CN101112817A - Ink jet printing head and its producing method - Google Patents

Ink jet printing head and its producing method Download PDF

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Publication number
CN101112817A
CN101112817A CNA2006100995034A CN200610099503A CN101112817A CN 101112817 A CN101112817 A CN 101112817A CN A2006100995034 A CNA2006100995034 A CN A2006100995034A CN 200610099503 A CN200610099503 A CN 200610099503A CN 101112817 A CN101112817 A CN 101112817A
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CN
China
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layer
ink
jet printing
nozzle
negative type
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CNA2006100995034A
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Chinese (zh)
Inventor
蔡尚颖
李致淳
江逊旌
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国际联合科技股份有限公司
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Priority to CNA2006100995034A priority Critical patent/CN101112817A/en
Publication of CN101112817A publication Critical patent/CN101112817A/en

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Abstract

The invention provides an ink injection print head which comprises at least a wafer, a chamber layer and a nozzle layer; wherein, the wafer is provided with a plurality of actuators; the chamber layer is arranged on the wafer; the nozzle layer is arranged on the chamber layer which is provided with a plurality of chambers; the chambers are arranged above the actuators; the material of the chamber layer is an organic solvent developed acrylic acid negative-typed photoresist. Furthermore, the nozzle layer is provided with a plurality of nozzles which are respectively communicated with the chambers; the material of the nozzles is the epoxy-typed or acyl imino group-typed negative-typed photoresist.

Description

Ink-jet printing head and manufacture method thereof

Technical field

The present invention relates to a kind of ink-jet printing head (inkjet print head) and manufacture method thereof, particularly relate to a kind of ink-jet printing head and the manufacture method thereof that can improve the adhesion strength between wafer (chip) and the chamber layer (chamber layer).

Background technology

Under the drive development of high-tech industry, all electronic correlation industries are advanced by leaps and bounds invariably in recent years.With regard to printer, within the time of a few years, printing technique is printed from early stage stylus printing and one-wavelength laser, progressive always color ink jet printed and color laser printing up till now.With regard to ink-jet printer, mainly contain the ink-jet technology of thermal bubble type (thermal bubble) or piezoelectric type (piezoelectric) at present at the applied printing technique of ink-jet printer on the market, in order to ink is sprayed onto recording medium, paper etc. for example, thereby form literal or pattern surface at recording medium.With Thermal Bubble Ink-jet Printer seal head is example, the ink-jet printing head of the type utilizes one deck to be disposed at chamber layer (chamber layer) on the substrate (substrate) mostly and forms substantially most ink runners (ink channel) and ink chamber (ink chamber) with the substrate surface level, and supply ink to these ink runners by the ink fluting (ink slot) or the through hole (via) that pass substrate, the ink runner of these levels of flowing through again enters corresponding ink chamber, spray to form ink droplet by the nozzle (nozzle) that at heating element heater (heating) strength that ink vaporization back is produced is promoted ink, make ink pass to be disposed at the nozzle plate (nozzle plate) in the ink chamber afterwards.Though nozzle plate is simple in structure, eruption has direct influence to ink droplet because of it, so the quality of nozzle plate, material, precision and nozzle form etc. require more.

Nozzle plate is pressure bonded to a kind of production method on the wafer, is to finish the nozzle plate that contains nozzle in advance with electroforming, machinery or laser drill mode earlier, and blocks of again contraposition is pressure bonded on the wafer.The nozzle plate that utilizes aforementioned manufacturing technology and method to produce (does not for example adopt the metallic nozzle plate) except cost is striking, must drop into expensive equipment yet and expend more manpower and man-hour on its process.A kind of developing technology is arranged at present, be to utilize dry ecthing (dry-etching) to make the nozzle plate of ink-jet printing head, but the process of dry ecthing needs higher cost equally on process device, therefore newer technology is with the material of negative type photoresist (negative photoresist) as nozzle plate, and to select for use for example be that epoxy radicals (epoxy-based) or polyimide-based (polyimide-based) resin are as nozzle plate, to solve the problem that electrocasting has the metallic nozzle plate to be corroded by ink in the use, and above-mentioned epoxy radicals or polyimide-based resinous nozzle plate are higher because of surface energy (surface energy), so be difficult for long-pending China ink with respect to the metallic nozzle plate, and it is a transparent material, so be easy to observe and carry out the analysis of bad product.Moreover, this low as the process of required process cost of the technology of nozzle plate material and all existing dry ecthing of equipment with negative type photoresist, and with the nozzle plate pressing of this kind material or to adhere to process temperature required on the wafer, pressure also lower, therefore after avoiding the nozzle plate pressing or adhere to wafer, produce the recessed problem of nozzle plate.

These employing epoxy radicals or polyimide-based resin are as the ink-jet printing head of nozzle plate, and the material of employed chamber layer also adopts epoxy fundamental mode or polyimide-based (polyimide-based) resin, and for example U.S. Pat 6,739,519, US6, shown in 409,312.Yet, because exposed material, Ta, oxidation material (oxide material), nitride material (nitridematerial) are arranged on the ink gun wafer, contain gold copper-base alloy etc., make the adhesion strength of the chamber layer of epoxy radicals or polyimide-based resin and wafer good inadequately, the problem of peeling off is arranged, and cause the reliability of product not good.

Summary of the invention

Purpose of the present invention is providing a kind of ink-jet printing head exactly, can improve the not good problem of adhesion strength between chamber layer and the wafer.

Another object of the present invention provides a kind of ink-jet printing head, takes place with the situation of avoiding chamber layer to peel off from wafer.

Another purpose of the present invention provides a kind of ink-jet printing head, can improve the not good problem of adhesion strength between chamber layer and the nozzle layer and can prevent the erosion of ink to chamber layer simultaneously.

A further object of the present invention provides a kind of manufacture method of ink-jet printing head, can reach with simple process to improve the not good problem of adhesion strength between wafer and the chamber layer, and the pre-adhesion strength between lifting nozzle layer and the chamber layer.

Other purposes of the present invention and advantage can be further understood from the disclosed technical characterictic of the present invention.

For reaching above-mentioned one or part or whole purposes or other purpose, the present invention proposes a kind of ink-jet printing head, at least comprise a wafer (chip), a chamber layer (chamber layer) and a nozzle layer (nozzle layer), wherein wafer has most actuation devices (actuators), chamber layer then is disposed on the wafer, and the mouth layer of disputing is to be disposed on the chamber layer.Wherein, chamber layer has most chambers, these chambers are positioned at the actuation device top, and the material of chamber layer is a kind of acrylic acid series negative type photoresist (organic-solyent developable acrylic familynegative photoresist) of organic solvent developable.In addition, nozzle layer has most nozzles, and these nozzles are communicated with above-mentioned chamber respectively, and the material of nozzle layer comprises epoxy fundamental mode negative type photoresist (epoxy-based negative photoresist) or acid imide fundamental mode negative type photoresist (imide-based negative photoresist).

The present invention reintroduces a kind of ink-jet printing head, comprises a wafer, a chamber layer and a nozzle layer at least, and wherein wafer has most actuation devices, and chamber layer then is disposed on the wafer, and nozzle layer is to be disposed on the chamber layer.Wherein, chamber layer has most chambers, and chamber is positioned at the actuation device top.Nozzle layer then has most nozzles, and nozzle is communicated with above-mentioned chamber respectively, and wherein the adhesion strength between employed material of chamber layer and the wafer is greater than the adhesion strength between employed material of nozzle layer and the wafer.

According to the described ink-jet printing head of preferred embodiment of the present invention, wherein the material of chamber layer comprises the acrylic acid series negative type photoresist with the organic solvent developable.

According to the described ink-jet printing head of preferred embodiment of the present invention, more comprise one deck first material layer, between chamber layer and nozzle layer.Wherein, first material layer and nozzle layer have identical materials, and first material layer has identical substantially profile with chamber layer.The thickness of first material layer is about between 1~40 μ m.

According to the described ink-jet printing head of preferred embodiment of the present invention, more comprise one deck second material layer, between chamber layer and nozzle layer, wherein second material layer and chamber layer have identical materials, and second material layer has identical substantially profile with nozzle layer.The thickness of second material layer is about between 0.5~40 μ m.

According to the described ink-jet printing head of preferred embodiment of the present invention, the angle of the inwall of above-mentioned each nozzle and the lower surface of nozzle layer is between 60 degree are spent to 90.

The present invention proposes a kind of ink-jet printing head in addition, comprises a wafer, a chamber layer and a nozzle layer at least, and wherein wafer has most actuation devices, and chamber layer then is disposed on the wafer, and nozzle layer is to be disposed on the chamber layer.Above-mentioned chamber layer has most chambers, and chamber is positioned at the actuation device top, and the material of chamber layer is a kind of acrylic acid series negative type photoresist of organic solvent developable.Moreover nozzle layer has most nozzles, and nozzle is communicated with chamber respectively, and the angle of the lower surface of the inwall of each nozzle and nozzle layer is between 60 degree are spent to 90.In addition, the material of nozzle layer is a kind of negative type photoresist, and is different from the material of chamber layer.

The present invention proposes a kind of ink-jet printing head again, comprises a wafer, a chamber layer and a nozzle layer at least, and wherein wafer has most actuation devices, and chamber layer then is disposed on the wafer, and nozzle layer is to be disposed on the chamber layer.Above-mentioned chamber layer has most chambers and most runners that are connected to chamber respectively, these chambers are positioned at the actuation device top, and chamber layer is a kind of mixed layer, and this mixed layer is mixed or mixed by the acrylic acid series negative type photoresist and the acid imide fundamental mode negative type photoresist of organic solvent developable by the acrylic acid series negative type photoresist of organic solvent developable and epoxy fundamental mode negative type photoresist.And nozzle layer has most nozzles, and these nozzles are communicated with chamber respectively.

According to the described ink-jet printing head of preferred embodiment of the present invention, the shared part by weight of acrylic acid series negative type photoresist of the organic solvent developable in the above-mentioned mixed layer is about between 5%~80%.

According to the described ink-jet printing head of preferred embodiment of the present invention, the angle of the inwall of above-mentioned each nozzle and the lower surface of nozzle layer is between 60 degree are spent to 90.

According to the described ink-jet printing head of preferred embodiment of the present invention, the material of said nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist.

According to the described ink-jet printing head of preferred embodiment of the present invention, the material of said nozzle layer is preferably polyimides fundamental mode negative type photoresist.

According to the described ink-jet printing head of preferred embodiment of the present invention, the acrylic acid series negative type photoresist of above-mentioned organic solvent developable is preferably the negative type photoresist polymer that organic solvent type contains the acrylic acid series of ester class or ethers.

According to the described ink-jet printing head of preferred embodiment of the present invention, the thickness of said nozzle layer is about between 15~70 μ m.

According to the described ink-jet printing head of preferred embodiment of the present invention, the thickness of above-mentioned chamber layer is about between 5~50 μ m.

According to the described ink-jet printing head of preferred embodiment of the present invention, above-mentioned actuation device is heating or piezoelectric element.

According to the described ink-jet printing head of preferred embodiment of the present invention, wherein chamber layer has several runners that are connected to chamber respectively.

The present invention reintroduces a kind of manufacture method of ink-jet printing head, and comprising provides the wafer with most actuation devices, forms a double-decker again on wafer.Wherein, one deck first material layer that double-decker comprises one deck chamber layer that contacts with wafer surface and do not contact with wafer surface, wherein double-decker has most chambers and most runners that are connected to chamber respectively, and chamber is positioned at the actuation device top.Then, form one deck nozzle layer on double-decker, wherein nozzle layer has most nozzles, and these nozzles are communicated with chamber respectively.Wherein, the material of chamber layer comprises the acrylic acid series negative type photoresist of organic solvent develop type, the material of nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist, and first material layer and nozzle layer have identical materials.

According to the described manufacture method of preferred embodiment of the present invention, wherein form double-deck step and comprise the acrylic acid series negative type photoresist and first material layer that on wafer, forms earlier organic solvent develop type in regular turn, the acrylic acid series negative type photoresist and first material layer to the organic solvent developable exposes again, and the acrylic acid series negative type photoresist and first material layer to the organic solvent developable develops afterwards.

According to the described manufacture method of preferred embodiment of the present invention, wherein form double-deck step and comprise the acrylic acid series negative type photoresist that on wafer, forms organic solvent develop type earlier, again the acrylic acid series negative type photoresist of organic solvent developable is carried out the exposure of first road and develop with first road.Then, on wafer, form the acrylic acid series negative type photoresist of the above-mentioned organic solvent developable of first layer of material covers, again first material layer is carried out the exposure of second road and develop with second road.

The present invention proposes a kind of manufacture method of ink-jet printing head again, and comprising provides the wafer with most actuation devices, forms one deck chamber layer then on wafer.This layer chamber layer has several chambers and most runners that are connected to chamber respectively, and chamber is positioned at the actuation device top, and the material of chamber layer comprises the acrylic acid series negative type photoresist of organic solvent develop type.Afterwards, form a double-decker on chamber layer, wherein double-decker comprises one deck second material layer that contacts with the chamber layer surface and one deck nozzle layer that does not contact with the chamber layer surface.Wherein, double-decker has most nozzles, and these nozzles are communicated with chamber respectively, and the material of nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist; And second material layer and chamber layer have identical materials.

According to the described manufacture method of preferred embodiment of the present invention, wherein form double-deck step and comprise: the dry film that pressing is made up of second material layer and nozzle layer on chamber layer.

The present invention is because adopt the material of the acrylic acid series negative type photoresist of organic solvent developable as chamber layer, comprise epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist that the physical mechanical strength of arranging in pairs or groups simultaneously is preferable as the material of nozzle layer, therefore can be improved the not good problem of adhesion strength between wafer and the chamber layer.In addition, the layer of material layer of also can arranging in pairs or groups between chamber layer and the nozzle layer improves this two-layer compatibility when pressing.Moreover, chamber layer also can be selected the acrylic acid series negative type photoresist that is mixed with the organic solvent developable and the material of epoxy fundamental mode negative type photoresist or polyimides fundamental mode negative type photoresist for use, can improve the not good problem of adhesion strength between wafer and the chamber layer that has now equally.

For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.

Description of drawings

Fig. 1 is the generalized section according to a kind of ink-jet printing head of the first embodiment of the present invention.

Fig. 2 A-1, Fig. 2 A-2 to Fig. 2 C are the manufacturing process generalized sections according to a kind of ink-jet printing head of the second embodiment of the present invention.

Fig. 3 A to Fig. 3 B is the manufacturing process generalized section according to a kind of ink-jet printing head of the third embodiment of the present invention.

Fig. 4 is the generalized section according to a kind of ink-jet printing head of the fourth embodiment of the present invention.

Fig. 5 is the generalized section according to a kind of ink-jet printing head of the fifth embodiment of the present invention.

100,200,300,400,500: wafer

102,202,302,402,502: actuation device

104,204,304,404,504: chamber layer

106,206,306,406,506: nozzle layer

105,305: chamber

107,307: runner

205: the first material layers

308: the second material layers

θ 1, θ 2, θ 3, θ 4, θ 5: angle

The specific embodiment

The explanation of following each embodiment is with reference to the accompanying drawings, can be in order to the specific embodiment of implementing in order to illustration the present invention.The direction term that the present invention mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side " etc., only be direction with reference to annexed drawings.Therefore, the direction term of use is to be used for explanation, but not is used for limiting the present invention.

The design concept of ink-jet printing head of the present invention is with the adhesion strength between material and the wafer, selects for use adhesion strength than the big person of material of the nozzle layer material as chamber layer.In other words, comparing the material employing of prior art chamber layer and the material identical materials of nozzle layer for example is epoxy radicals negative type photoresist (as SU-8), and the adhesion strength between employed material of the chamber layer of embodiments of the invention and the wafer is greater than the adhesion strength between employed material of nozzle layer and the wafer.Below enumerate several embodiment and describe structure of the present invention and manufacture method in detail, but be not to limit the applicable scope of the present invention with this.

First embodiment

Fig. 1 is the generalized section according to a kind of ink-jet printing head of the first embodiment of the present invention.

Please refer to Fig. 1, the ink-jet printing head of first embodiment comprises wafer (chip) 100, chamber layer 104 and nozzle layer 106, wherein wafer 100 has actuation device 102, and 104 of chamber layer are disposed on the wafer 100, and nozzle layer or nozzle plate 106 are to be disposed on the chamber layer 104.Wherein, chamber layer 104 generally all has most chambers 105, and chamber is positioned at actuation device 102 tops.In a preferred embodiment, chamber layer 104 has most runners 107 that are connected to chamber respectively.In a preferred embodiment, actuation device 102 as be heating element heater (heater; Resistive element; Or title heating), can be coated with other protective layers (protective layer) (not illustrating) thereon, for example be the lamination of SiN layer, SiC layer or SiN and SiC.Therefore, the alleged chamber of the present invention is positioned at actuation device 102 tops, is not limited to chamber and actuation device 102 and directly is close to.

Please continue with reference to Fig. 1, adhesion strength between chamber layer 104 employed materials and the wafer 100 is greater than the adhesion strength between nozzle layer 106 employed materials and the wafer 100, wherein the material of chamber layer 104 for example is a kind of acrylic acid series negative type photoresist (organic-solvent developable acrylic-family negative photoresist) of organic solvent developable, and preferred materials is the negative type photoresist polymer that contains the acrylic acid series of ester class for a kind of negative type photoresist polymer of the acrylic acid series that contains ethers that develops with organic solvent or a kind of organic solvent type that Tokyo Ohka Kogyo company is produced.Compared to the acrylic acid series negative type photoresist of alkaline aqueous solution (aqueous base) developable, adopt the formed chamber layer 104 of acrylic acid series negative type photoresist of organic solvent developable and chamber 105 to have the repellence that higher ink corrodes.And nozzle layer 106 has most nozzles, and these nozzles are communicated with above-mentioned chamber 105 respectively, and the material of nozzle layer 106 for example epoxy fundamental mode negative type photoresist (epoxy-based negative photoresist) or acid imide fundamental mode negative type photoresist (imide-based negative photoresist).The material of epoxy fundamental mode negative type photoresist can be SU-8, for example is the SU-8 series negative type photoresist of being produced by MicroChem company.If the material of nozzle layer 106 is an acid imide fundamental mode negative type photoresist, its preferred materials then is a polyimides fundamental mode negative type photoresist.In one embodiment, the angle theta of the lower surface of the inwall of above-mentioned each nozzle and nozzle layer 106 1For example be to spend between 90 degree angle theta between 60 approximately 1Preferred values is approximately between 80 degree are spent to 88.The thickness of said nozzle layer 106 for example is between 15~70 μ m, and preferred thickness is between 20~70 μ m; The thickness of above-mentioned chamber layer 104 for example is between 5~50 μ m, and preferred thickness is between 10~40 μ m.And above-mentioned actuation device 102 can be heating or piezoelectric element.

Second embodiment

Fig. 2 A-1, Fig. 2 A-2 to Fig. 2 C are the manufacturing process generalized sections according to a kind of ink-jet printing head of the second embodiment of the present invention, and the difference of the ink-jet printing head of the second embodiment made and first embodiment be more than between chamber layer and nozzle layer one deck first material layer.

Please, provide wafer 200, and actuation device 202 can be heating or piezoelectric element with most actuation devices 202 earlier with reference to Fig. 2 A-1 and Fig. 2 B.Afterwards, form a double-decker on wafer 200, it comprises one deck chamber layer 204 that contacts with wafer 200 surfaces and one deck first material layer 205 that does not contact with wafer 200 surfaces.Therefore, can select to adopt the mode of Fig. 2 A-1, on wafer 200, form earlier the acrylic acid series negative type photoresist (being the material of chamber layer 204) and first material layer 205 of organic solvent develop type in regular turn, again the acrylic acid series negative type photoresist of organic solvent developable and first material layer 205 are exposed and develop again, to form chamber, and in other embodiments, and form runner.Can adopt in the mode that forms chamber layer 204 on the wafer 200 and form first material layer 205 on chamber layer 204 for example is coating (coating), bonding or pressing (lamination) mode.In one embodiment, the chamber layer 204 and first material layer 205 are dry film (dry film) kenel, can be in advance to after its mutual pressing, and again that this double-decker is bonding or be pressure bonded on the wafer.Thus, first material layer 205 can have identical substantially profile (as Fig. 2 B) with chamber layer 204.Wherein, the thickness of chamber layer 204 for example is between 0.5~35 μ m, and preferred thickness is between 5~35 μ m.The thickness of first material layer 205 for example is between 1~40 μ m, and preferred thickness is between 10~35 μ m, and the nozzle layer of itself and follow-up formation has identical materials.

In addition, also can be in addition with reference to Fig. 2 A-2 and Fig. 2 B, this is the double-deck another kind of method that forms above-mentioned Fig. 2 B, be the acrylic acid series negative type photoresist (being the material of chamber layer 204) that on wafer 200, forms organic solvent develop type earlier, again the acrylic acid series negative type photoresist of organic solvent developable carried out the exposure of first road and develop with first road.Then, on wafer 200, form the acrylic acid series negative type photoresist (as Fig. 2 A-2) that one deck first material layer 205 covers above-mentioned organic solvent developable.Then, first material layer 205 is carried out exposure of second road and the development of second road, and obtain the double-decker shown in Fig. 2 B.

Then, please refer to Fig. 2 C, go up at double-decker (comprising the chamber layer 204 and first material layer 205) and form one deck nozzle layer 206, wherein nozzle layer 206 has several nozzles.The mode that forms can adopt bonding or pressing (lamination) mode.Wherein, the material of nozzle layer 206 is epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist for example, and has identical materials with first material layer 205, if the material of nozzle layer 206 is an acid imide fundamental mode negative type photoresist, its preferred materials then is a polyimides fundamental mode negative type photoresist.In addition, the angle theta of the lower surface of the inwall of above-mentioned each nozzle and nozzle layer 206 2For example be to spend between 90 degree angle theta between 60 approximately 2Preferred values is approximately between 80 degree are spent to 88.

The 3rd embodiment

Fig. 3 A to Fig. 3 B is the manufacturing process generalized section according to a kind of ink-jet printing head of the third embodiment of the present invention, and the difference of the ink-jet printing head of the 3rd embodiment made and first embodiment be more than between chamber layer and nozzle layer one deck second material layer.

Please, provide wafer 300, and actuation device 302 can be heating or piezoelectric element with most actuation devices 302 earlier with reference to Fig. 3 A.Afterwards, on wafer 300, form one deck chamber layer 304.This layer chamber layer 304 has most chambers 305 and most runners 307 that are connected to chamber 305 respectively, and chamber is positioned at actuation device 302 tops, and the material of chamber layer 304 is the acrylic acid series negative type photoresist of organic solvent developable, and preferred materials is the negative type photoresist polymer of a kind of organic solvent type acrylic acid series of containing ester class or ethers.

Then, please refer to Fig. 3 B, on chamber layer 304, form a double-decker, wherein double-decker comprises one deck second material layer 308 that contacts with chamber layer 304 surfaces and one deck nozzle layer 306 that does not contact with chamber layer 304 surfaces, and wherein chamber layer 304 thickness and nozzle layer 306 thickness can be the thickness shown in first embodiment.The thickness of second material layer 308 is about between 0.5~40 μ m, and preferred thickness is between 0.5~40 μ m.And form above-mentioned double-deck step for example is the dry film that pressing is made up of second material layer 308 and nozzle layer 306 on chamber layer 304.Wherein, the material of nozzle layer 306 is epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist, if the material of nozzle layer 306 is an acid imide fundamental mode negative type photoresist, its preferred materials then is a polyimides fundamental mode negative type photoresist.Second material layer 308 needs to have identical substantially profile with nozzle layer 306, shown in Fig. 3 B, and identical as second embodiment, the angle theta of the lower surface of the inwall of each nozzle and nozzle layer 306 3For example between 60 degree between 90 degree, and preferred values approximately between 80 degree between 88 degree, simultaneously second material layer 308 has identical materials with chamber layer 304.

The 4th embodiment

Fig. 4 is the generalized section according to a kind of ink-jet printing head of the fourth embodiment of the present invention.

Please refer to Fig. 4, the ink-jet printing head of this embodiment comprises wafer 400, chamber layer 404 and nozzle layer 406, and wherein wafer 400 has actuation device 402.And chamber layer 404 be disposed on the wafer 400, nozzle layer 406 is disposed on the chamber layer 404.And the position relation between above-mentioned each member is all identical with first embodiment with size.Moreover the material of chamber layer 404 is acrylic acid series negative type photoresist of a kind of organic solvent developable, and the angle theta of the inwall of the nozzle of nozzle layer 406 and its lower surface 4Need between 60 degree are spent to 90, and preferred values is approximately between 80 degree are spent to 88, to promote print quality.In addition, need to select for use be a kind of negative type photoresist that is different from the material of chamber layer to 406 materials of nozzle layer.

The 5th embodiment

Fig. 5 is the generalized section according to a kind of ink-jet printing head of the fifth embodiment of the present invention.

Please refer to Fig. 5, the ink-jet printing head of present embodiment comprises wafer 500, chamber layer 504 and nozzle layer 506, and wherein wafer 500 has actuation device 502.The difference of this embodiment and the 4th embodiment is that chamber layer 504 is a kind of mixed layer (blend layer), this layer mixed layer mixed or mixed by the acrylic acid series negative type photoresist and the acid imide fundamental mode negative type photoresist of organic solvent developable by the acrylic acid series negative type photoresist of organic solvent developable and epoxy fundamental mode negative type photoresist, and wherein the shared part by weight of acrylic acid series negative type photoresist of organic solvent developable is about between 5%~80%.And the angle theta 5 of the inwall of the nozzle of nozzle layer 506 and its lower surface for example is between 60 degree are spent to 90, and preferred values is approximately between 80 degree are spent to 88.

In sum, chamber layer in ink-jet printing head of the present invention has selected for use the acrylic acid series negative type photoresist of organic solvent developable as its material, acrylic acid series negative type photoresist compared to alkaline aqueous solution (aqueous-base) developable, the erosion that the organic solvent developable can be resisted ink, the physical mechanical strength of arranging in pairs or groups simultaneously is preferable comprises epoxy fundamental mode negative type photoresist or the acid imide fundamental mode negative type photoresist material as nozzle layer, so can improve the not good problem of adhesion strength between wafer and the chamber layer, keep the structural strength of nozzle layer simultaneously.In addition, also can arrange in pairs or groups between chamber layer and the nozzle layer material layer of one deck and chamber layer or nozzle layer same material, improve chamber layer and the nozzle layer compatibility when pressing, for example in aforementioned second example, the material of first material layer on nozzle layer material and the chamber layer is identical, therefore can promote nozzle layer pair with the bonding of chamber layer or wafer or combine effect; Therefore and in aforementioned the 3rd example, the material of second material layer in the double-decker on the chamber layer is identical with the material of chamber layer, can promote nozzle layer with the bonding of chamber layer or wafer or combine effect.In addition, chamber layer can be improved the not good problem of adhesion strength between existing wafer and the chamber layer with the acrylic acid series negative type photoresist of one deck mixed organic solvents developable and the material layer of epoxy radicals minus type photoresist or acid imide fundamental mode negative type photoresist.

Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.The invention is not restricted to use at specific ink discharge device, it for example is Thermal Bubble Ink-jet Printer printhead, piezoelectric ink jet head or other types ink jet-print head that the disclosed embodiment of the present invention can be used for.The double-decker that uses in the embodiment of the invention in addition, the double-decker that is not limited to these embodiment only can have two-layer, those skilled in the art should know, these embodiment use the structure (being to contain one or more layers of material layer between chamber layer and the nozzle layer) more than two layers also can reach one of them purpose of the present invention, so the alleged double-decker of the present invention means the structure that comprises two layers or more.Arbitrary embodiment of the present invention in addition or claim must not reached the disclosed whole purposes of the present invention or advantage or characteristics.In addition, specification digest part and title only are the usefulness that is used for assisting the patent document search, are not to be used for limiting interest field of the present invention.

Claims (35)

1. ink-jet printing head is characterized in that it comprises at least:
One wafer has most actuation devices;
One chamber layer is disposed on this wafer, wherein:
This chamber layer has most chambers, and those chambers are positioned at those actuation device tops;
The material of this chamber layer is a kind of acrylic acid series negative type photoresist of organic solvent developable; And
One nozzle layer is disposed on this chamber layer, wherein:
This nozzle layer has most nozzles, and those nozzles are communicated with those chambers respectively;
The material of this nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist.
2. ink-jet printing head according to claim 1, it is characterized in that it more comprises one first material layer, between this chamber layer and this nozzle layer, wherein this first material layer and this nozzle layer have identical materials, and this first material layer has identical substantially profile with this chamber layer.
3. ink-jet printing head according to claim 2, the thickness that it is characterized in that wherein said this first material layer are between 1~40 μ m.
4. ink-jet printing head according to claim 1, it is characterized in that it more comprises one second material layer, between this chamber layer and this nozzle layer, wherein this second material layer and this chamber layer have identical materials, and this second material layer has identical substantially profile with this nozzle layer.
5. ink-jet printing head according to claim 4, the thickness that it is characterized in that wherein said this second material layer are between 0.5~40 μ m.
6. ink-jet printing head according to claim 1 is characterized in that wherein said this chamber layer more comprises most runners that are connected to those chambers respectively.
7. ink-jet printing head according to claim 1 is characterized in that the acrylic acid series negative type photoresist of wherein said this organic solvent developable comprises that organic solvent type contains the negative type photoresist polymer of the acrylic acid series of ester class or ethers.
8. ink-jet printing head according to claim 1 is characterized in that the material of wherein said this nozzle layer comprises polyimides fundamental mode negative type photoresist.
9. ink-jet printing head is characterized in that it comprises at least:
One wafer has most actuation devices;
One chamber layer is disposed on this wafer, and wherein this chamber layer has most chambers, and those chambers are positioned at those actuation device tops; And
One nozzle layer, be disposed on this chamber layer, wherein this nozzle layer has most nozzles, and those nozzles are communicated with those chambers respectively, and wherein the adhesion strength between the employed material of this chamber layer and this wafer is greater than the adhesion strength between the employed material of this nozzle layer and this wafer.
10. ink-jet printing head according to claim 9, it is characterized in that it more comprises one first material layer, between this chamber layer and this nozzle layer, wherein this first material layer and this nozzle layer have identical materials, and this first material layer has identical substantially profile with this chamber layer.
11. ink-jet printing head according to claim 10, the thickness that it is characterized in that wherein said this first material layer are between 1~40 μ m.
12. ink-jet printing head according to claim 9, it is characterized in that it more comprises one second material layer, between this chamber layer and this nozzle layer, wherein this second material layer and this chamber layer have identical materials, and this second material layer has identical substantially profile with this nozzle layer.
13. ink-jet printing head according to claim 12, the thickness that it is characterized in that wherein said this second material layer are between 0.5~40 μ m.
14., it is characterized in that the material of wherein said this nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist according to claim 9,10 or 12 described ink-jet printing heads.
15. ink-jet printing head according to claim 14 is characterized in that the material of wherein said this nozzle layer comprises polyimides fundamental mode negative type photoresist.
16. according to claim 9,10 or 12 described ink-jet printing heads, the material that it is characterized in that wherein said this chamber layer comprises the acrylic acid series negative type photoresist of organic solvent develop type.
17. ink-jet printing head according to claim 16 is characterized in that the acrylic acid series negative type photoresist of wherein said this organic solvent developable comprises that organic solvent type contains the negative type photoresist polymer of the acrylic acid series of ester class or ethers.
18. according to claim 1 or the 9th described ink-jet printing head, the angle that it is characterized in that surface under the inwall of wherein said respectively this nozzle and this nozzle layer between 60 degree between 90 degree.
19. ink-jet printing head according to claim 9 is characterized in that wherein said this chamber layer more comprises most runners that are connected to those chambers respectively.
20. an ink-jet printing head is characterized in that it comprises at least:
One wafer has most actuation devices;
One chamber layer is disposed on this wafer, wherein:
This chamber layer has most chambers, and those chambers are positioned at those actuation device tops;
The material of this chamber layer is a kind of acrylic acid series negative type photoresist of organic solvent developable; And
One nozzle layer is disposed on this chamber layer, wherein:
This nozzle layer has most nozzles, and those nozzles are communicated with those chambers respectively, and respectively within this nozzle under wall and this nozzle layer angle on surface between 60 spend spend to 90 between;
The material of this nozzle layer is a kind of negative type photoresist, and is different from the material of this chamber layer.
21. ink-jet printing head according to claim 20 is characterized in that wherein said this chamber layer more comprises most runners that are connected to those chambers respectively.
22. an ink-jet printing head is characterized in that it comprises at least:
One wafer has most actuation devices;
One chamber layer is disposed on this wafer, wherein:
This chamber layer has most chambers and most runners that are connected to those chambers respectively, and those chambers are positioned at those actuation device tops;
This chamber layer is a kind of mixed layer, and this mixed layer is mixed by the acrylic acid series negative type photoresist of the acrylic acid series negative type photoresist of organic solvent developable and epoxy fundamental mode negative type photoresist or organic solvent developable and acid imide fundamental mode negative type photoresist;
One nozzle layer is disposed on this chamber layer, and wherein this nozzle layer has most nozzles, and those nozzles are communicated with those chambers respectively.
23. ink-jet printing head according to claim 22 is characterized in that the shared part by weight of acrylic acid series negative type photoresist of this organic solvent developable in wherein said this mixed layer is between 5%~80%.
24. ink-jet printing head according to claim 22, the angle that it is characterized in that surface under the inwall of wherein said respectively this nozzle and this nozzle layer between 60 degree between 90 degree.
25., it is characterized in that the material of wherein said this nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist according to claim 20 or the 22nd described ink-jet printing head.
26. ink-jet printing head according to claim 25 is characterized in that the material of wherein said this nozzle layer comprises polyimides fundamental mode negative type photoresist.
27., it is characterized in that the acrylic acid series negative type photoresist of wherein said this organic solvent developable comprises that organic solvent type contains the negative type photoresist polymer of the acrylic acid series of ester class or ethers according to claim 20 or 22 described ink-jet printing heads.
28. according to claim 1,9,20,22 each described ink-jet printing head wherein, the thickness that it is characterized in that wherein said this nozzle layer is between 15~70 μ m.
29. according to claim 1,9,0,22 each described ink-jet printing head wherein, the thickness that it is characterized in that wherein said this chamber layer is between 5~50 μ m.
30., it is characterized in that wherein said this actuation device is heating or piezoelectric element according to claim 1,9,20,22 each described ink-jet printing head wherein.
31. the manufacture method of an ink-jet printing head is characterized in that it comprises:
One wafer is provided, and this wafer has most actuation devices;
On this wafer, form the pair of lamina structure, this double-decker comprises a chamber layer that contacts with this wafer surface and one first material layer that does not contact with this wafer surface, wherein this double-decker has most chambers and most runners that are connected to those chambers respectively, and those chambers are positioned at those actuation device tops; And
Form a nozzle layer on this double-decker, wherein this nozzle layer has most nozzles, and those nozzles are communicated with those chambers respectively;
Wherein,
The material of this chamber layer comprises the acrylic acid series negative type photoresist of organic solvent develop type;
The material of this nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist; And
This first material layer and this nozzle layer have identical materials.
32. the manufacture method of ink-jet printing head according to claim 31 is characterized in that this double-deck step of wherein said formation comprises:
On this wafer, form the acrylic acid series negative type photoresist and first material layer of organic solvent develop type in regular turn;
Acrylic acid series negative type photoresist and this first material layer to this organic solvent developable expose; And
Acrylic acid series negative type photoresist and this first material layer to this organic solvent developable develop.
33. the manufacture method of ink-jet printing head according to claim 31 is characterized in that this double-deck step of wherein said formation comprises:
On this wafer, form the acrylic acid series negative type photoresist of organic solvent develop type;
The acrylic acid series negative type photoresist of this organic solvent developable is carried out the exposure of first road develops with first road;
On this wafer, form the acrylic acid series negative type photoresist of this organic solvent developable of first layer of material covers; And
This first material layer is carried out the exposure of second road to develop with second road.
34. the manufacture method of an ink-jet printing head is characterized in that it comprises:
One wafer is provided, and this wafer has most actuation devices;
On this wafer, form a chamber layer, wherein this chamber layer has most chambers and most runners that are connected to those chambers respectively, and those chambers are positioned at those actuation device tops, and the material of this chamber layer comprises the acrylic acid series negative type photoresist of organic solvent develop type;
On this chamber layer, form the pair of lamina structure, wherein this double-decker comprises one second material layer that contacts with this chamber layer surface and a nozzle layer that does not contact with this chamber layer surface, wherein this double-decker has most nozzles, and those nozzles are communicated with those chambers respectively;
Wherein,
The material of this nozzle layer comprises epoxy fundamental mode negative type photoresist or acid imide fundamental mode negative type photoresist; And
This second material layer and this chamber layer have identical materials.
35. the manufacture method of ink-jet printing head according to claim 34 is characterized in that this double-deck step of wherein said formation comprises: the dry film that pressing is made up of this second material layer and this nozzle layer on this chamber layer.
CNA2006100995034A 2006-07-26 2006-07-26 Ink jet printing head and its producing method CN101112817A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102407668A (en) * 2010-09-20 2012-04-11 研能科技股份有限公司 Manufacturing method for ink jet unit
CN104441996A (en) * 2013-09-22 2015-03-25 珠海纳思达企业管理有限公司 Method for making liquid ink gun, liquid ink gun and printing equipment
CN104669787A (en) * 2013-11-28 2015-06-03 珠海纳思达企业管理有限公司 Liquid ejection device and manufacturing method of liquid ejection device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102407668A (en) * 2010-09-20 2012-04-11 研能科技股份有限公司 Manufacturing method for ink jet unit
CN104441996A (en) * 2013-09-22 2015-03-25 珠海纳思达企业管理有限公司 Method for making liquid ink gun, liquid ink gun and printing equipment
CN104441996B (en) * 2013-09-22 2016-03-23 珠海赛纳打印科技股份有限公司 The manufacture method of liquid ink nozzle, liquid ink nozzle and printing device
CN104669787A (en) * 2013-11-28 2015-06-03 珠海纳思达企业管理有限公司 Liquid ejection device and manufacturing method of liquid ejection device
CN104669787B (en) * 2013-11-28 2017-11-03 珠海赛纳打印科技股份有限公司 Liquid injection apparatus and its manufacture method

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