CN1408552A - Hot foam type ink jet printing head and its backword developing method of jet board - Google Patents
Hot foam type ink jet printing head and its backword developing method of jet board Download PDFInfo
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- CN1408552A CN1408552A CN 01136109 CN01136109A CN1408552A CN 1408552 A CN1408552 A CN 1408552A CN 01136109 CN01136109 CN 01136109 CN 01136109 A CN01136109 A CN 01136109A CN 1408552 A CN1408552 A CN 1408552A
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- ink
- thick film
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- photoresistance
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Abstract
In the hot form type ink jet printing head, thick film layer is used to replace available nickel metal plate as the jet sheet, and nozzle of different apertures in two ends are formed on the thick film layer via backward developing mode. Developing liquid is sprayed to the back side of the chip and the developing liquid flows via the ink passage to the ink cavity. The nozzle has relatively larger aperture in the ink feeding end to form better nozzle shape, raise the correctness of sprayed ink drops and stabilize the ink spraying pressure.
Description
Technical field
The invention relates to the reverse development method of the thick film layers of a kind of semiconductor technology and micro electronmechanical technology, and particularly relevant for a kind of reverse development method of thick film layers of Thermal Bubble Ink-jet Printer printhead technology.
Background technology
Thermal bubble type (thermal bubble) inkjet technology provides sufficient pulse voltage, it has the pulse width of several microseconds (micron second), make the surface temperature of heater (heater) be increased to hundreds of degree Celsius rapidly, whereby ink moment gasification is produced thermal, and the formation of thermal promptly provides a pressure source, and this pressure source provides ink to spray needed thrust.When ink temperature reaches the critical-temperature of ink vaporization, the ink generation thermal of promptly vaporizing is producing thermal simultaneously, and the pressure in the ink cavity increased in moment, the pressure of thermal is along with the temperature of thermal descends and descends subsequently, and operating frequency can reach several kHz.
Please refer to Fig. 1, it is the cut-away section schematic diagram of known a kind of Thermal Bubble Ink-jet Printer print head structure.The chip 10 that ink-jet is used has heater 12 and ink road (ink channel) 14, and wherein heater 12 is formed at the front 16 of chip 10, and ink road 14 runs through the front 16 and reverse side 18 of chip 10, and near heater 12.In addition, have a black chamber layer 20 on the front 16 of chip 10, its China and Mexico's chamber layer 20 has an inking chamber 22, and it exposes heater 12, and communicates with ink road 14.In addition, on black chamber layer 20, have a nozzle plate 30, the nozzle (nozzle) the 32nd of nozzle plate (nozzle plate) 30 wherein, correspondence is positioned at the top of heater 12.When ink flows into inking chamber 22 along ink road 14, utilize heater 12 rapid heating inks to produce bubbles 40, and push ink by bubble 40 and produce ink droplet 42, make ink droplet 42 pass nozzle 32 and paper surface outside being ejected to.
Please also refer to Fig. 1 and Fig. 2, wherein Fig. 2 is the cut-away section schematic diagram of known another kind of Thermal Bubble Ink-jet Printer printhead.The Thermal Bubble Ink-jet Printer printhead of Fig. 2 and Fig. 1 not existing together structurally is the appearance profile of nozzle, for the ink droplet 42 that makes Fig. 1 has enough ejection pressure and accurate emission direction, nozzle plate 130 is when making, can make the aperture of ink input 136 of nozzle 132 greater than the aperture of its ink output 134, to meet the appearance profile of the required preferable nozzle 132 of inkjet printing.
The making of the nozzle plate of known Thermal Bubble Ink-jet Printer printhead has following several form basically, and as United States Patent (USP) the 4th, 694, No. 308 disclosed, and first electroforming is fitted in it on layer of black chamber after forming and having the nickel sheet metal of nozzle again.Perhaps as United States Patent (USP) the 4th, 829, No. 319 disclosed, and first mold pressing is fitted in it on layer of black chamber after forming and having the plastic sheet of nozzle again.Or disclosed as No. the 5297331st, United States Patent (USP) or No. 5305015, utilize the used similar flexible circuit board of TAB (Tapeautomated Bonding), and, it is fitted on the layer of black chamber again with after the laser boring.Or after having the photoresistance of nozzle with exposure imaging formation earlier, it is fitted on the layer of black chamber again.It should be noted that known technology is the nozzle plate that formation earlier has nozzle, is fitted in it on layer of black chamber again.
Summary of the invention
The object of the present invention is to provide the reverse development method of a kind of Thermal Bubble Ink-jet Printer printhead and nozzle plate thereof, elder generation's pressing thick film layers is on the layer of black chamber, again in the mode of reverse development, on thick film layers, form nozzle with preferable appearance profile, so can in the technology of ink jet-print head, directly finish the making of nozzle plate, and need not to make the nozzle plate with nozzle separately as known technology, and have more and carry out the step that nozzle plate is fitted together, help the making of nozzle plate directly is integrated in the technology of ink jet-print head, thereby reduce the cost of manufacture of Thermal Bubble Ink-jet Printer printhead.
Based on above-mentioned purpose of the present invention, the present invention proposes a kind of Thermal Bubble Ink-jet Printer printhead, and its chip has an at least one heater and a corresponding ink road, and wherein heater is positioned on the chip, and the ink road then runs through the two sides of chip.And black chamber layer is positioned on the chip, and has at least one inking chamber, and it is positioned on the heater, and communicates with the ink road of chip.Thick film layers then is positioned on the layer of black chamber, and has at least one nozzle, and it runs through the two sides of thick film layers, and the aperture of the ink input of nozzle is greater than the aperture of its ink output.
Based on above-mentioned purpose of the present invention, the present invention proposes a kind of reverse development method, be applicable in the technology of Thermal Bubble Ink-jet Printer printhead, the chip of this Thermal Bubble Ink-jet Printer printhead wherein, it has an at least one heater and a corresponding ink road, wherein heater is positioned on the chip, and the ink road then runs through the two sides of chip.China ink chamber layer is positioned on the chip, and wherein this black chamber layer has at least one inking chamber, and it is positioned on the heater, and communicates with the ink road of chip, and thick film layers then is positioned on the layer of black chamber, and wherein the part thick film layers has been exposed and formed a potential pattern.This reverse development method is that developer solution is flowed into inking chamber via the ink road, make the exposed portion of developing liquid developing thick film layers, and form at least one nozzle corresponding to the position of potential pattern, it runs through thick film layers and has an ink input and an ink output, and the aperture of its ink inside input is slightly greater than the aperture of ink output.
The present invention elder generation pressing thick film layers is on the layer of black chamber, again in the mode of reverse development, reverse side from chip, make developer solution flow into inking chamber from the ink road of chip, and on thick film layers, develop, be used to form the nozzle that differs in the aperture, two ends, the aperture of its ink input is greater than the aperture of its ink output, on thick film layers, to form nozzle with preferable appearance profile, so can in the technology of ink jet-print head, directly finish the making of nozzle plate, and need not make nozzle plate as is well known separately with nozzle, and have more the step of carrying out the nozzle plate applying together, help the making of nozzle plate directly is integrated in the technology of ink jet-print head.
Description of drawings
Fig. 1 is the cut-away section schematic diagram of known a kind of Thermal Bubble Ink-jet Printer print head structure;
Fig. 2 is the cut-away section schematic diagram of known another kind of Thermal Bubble Ink-jet Printer print head structure;
Fig. 3 A～3F is the section flow chart according to the technology of the Thermal Bubble Ink-jet Printer printhead of preferred embodiment of the present invention.
10: chip 12: heater
14: ink road 16: front
18: reverse side 20: black chamber layer
22: inking chamber 30: nozzle plate
32: nozzle 40: bubble
42: ink droplet 120: black chamber layer
130: nozzle plate 132: nozzle
134: ink output 136: the ink input
210: chip 212: heater
214: ink road 216: front
218: reverse side 220: black chamber layer
222: inking chamber 230: thick film layers
232: nozzle 234: the ink output
236: ink input 250: developer solution
238: potential pattern
The specific embodiment
Please successively with reference to figure 3A～3F, it is the reverse development method according to preferred embodiment of the present invention, and it is applied to the section flow chart of the technology of a kind of thermal bubble type (thermal bubble) ink jet-print head.As shown in Figure 3A, the chip 210 that provides an ink-jet to use for example is a silicon.In addition, chip 210 has at least one heater (heater) 212, it is positioned at the front 216 of chip 210, when supply one pulse voltage, the surface temperature of heater 212 will be increased to hundreds of degree Celsius rapidly, whereby the ink instant vaporization is produced thermal, to provide ejection ink droplet 42 (as shown in Figure 1) needed thrust.
Shown in Fig. 3 B, finish after the heater 212 of chip 210, grind special processing modes such as (ultrasonicmilling) by laser drill (laser drilling), sandblast (sand blasting) or ultrasonic wave again, form ink road 214 in chip 210, its ink inside road 214 runs through the front 216 and the reverse side 218 of chip 210, is used for the channel that flows into as ink.
Shown in Fig. 3 C, finish after the heater 212 and ink road 214 of chip 210, then form a black chamber layer 220 on the front 216 of chip 210, when the material of black chamber layer 220 for example is a silicon, glass, when metal and macromolecular material, can pass through photolithography (photolithography), the mode of etching (etching), patterning China ink chamber layer 220 is to form the structure of inking chamber 222, in addition, when the material of black chamber layer 220 is the dry film photoresistance, liquid photoresistance, positive photoresistance, negative photoresistance, during photosensitive macromoleculars such as sensing optical activity polyimide or sensing optical activity epoxy resin, then can be by exposure (photography), the mode of development (development), patterning China ink chamber layer 220 is to form the structures of inking chamber 222.Wherein, inking chamber 222 exposes the heater 212 on the chip 210, and communicates with ink road 214, makes ink to arrive heater 212 via ink road 214 and inking chamber 222.
Shown in Fig. 3 D, finish after the inking chamber 222 of black chamber layer 220, on black chamber layer 220, form a thick film layers 230, replace known nickel sheet metal, with nozzle plate 30 (as shown in Figure 1) as the Thermal Bubble Ink-jet Printer printhead, wherein the material of thick film layers 230 for example is dry film photoresistance, positive photoresistance, photosensitive macromoleculars such as negative photoresistance, sensing optical activity polyimide or sensing optical activity epoxy resin, and to fit or the mode of pressing, thick film layers 230 is superimposed on black chamber layer 220.
Shown in Fig. 3 E, because the material of thick film layers 230 is the sensing optical activity material, therefore, can pass through ultraviolet (Ultra-Violet Light, UV) through light shield (photo mask), thick film layers 230 is carried out after the step of exposing, to among thick film layers 230, form potential pattern (latent pattern) 238, the position of its corresponding heater 212, owing to do not carry out step of developing as yet, therefore can't find out by visual, so the exposed portion of thick film layers 230 is called " potential " pattern 238.
Shown in Fig. 3 F, thick film layers 230 is exposed to form after the potential pattern 238, it should be noted that, the present invention is in the reverse side 218 of chip 210, spray developing liquid 250 flows into inking chamber 222 from the ink road 214 of chip 210, to remove the exposed portion of thick film layers 230, promptly remove the potential pattern 238 of Fig. 3 E, and on the position of potential pattern 238, form nozzle 232, make the profile of nozzle 232 be horn-like slightly, and nozzle 232 runs through thick film layers 230, and having an ink output 234 and an ink input 236, the aperture of its ink inside input 236 is slightly greater than the aperture of ink output 234, thereby improves the accuracy of ink droplet 42 emission directions as shown in Figure 1, and the ejection pressure that increases ink droplet 42, the size of easy simultaneously control ink droplet 42.
According to feature of the present invention, the present invention is earlier with after the thick film layers applying or being pressed together on the layer of black chamber, on thick film layers, form potential pattern with Exposure mode again, follow mode with reverse development, reverse side spray developing liquid from chip, and flow into inking chamber via the ink road of chip, and on thick film layers, develop, be used to form the nozzle that differs in the aperture, two ends, the aperture of its ink input is greater than the aperture of ink output, and meet the required preferable nozzle form of inkjet printing, thus the accuracy of the emission direction of ink droplet can be improved, and the ejection pressure of stable ink droplet.
The present invention elder generation pressing thick film layers is on the layer of black chamber, again in the mode of reverse development, on thick film layers, form nozzle with preferable appearance profile, so can in the technology of ink jet-print head, directly finish the making of nozzle plate, and need not make nozzle plate as is well known separately with nozzle, and have more the step of carrying out the nozzle plate applying together, will help the making of nozzle plate directly is integrated in the technology of ink jet-print head, thereby reduce the cost of manufacture of Thermal Bubble Ink-jet Printer printhead.
In addition, because reverse development method of the present invention is characterised in that: a substrate is provided earlier, form a sensing optical activity thick film layers again in substrate, this thick film layers of then exposing is to form a potential pattern, empty again afterwards and remove the part substrate to form at least one opening, be used to expose the back side of the exposed portion of thick film layers, injecting developer solution from the back side of thick film layers again develops, have the perforation that differs in the aperture, two ends on thick film layers, to form, wherein perforation near the aperture of an end of substrate slightly greater than the aperture away from the other end of substrate of perforation.Therefore, what the reverse development method of the present invention was not only applicable to the Thermal Bubble Ink-jet Printer printhead is the technology of nozzle plate with the thick film layers, more is applicable in other technology, for example the technology of micromechanics, need mode, directly on the thick film layers of having exposed, form perforation by reverse development.
Claims (25)
1, a kind of Thermal Bubble Ink-jet Printer printhead comprises at least:
One chip has at least one heater and corresponding at least one ink road, and wherein this heater is positioned on this chip, and this ink road runs through the two sides of this chip;
One black chamber layer is configured on this chip, and has at least one inking chamber, and it is positioned on this heater, and communicates with this ink road of this chip;
It is characterized in that this printhead also comprises:
One thick film layers is configured on this China ink chamber layer, and has at least one nozzle, and it runs through this thick film layers and has an ink input and an ink output, and wherein the aperture of this ink input is slightly greater than the aperture of this ink output.
2, Thermal Bubble Ink-jet Printer printhead as claimed in claim 1 is characterized in that, this chip is a silicon.
3, Thermal Bubble Ink-jet Printer printhead as claimed in claim 1 is characterized in that, the material of this China ink chamber layer is selected from a kind of material in the group that is made up of silicon, glass, metal and macromolecular material.
4, Thermal Bubble Ink-jet Printer printhead as claimed in claim 1, it is characterized in that the material of this China ink chamber layer is selected from a kind of material in the group that is made up of dry film photoresistance, liquid photoresistance, positive photoresistance, negative photoresistance, sensing optical activity polyimide and sensing optical activity epoxy resin.
5, Thermal Bubble Ink-jet Printer printhead as claimed in claim 1 is characterized in that, the material of this thick film layers is selected from a kind of material in the group that is made up of dry film photoresistance, positive photoresistance, negative photoresistance, sensing optical activity polyimide and sensing optical activity epoxy resin.
6, a kind of reverse development method is applicable in the technology of Thermal Bubble Ink-jet Printer printhead, and wherein this Thermal Bubble Ink-jet Printer printhead has:
One chip has one first and corresponding one second, and has an at least one heater and a corresponding ink road, and wherein this heater is positioned at this first of this chip, and this ink road runs through this first and this second of this chip;
One black chamber layer is positioned on this first of this chip, wherein should have at least one inking chamber by China ink chamber layer, and it is positioned on this heater, and communicates with this ink road;
One thick film layers is positioned on this China ink chamber layer, and wherein this thick film layers of part has been exposed and formed a potential pattern, it is characterized in that,
This reverse development method comprises: developer solution is flowed into this inking chamber via this ink road, make the exposed portion of this thick film layers of developing liquid developing, and form at least one nozzle corresponding to the position of this potential pattern, it runs through this thick film layers and has an ink input and an ink output, and wherein the aperture of this ink input is slightly greater than the aperture of this ink output.
7, reverse development method as claimed in claim 6 is characterized in that, this chip is a silicon.
8, reverse development method as claimed in claim 6 is characterized in that, the generation type in this ink road is that laser drill, sandblast and ultrasonic wave grind one of them.
9, reverse development method as claimed in claim 6 is characterized in that, the material of this China ink chamber layer is selected from a kind of material in the group that is made up of silicon, glass, metal and macromolecular material.
10, reverse development method as claimed in claim 9 is characterized in that, the formation method of this inking chamber is the photolithography etching mode.
11, reverse development method as claimed in claim 6 is characterized in that, the material of this China ink chamber layer is selected from a kind of material in the group that is made up of dry film photoresistance, liquid photoresistance, positive photoresistance, negative photoresistance, sensing optical activity polyimide and sensing optical activity epoxy resin.
12, reverse development method as claimed in claim 11 is characterized in that, the method for the patterning of this China ink chamber layer comprises exposure imaging.
13, reverse development method as claimed in claim 6 is characterized in that, the material of this thick film layers is selected from a kind of material in the group that is made up of dry film photoresistance, positive photoresistance, negative photoresistance, sensing optical activity polyimide and sensing optical activity epoxy resin.
14, a kind of technology of Thermal Bubble Ink-jet Printer printhead is characterized in that, comprises the following steps:
One chip is provided, and wherein this chip has one first and corresponding one second, and this chip has at least one heater, and it is positioned at this first of this chip;
Form at least one ink road, wherein this ink road runs through this first and this second of this chip;
Form a black chamber layer on this first of this chip;
Remove part China ink chamber layer, to form at least one inking chamber, wherein this inking chamber exposes this heater, and communicates with this ink road;
Form a thick film layers on this China ink chamber layer;
This thick film layers of exposed portion is to form a potential pattern; And
The own exposed portion of this thick film layers of developing, the developer solution of the usefulness of wherein developing flows into this inking chamber via this ink road, make developer solution remove the exposed portion of this thick film layers, and form at least one nozzle corresponding to the position of this potential pattern, it runs through this thick film layers and has an ink input and an ink output, and wherein the aperture of this ink input is slightly greater than the aperture of this ink output.
15, the technology of Thermal Bubble Ink-jet Printer print head structure as claimed in claim 14 is characterized in that, this chip is a silicon.
16, the technology of Thermal Bubble Ink-jet Printer print head structure as claimed in claim 14 is characterized in that, the generation type in this ink road comprises that laser drill, sandblast and ultrasonic wave grind one of them.
17, the technology of Thermal Bubble Ink-jet Printer print head structure as claimed in claim 14 is characterized in that, the material of this China ink chamber layer is selected from a kind of material in the group that is made up of silicon, glass, metal and macromolecular material.
18, the technology of Thermal Bubble Ink-jet Printer print head structure as claimed in claim 17 is characterized in that, the formation method of this inking chamber is the photolithography etching mode.
19, the technology of Thermal Bubble Ink-jet Printer print head structure as claimed in claim 14, it is characterized in that the material of this China ink chamber layer is selected from a kind of material in the group that is made up of dry film photoresistance, liquid photoresistance, positive photoresistance, negative photoresistance, sensing optical activity polyimide and sensing optical activity epoxy resin.
20, the technology of Thermal Bubble Ink-jet Printer print head structure as claimed in claim 14 is characterized in that, the method for the patterning of this China ink chamber layer is the exposure imaging mode.
21, the technology of Thermal Bubble Ink-jet Printer print head structure as claimed in claim 14, it is characterized in that the material of this thick film layers is selected from a kind of material in the group that is made up of dry film photoresistance, positive photoresistance, negative photoresistance, sensing optical activity polyimide and sensing optical activity epoxy resin.
22, a kind of reverse development method is characterized in that, this method comprises:
One substrate is provided;
Form a sensing optical activity thick film layers in this substrate;
This thick film layers of exposing is to form a potential pattern;
Remove this substrate of part to form at least one opening, it exposes the back side of the exposed portion of this thick film layers; And
Develop from the back side of this thick film layers, and corresponding in the consistent at least hole of the position of this potential pattern formation, and it runs through this thick film layers.
23, reverse development method as claimed in claim 22 is characterized in that, the material of this substrate is selected from a kind of material in the group that is made up of silicon, glass, metal and macromolecular material.
24, reverse development method as claimed in claim 22 is characterized in that, the mode that removes this substrate of part comprises that photolithography etching, laser drill, sandblast and ultrasonic wave grind one of them.
25, reverse development method as claimed in claim 22 is characterized in that, the material of this thick film layers is selected from a kind of material in the group that is made up of dry film photoresistance, positive photoresistance, negative photoresistance, sensing optical activity polyimide and sensing optical activity epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01136109 CN1408552A (en) | 2001-09-29 | 2001-09-29 | Hot foam type ink jet printing head and its backword developing method of jet board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01136109 CN1408552A (en) | 2001-09-29 | 2001-09-29 | Hot foam type ink jet printing head and its backword developing method of jet board |
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| CN1408552A true CN1408552A (en) | 2003-04-09 |
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| CN 01136109 Pending CN1408552A (en) | 2001-09-29 | 2001-09-29 | Hot foam type ink jet printing head and its backword developing method of jet board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1311973C (en) * | 2003-09-22 | 2007-04-25 | 飞赫科技股份有限公司 | Heat bubble type ink jet printing head and manufacturing procedure |
| US7322668B2 (en) | 2004-06-17 | 2008-01-29 | Samsung Electronics Co., Ltd. | Inkjet head and methods of fabricating and exchanging the same |
| CN100421942C (en) * | 2003-06-11 | 2008-10-01 | 索尼株式会社 | Liquid ejector and liquid ejecting method |
| CN101444994B (en) * | 2007-11-30 | 2011-04-20 | 佳能株式会社 | Inkjet printing head and inkjet printing apparatus |
| CN110239218A (en) * | 2019-07-08 | 2019-09-17 | 华天科技（昆山）电子有限公司 | A kind of inkjet printhead chip encapsulating structure and preparation method thereof |
| CN110914063A (en) * | 2017-07-12 | 2020-03-24 | 迈康尼股份公司 | Jet device with acoustic transducer and control method thereof |
| CN113059913A (en) * | 2021-03-25 | 2021-07-02 | 苏州印科杰特半导体科技有限公司 | Design structure for preventing ink breaking and damage of thermal bubble type spray head |
-
2001
- 2001-09-29 CN CN 01136109 patent/CN1408552A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100421942C (en) * | 2003-06-11 | 2008-10-01 | 索尼株式会社 | Liquid ejector and liquid ejecting method |
| CN1311973C (en) * | 2003-09-22 | 2007-04-25 | 飞赫科技股份有限公司 | Heat bubble type ink jet printing head and manufacturing procedure |
| US7322668B2 (en) | 2004-06-17 | 2008-01-29 | Samsung Electronics Co., Ltd. | Inkjet head and methods of fabricating and exchanging the same |
| CN100457459C (en) * | 2004-06-17 | 2009-02-04 | 三星电子株式会社 | Inkjet head and methods of fabricating and exchanging the same |
| CN101444994B (en) * | 2007-11-30 | 2011-04-20 | 佳能株式会社 | Inkjet printing head and inkjet printing apparatus |
| CN110914063A (en) * | 2017-07-12 | 2020-03-24 | 迈康尼股份公司 | Jet device with acoustic transducer and control method thereof |
| CN110239218A (en) * | 2019-07-08 | 2019-09-17 | 华天科技（昆山）电子有限公司 | A kind of inkjet printhead chip encapsulating structure and preparation method thereof |
| CN113059913A (en) * | 2021-03-25 | 2021-07-02 | 苏州印科杰特半导体科技有限公司 | Design structure for preventing ink breaking and damage of thermal bubble type spray head |
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