CN1615077A - Device and method for installing electronic elements - Google Patents
Device and method for installing electronic elements Download PDFInfo
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- CN1615077A CN1615077A CN 200310103457 CN200310103457A CN1615077A CN 1615077 A CN1615077 A CN 1615077A CN 200310103457 CN200310103457 CN 200310103457 CN 200310103457 A CN200310103457 A CN 200310103457A CN 1615077 A CN1615077 A CN 1615077A
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Abstract
The invention can deal with high density assembly, narrower pitch assembly and chamber assembly. The amount of deviation between the chips picked up from wafer by picking up mouth and the reference special location is acquired. When the chips are transferred to the installation mouth and are actually installed into the base board, the amount of deviation will be considered to make deviation correction, and make the installation mouth hold the chip at a fixed special location.
Description
Technical field
The present invention relates to a kind of being used for is installed to apparatus and method on the circuit substrate with electronic component.More particularly, the present invention relates to a kind of erecting device and installation method that when the IC chip that is called back-off core wire sheet that will comprise jut (projection type electrode) is installed on the circuit substrate, is suitable for.
Technical background
In recent years, along with the miniaturization of electronic equipment, need with the electronic component comparatively dense be installed on the circuit substrate.In order to satisfy this requirement, develop to some extent aspect the position precision reducing the spacing between the element and improve when mounted.In addition, as a kind of new mode, usually adopt electronic component is installed to technology in the cavity in the multi layer substrate.
In the process of this installation electronic component, generally use image processing techniques to improve the method for position precision when being installed to electronic component on the circuit substrate.More particularly, thus the picture that utilizes the circuit substrate that camera etc. takes is in advance carried out image processing determines position that electronic component will be installed.Simultaneously, can also determine layout is positioned at the position of the electronic component of " loaded " position by identical operations.Then, compare these positions mutually to obtain relative position deviation.Utilize one pick up mouth single pick up be positioned at " loaded " position electronic component so that this electronic component is placed on the halfpace.Then, by the single sticking electronic component of mouth is installed.After having considered position deviation, utilize the fitting operation that mouth carries out electronic component is installed.
Will, for example: when chips such as IC were installed on the circuit substrate, the installation head of sticking chip made chip contact with precalculated position on the circuit substrate.Then, by installation head ultrasonic vibration is applicable to related chip so that chip connects (joint) to circuit substrate.Because the existing institute of narrower as mentioned above spacing develop, so also requirement installation mouth does not interfere with the surrounding space of the position to be installed of chip.Therefore, preferably, the shape of the chip sticking part of installation mouth and the shape of chip adapt, and the size of chip sticking part is less than the size of chip.
And, even the size of chip sticking part adapts less than the size of chip and the shape of chip sticking part and the shape of chip, can imagine also to obtain that picking up mouth can not be exactly from element " loaded " position receiving chip.For example, shown in Fig. 4 A, suppose to pick up mouth sticking chip under a kind of like this state, promptly along X-direction and Y direction shifted by delta X and Δ Y, and the central axis of mouth is with respect to the central axis deviation angle Δ θ of chip with respect to the center of chip in the center of mouth.When only noticing that as in the prior art position between chip and the circuit substrate concerns,, still there is bigger chance to keep these position deviations even chip is sent to mouth (adsorption mouth that is used to install) is installed from picking up mouth.
If plan chip is installed in this state, when the space between chip to be installed and the electronic component on every side is narrower, the end of mouth is installed interferes with these electronic components or to contact.And the mode as being adopted in recent installation has such a case, is about to that chip is installed on the circuit substrate so that the cavity in chip and the circuit substrate matches.Yet in this case, thereby compounding practice may can not be carried out from the end of chip is outstanding in the end of mouth.In addition, when utilizing ultrasonic vibration to make chip join to circuit substrate, when weight is acted on chip, also might depart from etc., and this has harmful effect to engagement state.This position deviation is in the permission level of existing chip size or existing installation situation.But, increase than aspects such as thin spaces in development, wish to improve this position deviation.
Summary of the invention
The present invention makes according to above-mentioned situation, thereby, an object of the present invention is to provide a kind of apparatus and method that are used to install chip, wherein, mouth is installed can the sticking chip and can not cause any position deviation.
In order to achieve the above object, according to the present invention, provide a kind of method that electronic component is installed, this method comprises: pick up the electronic component that is placed on the platform by picking up mouth; Electronic component is sent to the installation mouth from the mouth that picks up of sticking electronic component; The position of electronic component of mouth sticking and electronic component relatively are installed are installed in position on the circuit substrate, the installation site that mouth is installed electronic component is installed thereby proofread and correct; And electronic component is installed on the circuit substrate by mouth is installed, in the method, detection is by the electronic component of the pick device sticking deviation with respect to the reference position, the form of this deviation is along the deviation of orthogonal X and Y direction and anglec of rotation θ, and, when electronic component being sent to the installation mouth, correction has with respect to the predetermined space orientation that mouth is installed electronic component along the deviation and the anglec of rotation θ of X and Y direction to control.
According to above-mentioned installation method, preferably, the motion correction by picking up mouth is along in the deviation of X and Y direction any, and proofreaies and correct along another and anglec of rotation θ in the deviation of X and Y direction by the operation that mouth is installed.
In addition, to achieve these goals, provide a kind of being used for that electronic component is installed to device on the circuit substrate, this device comprises: a platform that is used to place and support electronic component, and this platform can move along orthogonal X and Y direction; The mouth that picks up that is used to pick up the electronic component that is placed on the platform, this picks up mouth and can move along X and Y direction; The image that is used to obtain the electronic component that picks up the mouth sticking is with the departure testing agency of detected electrons element with respect to the deviation of reference dimensional orientation, and the form of this deviation is along the deviation of orthogonal X and Y direction and angle θ; One is used for electronic component is installed to installation mouth on the circuit substrate, and electronic component is sent to this installation mouth from picking up mouth, and this installation mouth can along the Y direction move and can around with the X axis rotation vertical with the either direction in the Y direction; And substrate platform that is used to support circuit substrate, in this device, when electronic component was sent to the installation mouth from picking up mouth, correction had with respect to the predetermined space orientation that mouth is installed electronic component along the deviation and the angle θ of X and Y direction to control.
Description of drawings
Fig. 1 shows the structure according to the major part of erecting device of the present invention of reduced form;
Fig. 2 shows the schematic structure according to erecting device of the present invention;
Fig. 3 is the flow chart that helps to illustrate according to installation method of the present invention;
Fig. 4 A shows the chip in traditional erecting device, the position of picking up between mouth and the installation mouth concerns;
Fig. 4 B shows according to the chip in the erecting device of the present invention, picks up the position relation between mouth and the installation mouth;
Fig. 5 is a stereogram, shows to finish chip after the X among the present invention, Y and the θ correction for drift in the delivery status of picking up between mouth and the installation mouth.
The explanation of preferred embodiment
Describe one embodiment of the present of invention below with reference to the accompanying drawings in detail.Fig. 1 shows the schematic structure according to the major part of erecting device of the present invention, and Fig. 2 shows the schematic structure of this erecting device of reduced form.As shown in Figure 2, this erecting device is by a substrate workbench 10 that is used to support circuit substrate etc., element that is used to support electronic component loads 20, one of workbench and is used to support the component pick-up part 30 of picking up mouth and one and is used to support the mounting portion 50 that mouth is installed.
Component pick-up part 30 comprises that is used for picking up mouth 33 and and be used to drive rotating shaft 31 and pick up mouth 33 so that rotating shaft 31 and pick up rising/decline motor 35 that mouth 33 rises and descends by rotating shaft 31 is rotatably supported at the above-below direction turning-over of chip.These component parts are in the integrally formed part unit 39 that picks up, and support to be driven along X-direction by the CD-ROM drive motor (not shown) by picking up part base platform 37.Pick up in addition, get part 30 and comprise that also one is used for determining mensuration camera 41 and a prealignment camera 43 of loading member.These component parts are fixed on the base platform 37 and by base platform 37 and support, and are independent of simultaneously to have the unit 39 that picks up mouth 33 grades.
Should be noted that driving that component parts moves along X-axis and Y direction is carried out to by being directly connected to combinations such as ball thread spindle on the CD-ROM drive motor, guide wheel respectively.Therefore, for simplicity, omitted the explanation of these component parts.In addition, these structures are known, and wish and can compatibly substitute these component parts with any other known component parts according to required limit accuracy and actuating speed.And in this embodiment, the component pick-up mouth is fit to move along X-direction, mouth is installed is fit to move along Y direction.Yet, also can take a kind of like this structure, promptly the component pick-up mouth is fit to move along Y direction, mouth is installed is fit to move along X-direction.
Then, help to illustrate that below with reference to Fig. 1 and illustrating Fig. 3 of flow chart of the step of actual installation electronic component describes the method that electronic component is installed in detail.At first, installing in the step 1 of electronic component at the beginning, by being used for determining that the mensuration camera 41 of loading member is determined to be placed on the substrate platform 11, for example: the position of electronic component to be installed such as chip.Then, in step 2, drive substrate platform 11 moves in X-axis and Y direction, proofreaies and correct so that position and component pick-up mouth 33 position consistency that will pick up to be installed chip of chip to be installed on X-Y plane.Afterwards, in step 3, make and pick up mouth decline to adsorb and to keep chip to be installed.
In step 4, the component pick-up mouth 33 of sticking chip to be installed makes chip overturn so that chip makes progress at above-below direction around axle 31 rotations.And in step 5, driving element picks up mouth 33 and makes it move to a position under the prealignment camera 43 along X-direction.Then, obtain the image of chip in this position.In step 6, on image acquisition result's basis, obtain X, Y and θ departure with respect to the predetermined reference dimensional orientation of this chip.After having detected departure, in step 7, chip is moved near the position under the installation mouth 51 of chip delivering position at the component pick-up mouth 33 of the sticking chip of above-below direction upset.
Then, in step 9, make and mouth 51 is installed is descended contact with chip and to utilize vacuum suction etc. to adsorb chip.Afterwards, discharge by the chip of component pick-up mouth 33 vacuum suction etc. with finish chip from component pick-up mouth 33 to the transmission that mouth 51 is installed.Should be noted that before mouth 51 being installed and chip is contacted, in step 8, proofreaied and correct in advance according to the departure that obtains in the step 5 the layout (dimensional orientation) of mouth with respect to chip is installed.More particularly, based on component pick-up mouth 33 along the driving of X-direction and the axial departure Δ of corrected X X.And, respectively mouth 51 to be installed at the departure Δ Y and the chip rotating deviation amount Δ θ of Y direction of proofreading and correct with the driving θ direction Y direction.As a result, mouth 51 being installed always can be with predetermined space orientation sticking chip.
Fig. 5 is an amplification stereogram, and it has schematically shown the concrete example of the position relation of installing between mouth 51, chip 2 and the component pick-up mouth 33.In the figure, chip 2 is cuboid haply, and mouth mouth 51a utilizes vacuum suction to hold and keeps the upper surface of chip 2.In addition, the lower surface of chip 2 has the jut that engages with circuit substrate, and mouth mouth 33a utilizes vacuum suction to hold and keeps this lower surface so that stretch by component pick-up mouth 33 fully.As will be the same with reference to figure 4A hereinafter with the explanation that 4B carries out, install mouth 51 the chip absorption surface shape and the upper surface of chip 2 shape much at one or smaller a little than the latter.Enforcement of the present invention makes the chip absorption surface that mouth 51 is installed may have the shape shown in the figure.
Chip is sent to installs after the mouth 51, in step 10, drive installation mouth 51 moves towards circuit substrate along Y direction.Should be noted that in step 11 dimensional orientation of chip during driving measured camera 17 by element and determined.In operation so far, measure the image of camera 61 acquisition cuicuit substrates and detection chip installation site on image acquisition result's basis by the substrate sign.In step 11, measure by the dimensional orientation of sticking chip, and the position that obtains between chip installation site and the chip sticking dimensional orientation concerns to obtain the position deviation of chip sticking state with respect to the substrate installation site once more.
In subsequent step 12, along X-axis and Y direction drive substrate platform 11 with the circuit substrate that obtains in the aligning step 11 departure in X-axis and Y direction.Probably fallen in the allowed band of step 8 though should be noted that the departure of θ direction, can proofread and correct the departure of this direction once more.Yet, if necessary, can also proofread and correct again.Afterwards, in step 13, make installation head 51 drop to the circuit substrate place, and carry out compressive engagement and chip is installed on the circuit substrate to finish a fitting operation.
In brief, above-mentioned flow process probably is divided into two processes, is about to first process and second process of explanation hereinafter.First process is such process: the chip that is arranged in the position of being measured by the mensuration camera of measuring loading member is picked up by the component pick-up mouth, prealignment camera detecting element picks up the dimensional orientation of the chip of mouth sticking, install then mouth according to testing result with predetermined space orientation sticking chip.The effect of this process is described below with reference to Fig. 4 A and 4B.Fig. 4 A illustrates the conventional situation of not carrying out prealignment, and Fig. 4 B shows the situation of carrying out the prealignment among the present invention.Two figure show from chip 2 one sides and see that past tense chip 2 seen that in the situation of the mouth mouth 33a of component pick-up mouth 33 with from chip 2 one sides past tense chip 2 is by the situation of sticking at the mouth mouth 55a of component pick-up mouth 51 by sticking.In addition, in these figure, mouth part 33a and 51a have gas port 33b and the 51b that is used for vacuum suction respectively.Owing to mouth is installed, so the shape of the shape of wishing to install mouth and the absorption surface of chip much at one or smaller a little than the latter with chip 2 compressive engagement (not shown) to the circuit substrate.Yet, according to traditional process, the situation as shown in Fig. 4 A may take place, the side edge portions of mouth 51 promptly is installed stretches out from the side edge portions of chip 2.By finishing first process of carrying out prealignment, shown in Fig. 4 B, install mouth with all consistent state of X-direction, Y direction and the anglec of rotation θ of chip under the sticking chip.Therefore, when with much smaller than the spacing of first technology with chip layout on circuit substrate the time, or even when being installed to chip in the cavity, mouth is installed also can not be interfered, and chip is joined on the substrate securely with other any chip.
Second process is such process: position and the dimensional orientation of determining the chip of installation mouth sticking once more, to install the mouth sticking chip position and dimensional orientation and position relation between the position on the circuit substrate of chip will be installed, then after having considered these relations with chip join to circuit substrate.Proofread and correct by the chip 2 that mouth 51 accurate stickings are installed with respect to bonding station once more and be installed on the circuit substrate more accurately to allow chip.
Should be noted that in traditional erecting device,, also can adopt a kind of like this structure, promptly once finish transfer operation by a halfpace to shorten the fitting operation time when chip is sent to when mouth is installed from the component pick-up mouth.Also adopt structures such as halfpace in the present invention, and on halfpace the dimensional orientation etc. of detection chip, obtain to install effect thus.
Yet, in order to obtain this effect, halfpace can be driven along X-axis and Y direction, thereby make the structure of device become complicated.In addition, put into the transmission number of times that halfpace also may increase chip.Along with the increase that transmits number of times, the departure the when departure of the dimensional orientation of chip etc. is picked with chip is compared can further be increased.If increase the number of correcting value or correction parameter, and consider halfpace moving along X-axis and Y direction, when planning to make the position relation of installing between mouth and the chip always to remain unchanged, can also suspect, can not obtain well to shorten the effect of operating time.
According to aforementioned content, in the present invention, the erecting device with better simply structure is not provided with halfpace.Therefore, proofread and correct the position correction when mouth sticking chip is installed and mouth be installed position correction when being installed to chip on the circuit substrate by the axis number of minimum number.Therefore, erecting device has higher reliability, and carries out the adjustment etc. in the phase I operation easily.Thereby, erecting device more easily can be provided.
And according to the present invention, except extra having increased with the prealignment camera detects the operation of Δ θ and proofread and correct the operation of Δ θ when mouth is installed in that chip is sent to, the difference between conventional mounting process and the installation process of the present invention is little.Therefore, by only increase detecting operation and correct operation in the erecting device that tradition is used, the erecting device with different delivery systems just can obtain same effect.That is to say, even do not need higher cost to implement under the situation of the present invention, also can finish than thin space installation, cavity installation etc. at repacking conventional mounting device.
In addition, though this embodiment has supposed with higher density more miniature situations such as chip to be installed, the present invention is not limited to this embodiment.Particularly, for example, when bigger electronic component is installed, can by the end surface shape of the shape of its end face and associated electronic components much at one or than the smaller a little installation mouth of the latter definitely sticking be in the associated electronic components of expecting state.Therefore, uniform weight can be applied at the whole end face of electronic component so that electronic component to be installed, and thereby good engagement state between chip and the circuit substrate can be obtained.
Implement the present invention can so that: even the shape of shape of using its absorption end parts and the absorption end parts of chip is much at one or the installation mouth smaller a little than the latter, when mouth sticking chip is installed, the end parts of mouth is installed also can stretch out from the side edge portions of chip, and always can be with a fixing dimensional orientation sticking chip.Therefore,, also can carry out installing or cavity is installed, and can carry out pinpoint accuracy to install and mouth is installed can not be produced and interfere with other any chip, circuit substrate etc. than thin space even under the situation of high-density installation.
In addition, implement the present invention can so that: when mouth is installed a weight is applied on the chip when being installed to chip on the circuit substrate, the center of absorption end parts that mouth is installed is always consistent with the center of chip.Therefore, it is always uniform on entire engagement surface that the weight that mouth is applied on the chip is installed, and thereby stably obtain engagement state with high reliability and good accuracy.
And, can be by increasing the operation enforcement the present invention who detects the operation of Δ θ and when chip being sent to the installation mouth, proofread and correct Δ θ with the prealignment camera.Therefore, can have the erecting device of the simple delivery system of tradition use according to the present invention's repacking, and thereby can implement the present invention with low cost.
Claims (3)
1. method that electronic component is installed, this method comprises: pick up the electronic component that is placed on the platform by picking up mouth; Electronic component is sent to the installation mouth from the mouth that picks up that keeps electronic component; The position of the electronic component that mouth keeps and electronic component relatively are installed are installed in position on the circuit substrate, the installation site that mouth is installed electronic component is installed thereby proofread and correct; And by mouth is installed electronic component is installed on the circuit substrate,
Described installation method may further comprise the steps:
The electronic component that detection is kept by pick device is with respect to the deviation of reference position, and the form of this deviation is along the deviation of orthogonal X and Y direction and anglec of rotation θ; And
When electronic component being sent to the installation mouth, correction has with respect to the predetermined space orientation that mouth is installed electronic component along the deviation and the anglec of rotation θ of X and Y direction to control.
2. installation method according to claim 1 is characterized in that, the motion correction by picking up mouth is along in the deviation of X and Y direction any, and proofreaies and correct along another and anglec of rotation θ in the deviation of X and Y direction by the operation that mouth is installed.
3. one kind is used for electronic component is installed to device on the circuit substrate, and this device comprises:
A platform that is used to place and support electronic component, this platform can move along orthogonal X and Y direction;
The mouth that picks up that is used to pick up the electronic component that is placed on the platform, this picks up mouth and can move along directions X;
The image that is used to obtain the electronic component that picks up the mouth maintenance is with the departure checkout gear of detected electrons element with respect to the deviation of reference dimensional orientation, and the form of this deviation is along the deviation of orthogonal X and Y direction and angle θ;
One is used for electronic component is installed to installation mouth on the circuit substrate, and electronic component is sent to this installation mouth from picking up mouth, and this installation mouth can along the Y direction move with can be around being the center rotation with the X axis vertical with the either direction in the Y direction; And
A substrate platform that is used to support circuit substrate,
Wherein, when electronic component was sent to the installation mouth from picking up mouth, correction had with respect to the predetermined space orientation that mouth is installed electronic component along the deviation and the angle θ of X and Y direction to control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310103457 CN1286353C (en) | 2003-11-03 | 2003-11-03 | Device and method for installing electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310103457 CN1286353C (en) | 2003-11-03 | 2003-11-03 | Device and method for installing electronic elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1615077A true CN1615077A (en) | 2005-05-11 |
| CN1286353C CN1286353C (en) | 2006-11-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310103457 Expired - Fee Related CN1286353C (en) | 2003-11-03 | 2003-11-03 | Device and method for installing electronic elements |
Country Status (1)
| Country | Link |
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| CN (1) | CN1286353C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101884089B (en) * | 2007-12-03 | 2012-02-08 | 松下电器产业株式会社 | Chip mounting system |
| CN102157351B (en) * | 2009-11-06 | 2012-05-09 | 华中科技大学 | Chip pickup and placement control method |
| CN101553106B (en) * | 2008-03-31 | 2013-01-16 | 松下电器产业株式会社 | Element mounting device and element mounting method |
| CN103787071A (en) * | 2012-11-01 | 2014-05-14 | 凯吉凯精密电子技术开发（苏州）有限公司 | Automatic grabbing method and device for circuit board |
| CN111034387A (en) * | 2017-08-31 | 2020-04-17 | 株式会社富士 | Component mounting machine and component mounting method |
| CN114731778A (en) * | 2019-11-27 | 2022-07-08 | 株式会社富士 | Element management device and element management method |
-
2003
- 2003-11-03 CN CN 200310103457 patent/CN1286353C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101884089B (en) * | 2007-12-03 | 2012-02-08 | 松下电器产业株式会社 | Chip mounting system |
| CN101553106B (en) * | 2008-03-31 | 2013-01-16 | 松下电器产业株式会社 | Element mounting device and element mounting method |
| CN102157351B (en) * | 2009-11-06 | 2012-05-09 | 华中科技大学 | Chip pickup and placement control method |
| CN103787071A (en) * | 2012-11-01 | 2014-05-14 | 凯吉凯精密电子技术开发（苏州）有限公司 | Automatic grabbing method and device for circuit board |
| CN111034387A (en) * | 2017-08-31 | 2020-04-17 | 株式会社富士 | Component mounting machine and component mounting method |
| CN114731778A (en) * | 2019-11-27 | 2022-07-08 | 株式会社富士 | Element management device and element management method |
| CN114731778B (en) * | 2019-11-27 | 2023-07-25 | 株式会社富士 | Element management device and element management method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1286353C (en) | 2006-11-22 |
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