CN110239218A - A kind of inkjet printhead chip encapsulating structure and preparation method thereof - Google Patents
A kind of inkjet printhead chip encapsulating structure and preparation method thereof Download PDFInfo
- Publication number
- CN110239218A CN110239218A CN201910609526.2A CN201910609526A CN110239218A CN 110239218 A CN110239218 A CN 110239218A CN 201910609526 A CN201910609526 A CN 201910609526A CN 110239218 A CN110239218 A CN 110239218A
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- Prior art keywords
- polymer film
- opening
- thin polymer
- substrate
- layer
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- 238000002360 preparation method Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 229920006254 polymer film Polymers 0.000 claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 claims abstract description 38
- 239000012530 fluid Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims description 40
- 239000010408 film Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000206 photolithography Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention discloses a kind of inkjet printhead chip encapsulating structures, including multiple chip units, each chip unit includes substrate, first layer thin polymer film and second layer thin polymer film, substrate has front and back, substrate is equipped with through-hole, the front of substrate is equipped with metallic circuit, first layer thin polymer film is pressed together on the front of the substrate, second layer thin polymer film is pressed together on first layer thin polymer film, first layer thin polymer film is equipped with the first opening, second layer thin polymer film is equipped with the second opening, the through-hole of substrate, the first opening conducting corresponding with the second opening of second layer thin polymer film of first layer thin polymer film, to form fluid channel.The invention also discloses a kind of production methods of inkjet printhead chip encapsulating structure.The inkjet mouth in inkjet printhead chip encapsulating structure that the present invention makes will not collapse, and Aperture precision is high, and the low manufacture cost of the encapsulating structure, and the yields of product is high, and mass production may be implemented in production.
Description
Technical field
The present invention relates to chip encapsulation technology field, in particular to a kind of inkjet printhead chip encapsulating structure and its production
Method.
Background technique
Printer has become the required auxiliary device of computer.Ink-jet printer is because having high-resolution, color output effect
The advantages that excellent, consumptive material replacement is conveniently, moderate and maintenance is easy, is always the mainstream of printer market；Printer is beaten
The quality of printing matter, inkjet print head accounts for critically important factor, and most important element is exactly chip in inkjet print head, core
The manufacture quality quality of piece will determine the print quality of inkjet print head.The production of inkjet printhead chip can apply semiconductor
Encapsulation technology.In existing inkjet printhead chip structure, inkjet mouth is easy to collapse, and manufacture difficulty is big, and yields is low, is fabricated to
This height, and the precision of product is not ideal enough.
Summary of the invention
In order to solve the above technical problems, the purpose of the present invention is to provide a kind of inkjet printhead chip encapsulating structure and its
Production method, the inkjet mouth in the inkjet printhead chip encapsulating structure of production will not collapse, and Aperture precision is high, and the encapsulation knot
The yields of the low manufacture cost of structure, product is high, and mass production may be implemented in production.
To realize above-mentioned technical purpose and the technique effect, the invention is realized by the following technical scheme: a kind of spray
Black print head chip encapsulating structure, including pass through multiple chip units made of cutting, have between two neighboring chip unit
The scribe line formed is cut, each chip unit includes substrate, first layer thin polymer film and second layer thin polymer film, described
Substrate has front and back, and substrate is equipped with through-hole, and the front of substrate is equipped with metallic circuit, the first layer polymer thin
Film is pressed together on the front of the substrate, and the second layer thin polymer film is pressed together on the first layer thin polymer film, the
One layer of polymeric film is equipped with the first opening corresponding with the lead to the hole site of substrate, and second layer thin polymer film is equipped with and the
The position corresponding second of first opening of one layer of polymeric film is open, and the first opening on first layer thin polymer film is formed
First layer opening figure structure on substrate, the second opening on second layer thin polymer film form the opening of the second layer on substrate
Graphic structure, the second opening pair of the through-hole of substrate, the first opening of first layer thin polymer film and second layer thin polymer film
It should be connected, to form fluid channel.
Further, the structure of first opening and the structure of the second opening are hole, slot or combinations thereof.
Further, the first layer thin polymer film and second layer thin polymer film be can photolithography thin film.
The present invention also provides a kind of production methods of inkjet printhead chip encapsulating structure, include the following steps:
(1) preparation one includes the entire substrate of several chip units, which has front and back, whole
The front of plate base is provided with metallic circuit；
(2) one layer of surface pattern structure with multiple openings is formed on the front of above entire substrate, in the table
Prepare metal column in the opening of face graphic structure, metal stud removes the surface pattern structure of the entire substrate at rear；
(3) in the front pressing first layer thin polymer film of the entire substrate with metal column, pass through exposure, developing process
Metal column is exposed, and forms the first layer opening figure structure with the first opening on first layer thin polymer film；
(4) in one layer photoresist of front coating by step (3) treated entire substrate, by expose, develop with
And etching technics etches required through-hole on entire substrate, first opening pair of the through-hole and first layer thin polymer film
It should be connected；
(5) the second layers of polymer is pressed on by the first layer thin polymer film on step (4) treated entire substrate
Object film, metal column can be supported second layer thin polymer film, by exposure, developing process in second layer polymer thin
The second layer opening figure structure with the second opening is formed on film, after second layer opening figure structure is formed, metal column is again
It is exposed；
(6) metal column on entire substrate is removed by etching technics, so that through-hole, first layer on entire substrate
The first opening in opening figure structure and the second opening conducting in second layer opening figure structure, it is logical to form fluid
Road；
(7) step (6) is cut through treated entire substrate, form single substrate and comprising the single of single substrate
Chip unit.
Further, the etching technics in step (4) is dry etch process.
Further, the etching technics in step (6) is wet-etching technology.
Further, first layer thin polymer film is pressed by the way of vacuum film pressing.
Further, first layer thin polymer film is pressed by the way of idler wheel pad pasting.
Further, in step (2), metal column is prepared on the surface of the Cutting Road position of corresponding entire substrate.
Further, substrate is additionally provided in the bottom of metal column.
The beneficial effects of the present invention are: the production method of inkjet printhead chip encapsulating structure of the invention is in pressing first
Before one polymer film and second layer thin polymer film, first metal column is set on substrate, then gradually presses first layer again
Thin polymer film and second layer thin polymer film, and first layer opening figure structure and the second layer are formed by exposure development technique
Opening figure structure, and by the through-hole structure of exposure, development and etching technics formation substrate, it will finally by etching technics
Metal column removal, to realize the first opening, the second opening of second layer thin polymer film and substrate of first layer thin polymer film
Through-hole conducting, to form fluid channel.The present invention on substrate by making metal column, so that pressing the second one polymer
When film, metal column can form support, prevent second layer thin polymer film from collapsing or being broken, so that manufacturing process is easier,
Improve producing efficiency and yields.In the encapsulating structure for the inkjet printhead chip that the present invention makes, first layer polymer thin
Support cooperation mutually, the first layer opening figure structure of first layer thin polymer film, the between film and second layer thin polymer film
The second layer opening figure structure of two layers of polymer object film and the through-hole structure of substrate cooperate, and form inkjet printhead chip
Fluid channel, the inkjet mouth of fluid channel will not stay, and ink jet precision is high.Inkjet printhead chip encapsulating structure of the invention
Low manufacture cost, product yield is high, and mass production may be implemented in production.
Detailed description of the invention
Fig. 1 is the schematic diagram of inkjet printhead chip encapsulating structure of the invention.
Fig. 2 is the entire substrate production in the production method of inkjet printhead chip encapsulating structure of the present invention after step (2)
There is the structural schematic diagram of metal column.
Fig. 3 is that the pressing in the production method of inkjet printhead chip encapsulating structure of the present invention after step (3) has first layer
The structural schematic diagram of the entire substrate of thin polymer film.
Fig. 4 is to etch through-hole after step (4) in the production method of inkjet printhead chip encapsulating structure of the present invention
The structural schematic diagram of entire substrate.
Fig. 5 is that the pressing in the production method of inkjet printhead chip encapsulating structure of the present invention after step (5) has the second layer
The structural schematic diagram of the entire substrate of thin polymer film.
After Fig. 6 is the removal metal column after step (6) in the production method of inkjet printhead chip encapsulating structure of the present invention
Entire substrate structural schematic diagram.
Specific embodiment
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
As shown in Figure 1, a kind of inkjet printhead chip encapsulating structure, including pass through multiple chip units made of cutting,
The scribe line 16 that between two neighboring chip unit there is cutting to be formed, each chip unit includes substrate 11, the first layers of polymer
Object film 13 and second layer thin polymer film 14, first layer thin polymer film 13 and second layer thin polymer film 14 are can photoetching
Film.The substrate 11 has front and back, and substrate 11 is equipped with through-hole 15, and the front of substrate 11 is equipped with metallic circuit
12, the first layer thin polymer film 13 is pressed together on the front of the substrate 11, and the second layer thin polymer film 14 presses
On the first layer thin polymer film 13, first layer thin polymer film 13 is equipped with corresponding with the lead to the hole site of substrate 11 the
One opening, second layer thin polymer film 14 are equipped with and the position corresponding second of the first opening of first layer thin polymer film 13
It is open, the first opening on first layer thin polymer film 13 forms the first layer opening figure structure on substrate 11, the second strata
Close the second layer opening figure structure that the second opening on object film 14 is formed on substrate 11, through-hole 15, the first layer of substrate 11
The first opening conducting corresponding with the second opening of second layer thin polymer film 14 of thin polymer film 13, to form fluid channel.
Further, the structure of first opening and the structure of the second opening are hole, slot or combinations thereof.
The present invention also provides a kind of production methods of inkjet printhead chip encapsulating structure, include the following steps:
(1) preparation one includes the entire substrate 1 of several chip units, which has front and back,
The front of entire substrate 1 is provided with metallic circuit 12；
(2) as shown in Fig. 2, forming one layer of surfacial pattern with multiple openings on the front of above entire substrate 1
Structure；Specifically, the forming process of the surface pattern structure can pass through photoetching process to coat photoresist on entire substrate
To be formed；Median opening layout in the surface pattern structure and the median opening layout phase on the required second layer thin polymer film being bonded
Together, while on the surface pattern structure of the position to be cut (Cutting Road position) of corresponding entire substrate it is also provided with opening, at this
The metal column 17 of certain altitude is prepared in the opening of surface pattern structure, is also made on the surface of the cutting position of corresponding entire substrate
Standby metal column, while being additionally provided with substrate after metal column 17 is formed in the bottom of metal column 17 and removing the table of the entire substrate 1
Face graphic structure；In each chip unit, part of the entire substrate between two neighboring metal column is to need to open hole
Position；
(3) as shown in figure 3, in the front pressing the of the entire substrate 1 with metal column 17 by the way of vacuum film pressing
One layer of polymeric film 13, according to the opening cloth of the first layer opening figure structure on required first layer thin polymer film 13
Metal column 17 is exposed by exposure, developing process for office, and being formed on first layer thin polymer film 13 has first to open
The first layer opening figure structure of mouth 131, the structure of first opening 131 are hole, slot or combinations thereof；
(4) as shown in figure 4, passing through in one layer photoresist of front coating by step (3) treated entire substrate 1
The position that exposure, developing process make entire substrate need to open hole is exposed, then by dry etch process in full wafer base
Through-hole 15 required for being etched on plate 1, the through-hole 15 conducting corresponding with the first opening 131 of first layer thin polymer film 13；
(5) as shown in figure 5, by first on step (4) treated entire substrate 1 by the way of idler wheel pad pasting
Second layer thin polymer film 14 is pressed on one polymer film 13, the height of metal column 17 is slightly above first layer thin polymer film
13, metal column 17 can be supported second layer thin polymer film 14, by exposure, developing process in second layer polymer thin
The second layer opening figure structure with the second opening 141, after second layer opening figure structure is formed, metal column are formed on film 14
17 are exposed again, and the structure of second opening 141 is hole, slot or combinations thereof；
(6) as shown in fig. 6, by wet-etching technology (specific for using acid medical fluid corroded) by entire substrate
Metal column 17 on 1 removes, and substrate can protect entire substrate and metallic circuit from corroding, and makes after removal metal column 17 whole
In the first opening 131 and second layer opening figure structure in through-hole 15, first layer opening figure structure on plate base
Second opening, 141 conducting, to form fluid channel；
(7) as shown in Figure 1, the Cutting Road on entire substrate cuts through step (6), treated entire substrate 1, shape
One single chip unit at single substrate 11 and comprising single substrate 11.
Compared with prior art, the production method of inkjet printhead chip encapsulating structure of the invention, in pressing first layer
Before thin polymer film 13 and second layer thin polymer film 14, first metal column is set on substrate, then gradually presses first again
One polymer film 13 and second layer thin polymer film 14, and by exposure development technique formed first layer opening figure structure and
Second layer opening figure structure forms the through-hole structure of substrate further through exposure, development and etching technics, finally by etching
Technique removes metal column, to realize the first opening of first layer thin polymer film, the second opening of second layer thin polymer film
It is connected with the through-hole of substrate, to form fluid channel.The present invention on substrate by making metal column, so that in the pressing second layer
When thin polymer film, metal column can form support, prevent second layer thin polymer film from collapsing or being broken, so that manufacturing process is more
It is easy, improves producing efficiency and product yield.In the encapsulating structure for the inkjet printhead chip that the present invention makes, first layer
Support cooperation mutually, the first layer opening figure of first layer thin polymer film between thin polymer film and second layer thin polymer film
The through-hole structure of structure, the second layer opening figure structure of second layer thin polymer film and substrate cooperates, and forms ink-jet and beats
The inkjet mouth of the fluid channel of printing head chip, fluid channel will not stay, and ink jet precision is high.Inkjet printhead chip of the invention
Low manufacture cost, product yield is high, and mass production may be implemented in production.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of inkjet printhead chip encapsulating structure, it is characterised in that: including passing through multiple chip units made of cutting, phase
The scribe line that between adjacent two chip units there is cutting to be formed, each chip unit includes substrate, first layer thin polymer film
With second layer thin polymer film, the substrate has front and back, and substrate is equipped with through-hole, and the front of substrate is equipped with metal
Route, the first layer thin polymer film are pressed together on the front of the substrate, and the second layer thin polymer film is pressed together on institute
It states on first layer thin polymer film, first layer thin polymer film is equipped with the first opening corresponding with the lead to the hole site of substrate, the
Two layers of polymer object film is equipped with the second opening corresponding with the position of the first opening of first layer thin polymer film, the first strata
The first layer opening figure structure that the first opening on object film is formed on substrate is closed, second on second layer thin polymer film opens
Second layer opening figure structure on mouthful formation substrate, the first opening and second of the through-hole of substrate, first layer thin polymer film
The corresponding conducting of the second opening of one polymer film, to form fluid channel.
2. a kind of inkjet printhead chip encapsulating structure according to claim 1, it is characterised in that: first opening
The structure of structure and the second opening is hole, slot or combinations thereof.
3. a kind of inkjet printhead chip encapsulating structure according to claim 1, it is characterised in that: first layers of polymer
Object film and second layer thin polymer film are can photolithography thin film.
4. a kind of production method of inkjet printhead chip encapsulating structure as described in any one of claims 1 to 3, feature exist
In including the following steps:
(1) preparation one includes the entire substrate of several chip units, which has front and back, full wafer base
The front of plate is provided with metallic circuit；
(2) one layer of surface pattern structure with multiple openings is formed on the front of above entire substrate, in the exterior view
Prepare metal column in the opening of shape structure, metal stud removes the surface pattern structure of the entire substrate at rear；
(3) with metal column entire substrate front pressing first layer thin polymer film, by exposure, developing process will be golden
Belong to column to be exposed, and forms the first layer opening figure structure with the first opening on first layer thin polymer film；
(4) in one layer photoresist of front coating by step (3) treated entire substrate, pass through exposure, development and quarter
Etching technique etches required through-hole on entire substrate, and the through-hole is corresponding with the first opening of first layer thin polymer film to lead
It is logical；
(5) second layer polymer thin is pressed on by the first layer thin polymer film on step (4) treated entire substrate
Film, metal column can be supported second layer thin polymer film, through exposure, developing process on second layer thin polymer film
The second layer opening figure structure with the second opening is formed, after second layer opening figure structure is formed, metal column is sudden and violent again
Expose；
(6) metal column on entire substrate is removed by etching technics, so that through-hole, first layer opening on entire substrate
The first opening in graphic structure and the second opening conducting in second layer opening figure structure, to form fluid channel；
(7) step (6) is cut through treated entire substrate, form single substrate and the one single chip comprising single substrate
Unit.
5. a kind of production method of inkjet printhead chip encapsulating structure according to claim 4, it is characterised in that: in step
Suddenly the etching technics in (4) is dry etch process.
6. a kind of production method of inkjet printhead chip encapsulating structure according to claim 4, it is characterised in that: in step
Suddenly the etching technics in (6) is wet-etching technology.
7. a kind of production method of inkjet printhead chip encapsulating structure according to claim 4, it is characterised in that: use
The mode of vacuum film pressing presses first layer thin polymer film.
8. a kind of production method of inkjet printhead chip encapsulating structure according to claim 4, it is characterised in that: use
The mode of idler wheel pad pasting presses second layer thin polymer film.
9. a kind of production method of inkjet printhead chip encapsulating structure according to claim 4, it is characterised in that: in step
Suddenly in (2), metal column is prepared on the surface of the Cutting Road position of corresponding entire substrate.
10. a kind of production method of inkjet printhead chip encapsulating structure according to claim 4, it is characterised in that:
The bottom of metal column is additionally provided with substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910609526.2A CN110239218A (en) | 2019-07-08 | 2019-07-08 | A kind of inkjet printhead chip encapsulating structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910609526.2A CN110239218A (en) | 2019-07-08 | 2019-07-08 | A kind of inkjet printhead chip encapsulating structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110239218A true CN110239218A (en) | 2019-09-17 |
Family
ID=67891334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910609526.2A Pending CN110239218A (en) | 2019-07-08 | 2019-07-08 | A kind of inkjet printhead chip encapsulating structure and preparation method thereof |
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| CN (1) | CN110239218A (en) |
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-
2019
- 2019-07-08 CN CN201910609526.2A patent/CN110239218A/en active Pending
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