CN1600548A - Heat bubble type ink jet printing head and manufacturing procedure - Google Patents

Heat bubble type ink jet printing head and manufacturing procedure Download PDF

Info

Publication number
CN1600548A
CN1600548A CN 03159440 CN03159440A CN1600548A CN 1600548 A CN1600548 A CN 1600548A CN 03159440 CN03159440 CN 03159440 CN 03159440 A CN03159440 A CN 03159440A CN 1600548 A CN1600548 A CN 1600548A
Authority
CN
China
Prior art keywords
ink
spray nozzle
jet
jet printer
thermal bubble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 03159440
Other languages
Chinese (zh)
Other versions
CN1311973C (en
Inventor
庄至顺
杨明勋
Original Assignee
Feihe Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Feihe Science & Technology Co Ltd filed Critical Feihe Science & Technology Co Ltd
Priority to CNB031594409A priority Critical patent/CN1311973C/en
Publication of CN1600548A publication Critical patent/CN1600548A/en
Application granted granted Critical
Publication of CN1311973C publication Critical patent/CN1311973C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)

Abstract

A thermal ink-jet printing head is prepared by stacking a jethole plate on ink cavity layer located at surface of a ink-jet chip and forming multiple jetholes on the plate, or utilizing a cover plate as connection interface of jethole plate with ink supply opening on ink box and utilizing the opening on the cover plate to expose the jetholes.

Description

Thermal Bubble Ink-jet Printer printhead and manufacturing process thereof
Technical field
The present invention relates to a kind of ink jet-print head (inkjet print-head), particularly a kind of thermal bubble type (thermal bubble) ink jet-print head and manufacturing process thereof.
Background technology
Under the drive development of high-tech industry, all electronic correlation industries are advanced by leaps and bounds invariably in recent years.With regard to printer, within the time of a few years, printing technique is printed from early stage stylus printing and one-wavelength laser, progressive always color ink jet printed and color laser printing up till now, even printing technique such as hot transfer printing printing appears.Yet, with regard to common ink-jet printer, appear on the market the applied printing technique of ink-jet printer at present nothing more than the ink-jet technology of thermal bubble type (thermalbubble) or piezoelectric type (piezoelectric), be used for the ink target is hit recording medium, paper etc. for example, thereby form literal or pattern on the surface of recording medium.Wherein, the printing technique of bubble type is to utilize heating component (heater) with the gasification of ink moment, thereby produces the high pressure bubble and promote ink, ink is penetrated via spray orifice again and forms ink droplet (droplet).In addition, the printing technique of piezoelectric type is to utilize because of applying the piezoelectric (piezoelectricmaterial) that voltage produces deformation to make driver (actuator), therefore can apply voltage pushes the ink that is positioned at print cartridge (ink chamber) to driver, ink is penetrated and the formation ink droplet via spray orifice again.
With regard to the Thermal Bubble Ink-jet Printer technology, the ink supply mode roughly has two kinds of central feeding (central feed) and edge feedings (edgefeed).At first, the ink supply mode of central authorities' feeding is the middle body that cutter is worn ink-jet chip, be used for forming the ink entry (ink slot) of a long and narrow, so can be successively via the ink entry of the central authorities of ink-jet chip, and via the formed ink runner in black chamber layer (chamberlayer) (ink channel), and with the heating component of ink feed to the surface of ink-jet chip.In addition, the ink supply mode of edge feeding is the edge that layer formed ink runner in black chamber is extended outwardly into ink-jet chip, so can ink directly be fed to the heating component top on the surface of ink-jet chip via the ink runner of black chamber layer.
Referring to Fig. 1, shown the generalized section of the Thermal Bubble Ink-jet Printer printhead of existing a kind of edge advanceable ink supply.Thermal Bubble Ink-jet Printer printhead 100 mainly comprises ink-jet chip 110, black chamber layer 120 and spray nozzle sheet 130.At first, ink-jet chip 110 has a plurality of heating components 112, is configured in the surperficial 110a of ink-jet chip 110.In addition, China ink chamber layer 120 also is configured in the surface of ink-jet chip 110, and form a plurality of ink runners 122, and wherein an end of these ink runners 122 exposes these heating components 112 respectively, and the other end of these ink runners 122 then extends to the side of black chamber layer 120 respectively.Moreover, spray nozzle sheet 130 is stacked on the black chamber layer 120, and has a plurality of spray orifices 132, runs through spray nozzle sheet 130, and the position of these spray orifices 132 corresponds respectively to the position of these heating components 112, and utilizes the peripheral edge portion of spray nozzle sheet 130 directly to be assembled to the ink supply port 12 of print cartridge 10.Therefore, ink can be along flow direction 14, ink runner 122 from the side edge of ink-jet chip 110, flow on the heating component 112, and via heating component 112 with the gasification of ink moment, thereby produce the high pressure bubble and promote ink, again ink is penetrated via spray orifice 132 and form ink droplet (droplet).
As mentioned above, because the material of spray nozzle sheet 130 adopts macromolecular compound (macromolecular compounds), and utilize the mode of laser drill (laser drilling), for example PRK (excimer laser) or yag laser (YAG laser), these spray orifices 132 are precisely defined on the spray nozzle sheet 130, then again spray nozzle sheet 130 is joined exactly to black chamber layer 120, and make the position of spray orifice 132 can correspond respectively to the position of heating component 112.Yet, the cost that forms these spray orifices 132 owing to the mode of utilizing laser drill on spray nozzle sheet 130 is higher, must adopt the technology and the equipment of more accurate contraposition joint simultaneously, ink-jet chip 110 and black chamber layer 120 could be joined on the spray nozzle sheet 130 exactly, therefore can't effectively reduce the cost of manufacture that printhead 100 is beaten in ink-jet.
Summary of the invention
In view of this, purpose of the present invention just provides a kind of Thermal Bubble Ink-jet Printer printhead and manufacturing process thereof, is used for reducing the cost of manufacture of Thermal Bubble Ink-jet Printer printhead.
For reaching above-mentioned purpose of the present invention, the present invention proposes a kind of Thermal Bubble Ink-jet Printer printhead, be applicable to the ink supply port that is assembled to a print cartridge, this Thermal Bubble Ink-jet Printer printhead has an ink-jet chip, a black chamber layer, a spray nozzle sheet and an emulsion sheet.At first, ink-jet chip has a surface and a plurality of heating component, and wherein these heating components are configured in the above-mentioned surface of ink-jet chip.In addition, black chamber layer is stacked on the above-mentioned surface of ink-jet chip, and has a plurality of ink runners, and an end of these ink runners exposes these heating components respectively, and the other end of these ink runners then extends to the side of black chamber layer respectively.In addition, spray nozzle sheet is stacked on the layer of black chamber, and has a plurality of spray orifices, runs through spray nozzle sheet, and the position of these spray orifices corresponds respectively to the position of these heating components.Moreover emulsion sheet is stacked on the spray nozzle sheet, and has at least one opening, runs through emulsion sheet, and exposes at least one spray orifice, and the outer rim of emulsion sheet is suitable for being assembled to the ink supply port of print cartridge.
For reaching above-mentioned purpose of the present invention, the present invention also proposes a kind of manufacturing process of Thermal Bubble Ink-jet Printer printhead.At first, an ink-jet chip and a black chamber layer are provided, wherein ink-jet chip has a surface and a plurality of heating component, and these heating components are configured in the above-mentioned surface of ink-jet chip, and black chamber layer is stacked on the above-mentioned surface of ink-jet chip, and black chamber layer has a plurality of ink runners, and an end of these ink runners exposes these heating components respectively, and the other end of these ink runners then extends to the side of black chamber layer respectively.Then, on the layer of black chamber, pile up a spray nozzle sheet.Afterwards, form a plurality of spray orifices on spray nozzle sheet, wherein the position of these spray orifices corresponds respectively to the position of these heating components.Then, pile up an emulsion sheet on spray nozzle sheet, wherein, emulsion sheet has at least one opening, runs through emulsion sheet, and exposes at least one spray orifice.
Based on above-mentioned, the present invention earlier is stacked on a spray nozzle sheet on the black chamber layer on a surface that is positioned at ink-jet chip, on spray nozzle sheet, form a plurality of spray orifices again, just can omit existing " with a spray nozzle sheet that has formed spray orifice accurately contraposition join black chamber layer to " step.In addition, the present invention also utilizes the connecting interface of an emulsion sheet as the ink supply port of spray nozzle sheet and print cartridge, and emulsion sheet does not need accurately contraposition to join spray nozzle sheet to, so compare with " the accurate contraposition of spray nozzle sheet joins the cost of manufacture of black chamber layer to ", the cost of manufacture of the extra emulsion sheet that increases is relatively low.Therefore, the present invention can reduce the integral manufacturing cost of Thermal Bubble Ink-jet Printer printhead effectively.
Description of drawings
Fig. 1 is the generalized section of the Thermal Bubble Ink-jet Printer printhead of existing a kind of edge advanceable ink supply;
Fig. 2 is the generalized section of the Thermal Bubble Ink-jet Printer printhead of preferred embodiment of the present invention;
Fig. 3 (A)~3 (C) is the profile of the Thermal Bubble Ink-jet Printer printhead processing procedure of preferred embodiment of the present invention;
Fig. 4 is the partial top view of the Thermal Bubble Ink-jet Printer printhead of Fig. 2.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, existing in conjunction with a preferred embodiment, and conjunction with figs., be described in detail as follows.
Referring to Fig. 2, be the generalized section of the Thermal Bubble Ink-jet Printer printhead of preferred embodiment of the present invention.Thermal Bubble Ink-jet Printer printhead 200 mainly comprises ink-jet chip 210, black chamber layer 220, spray nozzle sheet 230 and emulsion sheet 240.At first, ink-jet chip 210 has a plurality of heating components 212, is configured in the surface of ink-jet chip 210, such as the side on the surface that is configured in ink-jet chip 210.In addition, China ink chamber layer 220 also is configured in the surface of ink-jet chip 210, and form a plurality of ink runners 222, and wherein an end of these ink runners 222 exposes these heating components 212 respectively, and the other end of these ink runners then extends to the side edge of black chamber layer 220 respectively.In addition, spray nozzle sheet 230 is stacked on the black chamber layer 220, and has a plurality of spray orifices 232, run through spray nozzle sheet 230, and the position of these spray orifices 232 corresponds respectively to the position of these heating components 212.Moreover emulsion sheet 240 is stacked on the spray nozzle sheet 230, and has at least one opening 242, run through emulsion sheet 240, and expose these spray orifices, and the outer rim of emulsion sheet 240 is suitable for being assembled to the ink supply port 22 of print cartridge 20.Therefore, ink can be along flow direction 24, from the ink runner 222 on the side edge of ink-jet chip 210, flow on the heating component 212, and via heating component 212 with the gasification of ink moment, thereby produce the high pressure bubble and promote ink, again ink is penetrated via spray orifice 232 and forms ink droplet.
Manufacturing process for the Thermal Bubble Ink-jet Printer printhead that describes preferred embodiment of the present invention in detail, please reach hereinafter with reference to figure 3 (A)~Fig. 3 (D) figure successively, wherein Fig. 3 (A)~3 (D) is the profile of the Thermal Bubble Ink-jet Printer printhead manufacturing process of preferred embodiment of the present invention.
With reference to figure 3 (A), an ink-jet chip 210 and a black chamber layer 220 are provided, wherein ink-jet chip 210 has a plurality of heating components 212, and these heating components 212 are configured in the surperficial 210a of ink-jet chip 210, and black chamber layer 220 is stacked on the surperficial 210a of ink-jet chip 210, and black chamber layer 220 has a plurality of ink runners 222, and an end of these ink runners 222 exposes these heating components 212 respectively, and the other end of these ink runners 222 extends to the side of black chamber layer 220 respectively.Material employing photoresistance (Photo-Resist when black chamber layer 220, PR) time, can utilize the mode of photoetching (photolithography), promptly utilize exposure (exposing) and the mode of develop (development), these ink runners 222 are formed directly on the black chamber layer 230.
With reference to figure 3 (B), on black chamber layer 220, pile up a spray nozzle sheet 230, wherein the material of spray nozzle sheet 230 can be photoresistance (Photo-Resister), macromolecular material or metal etc., and macromolecular material can be as poly-vinegar ethamine (Ployimide), polymethyl methacrylate (Poly (methyl methacrylate), be called for short PMMA), polyester (PET) or epoxy resin (Expoxy) etc., metal material then can be as stainless steel (stainless steel) or nickel (Ni).
With reference to figure 3 (C), on spray nozzle sheet, form a plurality of spray orifices 232, wherein the position of these spray orifices 232 corresponds respectively to the position of these heating components 212.Similarly, when the material of spray nozzle sheet 230 adopts photoresistance (PR), can utilize the mode of photoetching, i.e. the mode of utilizing exposure and developing, these spray orifices 232 are formed directly on the spray nozzle sheet 230, and make the position of these spray orifices 232 all can distinguish the position of corresponding these heating components 212.
With reference to figure 3 (D), on spray nozzle sheet 230, pile up an emulsion sheet 240, wherein emulsion sheet 240 has at least one opening 242, runs through emulsion sheet 240, and exposes these spray orifices 232.With reference to figure 4, be the partial top view of the Thermal Bubble Ink-jet Printer printhead of Fig. 2 simultaneously.In preferred embodiment of the present invention, the material of emulsion sheet 240 can comprise silicon (silicon), metal material, ceramic material (ceramic material), titanium oxide (TiO2), zirconia (TiO2) or macromolecular material etc., wherein macromolecular material can be again for example poly-vinegar ethamine (Ployimide), polymethyl methacrylate (Poly (methylmethacrylate), be called for short PMMA), polyester (PET) or epoxy resin (Expoxy) etc., and utilize dry-etching (dryetching), the mode of Wet-type etching (wet etching) or machining patternings such as (machining), form these openings 242 on emulsion sheet 240, wherein the internal diameter of these openings 242 is much larger than the internal diameter of spray orifice 232.Simultaneously, after piling up emulsion sheet 240 on the spray nozzle sheet 230, the opening 242 of the single rectangular shape of emulsion sheet 240 can expose a plurality of spray orifices 232 of whole row simultaneously, as shown in Figure 4.And the end face of black chamber layer 220 can corresponding attach to the bottom surface of the local emulsion sheet 240 between two openings 242, shown in Fig. 3 (D).
With reference to figure 2, the thickness of emulsion sheet 240 must be controlled at certain below the default value again, makes the top of spray orifice 232 and the distance between the recording medium (for example paper) can obtain good control.Thickness for thinning emulsion sheet 240, pile up emulsion sheet 240 on the spray nozzle sheet 230 before, can utilize cmp (CMP) or other thinning technology in advance, reduce the thickness of emulsion sheet 240 effectively, but the emulsion sheet after the thinning 240 must provide enough structural strengths, is used for locating the spray nozzle sheet 230 under it, black chamber layer 220 and ink-jet chip 210 within the ink supply port 22 of print cartridge 20.
The technical characterictic of preferred embodiment of the present invention is that then the mode of utilizing exposure and developing again is formed directly into a plurality of spray orifices on the spray nozzle sheet with on the black chamber layer that is stacked on a surface that is positioned at ink-jet chip by the made spray nozzle sheet of photoresistance.In addition, another technical characterictic of preferred embodiment of the present invention is to utilize an emulsion sheet to be used as the media that structure connects usefulness, be used for to pile up the ink supply port that ink-jet chip, black chamber layer and the spray nozzle sheet finished are assembled to print cartridge, and the opening that utilizes emulsion sheet exposes a plurality of spray orifices of spray nozzle sheet, makes ink droplet can successfully inject to the external world via spray orifice.It should be noted that contraposition will join spray nozzle sheet to so emulsion sheet will not need accurately because these openings of emulsion sheet only need expose these spray orifices of spray nozzle sheet.
In sum, Thermal Bubble Ink-jet Printer printhead manufacturing process of the present invention is earlier a spray nozzle sheet to be stacked on the black chamber layer on a surface that is positioned at ink-jet chip, on spray nozzle sheet, form a plurality of spray orifices again, therefore can omit of the prior art " with a spray nozzle sheet that has formed spray orifice accurately contraposition join black chamber layer to " step.In addition, the present invention also utilizes the connecting interface of an emulsion sheet as the ink supply port of spray nozzle sheet and print cartridge, and emulsion sheet does not need accurately contraposition to join spray nozzle sheet to, so compare with " the accurate contraposition of spray nozzle sheet joins the cost of manufacture of black chamber layer to ", the cost of manufacture of the extra emulsion sheet that increases is still relatively low.Therefore, the present invention can reduce the integral manufacturing cost of this Thermal Bubble Ink-jet Printer printhead effectively.
Above-mentioned only is that a preferable enforcement of the present invention is sharp; be not to be used for limiting scope of the present invention, without departing from the spirit and scope of the present invention, any change and the modification done; all belong to protection scope of the present invention, so protection scope of the present invention is worked as with being as the criterion that claims were defined.
The reference numeral explanation
10,20: print cartridge 12,22: ink supply port
14,24: flow direction
100: Thermal Bubble Ink-jet Printer printhead 110: ink-jet chip
110a: surface 112: heating component
120: black chamber layer 122: ink runner
130: spray nozzle sheet 132: spray orifice
200: Thermal Bubble Ink-jet Printer printhead 210: ink-jet chip
210a: surface 212: heating component
220: black chamber layer 222: ink runner
230: spray nozzle sheet 232: spray orifice
240: emulsion sheet 242: opening

Claims (10)

1. a Thermal Bubble Ink-jet Printer printhead is applicable to an ink supply port that is assemblied in a print cartridge, it is characterized in that described Thermal Bubble Ink-jet Printer printhead comprises at least:
An ink-jet chip has a surface and a plurality of heating component, and wherein said these heating components are configured in the described surface of described ink-jet chip;
A black chamber layer, be stacked on the described surface of described ink-jet chip, and have a plurality of ink runners, and an end of described these ink runners exposes described these heating components respectively, and the other end of described these ink runners extends to the side of described black chamber layer respectively; And
A spray nozzle sheet is stacked on the layer of described black chamber, and has a plurality of spray orifices, run through described spray nozzle sheet, and the position of described these spray orifices corresponds respectively to the position of described these heating components; And
An emulsion sheet is stacked on the described spray nozzle sheet, and has at least one opening, runs through described emulsion sheet, and exposes at least one described these spray orifice, and the outer rim of described emulsion sheet is suitable for being assembled to the described ink supply port of described print cartridge.
2. Thermal Bubble Ink-jet Printer printhead as claimed in claim 1 is characterized in that, described these heating components are distributed in the side edge on the described surface of described ink-jet chip.
3. Thermal Bubble Ink-jet Printer printhead as claimed in claim 1 is characterized in that the material of described spray nozzle sheet comprises one of them of photoresistance, non-photosensitive macromolecular or metal.
4. Thermal Bubble Ink-jet Printer printhead as claimed in claim 1 is characterized in that the material of described emulsion sheet comprises one of them of silicon, metal, ceramic material, titanium oxide, zirconia or macromolecular material.
5. Thermal Bubble Ink-jet Printer printhead as claimed in claim 1 is characterized in that the internal diameter of described opening is greater than the internal diameter of described spray orifice.
6. the manufacturing process of a Thermal Bubble Ink-jet Printer printhead is characterized in that, comprises the following steps: at least
An ink-jet chip and a black chamber layer are provided, wherein said ink-jet chip has a surface and a plurality of heating component, and described these heating components are configured in the described surface of described ink-jet chip, and described black chamber layer is stacked on the described surface of described ink-jet chip, and described black chamber layer has a plurality of ink runners, and an end of described these ink runners exposes described these heating components respectively, and the other end of described these ink runners extends to the side of described black chamber layer respectively;
Spray nozzle sheet of storehouse is on the layer of described black chamber;
Form a plurality of spray orifices on described spray nozzle sheet, the position of wherein said these spray orifices corresponds respectively to the position of described these heating components; And
Pile up an emulsion sheet on described spray nozzle sheet, wherein said emulsion sheet has at least one opening, runs through described emulsion sheet, and exposes at least one described these spray orifice.
7. the manufacturing process of Thermal Bubble Ink-jet Printer printhead as claimed in claim 6 is characterized in that, described these heating components are configured in the side edge on the described surface of described ink-jet chip.
8. the manufacturing process of Thermal Bubble Ink-jet Printer printhead as claimed in claim 6 is characterized in that, the material of described spray nozzle sheet comprises one of them of photoresistance, non-photosensitive macromolecular or metal.
9. the manufacturing process of Thermal Bubble Ink-jet Printer printhead as claimed in claim 8 is characterized in that, the generation type of the described spray orifice of described spray nozzle sheet comprises photoetching.
10. the manufacturing process of Thermal Bubble Ink-jet Printer printhead as claimed in claim 6 is characterized in that, the material of described emulsion sheet comprises one of them of silicon, metal, ceramic material, titanium oxide, zirconia or macromolecular material.
CNB031594409A 2003-09-22 2003-09-22 Heat bubble type ink jet printing head and manufacturing procedure Expired - Fee Related CN1311973C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB031594409A CN1311973C (en) 2003-09-22 2003-09-22 Heat bubble type ink jet printing head and manufacturing procedure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB031594409A CN1311973C (en) 2003-09-22 2003-09-22 Heat bubble type ink jet printing head and manufacturing procedure

Publications (2)

Publication Number Publication Date
CN1600548A true CN1600548A (en) 2005-03-30
CN1311973C CN1311973C (en) 2007-04-25

Family

ID=34660654

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031594409A Expired - Fee Related CN1311973C (en) 2003-09-22 2003-09-22 Heat bubble type ink jet printing head and manufacturing procedure

Country Status (1)

Country Link
CN (1) CN1311973C (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102218915A (en) * 2010-03-26 2011-10-19 精工爱普生株式会社 Liquid nozzle, liquid nozzle unit and liquid jet device
CN113059913A (en) * 2021-03-25 2021-07-02 苏州印科杰特半导体科技有限公司 Design structure for preventing ink breaking and damage of thermal bubble type spray head
CN113211987A (en) * 2020-01-21 2021-08-06 国际联合科技股份有限公司 Thermal bubble type ink jet head and ink jet head heating chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5305015A (en) * 1990-08-16 1994-04-19 Hewlett-Packard Company Laser ablated nozzle member for inkjet printhead
CN1146953A (en) * 1995-04-24 1997-04-09 李韫言 Single chip integrated heat vapor ink-jet print head
TW487638B (en) * 2001-09-06 2002-05-21 Nanodynamics Inc Thermal bubble ink-jet nozzle and the inverse developing of the nozzle thereof
CN1408552A (en) * 2001-09-29 2003-04-09 飞赫科技股份有限公司 Hot foam type ink jet printing head and its backword developing method of jet board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102218915A (en) * 2010-03-26 2011-10-19 精工爱普生株式会社 Liquid nozzle, liquid nozzle unit and liquid jet device
CN102218915B (en) * 2010-03-26 2014-11-12 精工爱普生株式会社 Liquid nozzle, liquid nozzle unit and liquid jet device
CN113211987A (en) * 2020-01-21 2021-08-06 国际联合科技股份有限公司 Thermal bubble type ink jet head and ink jet head heating chip
CN113211986A (en) * 2020-01-21 2021-08-06 国际联合科技股份有限公司 Thermal bubble type ink jet head and ink jet head heating chip
CN113211986B (en) * 2020-01-21 2022-07-29 国际联合科技股份有限公司 Thermal bubble type ink jet head and ink jet head heating chip
US11407225B2 (en) 2020-01-21 2022-08-09 International United Technology Co., Ltd. Inkjet chip and thermal bubble inkjet printhead using the same
CN113059913A (en) * 2021-03-25 2021-07-02 苏州印科杰特半导体科技有限公司 Design structure for preventing ink breaking and damage of thermal bubble type spray head

Also Published As

Publication number Publication date
CN1311973C (en) 2007-04-25

Similar Documents

Publication Publication Date Title
JP3132291B2 (en) Method of manufacturing inkjet head
EP0937579B1 (en) Ink jet head and manufacturing method thereof, discharge opening plate for head and manufacturing method thereof, and ink jet apparatus with ink jet head
EP2563597B1 (en) Fluid ejection device
US8449783B2 (en) Method of manufacturing liquid ejection head substrate
JPH04229279A (en) Manufacture of channel plate of ink jet print head
US10843465B2 (en) Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices
JPH02265754A (en) Thermal ink-jet printing head
JP4208794B2 (en) Inkjet head substrate, method for producing the substrate, and inkjet head using the substrate
US9782970B2 (en) Ink-jet recording head, recording element substrate, method for manufacturing ink-jet recording head, and method for manufacturing recording element substrate
US7828419B2 (en) Ink jet recording head and method of manufacturing the same
US20110020966A1 (en) Method for processing silicon substrate and method for producing substrate for liquid ejecting head
KR100469879B1 (en) Ink jet head, method of producing ink jet heads, and printer
JP2006051770A (en) Substrate for inkjet head, manufacturing method for the substrate and inkjet head using the substrate
CN1600548A (en) Heat bubble type ink jet printing head and manufacturing procedure
KR20020086462A (en) Ink jet head and printer
CN1157291C (en) Method of manufacturing ink-jet printer head
US8091233B2 (en) Method of manufacturing liquid discharge head
JP4193890B2 (en) Inkjet head
KR20120043139A (en) Method of manufacturing substrate for liquid discharge head
US8210661B2 (en) Stacked slice printhead
JP2007168115A (en) Inkjet head and its manufacturing process
JP4438374B2 (en) Inkjet head assembly
CN101112817A (en) Ink jet printing head and its producing method
US6908564B2 (en) Liquid discharge head and method of manufacturing the same
TWI232808B (en) Thermal bubble inkjet print head and process thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: Taiwan, Hsinchu, China Hsinchu Science Industrial Park, industrial road, No. 1, No. 36, East fourth floor

Patentee after: Cape universal Polytron Technologies Inc.

Address before: Taiwan, Hsinchu, China Science Industrial Park, industrial road, No. 24-1, 1 East

Patentee before: Cape universal Polytron Technologies Inc.

TR01 Transfer of patent right

Effective date of registration: 20090109

Address after: Taiwan, Hsinchu, China Science Industrial Park, industrial road, No. 24-1, 1 East

Patentee after: Cape universal Polytron Technologies Inc.

Address before: 5, building 9, 81 water conservancy Road, Taiwan, Hsinchu

Patentee before: NANODYNAMICS INC.

ASS Succession or assignment of patent right

Owner name: YINGPU TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: FEIHE SCIENCE AND TECHNOLOGY CO LTD

Effective date: 20090109

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070425

Termination date: 20110922