TWI232808B - Thermal bubble inkjet print head and process thereof - Google Patents
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1232808 五、發明說明（1) 【發明所屬之技術領域】 本發明是有關於一種喷墨印頭（i n k j e t p r i n t h e a d )，且特別是有關於一種熱泡式（t h e r m a 1 b u b b 1 e )喷墨 印頭及其製程。 【先前技術】 近年來在高科技產業的帶動發展之下，所有電子相關 產業無不突飛猛進。就印表機而言，在短短幾年的時間之 内，列印技術已經從早期的撞針式列印及單色雷射列印， 一直進步到目前的彩色喷墨列印及彩色雷射列印，甚至出 現熱轉印列印等列印技術。然而，就常見之喷墨印表機而 言，目前出現在市面上的喷墨印表機所應用之列印技術不 外乎熱泡式（thermal bubble)或壓電式 · (piezoelectric )的喷墨技術，用以將墨水乾擊至記錄 媒介，例如紙張等，因而形成文字或圖案於記錄媒介之表 、 面。其中，氣泡式之列印技術乃是利用加熱元件（h e a t e r )將墨水瞬間氣化，因而產生高壓氣泡來推動墨水，再將 墨水經由喷孔射出而形成墨滴（d r ο p 1 e t )。此外，壓電 _ 式之列印技術乃是利用一因施加電壓而產生形變的壓電材 料(piezoelectric material )來製作驅動器（actuator )，故可施加電壓至驅動器來擠壓位於墨水腔（i n k chamber )内的墨水，再將墨水經由喷孔射出而形成墨 滴。 〇 就熱泡式喷墨技術而言，供墨方式大致有中央進給 (central feed)及邊緣進給（edge feed)兩種。首1232808 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an inkjet printhead, and particularly to a thermal bubble type (therma 1 bubb 1 e) inkjet print head and Its process. [Previous technology] In recent years, driven by the development of high-tech industries, all electronics-related industries have made rapid progress. As far as printers are concerned, in just a few years, the printing technology has progressed from the early striker printing and monochrome laser printing to the current color inkjet printing and color laser. Printing, and even printing technologies such as thermal transfer printing. However, in terms of common inkjet printers, the inkjet printers currently appearing on the market use printing technology other than thermal bubble or piezoelectric (piezoelectric) inkjet printers. Ink technology is used to dry the ink to the recording medium, such as paper, so as to form characters or patterns on the surface and surface of the recording medium. Among them, the bubble-type printing technology uses a heating element (h e a t e r) to instantaneously vaporize the ink, thereby generating high-pressure air bubbles to push the ink, and then ejecting the ink through a nozzle to form an ink droplet (d r ο p 1 e t). In addition, the piezoelectric printing method uses a piezoelectric material (piezoelectric material) that is deformed by applying a voltage to make an actuator. Therefore, a voltage can be applied to the driver to squeeze the ink chamber. ), And the ink is ejected through a nozzle to form an ink droplet. 〇 In terms of thermal bubble inkjet technology, there are roughly two types of ink supply methods: central feed and edge feed. first
10982rwf.ptd 第6頁 1232808 五、發明說明（2) 先，中央進給之供墨方式乃是鑿穿喷墨晶片之中央部分， 用以形成一狹長狀之墨水入口 （ i n k s 1 〇 t )，故可依序經 由育墨晶片之中央的墨水入口 ，以及經由墨腔層 (chamber layer )所形成之墨水流道（ink channel)， 而將墨水供應至噴墨晶片之表面的加熱元件。此外，邊緣 進給之供墨方式乃是將墨腔層所形成的墨水流道向外延伸 至喷墨晶片之邊緣，故可經由墨腔層之墨水流道，將墨水 直接供應至喷墨晶片之表面的加熱元件其上方。 請參考第1圖，其繪示習知之一種邊緣進給式供墨之 熱泡式喷墨印頭的剖面示意圖。熱泡式噴墨印頭1 0 0主要 包括喷墨晶片11 0 、墨腔層1 2 0及喷孔片1 3 0。首先，喷墨·· 晶片1 1 〇具有多個加熱元件1 1 2 ，其配置於喷墨晶片1 1 0之 . 表面1 1 0 a。此外，墨腔層1 2 0亦配置於喷墨晶片1 1 0之表面 1 1 0 a，並形成多個墨水流道1 2 2，其中這些墨水流道1 2 2之 · 一端係分別暴露出這些加熱元件1 1 2，而這些墨水流道1 2 2 之另一端則分別延伸至墨腔層1 2 0之側面。再者，喷孔片 1 3 0係堆疊於墨腔層1 2 0之上，並具有多個喷孔1 3 2，其貫 -穿喷孔片1 3 0，且這些噴孔1 3 2之位置係分別對應於這些加 熱元件1 1 2之位置，並利用喷孔片1 3 0之外緣部分直接裝配 至墨水匣1 0之供墨口 1 2。因此，墨水可沿著流動方向1 4， 從喷墨晶片1 1 0之側緣的墨水流道1 2 2，而流到加熱元件 1 1 2之上，並經由加熱元件1 1 2將墨水瞬間氣化後所產生的ψ 高壓氣泡來推動墨水，因而將墨水經由噴孔1 3 2射出而形 成墨滴（d r ο p 1 e t )。10982rwf.ptd Page 6 1232808 V. Description of the invention (2) First, the central feeding method is to cut through the central part of the inkjet wafer to form a narrow ink inlet (inks 1 〇t), Therefore, the ink can be sequentially supplied to the heating element on the surface of the inkjet wafer through the ink inlet in the center of the inkjet wafer and the ink channel formed by the ink chamber layer. In addition, the ink supply method of edge feeding is to extend the ink flow channel formed by the ink cavity layer to the edge of the inkjet wafer, so the ink can be directly supplied to the inkjet wafer through the ink flow channel of the ink cavity layer. The heating element on the surface is above it. Please refer to FIG. 1, which is a schematic cross-sectional view of a conventional thermal inkjet print head of edge feed ink supply. The thermal bubble inkjet print head 100 mainly includes an inkjet wafer 110, an ink cavity layer 120, and an orifice plate 130. First, the inkjet wafer 1 10 has a plurality of heating elements 1 12, which are arranged on the surface 1 1 0 a of the inkjet wafer 1 10. In addition, the ink chamber layer 1 2 0 is also disposed on the surface 1 1 0 a of the inkjet wafer 1 10 and forms a plurality of ink flow channels 1 2 2, in which one end of the ink flow channels 1 2 2 is respectively exposed. The heating elements 1 1 2 and the other ends of the ink flow channels 1 2 2 respectively extend to the sides of the ink cavity layer 1 2 0. Furthermore, the nozzle hole sheet 130 is stacked on the ink cavity layer 120 and has a plurality of nozzle holes 1 32, which penetrates through the nozzle sheet 1 3 0, and these nozzle holes 1 3 2 The positions correspond to the positions of these heating elements 1 12 respectively, and are directly assembled to the ink supply port 12 of the ink cartridge 10 by using the outer edge part of the nozzle hole sheet 130. Therefore, the ink can flow along the flow direction 14 from the ink flow path 1 2 2 on the side edge of the inkjet wafer 1 10 to the heating element 1 1 2 and instantly transfer the ink through the heating element 1 1 2 The ψ high-pressure bubble generated after gasification pushes the ink, so the ink is ejected through the nozzle holes 1 3 2 to form ink droplets (dr ο p 1 et).
10982twf.ptd 第7頁 1232808 五、發明說明（3) 承上所述，由於喷孔片1 3 0之材質係採用高分子化合 物(macromolecular compounds )，並利用雷射鑽孑L (laser drilling )的方式，例如準分子雷射（excimer laser)或紀在呂石權石雷射（YAG laser)，將這些喷孑L 1 3 2精準地形成於喷孔片1 3 0上，接著再將喷孔片1 3 0準確 地接合至墨腔層1 2 0，並使喷孔1 3 2之位置將可分別對應於 加熱元件1 1 2之位置。然而，由於利用雷射鑽孔之方式來 形成這些喷孔1 3 2於噴孔片1 3 0上的成本較高，同時必須採 用較為精確之對位接合的技術及設備，才能將喷墨晶片 1 1 0及墨腔層1 2 0準確地接合至喷孔片1 3 0上，如此將無法 有效降低喷墨印頭1 0 0之製作成本。 & 【發明内容】 . 有鑑於此，本發明之目的就是在提供一種熱泡式噴墨 印頭及其製程，用以降低熱泡式喷墨印頭之製作成本。 · 為達本發明之上述目的，本發明提出一種熱泡式喷墨 印頭，適用於裝配至一墨水S之一供墨口，此熱泡式嘴墨 印頭具有一喷墨晶片、一墨腔層、一喷孔片及一覆蓋片。 · 首先，噴墨晶片具有一表面及多個加熱元件，其中這些加 熱元件係配置於喷墨晶片之上述表面。此外，墨腔層係堆 疊於喷墨晶片之上述表面，並具有多個墨水流道，且這些 墨水流道之一端係分別暴露出這些加熱元件，而這些墨水 流道之另一端則分別延伸至墨腔層之側面。另外，喷孔片ο 係堆疊於墨腔層之上，並具有多個喷孔，其貫穿噴孔片， 且這些喷孔之位置係分別對應於這些加熱元件之位置。再10982twf.ptd Page 7 1232808 V. Description of the invention (3) As mentioned above, the material of the nozzle plate 130 is made of macromolecular compounds, and the laser drilling cymbal L (laser drilling) is used. Method, such as an excimer laser or a YAG laser, these jets L 1 3 2 are precisely formed on the nozzle plate 1 3 0, and then the nozzle plate 1 30 is accurately connected to the ink cavity layer 120, and the positions of the nozzle holes 1 32 can correspond to the positions of the heating elements 1 12 respectively. However, the cost of forming these nozzle holes 1 3 2 on the nozzle plate 1 30 is higher by using laser drilling. At the same time, more accurate alignment and bonding technology and equipment must be used to transfer the inkjet wafers. 1 10 and the ink cavity layer 120 are accurately bonded to the nozzle plate 130, so that the manufacturing cost of the inkjet print head 100 cannot be effectively reduced. In view of this, the object of the present invention is to provide a thermal bubble inkjet print head and a process for reducing the manufacturing cost of the thermal bubble inkjet print head. In order to achieve the above object of the present invention, the present invention proposes a thermal bubble inkjet print head, which is suitable for assembling to an ink supply port of an ink S. The thermal bubble nozzle ink print head has an inkjet chip, an ink Cavity layer, a spray hole sheet and a cover sheet. · First, the inkjet wafer has a surface and a plurality of heating elements, wherein these heating elements are arranged on the above surface of the inkjet wafer. In addition, the ink cavity layer is stacked on the above surface of the inkjet wafer and has a plurality of ink flow channels, and one end of the ink flow channels respectively exposes the heating elements, and the other ends of the ink flow channels extend to The side of the ink cavity layer. In addition, the nozzle holes ο are stacked on the ink cavity layer and have a plurality of nozzle holes, which penetrate the nozzle holes, and the positions of the nozzle holes respectively correspond to the positions of the heating elements. again
10982twf.ptd 第8頁 1232808 五、發明說明（4) 者，覆蓋片係堆疊於噴孔片之上，並具有至少一開口 ，其 貫穿覆蓋片，且暴露出至少一喷孔，而覆蓋片之外緣係適 於裝配至墨水匣之供墨口。 為達本發明之上述目的，本發明更提出一種熱泡式喷 墨印頭之製程。首先，提供一喷墨晶片及一墨腔層，其中 喷墨晶片具有一表面及多個加熱元件，而這些加熱元件係 配置於喷墨晶片之上述表面，且墨腔層係堆疊於喷墨晶片 之上述表面，而墨腔層具有多個墨水流道，且這些墨水流 道之一端係分別暴露出這些加熱元件，而這些墨水流道之 另一端則分別延伸至墨腔層之側面。接著，堆疊一喷孔片 於墨腔層之上。之後，形成多個喷孔於喷孔片上，其中這 些喷孔之位置係分別對應於這些加熱元件之位置。然後， . 堆疊一覆蓋片於喷孔片之上，其中覆蓋片具有至少一開 口，其貫穿覆蓋片，並暴露出至少一喷孔。 ' 基於上述，本發明乃是先將一喷孔片堆疊於一位於喷 墨晶片之表面的墨腔層之上，再形成多個喷孔於喷孔片 上，故可省略習知之π將一已形成喷孔之喷孔片精確地對 位接合至墨腔層”的步驟。此外，本發明更利用一覆蓋片 作為喷孔片與墨水匣之供墨口的連接介面，且覆蓋片不須 精確地對位接合至喷孔片，故與’’喷孔片之精確對位接合 至墨腔層的製作成本”相較之下，額外增加之覆蓋片其所 衍生的製作成本仍相對較低。因此，本發明將可有效地降ψ 低此熱泡式喷墨印頭之整體的製作成本。 為讓本發明之上述目的、特徵和優點能更明顯易懂，10982twf.ptd Page 8 1232808 V. Description of the invention (4) The cover sheet is stacked on the nozzle plate and has at least one opening that penetrates the cover sheet and exposes at least one nozzle hole. The outer edge is suitable for fitting to the ink supply port of the ink cartridge. In order to achieve the above-mentioned object of the present invention, the present invention further provides a process for manufacturing a thermal ink jet print head. First, an inkjet wafer and an ink cavity layer are provided. The inkjet wafer has a surface and a plurality of heating elements. The heating elements are arranged on the above surface of the inkjet wafer, and the ink cavity layer is stacked on the inkjet wafer. On the above surface, the ink cavity layer has a plurality of ink flow channels, and one end of the ink flow channels respectively exposes the heating elements, and the other ends of the ink flow channels respectively extend to the sides of the ink cavity layer. Then, a nozzle plate is stacked on the ink cavity layer. After that, a plurality of spray holes are formed on the spray hole sheet, and the positions of the spray holes respectively correspond to the positions of the heating elements. Then, a cover sheet is stacked on the spray hole sheet, wherein the cover sheet has at least one opening that penetrates the cover sheet and exposes at least one spray hole. '' Based on the above, the present invention is to first stack an orifice plate on an ink cavity layer on the surface of an inkjet wafer, and then form a plurality of orifices on the orifice plate, so the conventional π can be omitted. The step of forming the nozzle hole to precisely join the ink cavity layer in position. In addition, the present invention further uses a cover sheet as the connection interface between the nozzle hole sheet and the ink supply port of the ink cartridge, and the cover sheet does not need to be precise The ground alignment is connected to the nozzle plate, so compared with "the manufacturing cost of the precise alignment of the nozzle plate to the ink cavity layer", the additional manufacturing cost of the additional cover sheet is still relatively low. Therefore, the present invention can effectively reduce the overall manufacturing cost of the thermal inkjet print head. In order to make the aforementioned objects, features, and advantages of the present invention more comprehensible,
10982twf.ptd 第9頁 1232808 五、發明說明（5) 下文特舉一較佳實施例，並配合所附圖式，作詳細說明如 下： 【實施方式】 請參考第2圖，其繪示本發明之較佳實施例之熱泡式 喷墨印頭的剖面示意圖。熱泡式喷墨印頭2 0 0主要包括喷 墨晶片2 1 0 、墨腔層2 2 0 、噴孔片2 3 0及覆蓋片2 4 0 。首先， 喷墨晶片2 1 0具有多個加熱元件2 1 2，其配置於喷墨晶片 2 1 0之表面2 1 0 a，例如是配置於喷墨晶片2 1 0之表面2 1 0 a的 側緣。此外，墨腔層2 2 0亦配置於喷墨晶片2 1 0之表面 2 1 0 a，並形成多個墨水流道2 2 2，其中這些墨水流道2 2 2之 一端係分別暴露出這些加熱元件2 1 2，而這些墨水流道2 2 2 之另一端則分別延伸至墨腔層2 2 0之側面。另夕卜，喷孔片 . 230係堆疊於墨腔層220之上，並具有多個喷孔232，其貫 穿喷孔片2 3 0，且這些喷孔2 3 2之位置係分別對應於這些加 · 熱元件2 1 2之位置。再者，覆蓋片24 0係堆疊於喷孔片2 3 0 之上，並具有至少一開口242 ，其貫穿覆蓋片240 ，且暴露 ’ 出這些喷孔2 3 2 ，而覆蓋片2 4 0之外緣係適於裝配至墨水匣 2 〇之供墨口 2 2。因此，墨水可沿著流動方向2 4，從喷墨晶 片2 1 0之側緣的墨水流道2 2 2，而流到加熱元件2 1 2之上， 並經由加熱元件2 1 2將墨水瞬間氣化所產生的高壓氣泡來 推動墨水，因而將墨水經由喷孔2 3 2射出而形成墨滴。 為了詳細說明本發明之較佳實施例之熱泡式喷墨印頭ψ 的製程，請依序參考第3A〜3D圖及下文，其中第3A〜3D圖 繪示本發明之較佳實施例之熱泡式喷墨印頭製程的剖面10982twf.ptd Page 9 1232808 V. Description of the invention (5) The following is a detailed description of a preferred embodiment and the accompanying drawings, as follows: [Embodiment] Please refer to FIG. 2, which illustrates the present invention A schematic sectional view of a thermal bubble inkjet print head of a preferred embodiment. The thermal bubble inkjet print head 200 mainly includes an inkjet wafer 2 1 0, an ink cavity layer 2 2 0, a nozzle hole sheet 2 3 0 and a cover sheet 2 4 0. First, the inkjet wafer 2 10 has a plurality of heating elements 2 1 2, which are arranged on the surface 2 1 0 a of the inkjet wafer 2 1 0, for example, are arranged on the surface 2 1 0 a of the inkjet wafer 2 1 0 Side edge. In addition, the ink cavity layer 2 2 0 is also disposed on the surface 2 1 0 a of the inkjet wafer 2 10 and forms a plurality of ink flow channels 2 2 2, wherein one end of these ink flow channels 2 2 2 respectively exposes these The heating element 2 1 2, and the other ends of the ink flow channels 2 2 2 respectively extend to the sides of the ink cavity layer 2 2 0. In addition, the nozzle plate 230 is stacked on the ink cavity layer 220 and has a plurality of nozzle holes 232 that penetrate the nozzle plate 2 3 0, and the positions of the nozzle holes 2 3 2 correspond to these Position of heating element 2 1 2. Furthermore, the cover sheet 24 0 is stacked on the spray hole sheet 2 3 0 and has at least one opening 242 that penetrates the cover sheet 240 and exposes these spray holes 2 3 2 and the cover sheet 2 4 0 The outer edge is adapted to be fitted to the ink supply port 22 of the ink cartridge 20. Therefore, the ink can flow along the flow direction 24 from the ink flow path 2 2 2 on the side edge of the inkjet wafer 2 10 to the heating element 2 1 2, and the ink can be instantaneously passed through the heating element 2 1 2 The high-pressure air bubbles generated by the vaporization push the ink, so the ink is ejected through the nozzle holes 2 3 2 to form ink droplets. In order to explain in detail the manufacturing process of the thermal inkjet inkjet print head ψ of the preferred embodiment of the present invention, please refer to FIGS. 3A to 3D and the following in order. Thermal bubble inkjet print head process profile
10982twf.ptd 第10頁 1232808 五、發明說明（6) 圖。 請參考第3A圖，提供一喷墨晶片210及一墨腔層22〇 ^ 其中喷墨晶片2 1 0具有多個加熱元件2 1 2 ，而這些加熱元件 2 1 2係配置於喷墨晶片2 1 0之表面2 1 0 a，且墨腔層2 2 0係雉 疊於噴墨晶片2 1 0之表面2 1 0 a ，而墨腔層2 2 0具有多個墨水 流道2 2 2，且這些墨水流道2 2 2之一端係分別暴露出這些力口 熱元件2 1 2，而這些墨水流道2 2 2之另一端係分別延伸I I 腔層2 2 0之側面。當墨腔層2 2 0之材質係採用光阻 (Photo-Resist ，PR)日夺，可禾J用禮支影 (photolithography)的方式，即禾J 用曝光（exposing) 及顯影（d e v e 1 〇 p m e n t )的方式，將這些墨水流道2 2 2直接· 形成於墨腔層220上。 . 請參考第3B圖，堆疊一喷孔片230於墨腔層220之上， 其中喷孔片230之材料係可為光阻（Photo- Resist)、高 -分子材料或金屬等，而高分子材料又例如為聚酷乙胺 (Polyimide )、聚甲基丙烯酸甲醋（Poly( methyl methacrylate)，簡稱PMMA )、聚酯（PET )或環氧樹酯 ， (Expoxy )等，而金屬材料則例如為不銹鋼（s t a i η 1 e s s steel )或鎳（Ni)。 請參考第3C圖，形成多個喷孔232於喷孔片230上，其 中這些噴孔2 3 2之位置係分別對應於這些加熱元件2 1 2之位 置。同樣地，當喷孔片2 3 0之材質係採用光阻（P R )時，φ 可利用微影的方式，即利用曝光及顯影的方式’將這些喷 孔2 3 2直接形成於喷孔片2 3 0上，並且使得這些喷孔2 3 2之10982twf.ptd Page 10 1232808 V. Description of the invention (6) Figure. Referring to FIG. 3A, an inkjet wafer 210 and an ink cavity layer 22 are provided. The inkjet wafer 2 10 has a plurality of heating elements 2 1 2, and these heating elements 2 1 2 are arranged on the inkjet wafer 2 The surface 2 1 0 a of 10 and the ink cavity layer 2 2 0 are stacked on the surface 2 1 0 a of the inkjet wafer 2 1 0, and the ink cavity layer 2 2 0 has a plurality of ink flow channels 2 2 2 In addition, one end of the ink flow channels 2 2 2 respectively exposes the force heating elements 2 1 2, and the other ends of the ink flow channels 2 2 2 respectively extend to the sides of the II cavity layer 2 2 0. When the material of the ink cavity layer 2 2 0 is photo-resist (PR), Ke He J uses photolithography, that is, he uses exposing and developing (deve 1 〇). pment), the ink flow channels 2 2 2 are directly formed on the ink cavity layer 220. Please refer to FIG. 3B. A nozzle plate 230 is stacked on the ink cavity layer 220. The material of the nozzle plate 230 may be photo-resistor, high-molecular material or metal, and the polymer The material is, for example, Polyimide, Poly (methyl methacrylate, PMMA), polyester (PET), or epoxy resin (Expoxy), and the metal material is, for example, It is stainless steel (stai η 1 ess steel) or nickel (Ni). Referring to FIG. 3C, a plurality of spray holes 232 are formed on the spray hole sheet 230. The positions of the spray holes 2 3 2 correspond to the positions of the heating elements 2 1 2 respectively. Similarly, when the material of the nozzle holes 2 3 0 is photoresist (PR), φ can use the lithography method, that is, use the method of exposure and development to 'form these nozzle holes 2 3 2 directly on the nozzle holes. 2 3 0 and make these nozzle holes 2 3 2
10982twf.ptd 第11頁 1232808 五、發明說明（7) 位置均可分別對應這些加熱元件2 1 2之位置。 請參考第3D圖，堆疊一覆蓋片240於喷孔片230之上， 其中覆蓋片240具有至少一開口242 ，其貫穿覆蓋片240 ， 並暴露出這些喷孔232。並請同時參考第4圖，其繪示第2 圖之熱泡式喷墨印頭的局部俯視圖。在本發明之較佳實施 例之中，覆蓋片2 4 0之材質可包括石夕（s i 1 i c ο η )、金屬材 料、陶究材料（ceramic material )、氧化鈦（Ti02)、 氧化锆（Z :r 02 )或高分子材料等，其中高分子材料又例如 為聚驢乙胺（Ρ ο 1 y i m i d e )、聚甲基丙稀酸甲醋 (P〇ly(methyl methacrylate)，簡稱PMMA)、聚酯（PET )或環氧樹醋（E x p o x y )等，並利用乾式餘刻（d r y etching )、濕式餘刻（w e t e t c h i n g )或機械加工 . (machining )等圖案化的方式，將這些開口 242形成於覆 蓋片240上，其中這些開口 242之内徑係遠大於喷孔232之 -内徑。同時，在堆疊覆蓋片240於喷孔片230之上以後，覆 蓋片2 4 0之單一矩形狀的開口 2 4 2將可同時暴露出整排之多 個喷孔2 3 2 ，如第4圖所示。而且，喷孔片2 3 0之頂面係可 對應貼附至兩開口 2 4 2之間的局部覆蓋片2 4 0的底面，如第 3 D圖所示。 請再參考第2圖，覆蓋片2 4 0之厚度必須控制在某個預 設值以下，使得喷孔2 3 2之頂端與記錄媒介（例如紙張） 之間的距離可以獲得良好的控制。為了薄化覆蓋片2 4 0之 f 厚度，在堆疊覆蓋片240於喷孔片230之上以前，可預先利 用化學機械研磨（C Μ P )或其他薄化技術，來有效地減少10982twf.ptd Page 11 1232808 V. Description of the invention (7) The positions can correspond to the positions of these heating elements 2 1 2 respectively. Referring to FIG. 3D, a cover sheet 240 is stacked on the spray hole sheet 230. The cover sheet 240 has at least one opening 242 that penetrates the cover sheet 240 and exposes the spray holes 232. Please also refer to FIG. 4, which shows a partial top view of the thermal inkjet print head of FIG. 2. In a preferred embodiment of the present invention, the material of the cover sheet 240 may include si 1 ic ο η, a metal material, a ceramic material, a titanium oxide (Ti02), and a zirconia ( Z: r 02) or polymer materials, among which the polymer materials are, for example, poly (ethyl amine) (P ο 1 yimide), polymethyl methacrylate (PMA), Polyester (PET) or epoxy resin (E xpoxy), etc., and use dry etching (wet etching), wet etching (wetetching) or machining (machining) and other patterning methods, these openings 242 Formed on the cover sheet 240, wherein the inner diameter of the openings 242 is much larger than the inner diameter of the spray holes 232. At the same time, after stacking the cover sheet 240 on the nozzle hole sheet 230, the single rectangular opening 2 4 2 of the cover sheet 2 40 can simultaneously expose a whole row of multiple nozzle holes 2 3 2, as shown in FIG. 4. As shown. Moreover, the top surface of the spray hole sheet 230 can correspond to the bottom surface of the partial cover sheet 240 attached between the two openings 2 4 2, as shown in FIG. 3D. Please refer to Figure 2 again. The thickness of the cover sheet 2 40 must be controlled below a preset value, so that the distance between the top of the nozzle hole 2 3 2 and the recording medium (such as paper) can be well controlled. In order to reduce the f thickness of the cover sheet 240, before the cover sheet 240 is stacked on the orifice sheet 230, chemical mechanical polishing (CMP) or other thinning techniques can be used in advance to effectively reduce the thickness.
10982twf.ptd 第12頁 1232808 五、發明說明（8) 覆蓋片2 4 0之厚度，但是薄化後之覆蓋片2 4 0仍必須提供足 夠的結構強度，用以定位其下之喷孔片2 3 0 、墨腔層2 2 0及 喷墨晶片2 1 0於墨水匣2 0之供墨口 2 2之内。 本發明之較佳實施例的技術特徵乃是將一由光阻所製 成之噴孔片堆疊於一位於喷墨晶片之表面的墨腔層之上， 接著再利用曝光及顯影的方式，將多個喷孔直接形成於喷 孔片上。此外，本發明之較佳實施例的另一技術特徵乃是 利用一覆蓋片來作為結構連接用之媒介，用以將已堆疊完 成之喷墨晶片、墨腔層及喷孔片，經由覆蓋片而裝配至墨 水匣之供墨口 ，並利用覆蓋片之開口暴露出喷孔片之多個 喷孔，使得墨滴能夠順利地經由喷孔而射出至外界。值得 注意的是，由於覆蓋片之這些開口僅需暴露出喷孔片之這 . 些喷孔，所以覆蓋片將不須精確地對位接合至喷孔片。 綜上所述，本發明之熱泡式喷墨印頭製程乃是先將一 _ 喷孔片堆疊於一位於喷墨晶片之表面的墨腔層之上，再形 成多個喷孔於喷孔片上，故可省略習知之π將一已形成喷 孔之喷孔片精確地對位接合至墨腔層π的步驟。此外，本 -發明更利用一覆蓋片作為喷孔片與墨水匣之供墨口的連接 介面，且覆蓋片不須精確地對位接合至喷孔片，故與π喷 孔片之精確對位接合至墨腔層的製作成本π相較之下，額 外增加之覆蓋片其所衍生的製作成本仍相對較低。因此， 本發明將可有效地降低此熱泡式喷墨印頭之整體的製作成f 本0 雖然本發明已以一較佳實施例揭露如上，然其並非用10982twf.ptd Page 12 1232808 V. Description of the invention (8) The thickness of the cover sheet 2 4 0, but the thinned cover sheet 2 4 0 must still provide sufficient structural strength to locate the orifice plate 2 below it. 30, the ink cavity layer 220 and the inkjet wafer 210 are within the ink supply port 22 of the ink cartridge 20. The technical feature of the preferred embodiment of the present invention is to stack an orifice plate made of photoresist on an ink cavity layer on the surface of an inkjet wafer, and then use exposure and development to A plurality of spray holes are directly formed on the spray hole sheet. In addition, another technical feature of the preferred embodiment of the present invention is to use a cover sheet as a medium for structural connection, to pass the stacked inkjet wafer, ink cavity layer and nozzle hole sheet through the cover sheet. The ink supply port of the ink cartridge is assembled, and the openings of the cover sheet are used to expose a plurality of nozzle holes of the nozzle hole sheet, so that ink droplets can be smoothly ejected to the outside through the nozzle holes. It is worth noting that, because these openings of the cover sheet only need to expose these nozzle holes of the nozzle plate, the cover sheet does not need to be precisely aligned and bonded to the nozzle plate. To sum up, the process of the thermal bubble inkjet print head of the present invention is to firstly stack a nozzle plate on an ink cavity layer on the surface of the inkjet wafer, and then form a plurality of nozzle holes in the nozzle hole. On the sheet, the conventional π step of precisely aligning an orifice plate having an orifice formed with the ink cavity layer π can be omitted. In addition, the present invention further uses a cover sheet as the connection interface between the nozzle hole sheet and the ink supply port of the ink cartridge, and the cover sheet does not need to be accurately aligned with the nozzle hole sheet, so it is accurately aligned with the π nozzle hole sheet. Compared with the manufacturing cost π of bonding to the ink cavity layer, the additional manufacturing cost of the additional cover sheet is still relatively low. Therefore, the present invention can effectively reduce the overall fabrication of the thermal bubble inkjet print head to f. 0 Although the present invention has been disclosed as above with a preferred embodiment, it is not useful.
10982twf.pt d 第13頁 123280810982twf.pt d p. 13 1232808
10982twf.ptd 第14頁 1232808 圖式簡單說明 第1圖繪示習知之一種邊緣進給式供墨之熱泡式喷墨 印頭的剖面示意圖。 第2圖繪示本發明之較佳實施例之熱泡式喷墨印頭的 剖面示意圖。 第3 A〜3 D圖繪示本發明之較佳實施例之熱泡式喷墨印 頭製程的剖面圖。 第4圖繪示第2圖之熱泡式喷墨印頭的局部俯視圖。 圖式標示說明】 1 0 、2 0 :墨水匣 1 4、2 4 :流動方向 1 ◦ 0 :熱泡式喷墨印頭 1 1 Oa :表面 1 2 0 :墨腔層 1 3 0 :噴孔片 2 0 0 :熱泡式喷墨印頭 2 1 0 a ··表面 2 2 0 :墨腔層 2 3 ◦:噴孔片 2 4 0 :覆蓋片 1 2、2 2 :供墨口 110 112 122 132 210 212 222 232 242 喷墨晶片 加熱元件 墨水流道 喷孔 喷墨晶片 加熱元件 墨水流道 喷孔 開口 ❹10982twf.ptd Page 14 1232808 Brief Description of Drawings Figure 1 shows a schematic cross-sectional view of a conventional thermal inkjet print head with edge feed ink supply. Fig. 2 is a schematic cross-sectional view of a thermal ink jet print head according to a preferred embodiment of the present invention. Figures 3A to 3D are cross-sectional views showing the process of manufacturing a thermal inkjet print head according to a preferred embodiment of the present invention. FIG. 4 is a partial plan view of the thermal ink jet print head of FIG. 2. Description of the diagrams] 1 0, 2 0: Ink tank 1 4, 2 4: Flow direction 1 ◦ 0: Thermal bubble inkjet print head 1 1 Oa: Surface 1 2 0: Ink cavity layer 1 3 0: Nozzle Sheet 2 0 0: Thermal inkjet print head 2 1 0 a · Surface 2 2 0: Ink cavity layer 2 3 ◦ Nozzle sheet 2 4 0: Cover sheet 1 2, 2 2: Ink supply port 110 112 122 132 210 212 222 232 242 Ink jet wafer heating element ink flow channel nozzle hole Ink jet wafer heating element ink flow channel nozzle hole opening ❹
10982twf.pt d 第15頁10982twf.pt d p. 15
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113211985B (en) * | 2020-01-21 | 2022-10-14 | 国际联合科技股份有限公司 | Thermal bubble ink jet head device |
-
2003
- 2003-05-29 TW TW92114529A patent/TWI232808B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI614123B (en) * | 2015-07-16 | 2018-02-11 | 研能科技股份有限公司 | Full color 3d printing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200426041A (en) | 2004-12-01 |
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