminants 104 are captured and removed by the cleaning material 110 . In some embodiments, a pick-up error of the machine may be detected and a cleaning process may be initiated. The cleaning frequency can be preventative maintenance to reduce the need to take units offline as well as extend the average time between manual cleaning runs.

5 depicts a cleaning process 500 that may be performed on a pick and place device, a vacuum pick-up tool, or a suction pick-up tool. The process illustrated in FIG. 5 may be performed manually, semi-automatically or automatically, as described above. Process 500 keeps the pick-up tool contact surface clean; regular collection of debris, particles or contaminants; It may also be performed in place at regular intervals to maintain a suction level to prevent device dropping or mishandling that would cause downtime or equipment failure. As shown in FIG. 5 , the process may include placing 502 a cleaning material proximate to the tool when the cleaning process is performed. The cleaning method may then cause a tool to be inserted onto and into the cleaning material to remove debris ( 504 ). In one embodiment, the cleaning material may be used to perform cleaning between periods of normal operation of the machine.

The cleaning material used to clean the pick and place device, vacuum pick-up tool, or suction pick-up tool may take a variety of forms. For example, the cleaning material may have a cross-linked polymer layer, and may have a cleaning layer on top of a carrier or substrate or frame so that the cleaning material may be handled in the same way as a semiconductor device, the cleaning layer and the cleaning layer It may have one or more intermediate layers or the like underneath. The cleaning material may also have a textured, featured, or irregular surface or pattern that would be beneficial for cleaning the interior and exterior of the pickup tool. The cleaning material may be capable of retaining debris from the pickup tool and the vacuum inlet/outlet when the pickup tool is inserted into the cleaning material. The cleaning material may preferably include a flexible polymer having embedded abrasive particles such as Probe Polish, a commercial product manufactured by International Test Solutions, Inc., or a lapping film such as Probe Lap.

6A, 6B, and 6C illustrate three typical different types of cleaning devices applied to various substrate materials, different size substrates, different shape substrates, or in some applications made of substrateless cleaning materials. 6A and 6B, the cleaning devices 20 and 21 include a cleaning medium material or pad 24 fixed, adhered or applied to the surface of the substrate 23 and the carrier or to a substrate of known geometry, respectively. ) may be included. The substrate 23 may be plastic, metal, glass, silicon, ceramic or any other similar material. Moreover, the substrate 25 shown in FIG. 6C may have a geometry that approximates the geometry of the packaged IC device (DUT) 22 . Use these cleaning devices with cleaning materials to clean the pickup tool contact surfaces, sides, and vacuum inlet/outlet without removing the pickup tool contact surface, sides and vacuum inlet/outlet from the machine during cleaning operation during normal operation of the machine. It is not known to do so.

Pickup tool contact surfaces, sides, and vacuum inlet/outlet cleaning processes and devices may use cleaning media having one or more intermediate flexible layers as described in greater detail with reference to the accompanying drawings and embodiments. In one embodiment (shown in FIG. 7A ), cleaning medium 220 is pre-selected, such as hardness, modulus of elasticity, etc., that contribute to cleaning of the pickup tool contact surfaces, sides, and vacuum inlet/outlet in contact with the bond pad or frame. It may be fabricated from the cleaning pad layer 202 of the determined properties. The cleaning medium 220 may also have one or more intermediate flexible layers 203 attached to and below the cleaning pad layer. Combinations of layers create material properties not available from the individual constituent materials, and a wide range of matrices, abrasive grains and geometries allow articles or structures with optimal combinations to maximize cleaning performance. By adding a flexible or microporous foam sublayer under the rigid cleaning layer, the overall properties of the cleaning material are improved to extend the overall service life of the pickup tool contact surfaces, sides and vacuum inlet/outlet without compromising shape or function. Application of a layer of abrasive particles to the surface of the flexible unfilled polymer or to the "skin" side of the microporous foam results in a multilayer material with preferential abrasive properties. As the overall compliance of the sublayer(s) systematically increases (or as the stiffness decreases), the overall properties of the cleaning material can be defined.

7A, the cleaning medium 220 also has a removable protective layer 201 installed on top of the cleaning pad 202 layer prior to its intended use to isolate the surface cleaning pad layer from contaminants. may have The removable protective layer 201 protects the working surface of the cleaning pad layer 202 from debris/contaminants until the cleaning device is ready to be used to clean the pickup tool contact surfaces, sides, and vacuum inlet/outlet. When the cleaning device is ready to be used to clean the pickup tool contact surfaces, sides, and vacuum inlet/outlet, the removable protective layer 201 may be removed to expose the working surface of the cleaning pad layer 202 . The protective layer is made of a known non-reactive polymer film material and may preferably be made of a polyester (PET) film. The protective layer may have a matte finish or other “textured” features to improve cleaning efficiency. A matte or featured surface may also help identify a cleaning surface. The surface will be “functional” and these “functional features” will facilitate the cleaning performance of various nozzles and collets. These functional features can be inserted into the interior of the vacuum nozzle for cleaning and debris collection in the vacuum channel.

The cleaning medium 220 is, in addition to the one or more flexible layers 203 , an adhesive layer 204 below the one or more flexible layers 203 and on top of the adhesive layers 204 as shown in FIG. 7A . It may also have a removable release layer 205 . The installation of the cleaning device 220 (for cleaning tools) on the predetermined substrate material is to expose the second release liner layer 205 (made of the same material as the first release liner layer) to expose the adhesive layer 204 . ) followed by application on the substrate surface with an adhesive layer 204 . The adhesive layer 204 may then be disposed relative to the substrate to adhere the cleaning device 220 to the substrate. The substrate may be of a variety of different materials as described in the prior art for different purposes.

The cleaning pad layer 202 described above and the cleaning pad layer described below may provide predetermined mechanical, material, and dimensional properties to the cleaning material. For example, the cleaning pad layer may have abrasive properties, specific gravity (eg, in the range of 0.75 to 2.27), where specific gravity is the ratio of density to density of water at a particular temperature, and elasticity (eg, 40-MPa to 600- MPa), tack (eg, in the range of 20 to 800 grams), flatness, and thickness (eg, in the range of 25-um to 500-um).

The one or more intermediate layers 203 (which may be flexible as described above, rigid as described below, or a combination of flexible and rigid layers as described below) exhibit predetermined mechanical, material and dimensional properties of the cleaning material. can also be provided to For example, the one or more intermediate layers may have abrasive properties (discussed in more detail below), specific gravity (eg, in the range of 0.75 to 2.27), where the specific gravity is the ratio of the density of the one or more intermediate layers to the density of water at a particular temperature. beam), elasticity (eg in the range of 40-MPa to 600-MPa), tack (eg in the range of 20-800 grams), flatness, thickness (eg, in the range of 25-um to 500-um) ), and/or a porosity that is the average number of pores per inch (eg, in the range of 10 to 150 pores per inch).

In another embodiment, shown in FIG. 7B , the cleaning medium 220 is a cleaning pad layer 202 having one or more intermediate rigid layers 206 below the cleaning pad layer 202 supporting the cleaning pad layer 202 . It can also be prepared from In another embodiment ( FIG. 7C ), the cleaning medium 220 is constructed using a combination of one or more intermediate rigid layers 206 and one or more flexible material layers 203 under the cleaning pad layer 202 of predetermined properties. it might be While the embodiment of FIG. 7C has one or more flexible layers 203 between the cleaning pad 202 and the one or more rigid layers 206 , the embodiment instead has one or more rigid layers directly under the cleaning pad layer 202 and Note that one may have one or more flexible layers below the rigid layer 206 . Note also that the embodiment of FIGS. 7B and 7C also has two protective liner layers 201 , 205 and an adhesive layer 204 as described above.

7D shows an embodiment of a cleaning medium 220 constructed by alternating one or more intermediate rigid layers 206 and one or more flexible material layers 203 under a cleaning pad layer 202 of predetermined properties. In this embodiment, the cleaning medium 220 has one or more flexible layers 203 below the cleaning pad 202 , followed by one or more rigid layers 206 and one or more flexible layers 203 , although the cleaning medium 220 has one or more flexible layers 203 . may have alternating flexible and rigid layers in different configurations that are within the scope of this disclosure. In this embodiment, the cleaning pad 202 and sublayers 203, 206, etc. have predetermined abrasive, density, elastic and/or tacky properties that contribute to cleaning the pickup tool contact surfaces, sides, and vacuum inlet/outlet. will have The superposition of cleaning layer and intermediate material layer properties may vary depending on the specific configuration and geometrical features of the pick-up tool contact surface, sides, and vacuum inlet/outlet.

The abrasiveness of the cleaning pad layer 202 will loosen and shear debris from the pickup tool contact surface, sides, and vacuum inlet/outlet. using a predetermined volumetric and mass density of the abrasive particles; The abrasiveness of the cleaning material can be systematically affected to facilitate debris removal. Typical abrasive material and particle weight percent loadings in the cleaning material layer may range from 30% to 500% weight percent. As used herein, weight percent polymer loading is defined as the weight of the polymer divided by the weight of the polymer plus the weight of the abrasive particles. Typical abrasives that may be incorporated into the material may include aluminum oxide, silicon carbide, and diamond, although the abrasive material may also be other known abrasive materials. The abrasive may include spatially or preferentially distributed particles of aluminum oxide, silicon carbide or diamond, but the abrasive particles may also be other known abrasive materials having a Mohs Hardness of 7 or greater. The controlled surface tack of the cleaning layer allows debris on the pickup tool contact surface, sides and vacuum inlet/outlet to preferentially adhere to the pad and thus be removed from the pickup tool contact surface, side and vacuum inlet/outlet during a cleaning operation.

In one embodiment, the cleaning material layer 202, and/or the intermediate rigid layer 206, and/or the intermediate flexible layer 203 (each a “material layer”) may include both rubber and synthetic and natural polymers. It may also be made of a solid or foam based elastomeric material with open or closed cells. Each material layer may have an elastic modulus in the range of greater than 40-MPa to less than 600-MPa and the thickness of the layer may be in the range of greater than or equal to 25-um to less than or equal to 500-um. Each layer of material may have a hardness range of a layer greater than or equal to 30 Shore A and less than or equal to 90 Shore A. The cleaning and adhesion layer may have a service range between -50C and +200C. Each elastomeric material may be abrasive particles spatially or preferentially distributed within a body of material or material made with a predetermined tackiness. Each material can be vacuum picked up with the pick-up tool contact surface, side and vacuum inlet/outlet penetrating through the elastomeric material layer without damage to the geometric features of the pick-up tool contact surface, side, and vacuum inlet/outlet, while maintaining the integrity of the elastomeric matrix. It may have predetermined elasticity, density, and surface tension parameters that may allow removal of debris on the tool. Each layer of material will have a predetermined thickness, generally between 1 and 20 mils thick. The thickness of each layer may vary depending on the specific configuration of the pick-up tool contact surface, sides, and vacuum inlet/outlet. For example, a thin material cleaning material layer (~1-mil thick) would be suitable for "non-penetrating" geometries such as flat tubes, and a thick material cleaning material layer (~20-mil) would be good for "through" tube geometries. will be suitable One or more assembly elements and supporting hardware of an assembly equipment of a cleaning pad during normal operation of automatic, semi-automatic or manual cleaning, wherein a normal contact force drives the contact elements into the pad, wherein debris on the pick-up tool contact surface, sides, and vacuum inlet/outlet is removed. It will be removed and retained by the pad material.

In another embodiment of the cleaning medium 221 (shown in FIGS. 8A and 8B ), the maximum cleaning efficiency of the cleaning material is a micro-column of a predetermined aspect ratio (diameter to height), cross-section (square, circular, triangular, etc.) or by using a plurality of uniformly shaped and regularly spaced geometrical micro-features 212 , such as micro pyramids. In the embodiment of FIG. 8A , the spaced-apart microfeatures are constructed from a single layer 212 on and across a combination of intermediate flexible or rigid layers 207 having predetermined predetermined properties. As an example of one type of micro-feature construction, the square micro-columns shown in FIG. 8A can be created using a combination of precision manufacturing processes and/or controlled cutting methods, wherein the long axis is a dimension of 100-microns or less. , and "street" and "avenue" widths are less than 50-um. The depth of "street" and "avenue" is controlled by the cutting method to obtain the aspect ratio. In this example, the feature has a 100-micron major axis width versus a 200-micron depth (or height). In this configuration, the depth is achieved without cutting through the cleaning material layer or into the sublayer(s). In the embodiment of FIG. 8B , the uniformly spaced microfeatures may be constructed from multiple layers 213 of an intermediate flexible or rigid layer 207 having predetermined properties. The size and geometry of the micro-features will remove debris but will not damage the pick-up tool contact surface, sides, and vacuum inlet/outlet to achieve a pad that will remove debris. It may vary depending on the composition and material. If the micro-features are large compared to the contact element geometry, this will adversely affect the cleaning performance. If the micro-features are small compared to the contact element geometry, the reciprocal force will be insufficient to facilitate high cleaning efficiency to remove adhesive contaminants.

In general, microfeatures may have several types of geometric shapes, including cylinders, squares, triangles, rectangles, and the like. The cross-sectional size in the long axis of each micro-feature may be greater than or equal to 25-um and less than 500-um, and each micro-feature may have an aspect ratio (height to width) ranging from 1:10 to 20:1. The micro-feature geometry may be adjusted during manufacture of the cleaning layer so that the material can be used to retrofit the pickup tool contact surfaces, sides, and vacuum inlet/outlet.

9A and 9B showing enlarged cross-sectional views of cleaning material having micro-features (features of micro-columns 219 of FIG. 9A and micro-pyramids 319 of FIG. 9B of cleaning materials 224 and 324, respectively); in the example of; However, these features may also be any other conformal geometric features. The deflection of micro-features under load depends not only on the load, but also on the geometry of the cross-section of the feature.

In the embodiment of Figure 9A, micro column spacing or pitch 215; The areal moment of inertia 216 or the second moment of inertia, which are properties of the shape, can both be used to predict the resistance of a feature to bending and deflection, including cleaning pad length 217; middle pad length 218; and the total length of the micro-column 219 is predetermined according to the specific configuration of the pick-up tool contact surface, sides, and vacuum inlet/outlet. For pick-up tool contact surfaces, sides, and vacuum inlet/outlet, the micro-column geometry allows the cleaning features to fit "in/out" as well as physical contact along the tool side, reducing the cleaning action and debris collection. made to provide In this example, the vacuum inlet/outlet may have a diameter of 125-microns. For a cleaning material, the feature major cross-sectional axial length will be less than 125-microns and the height will be at least 60-microns to facilitate over-travel into the cleaning material.

In FIG. 9B , the micro pyramid apex spacing or pitch 315 and variable moment of inertia along the height 316 , the cleaning pad pyramid length 317 , the pyramid frustum height 318 , and the overall height of the micro pyramid 319 are vacuum pickup It is similarly predetermined according to the particular configuration of the tool. As an example, the micro-pyramidal geometry allows the cleaning material to conform to the pick-up tool contact surface, sides, and vacuum inlet/outlet to facilitate a cleaning action and debris collection along the pick-up tool contact surface, side and vacuum inlet/outlet and along the side of the pick-up tool. made to provide For certain pick-up tool configurations, micro-feature geometries allow cleaning features to fit on the pick-up tool contact surface, sides, and vacuum inlet/outlet and along the sides of the pick-up tool contact surface, side, and vacuum inlet/outlet so that cleaning motions and debris are eliminated. It is made to provide a collection. The shape of the micro-features will be defined either by a kerf (ie, “street width and shape” and “avenue width and shape”) if a precision cutting process is used or via a molded shape if a casting process is used. For micro-features of the cleaning material, the major cross-sectional axial length of the micro-feature top surface will be less than 125-microns to facilitate pickup collet cleaning. The overall height will be at least 200-microns to facilitate over-travel into the cleaning material and provide sufficient reciprocal force to initiate cleaning and/or material removal operations.

The micro-features described above may have abrasive particles applied to the top surface along the length of the micro-feature, within the body of the micro-feature, or at the base of the micro-feature. In one embodiment, the average micro-features may have a cross-sectional width of 1.0-μm or greater, a height of 400-μm or less, and an average abrasive grain size of less than 15.0-μm. Typical abrasives that may be incorporated into and across material layers and micro-features may include aluminum oxide, silicon carbide, and diamond, although the abrasive particles may also be other known abrasive materials having a Mohs hardness of 7 or greater. The amount and size of abrasive material applied to the micro-features may vary depending on the configuration and material of the pickup tool contact surface and vacuum inlet/outlet to achieve a pad that will remove and collect debris but not cause damage. there is.

10A, 10B, and 10C show, respectively, that micro-features are mutually isolated and formed with predetermined moments of inertia using predetermined arrays of streets 351 , avenues 352 , and diagonals 353 to create undesirable mutual respect. When the vacuum pick-up tool contacts the pad surface, eliminating action and other bonding effects and obtaining a predetermined surface compliance, an interaction force is imparted by the material into the contact area, the contact element tip geometry, and within the support structure to dislodge debris and The drawing depicts embodiments of cleaning materials 226 and 326 that increase the efficiency with which contaminants are removed. The width and diagonal size of the streets, avenues may vary depending on the construction and material of the vacuum pickup tool to achieve a separate material surface to uniformly remove debris from within the contact element tips and geometrical features of the contact elements. Streets, avenues and diagonals may have abrasive particles uniformly or preferentially distributed across its width. The width of streets, avenues and diagonals, as well as the size of the abrasive material across the width, may vary depending on the construction and material of the pickup tool contact surfaces, sides, and vacuum inlet/outlet. In these embodiments, each island 360 of cleaning material is a micro-feature separate from the other micro-features.

The cleaning system and cleaning pad not only removes and collects adhesive particulates from the pickup tool contact surfaces, sides and vacuum inlet/outlet, but also does not affect overall shape and geometry. carrier device 20 of FIG. 6a; the substrate device 21 of Fig. 6b; and insertion of the pickup tool contact surface, side, and vacuum inlet/outlet into a cleaning device, such as the devices shown in dummy package device 22 of FIG. 6C , are any additional online of the offline process that must subsequently be removed. Removes adhesive debris and support hardware without leaving any organic residue.

The in situ cleaning method of pickup tool contact surfaces, sides and vacuum inlet/outlet achieves the goal of cleaning a pickup tool without removing the tool from a handling machine, thereby reducing downtime and increasing productivity. The cleaning material is installed in the cleaning block or station at a predefined location, and when the cleaning algorithm is manually, semi-automatically or automatically initiated, the machine moves the pick-up tool to the predefined location where the cleaning material is installed and then the pick-up tool is embedded in the cleaning material. The cleaning material layer of the device has predetermined physical, mechanical and geometric properties depending on the configuration and material pickup tool contact surface, side and vacuum inlet/outlet.

An embodiment of a cleaning material having micro-features suitable for cleaning a conical vacuum pick-up tool 101 is shown in FIG. 11A ; A suction cup vacuum pickup tool 102 is shown in FIG. 11B ; A faceted vacuum collet pick-up tool 103 is shown in FIG. 11C . In this illustrative example, a standard pickup tool is shown but other known elements of the handling machine are not shown. The cleaning material 324 is installed on the carrier substrate 20 (as shown in FIGS. 11A-11C ) or the cleaning area substrate 500 . During cleaning performance, the handling machine will be programmed to move (manually, semi-automatically and/or automatically) to the position of the cleaning block/pad such that a pick-up tool may be inserted into the cleaning material. At designated intervals or “on demand,” the pick-up tool is cleaned when the cleaning material 324 is driven into contact with a preset vertical position.

The cleaning material 324 shown in FIGS. 11A-11C may have micro-features as described above. Micro-features (which may also be micro columns) may be used, wherein the geometry of the cleaning device is such that the spacing, geometry, and geometry of the micro-columns such that mutual pressure on the pick-up tool imparts efficient cleaning to remove and collect debris, and It has abrasiveness. The spacing 215, moment of inertia 216, and total length 219 of the micro-columns are configured based on the construction and material of the pickup tool contact surface, sides, and vacuum inlet/outlet diameters 101, 102, 103. As the pick-up tools 101 , 102 , 103 act into the cleaning material 324 , debris is removed from the surface as well as the interior of the inlet/outlet. The number of pad/polymer/substrate layers and surface micro-features may be controlled to provide control of compliance of the overall thickness of the cleaning device as well as the thickness of the cleaning. This multi-layer embodiment provides efficient "edge-side" cleaning of the interior of a multi-faceted vacuum collet pick-up tool.

As mentioned above, the cleaning operation in no way affects the operation of the handling machine, since cleaning of the pickup tool contact surface, sides and vacuum inlet/outlet is achieved during normal operation. In this way, the cleaning operation is inexpensive and allows the pickup tool contact surfaces, sides, and vacuum inlet/outlet to be cleaned without undue downtime and loss of throughput.

In the micro-featured embodiment shown in FIGS. 12A-13C , micro-features (micro columns 224 in FIGS. 12A-12C or micro pyramid structure 324 in FIGS. 13A-13C ) may be used and , wherein the geometrical features of the cleaning device have micro-pyramidal spacing, geometry and abrasiveness such that mutual pressure on the pick-up tool imparts efficient cleaning to remove and collect debris. The separation of the micro-features having a street 350, an avenue 351 and a diagonal 352 having a width and a depth is predetermined according to the construction and material of the pickup tool contact surface, the sides, and the vacuum inlet/outlet. The number of pad/polymer/substrate layers and surface micro-features may be controlled to provide control of compliance of the overall thickness of the cleaning device as well as the thickness of the cleaning. This multi-layer embodiment provides efficient "edge-side" cleaning of the interior of a multi-faceted vacuum collet pick-up tool.

14A is an example of a vacuum collet 1400 before cleaning using a cleaning device, and FIG. 14B is an example of a vacuum collet 1400 after cleaning using a cleaning device. The vacuum collet 1400 has a contact surface 1402 having a circular shape with an interior void area. As shown in FIG. 14A , an unpolished vacuum collet 1400 has one or more pieces of debris 1404 on a contact surface 1402 for a pick and place machine that accumulates after repeated pick and place operations. . Adhesive debris 1404 will affect the quality of the vacuum seal between the collet and the device being picked up and placed to reduce vacuum forces. Fragments of debris 1404 cause unscheduled downtime required to manually clean debris and restore collet performance. When the vacuum collet was cleaned using the cleaning material and cleaning process disclosed above, the vacuum collet came into contact with the surface of the cleaning material and adhesive debris was removed from the contact surface 1402 of the collet tip as shown in FIG. 14B. removed along the sides. If desired, the collection can be run multiple times into the cleaning polymer to remove adhesive debris. As shown in FIG. 14B , cleaning of collet contact surfaces 1402 can be performed without taking the system offline for unscheduled maintenance.

The foregoing description, for purposes of explanation, has been described with reference to specific embodiments. However, the above illustrative description is not intended to be exhaustive or to limit the present disclosure to the precise form disclosed. Many modifications and variations are possible in light of the above teachings. The embodiments were chosen and described so as to best explain the principles of the disclosure and its practical use, thereby allowing those skilled in the art to best illustrate the disclosure and various embodiments with various modifications as are suited to the particular use contemplated. make good use of it.

The systems and methods disclosed herein may be implemented through or distributed among one or more components, systems, servers, devices, and other subcomponents. When implemented as a system, such a system may include and/or involve components such as software modules, general purpose CPUs, RAM, and the like, particularly found in general purpose computers. In implementations where the innovation resides on a server, such a server may include or involve components such as CPUs, RAM, etc., such as those found in general purpose computers.

Additionally, the systems and methods herein may be achieved via implementations having heterogeneous or completely different software, hardware and/or firmware components other than those described above. For example, with respect to such other components (eg, software, processing components, etc.) and/or computer readable media in connection with or embodying the present invention, aspects of the innovations herein are useful for numerous general or special purposes. It may be implemented according to a computing system or configuration. The various exemplary computing systems, environments, and/or configurations that may be suitable for use with the innovations herein are server or server computing, such as software or other components, routing/connection components, embodied in or on a personal computer. devices, handheld or laptop devices, multiprocessor systems, microprocessor-based systems, set-top boxes, consumer electronic devices, network PCs, other existing computer platforms, distributed computing environments including one or more of the above systems or devices, and the like. However, it is not limited to these.

In some examples, aspects of systems and methods may be achieved or performed via, for example, logic and/or logic instructions including program modules executed in association with such components or circuitry. In general, program modules may include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular instructions herein. The invention may also be practiced in the context of distributed software, computer or circuit settings in which circuits are connected via communication buses, circuits or links. In a distributed setting, the control/instructions may arise from both local and remote computer storage media including memory storage devices.

The software, circuits, and components herein may also include and/or use one or more tangible computer-readable media. Computer-readable media can be any available media that resides on, is associated with, or can be accessed by such circuitry and/or computing components. By way of example, and not limitation, computer-readable media may include computer storage media and communication media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media may include RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical storage device, magnetic tape, magnetic disk storage device or other magnetic storage device, or any desired information. including, but not limited to, any other medium that can be used for storage and that can be accessed by a computing component. Communication media may include computer-readable instructions, data structures, program modules, and/or other components. Communication media may also include wired media such as a wired network or direct-wired connection, but any of these types of media is not intended to include transitory media. Combinations of any of the above are also included within the scope of computer-readable media.

In this description, the terms component, module, device, etc. may refer to any type of logical or functional software element, circuit, block, and/or process that may be implemented in various ways. For example, the functions of the various circuits and/or blocks may be combined with each other in any other number of modules. Each module even has tangible memory (eg, random access memory, read-only memory, CD-ROM memory, hard disk drive) to be read by a central processing unit to implement the functions of the innovations herein. etc.) may be implemented as a software program stored on the . Alternatively, a module may include programming instructions that are transmitted over a transmission carrier to a general purpose computer or processing/graphics hardware. In addition, modules may be implemented as hardware logic circuits implementing the functions encompassed by the innovations herein. Finally, modules may be implemented using special purpose instructions (SIMD instructions), field programmable logic arrays, or any combination thereof that provide a desired level of performance and cost.

As disclosed herein, features according to the present disclosure may be implemented via computer-hardware, software and/or firmware. For example, the systems and methods disclosed herein may be implemented in various forms including, for example, a data processor such as a computer that also includes a database, digital electronic circuitry, firmware, software, or combinations thereof. Further, while some disclosed implementations describe specific hardware components, the systems and methods in accordance with the innovations herein may be implemented in any combination of hardware, software and/or firmware. Moreover, the above-described features and other aspects and principles of the innovations herein may be implemented in a variety of environments. Such environments and related applications include general-purpose computers or computing platforms that may be specially configured to perform various routines, processes, and/or operations in accordance with the present invention or are selectively activated or reconfigured by code to provide the necessary functionality. You may. The processes disclosed herein are essentially independent of any particular computer, network, architecture, environment, or other device, and may be implemented by any suitable combination of hardware, software, and/or firmware. For example, various general purpose machines may be used with programs written in accordance with the teachings of the present invention, or it may be more convenient to construct special apparatus or systems to perform the required methods and techniques.

Aspects of the methods and systems described herein, such as logic, can also be applied to programmable logic devices (“PLDs”), such as field programmable gate arrays (“FPGAs”), programmable array logic (“PALs”) devices, electrical It may be implemented as a function programmed in any of a variety of circuits, including programmable logic and memory devices and standard cell based devices, as well as application specific integrated circuits. Some other possibilities for implementing aspects include memory devices, microcontrollers with memory (such as EEPROM), embedded microprocessors, firmware, software, and the like. Moreover, aspects may be implemented in microprocessors having software-based circuit emulation, discrete logic (sequential and combinatorial), custom devices, fuzzy (neural) logic, quantum devices, and hybrids of any of the above device types. The underlying device technology includes various component types, for example, metal oxide semiconductor field effect transistor ("MOSFET") technology, such as complementary metal oxide semiconductor ("CMOS"), and bipolar technology, such as emitter coupled logic ("ECL"). , polymer technology (eg, silicon-conjugated polymer and metal-conjugated polymer-metal structures), mixed analog and digital, and the like.

The various logic and/or functions disclosed herein may be implemented using any number of combinations of hardware, firmware, and/or as data and/or instructions embodied in various machine-readable or computer-readable media, including their behavior; It should also be noted that this may be enabled in terms of register transfers, logic components, and/or other characteristics. Computer-readable media in which such formatted data and/or instructions may be embodied include, but are not limited to, various forms of non-volatile storage media (eg, optical, magnetic, or semiconductor storage media), which again are transitory. Does not include media. Unless the context clearly requires otherwise, throughout the description, the words "comprises", "comprising" and the like are used in an inclusive sense as opposed to an exclusive or exhaustive sense; That is, it should be construed as meaning "including, but not limited to". Words using the singular or plural also include the plural or singular respectively. Additionally, the words “herein,” “below,” “above,” “below,” and words of similar meaning refer to this application as a whole and not to any specific part of the application. When the word "or" is used in reference to a list of two or more items, the word covers all of the following interpretations of the word: any item in the list, all items in the list, and any combination of items in the list.

Although certain presently preferred embodiments of the invention have been specifically described herein, it is within the skill of the art that variations and modifications of the various embodiments disclosed and described herein may be made without departing from the spirit and scope of the invention. It will be clear to a person skilled in the art. Accordingly, it is intended that the invention be limited only to the extent required by applicable legal rules.

While reference has been made to specific embodiments of the present disclosure above, it will be appreciated by those skilled in the art that changes in these embodiments may be made without departing from the spirit and spirit of the disclosure, the scope of which is defined by the appended claims. it could be

Claims (61)

A method for cleaning a pick and place apparatus of a semiconductor device handling machine used for testing packaged semiconductor devices, the method comprising:
positioning the elastomeric cleaning material in the vicinity of a pick and place apparatus coupled to a semiconductor device handling machine, the pick and place apparatus having one of a vacuum hole, a nozzle, a suction cup, a suction inlet, a vacuum collet, and a vacuum pickup tool; , each of which has an inner surface and an outer surface;
While the pick and place apparatus remains attached to the semiconductor device handling machine, one of the vacuum holes, nozzles, suction cups, suction inlets, vacuum collets and vacuum pick tools pick on and within the elastomeric cleaning material to contact the elastomeric cleaning material. inserting the n-place device; and
and removing debris from an inner surface and an outer surface of one of the vacuum aperture, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pickup tool. The method of claim 1 , further comprising moving the elastomeric cleaning material adjacent the pick and place device. The method of claim 1 , further comprising trapping debris within the elastomeric cleaning material. The method of claim 1 , wherein the elastomeric cleaning device has a cross-linked polymer layer. 5. The method of claim 4, wherein the elastomeric cleaning material further comprises one or more intermediate layers having predetermined properties under the crosslinked polymer layer. The method of claim 1 , wherein positioning the elastomeric cleaning material further comprises using a semiconductor device handling machine to position the elastomeric cleaning material and move the plurality of semiconductor devices during a package test process. The method of claim 5 , wherein the elastomeric cleaning material further comprises a carrier under the one or more intermediate layers. 8. The method of claim 7, wherein the elastomeric cleaning material has a specific gravity, elasticity, tack, thickness and porosity. A method for cleaning the pick and place device of a surface mount technology (SMT) part placement machine, comprising:
positioning the elastomeric cleaning material in the vicinity of a pick and place device coupled to the SMT machine, the pick and place device having one of a vacuum hole, a nozzle, a suction cup, a suction inlet, a vacuum collet, and a vacuum pickup tool. setting step; and
While the pick-and-place device remains attached to the SMT machine, one of the vacuum bore, nozzle, suction cup, suction inlet, vacuum collet and vacuum pick-up tool is provided with vacuum bore, nozzle, suction cup, suction inlet, vacuum collet and vacuum pickup. and inserting a pick and place device onto and within the elastomeric cleaning material to contact the elastomeric cleaning material that removes debris from one or more surfaces of one or more of the tools. 10. The method of claim 9, further comprising moving the elastomeric cleaning material adjacent the pick and place device. 10. The method of claim 9, further comprising trapping debris within the elastomeric cleaning material. The method of claim 9 , wherein the elastomeric cleaning device has a cross-linked polymer layer. The method of claim 12 , wherein the elastomeric cleaning material further comprises one or more intermediate layers having predetermined properties under the cross-linked polymer layer. The method of claim 9 , wherein positioning the elastomeric cleaning material further comprises using a semiconductor device handling machine to position the elastomeric cleaning material and move the plurality of semiconductor devices during a printed circuit board assembly process. The method of claim 13 , wherein the elastomeric cleaning material further comprises a carrier under the one or more intermediate layers. 16. The method of claim 15, wherein the elastomeric cleaning material has a specific gravity, elasticity, tack, thickness and porosity. A method for cleaning the pick and place device of a die attach or flip chip bonder machine, comprising:
positioning the elastomeric cleaning material in the vicinity of a pick and place device coupled to a die attach or flip chip bonder machine, the pick and place device comprising: one of a vacuum hole, a nozzle, a suction cup, a suction inlet, a vacuum collet, and a vacuum pickup tool a positioning step, each having an inner surface and an outer surface;
While the pick and place device remains attached to the die attach or flip chip bonder machine, one of the vacuum holes, nozzles, suction cups, suction inlets, vacuum collets, and vacuum pick tools are placed on the elastomeric cleaning material to contact the elastomeric cleaning material. and inserting a pick and place device therein; and
and removing debris from an inner surface and an outer surface of one of the vacuum aperture, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pickup tool. 18. The method of claim 17, further comprising moving the elastomeric cleaning material adjacent the pick and place device. 18. The method of claim 17, further comprising trapping debris within the elastomeric cleaning material. The method of claim 17 , wherein the elastomeric cleaning device has a cross-linked polymer layer. The method of claim 20 , wherein the elastomeric cleaning material further comprises one or more intermediate layers having predetermined properties under the cross-linked polymer layer. The method of claim 17 , wherein positioning the elastomeric cleaning material further comprises using a semiconductor device handling machine to position the elastomeric cleaning material and move the plurality of semiconductor devices during a printed circuit board assembly process. 23. The method of claim 22, wherein the elastomeric cleaning material further comprises a carrier under the one or more intermediate layers. 24. The method of claim 23, wherein the elastomeric cleaning material has a specific gravity, elasticity, tack, thickness and porosity. is a device,
A semiconductor device handling machine having a pick and place apparatus, the pick and place apparatus having a contact element having an inner surface and an outer surface, the contact element contacting and picking up one of a device and a component using suction handling machine;
A cleaning material adhered to a substrate positioned adjacent a pick and place apparatus, the cleaning material having an upper layer contacted by a contact element of the pick and place apparatus during a cleaning process, the upper layer having an inner surface and an outer surface of the contact element a cleaning material having properties of cleaning
The contact element is cleaned while the contact element is attached to the pick and place device by inserting the end of the contact element into the cleaning material;
The pick and place device performs a pick and place operation once the contact elements are cleaned. 26. The apparatus of claim 25, wherein the cleaning material further comprises a surface tack that allows the pieces of debris on the contact element to transfer to the cleaning material. 27. The device of claim 26, wherein the surface tack ranges from 20 grams to 800 grams. 26. The apparatus of claim 25, wherein the cleaning material further comprises a cleaning pad layer having one or more microfeatures formed in the cleaning pad layer. 29. The apparatus of claim 28, wherein the one or more microfeatures are one of a micro column and a micro pyramid. 29. The apparatus of claim 28, wherein the cleaning material further comprises one or more intermediate layers supporting the cleaning pad layer under the cleaning pad layer. 31. The device of claim 30, wherein the intermediate layer is one of a rigid layer, a flexible layer, and a rigid and flexible layer. 31. The apparatus of claim 30, wherein the cleaning material further comprises a release layer protecting the cleaning pad layer on top of the top surface of the cleaning pad layer. 26. The apparatus of claim 25, wherein the cleaning material further comprises a substrate having a cleaning pad layer supported thereon. 26. The apparatus of claim 25, wherein the pick and place apparatus further comprises one of a pick and place apparatus for a packaged device being tested and a pick and place apparatus for a component used in a surface mount process. 26. The apparatus of claim 25, wherein the pick and place apparatus further comprises one of a pick and place apparatus for a die attach machine and a pick and place apparatus for a flip-chip bonder machine. 26. The apparatus of claim 25, wherein the contact element further comprises one of a vacuum hole, a nozzle, a suction cup, a suction inlet, and a vacuum collet of the pick and place device. 26. The apparatus of claim 25, wherein the upper surface of the cleaning material is a textured surface for cleaning the inner and outer surfaces of the vacuum pickup tool. 26. The device of claim 25, wherein the cleaning layer has a set of microfeatures having a total length, a moment of inertia, and a spacing of each microfeature determined based on at least a diameter of a content element of the pick and place device. 26. The pick and place of claim 25, wherein the cleaning layer has a set of microfeatures and an array of streets, avenues or diagonals separating each microfeature from each other microfeature, the width of each street, avenue or diagonal being a pick and place A device based on the dimensions of a content element of the device. a cleaning device,
a cleaning material adhered to the substrate;
the cleaning material is a polymer and has a set of microfeatures configured to clean a contact element of a pick and place machine having an interior surface and an exterior surface;
wherein the top surface of the cleaning material has a surface tack that allows fragments of debris on the surface of the contact element to be transferred to the cleaning material and has properties for cleaning the inner and outer surfaces of the contact element. 41. The cleaning device of claim 40, wherein the surface tack ranges from 20 grams to 800 grams. 42. The cleaning device of claim 41, wherein the set of microfeatures is one of a micro column and a micro pyramid. 41. The cleaning device of claim 40, wherein the cleaning material further comprises a cleaning pad layer and one or more intermediate layers supporting the cleaning pad layer under the cleaning pad layer. 44. The cleaning device of claim 43, wherein the intermediate layer is one of a rigid layer, a flexible layer, and a rigid and flexible layer. 41. The cleaning device of claim 40, wherein the cleaning material further comprises a release layer protecting the cleaning pad layer on top of the top surface of the cleaning pad layer. 41. The cleaning device of claim 40, wherein the cleaning material has a specific gravity, elasticity, tack, thickness and porosity. 46. The cleaning device of claim 45, wherein the cleaning material is one of rubber, natural polymers and synthetic polymers. 47. The cleaning material of claim 46, wherein the cleaning material has a specific gravity in the range of 0.75 to 2.27, a modulus of elasticity in the range of 40-MPa to 600-MPa, a tackiness in the range of 20 to 800 grams, and a thickness in the range of 25-um to 500-um, each wherein the layer of has a hardness of 30 Shore A to 90 Shore A, and a porosity in the range of 10 to 150 pores per inch. 45. The cleaning device of claim 44, wherein the cleaning pad layer further comprises a plurality of abrasive particles having a Mohs' Hardness of 7 or greater. 49. The cleaning material of claim 48, wherein the cleaning material has a specific gravity ranging from 0.75 to 2.27, a modulus of elasticity ranging from 40-MPa to 600-MPa, a tackiness ranging from 20 to 800 grams, a thickness ranging from 25-um to 500-um, each wherein the layer of has a hardness of 30 Shore A to 90 Shore A, and a porosity in the range of 10 to 150 pores per inch. 41. The apparatus of claim 40, wherein the upper surface of the cleaning material is a textured surface that cleans the inner and outer surfaces of the contact element. 41. The apparatus of claim 40, wherein the cleaning layer has a set of microfeatures having a total length, a moment of inertia, and a spacing of each microfeature determined based on at least a diameter of the content element. 41. The method of claim 40, wherein the cleaning layer has a set of microfeatures and an array of streets, avenues or diagonals separating each microfeature from each other microfeature, the width of each street, avenue or diagonal being the width of the content element. Device based on dimensions. A method for picking and placing semiconductor elements,
performing a pick and place operation on a semiconductor device using a contact element of the pick and place apparatus, the contact element having an inner surface and an outer surface;
cleaning the contact element of the pick and place apparatus while the contact element is attached to the pick and place apparatus, the contact element cleaning step inserting an end of the contact element into the cleaning material and cleaning the interior of the contact element by the cleaning material cleaning the contact element, further comprising cleaning the face and the outer face; and
performing a pick and place operation once the contact element is cleaned. 54. The method of claim 53, wherein cleaning the contact element further comprises transferring the piece of debris from the surface of the contact element to the cleaning material. 55. The method of claim 54, wherein transferring the piece of debris from the surface of the contact element further comprises attracting the piece of debris using a surface tack of the top surface of the cleaning material. 56. The method of claim 55, wherein transferring the piece of debris from the surface of the contact element further comprises transferring the piece of debris from the interior surface of the contact element to the surface of the cleaning material. 54. The method of claim 53, wherein performing a pick and place operation further comprises one of performing a pick and place operation for the packaged device being tested and performing a pick and place operation for a component used in a surface mount process. method. 54. The method of claim 53, wherein performing a pick and place operation further comprises one of performing a pick and place operation for a die attach machine and performing a pick and place operation for a flip-chip bonder machine. 54. The method of claim 53, wherein cleaning the contact element further comprises positioning the cleaning material proximate the pick and place device. 54. The method of claim 53, wherein cleaning the contact element further comprises cleaning one of a vacuum hole, a nozzle, a suction cup, a suction inlet, and a vacuum collet of the pick and place device.

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