CN1590032A - Electronic component carrier and method for shattering and loading electronic components on circuit board - Google Patents
Electronic component carrier and method for shattering and loading electronic components on circuit board Download PDFInfo
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- CN1590032A CN1590032A CN 03155057 CN03155057A CN1590032A CN 1590032 A CN1590032 A CN 1590032A CN 03155057 CN03155057 CN 03155057 CN 03155057 A CN03155057 A CN 03155057A CN 1590032 A CN1590032 A CN 1590032A
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- circuit board
- electronic component
- fixed frame
- component carrier
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Abstract
An electronic element carrier is composed of a fixed frame, a clamper fixed to said fame and clamping a circuitboard on said frame, an impacter for impacting the circuitboard to separate the electronic elements from the circuitboard when the temp in a welding furnace is higher than a predefined temp, and a carrier for collecting the separated electronic elements.
Description
Technical field
The invention provides a kind of electronic component carrier, refer to a kind of electronic component carrier that can be used for shaking the electronic component on the circuit board and carry the element that is fallen by shake especially.
Background technology
Along with the fast development of electronics technology, the alternation of generations of each electronic product is also just more frequent.Usually the electronic component on the circuit board in the electronic product that is eliminated, except some as comparatively valuable electronic component such as memory, processor can with artificial mode carefully the circuit board in the electronic product be removed, remaining more inexpensive electronic component tends to be dropped in company with whole electronic product because of expensive cost of labor, bypass environmental issue and do not say, this way can be wasted the resource of many preciousnesses.
The method of the electronic component on the conventional dismounting circuit board has two kinds: one for utilizing the flatiron scalp acupuncture of particular design, to lacking Small Scale Integration (small outlinedintegrated circuit at the different size of 64 number of pins, SOIC) heating is treated after the melts soldering tin on it it to be taken off on circuit board; Another is to utilize heat gun and cooperate Small Scale Integration or ball lattice type array package (the ball grid array package of the tuyere of particular design at different size, BGA package) integrated circuit of type heating is treated after the melts soldering tin on it it to be taken off under circuit board.
But the method for the electronic component on the conventional dismounting circuit board has following shortcoming at least, is example with the heat gun:
1) size of dismounting cost of equipment costliness-integrated circuit is various, and the essential tuyere that is equipped with the whole series of heat gun could be dismantled at the integrated circuit of different size;
2) dismounting speed slowly-be example with 17 millimeters square integrated circuits, skilled electronic component dismounting person on average need spend 30 seconds ability the integrated circuit of this size is disassembled from circuit board, and just an integrated circuit was disassembled from circuit board the time of required cost in these 30 seconds, if desire all disassembles electronic components all on the circuit board, the time of required cost will be longer;
3) can the key factor that satisfactorily finish of the temperature control process of be difficult for-utilizing heat gun that electronic component is disassembled from circuit board be whether heat gun is stablized by the temperature and the air quantity of the hot blast that its tuyere sent.General heat gun is spent to 600 degree between Celsius 250 by the temperature of the hot blast that its tuyere sent, and crosses low or too high hot blast temperature and can cause the integrated circuit (also comprising electronic component certainly) can't be by being removed on the circuit board and damaging this integrated circuit respectively;
4) some electronic component can't be removed from circuit board-because the electronic component of plastic material class, as connector, switch etc., after being brushed by the hot blast that tuyere sent of heat gun, a little less than its quality has become and has been highly brittle, may bear any irregular external force hardly, therefore by force this type of electronic component is disassembled from circuit board at last, the utilization rate of this type of electronic component that then disassembles also must be low;
5) the electronic component that on circuit board, is removed as integrated circuit and so on, normal skillful inadequately because of the careless of electronic component dismounting person or dismounting skill, and make the crooked or distortion of pin of integrated circuit, so that be removed from circuit board in that though integrated circuit is not at all easy, can not re-use unfortunately.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of can be easily and the electronic component carrier that intactly electronic component on the circuit board is disassembled, to solve the above problems.
Electronic component carrier of the present invention is placed in the reflow soldering, this electronic component carrier comprises a fixed frame, a clamper, it is fixed on this fixed frame, be used for a circuit board is clamped in this fixed frame, an impactor, be used in this reflow soldering the temperature height time of a predetermined temperature greatly in scheduled time during length, in this reflow soldering, shake an electronic component and a carrier on this circuit board, be located on this fixed frame, be used to carry from this circuit board shake the electronic component that falls.This carrier is provided with a plurality of mesh, and the size of each mesh is all less than the size of arbitrary electronic component on this circuit board.
This impactor in the electronic component carrier of the present invention comprises a support, and it is located on this fixed frame, is used for an end of the circuit board of this clamper clamping is supported to a predetermined altitude.This impactor comprises in addition that a bracket groove is used to hold this support and a support button is used for this support is fastened in this bracket groove.This reflow soldering that is equipped with electronic component carrier of the present invention comprises a touch device, be used to touch the support of this impactor, this touch device comprises a trigger housing and a stuck-finger, one end of this stuck-finger is fixed on this trigger housing, when the other end then is used for temperature in this reflow soldering and is higher than this predetermined temperature, touch this support so that this support makes progress circuit supported plate bullet fall on this fixed frame.
Description of drawings
Fig. 1 is the schematic diagram of most preferred embodiment electronic component carrier of the present invention in a reflow soldering.
Fig. 2 is the temperature/time chart in the reflow soldering among Fig. 1.
Fig. 3 is the schematic diagram of the touch device in clamping one circuit board and the reflow soldering on Fig. 1 electronic component carrier.
Fig. 4 is for fixing the schematic diagram of a circuit board on the second embodiment of the present invention electronic component carrier.
Fig. 5 is the schematic diagram of third embodiment of the present invention electronic component carrier.
Fig. 6 is the flow chart that utilizes the method that the third embodiment of the present invention disassembles the electronic component on the circuit board.
The schematic symbol explanation
10,40,70 electronic component carriers, 12,72 fixed frames
14,74 clampers, 16 circuit boards
18,78 impactors, 20,80 carriers
More than 22 electronic component 24, more than 84 mesh
28 supports, 30 bracket grooves
32 support buttons, 34 trigger housings
36 stuck-fingers, 38 touch devices
42 circuit board fixed frames, 44 circuit board holders
46 first grooves, 47 second grooves
50 springs, 58 first supports
59 second supports 60 the 3rd support
61 first bracket grooves, 62 second bracket grooves
63 the 3rd bracket grooves, 64 first support buttons
65 second support buttons, 76 Temperature Detectors
90 reflow solderings, 92 conveying devices
The specific embodiment
Electronic component carrier of the present invention is used in the reflow soldering, please refer to Fig. 1, Fig. 1 is the schematic diagram of most preferred embodiment electronic component carrier 10 of the present invention in a reflow soldering (reflow oven) 90, place a circuit board 16 in the electronic component carrier 10, which is provided with that a plurality of (Surfacemounting technology is SMT) attached to the electronic component on the circuit board 16 (shown in the dotted line) 22 with surface mounting technique.Reflow soldering 90 comprises a touch device 38 (being presented at Fig. 3) and a conveying device 92, and conveying device 92 is used for delivering electronic components carrier 10.Please refer to Fig. 2, Fig. 2 is the temperature/time chart in the reflow soldering 90, and wherein transverse axis is represented time, longitudinal axis representation temperature.Reflow soldering 90 is activated when time t0, temperature in the reflow soldering 90 can rise gradually subsequently, during to time t1, temperature in the reflow soldering 90 rise rapidly and are maintained to 220-240 Celsius approximately and spend a period of time, and this temperature can make on the circuit board 16 to be used for the scolding tin that a plurality of electronic components 22 are electrically connected on the circuit board 16 is begun to melt.Be unlikely injury circuit board 16 again in order to ensure the scolding tin on the circuit board 16 when all melting and make its crooked or distortion, behind time t2, the temperature in the reflow soldering 90 descends gradually.
Please refer to Fig. 3, Fig. 3 is the schematic diagram of touch devices 38 in electronic component carrier 10 and the reflow soldering 10 among Fig. 1, and touch device 38 comprises a trigger housing 34 and a stuck-finger 36, and use that it is concrete and usage back repeat.Electronic component carrier 10 comprises a fixed frame 12, a clamper 14 is fixed on the fixed frame 12, be used for a end with the circuit board 16 in the electronic component carrier 10 and be clamped in fixed frame 12, an impactor 18 and be used for temperature height reflow soldering 90 in when the time of a predetermined temperature, shake-up circuit board 16 is to shake a plurality of electronic components 22 on the circuit board 16 reflow soldering 90 in.Electronic component carrier 10 comprises a carrier 20 in addition and is located on the fixed frame 12, be used to carry from the circuit board 16 shake the electronic component 22 that falls, carrier 20 is provided with a plurality of mesh 24, the size of each mesh 24 is all less than the size of arbitrary electronic component 22 on the circuit board 16, that is to say, the size of mesh 24 will even as big as allow hot blast that reflow soldering 90 sent by and again little of not allowing the electronic component 22 that from circuit board 16, is fallen drop to outside the electronic component carrier 10 by shake.In addition, the degree of depth of carrier 20 wants to make electronic component 22 on the circuit board 16 when being fallen by impactor 18 shakes, is unlikelyly touched circuit board 16 by the bottom surface resilience of carrier 20.Clamper 14 can be a rubber-like sheet metal.
The impactor 18 of electronic component carrier 10 comprises a support 28, be located on the fixed frame 12, the other end that is used for not being held on the circuit board 16 with clamper 14 clampings device 14 clampings supports to a predetermined altitude, the other end that this predetermined altitude wants to make circuit board 16 is no longer by 28 time-outs of support, can strike fixed frame 12 against the screen resilience of rubber-like clamper 14, so that a plurality of electronic components 22 on the circuit board 16 are fallen in the carrier 20 by shake when being able to melts soldering tin on circuit board 16.Impactor 18 comprises in addition that a bracket groove 30 is used for containment bracket 28 and a support button 32 is used for support 28 is fastened in the bracket groove 30.
One end of the stuck-finger 36 in the touch device 38 of reflow soldering 90 is fixed on the trigger housing 34, the other end then is used for time that temperature in reflow soldering 90 is higher than this predetermined temperature greater than this during length scheduled time, touch support 28 so that support 28 circuit supported plate 16 bullets that make progress are fallen on the fixed frame 12, that is to say (please also refer to Fig. 2), during as time t2 or near t2, temperature in the reflow soldering 90 can make the scolding tin on the circuit board 16 all melt, and stuck-finger 36 touches the support 28 of support circuit plate 16 at this moment, an end of being propped by support 28 on the circuit board 16 is fallen on the fixed frame 12 because of the rebound effect power bullet of clamper 14, and a plurality of electronic components 22 on the circuit board 16 can be fallen in the carrier 20 of electronic component carrier 10 by shake because of inertial force at this moment.
Use most preferred embodiment electronic component carrier 10 of the present invention that the program description that a plurality of electronic components 22 on the circuit board 16 disassemble is as follows, when the service routine of explanation electronic component carrier 10, please also refer to Fig. 2: at first, in a plurality of electronic components 22 mode down on the circuit board 16, an end of circuit board 16 is clamped in clamper 14; Then, utilize support 28 in the impactor 18 that the other end of circuit board 16 is propped up and play this predetermined altitude; Then, the electronic component carrier 10 that includes circuit board 16 is placed the ad-hoc location on the conveying device 92 of reflow soldering 90 after, when time t0, start reflow soldering 90; Through the process of one section preheating, the moisture in the electronic component 22 on the circuit board 16 dissipates gradually, and the temperature in the reflow soldering 90 rises rapidly when time t1 and is maintained to temperature T, and the scolding tin on the circuit board 16 begins fusing at this moment; After having passed through this special time length (about 5-10 second), scolding tin on the circuit board 16 will all melt, meanwhile, conveying device 92 also has been transported to the electronic component carrier 10 on it position that stuck-finger 36 in touch device 38 just can touch support 28, along with conveying device 92 continue advance, the end of being propped by support 28 that stuck-finger 36 just touches support 28 circuit supported plate 16 so that it makes progress strikes on the fixed frame 12, as previously mentioned, the power of this bump is enough to make all electronic components 22 on the circuit board 16 to be fallen on the carrier 20 by shake.Because carrier 20 has certain degree of depth, can be so shaken a plurality of electronic components 22 of falling on the carrier 20 again by rebounding on the carrier 20 and touching circuit board 16; At last, when time t2, temperature in the reflow soldering 90 descends, electronic component dismounting person just can will include empty circuit board 16 and previous electronic component carrier 10 taking-ups attached to a plurality of electronic components 22 on the circuit board 16 from conveying device 92, and be placed in the proper container after the detin processing that 22 processes of the electronic component in the electronic component carrier 10 are suitable, in order to re-using in the future.
All elements in the most preferred embodiment electronic component carrier of the present invention 10, for example fixed frame 12, support 28 or stuck-finger 36 etc. are resistant to elevated temperatures material and make.Impactor 18 shown in the embodiments of the invention only is a kind of in numerous shaking devices, and in other words, every source that circuit board 16 vibrations are provided all can be the shaking device in the electronic component carrier 10 of the present invention.But what need pay special attention to is, shaking device in any electronic component carrier 10 must touch circuit board 16 during with the whole melts soldering tin on the circuit board 16 at reflow soldering 90, and the power of its shake-up will be the emphasis of consideration so that electronic component 22 on the circuit board 16 is fallen by shake.
Please refer to Fig. 4, Fig. 4 is the schematic diagram of second embodiment of the present invention electronic component carrier 40.The structure of the structure of electronic component carrier 40 and the electronic component carrier 10 among Fig. 3 is roughly the same, and main difference is that electronic component carrier 40 does not comprise clamper 14, support 28, bracket groove 30 or support and buckles 32, and electronic component carrier 40 is to comprise a circuit board fixed frame 42 and a circuit board holder 44 in addition on the contrary.In the present embodiment, circuit board 16 utilizes circuit board holder 44 to be fixed on the circuit board fixed frame 42.Circuit board holder 42 is provided with one first groove 46 and two second grooves 47, as shown in Figure 4, first groove 46 is arranged on an end of circuit board fixed frame 42, second groove 47 then is arranged on the position apart from the other end one preset distance of circuit board fixed frame 42, and the concrete function back of first groove 46 and second groove 47 repeats.Be noted that in addition the impactor of electronic component carrier 40 is not also if only comprise single support 28 as the impactor 18 of electronic component carrier 10, the impactor of electronic component carrier 40 comprises one first support 58, one second support 59, reaches one the 3rd support 60.In the present embodiment, fixed frame 12 is provided with corresponding to the bracket groove 61-63 of each support and support button 64,65, yet note that only the 3rd support 60 does not have corresponding support button.First support 58 and second support 59 are arranged on the position that corresponds respectively to first groove 46 and second groove 47 on the circuit board fixed frame 42 on the fixed frame 12, are used for propping jointly circuit board fixed frame 42.And an end of the 3rd support 60 is arranged in the 3rd groove 63, and the other end of the 3rd support 60 then is used to accept the shake-up of touch device 38.The height of first support 58 and second support 59 approximates this preset distance, can guarantee that so just a plurality of electronic components 22 on the circuit board 16 are unlikely bullet and fall outside the circuit board fixed frame 42 when being fallen by shake.The impactor of electronic component carrier 40 comprises the elastic material 50 of spring and so in addition, it is located at corresponding in the bracket groove 62 of second support 59 and be connected to second support 59, be used for being touched device 38 shake-up backs and circuit board fixed frame 42 bullets fallen fixed frame 12, fall in the circuit board fixed frame 42 so that a plurality of electronic components 22 on the circuit board 16 are able to be shaken with the elastic force of itself at the 3rd support 60.
Use program that second embodiment of the present invention electronic component carrier 40 disassembles a plurality of electronic components 22 on the circuit board 16 with previous roughly the same: at first in the program described in the most preferred embodiment, use the circuit board holder 44 on the circuit board fixed frame 42 that circuit board 16 is fixed on the circuit board fixed frame 42, then first support 58 and second support 59 are set in respectively in first groove 46 and second groove 47 on the circuit board fixed frame 42, and utilize the 3rd support 60 with 42 height that play this preset distance of circuit board fixed frame, this moment, one end (part shown in the arrow A) of the 3rd support 60 propped up second support 59, thus, circuit board fixed frame 42 is fallen on the fixed frame 42 with regard to being unlikely because of the screen resilience bullet of spring 50; And then the electronic component carrier 40 that will include circuit board 16 is sent into reflow soldering 90, when before the temperature in the reflow soldering 90 arrived this predetermined temperature, the conveying devices 92 in the reflow soldering 90 also had been transported to electronic component carrier 40 position that the stuck-finger 36 that makes touch device 38 just will touch the 3rd support 60.After the 3rd support 60 was touched by stuck-finger 36, an end that props up second support 59 on the 3rd support 60 can move towards the direction of arrow B, till it no longer props up second support 59.When the support source of second support 59 disappears, circuit board fixed frame 42 will be fallen on the fixed frame 42 because of the screen resilience bullet of spring 50, and will by shake be fallen carrier 20 in by the electronic component 22 that circuit board holder 44 is fixed on the circuit board 16 on the circuit board fixed frame 42 this moment.
Use third embodiment of the present invention electronic component carrier 70 that program and previous described program that a plurality of electronic components 22 on the circuit board 16 disassemble is roughly the same, the electronic component carrier 70 in the different just present embodiments does not need with reflow soldering 90 close interaction is arranged.Please refer to Fig. 6, the flow chart of the method that Fig. 6 disassembles a plurality of electronic components 22 on the circuit board 16 for third embodiment of the present invention electronic component carrier 70, it comprises following step:
Step 100: beginning;
Step 110:, an end of circuit board 16 is clamped in the clamper 74 of electronic component carrier 70 in a plurality of electronic components 22 mode down on the circuit board 16;
Step 120: the electronic component carrier 70 that will include circuit board 16 places in the reflow soldering 90;
Step 130: when the temperature in Temperature Detector 76 detects reflow soldering 90 reached this predetermined temperature, the impactor 78 of electronic component carrier 70 can impact fixed frame 72 or circuit board 16;
(when the temperature in the reflow soldering 90 reaches this predetermined temperature, scolding tin on the circuit board 16 is fusing all, therefore, when impactor 78 meanwhile impacts fixed frame 72, certainly also can impact circuit board 16 jointly, so the electronic component 22 on the circuit board 16 will be fallen on the carrier 80 by shake.)
Step 140: finish.
(can take out electronic component carrier 70 this moment in reflow soldering 90, and shake dropped on be placed in the proper container after electronic components 22 in the electronic component carrier 70 are handled through suitable detins, in order to re-using in the future.)
The Temperature Detector 76 of electronic component carrier 70 can be adopted the warming method of electronic temperature sensing, mechanical temperature-sensitive or other any kind of in the third embodiment of the invention, with the work of control impactor 78.With mechanical warming method is example, and Temperature Detector 76 can utilize the characteristic of the thermal expansion of metal, and just length and this strip metal the length when this predetermined temperature of the length of a strip metal when room temperature can be unequal, controls the action of impactor 78.In addition, the impactor 78 shown in Fig. 5 only is the simplest a kind of impactor, so long as the impactor that can be according to variation of temperature any object be produced an impulsive force is all scope disclosed in this invention.
With the technology that the electronic component on the circuit board disassembles being compared with heat gun or flatiron scalp acupuncture etc. of routine, electronic component carrier 10 of the present invention (also comprising electronic component carrier 40,70 certainly) has following advantage at least:
1) all elements in low cost of manufacture-electronic component carrier 10 combine by simple metal die, and therefore maintenance is easy, and service life is extremely long;
2) can place many group electronic component carriers 10 on high efficiency-conveying device 92, and all electronic components 22 can be removed once when impactor 18 vibrations circuit boards 16 all on the circuit board 16 in the electronic component carrier 10;
3) control of temperature and time is wanted easily far beyond the temperature and the air quantity control of the hot blast that conventional heat gun sent in product yield height-reflow soldering 90, therefore the electronic component 16 on the circuit board 16 can not crossed low can't being removed because of the temperature in the reflow soldering 90, can be because of too high damage of temperature in the reflow soldering 90 yet;
4) with non-removable electronic component, for example previously mentioned connector, switch etc., become dismountable-because that circuit board 16 strikes the inertial force that fixed frame 12 produced is all quite regular for each electronic component 22 on the circuit board 16, so the plastic material electronic component 22 that is disassembled from the circuit board 16 can have higher utilization rate;
5) the electronic component dismounting person of simple to operate-use electronic component carrier 10 of the present invention only need learn electronic component carrier 10 is seated on the conveying device 92, start reflow soldering 90, after a period of time, electronic component carrier on the conveying device 92 10 is taken out, can be used again after again 22 detins of the electronic component in it being cleaned.
The above only is preferred embodiment of the present invention, and all equivalences of carrying out according to claim of the present invention change and revise, and all should belong to covering scope of the present invention.
Claims (24)
1. electronic component carrier, it comprises:
One fixed frame;
One clamper is fixed on this fixed frame, is used for a circuit board is clamped in this fixed frame, and wherein, this circuit board has an electronic component at least;
One impactor, when being used for temperature in a reflow soldering and arriving a predetermined temperature, shake this electronic component on this circuit board that falls in this reflow soldering; And
One carrier is located on this fixed frame, be used to carry from this circuit board shake this electronic component of falling.
2. electronic component carrier as claimed in claim 1, wherein this carrier is provided with a plurality of mesh, and the size of those mesh is all less than the size of this electronic component on this circuit board.
3. electronic component carrier as claimed in claim 1, wherein this clamper is an elastic sheet metal.
4. electronic component carrier as claimed in claim 3, wherein this impactor comprises:
One support is located on this fixed frame, is used for an end of this circuit board of this clamper clamping is supported to a predetermined altitude;
One bracket groove is used to hold this support; And
One support button is used for this support is fastened in this bracket groove.
5. electronic component carrier as claimed in claim 4, wherein this reflow soldering comprises a touch device, is used for touching this support so that this circuit board bullet of this stent support is fallen this fixed frame when temperature in this reflow soldering arrives this predetermined temperature.
6. electronic component carrier as claimed in claim 5, wherein this touch device comprises a trigger housing and a stuck-finger, one end of this stuck-finger is fixed on this trigger housing, the other end of this stuck-finger then is used for touching this support when temperature in this reflow soldering arrives this predetermined temperature, so that this circuit board bullet that this support supported is fallen on this fixed frame.
7. electronic component carrier as claimed in claim 1, wherein this electronic component on this circuit board with surface mounting technique attached on this circuit board.
8. electronic component carrier as claimed in claim 1, wherein this reflow soldering comprises a conveying device, is used for carrying in this reflow soldering this fixed frame.
9. electronic component carrier, it is used in the reflow soldering, and this reflow soldering comprises a touch device, and this electronic component carrier comprises:
One fixed frame;
One clamper is fixed on this fixed frame, is used for a circuit board is clamped in this fixed frame, and wherein, this circuit board has an electronic component at least;
One impactor, when being used for temperature in this reflow soldering and arriving a predetermined temperature, by the touch device shake-up of this reflow soldering with fall this electronic component on this circuit board of shake; And
One carrier is located on this fixed frame, be used to carry from this circuit board shake this electronic component of falling.
10. electronic component carrier, it comprises:
One fixed frame;
One circuit board fixed frame;
One clamper is fixed on this circuit board fixed frame, is used for a circuit board is clamped in this circuit board fixed frame, and wherein, this circuit board has an electronic component at least;
One impactor, when being used for temperature in a reflow soldering and arriving a predetermined temperature, shake this electronic component on this circuit board that falls in this reflow soldering; And
One carrier is located on this fixed frame, be used to carry from this circuit board shake this electronic component of falling.
11. electronic component carrier as claimed in claim 10, wherein this carrier is provided with a plurality of mesh, and the size of those mesh is all less than the size of this electronic component of this circuit board.
12. electronic component carrier as claimed in claim 10, wherein this clamper is an elastic sheet metal.
13. electronic component carrier as claimed in claim 12, wherein this impactor comprises an elastic material, one first support, one second support, reaches one the 3rd support, all be located on this fixed frame, this first support and this second support are used for this circuit board fixed frame is supported to a predetermined altitude, the 3rd support props up this second support in order to prop at this second support when this circuit board fixed frame reaches this predetermined altitude, so that this circuit board fixed frame of this second stent support.
14. electronic component carrier as claimed in claim 13, wherein this reflow soldering comprises a touch device, is used for touching when temperature in this reflow soldering arrives this predetermined temperature the 3rd support, with so that this circuit board holder bullet fall on this fixed frame.
15. electronic component carrier as claimed in claim 14, wherein this touch device comprises a trigger housing and a stuck-finger, one end of this stuck-finger is fixed on this trigger housing, the other end of this stuck-finger then is used for touching the 3rd support when temperature in this reflow soldering arrives this predetermined temperature, so that this circuit board holder bullet is fallen on this fixed frame.
16. electronic component carrier as claimed in claim 10, wherein this electronic component on this circuit board with surface mounting technique attached on this circuit board.
17. electronic component carrier as claimed in claim 10, wherein this reflow soldering comprises a conveying device, is used for carrying in this reflow soldering this fixed frame.
18. an electronic component carrier, it comprises:
One fixed frame;
One clamper is fixed on this fixed frame, is used for a circuit board is clamped in this fixed frame, and wherein, this circuit board comprises an electronic component at least;
One Temperature Detector is used to detect this circuit board temperature on every side;
One impactor is used for impacting this fixed frame or this circuit board when this Temperature Detector detects temperature around this circuit board and reaches at a predetermined temperature; And
One carrier is located on this fixed frame, be used to carry from this circuit board shake this electronic component of falling.
19. electronic component carrier as claimed in claim 18, wherein this carrier is provided with a plurality of mesh, and the size of those mesh is all less than the size of this electronic component on this circuit board.
20. the method that the electronic component on the circuit board is disassembled, it comprises:
One electronic component carrier is provided;
This circuit board is fixed on this electronic component carrier;
Temperature around this circuit board is heated to a predetermined temperature;
When the temperature around this circuit board reaches in this predetermined temperature, impact this electronic component carrier or this circuit board, so that this electronic component on this circuit board is fallen in this electronic component carrier by shake;
21. method as claimed in claim 20, wherein this predetermined temperature is the fusing point of scolding tin.
22. method as claimed in claim 20, wherein this electronic component carrier comprises a plurality of mesh, and the size of those mesh is all less than the size of this electronic component on this circuit board.
23. method as claimed in claim 19, it comprises in addition provides a Temperature Detector, is used to detect this circuit board temperature on every side.
24. method as claimed in claim 19, it comprises in addition provides an impactor, is used for impacting when this circuit board temperature on every side reaches this predetermined temperature this fixed frame or this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031550576A CN100427273C (en) | 2003-08-26 | 2003-08-26 | Electronic component carrier and method for shattering and loading electronic components on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031550576A CN100427273C (en) | 2003-08-26 | 2003-08-26 | Electronic component carrier and method for shattering and loading electronic components on circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1590032A true CN1590032A (en) | 2005-03-09 |
| CN100427273C CN100427273C (en) | 2008-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031550576A Expired - Fee Related CN100427273C (en) | 2003-08-26 | 2003-08-26 | Electronic component carrier and method for shattering and loading electronic components on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100427273C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101370375B (en) * | 2007-08-17 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Positioning device |
| CN102152042A (en) * | 2011-03-07 | 2011-08-17 | 苏州工业园区宏创科技有限公司 | Universal load device for loading single-side mainboard |
| CN104690388A (en) * | 2013-12-05 | 2015-06-10 | 珠海格力电器股份有限公司 | Device and method for recovering tin on circuit board |
| CN105327934A (en) * | 2015-12-11 | 2016-02-17 | 珠海格力电器股份有限公司 | Waste circuit board element removing system and process |
| CN109249108A (en) * | 2018-10-22 | 2019-01-22 | 伟创力电子技术(苏州)有限公司 | Track Crashworthy plate device before reflow soldering |
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| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| JP3460480B2 (en) * | 1996-11-29 | 2003-10-27 | 松下電器産業株式会社 | Apparatus and method for separating electronic components and solder from printed circuit board |
| FR2781706B1 (en) * | 1998-07-30 | 2000-08-25 | Air Liquide | METHOD OF BRAZING BY REFUSION OF ELECTRONIC COMPONENTS AND BRAZING DEVICE FOR CARRYING OUT SUCH A METHOD |
| FR2826231B1 (en) * | 2001-06-19 | 2006-07-07 | Wavecom Sa | METHOD FOR ASSEMBLING AND / OR DISASSEMBLING AN ELECTRONIC MODULE ON AN APPLICATION CARD, MANUFACTURING METHOD AND CORRESPONDING MECHANICAL HOLDING CLIP |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101370375B (en) * | 2007-08-17 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Positioning device |
| CN102152042A (en) * | 2011-03-07 | 2011-08-17 | 苏州工业园区宏创科技有限公司 | Universal load device for loading single-side mainboard |
| CN104690388A (en) * | 2013-12-05 | 2015-06-10 | 珠海格力电器股份有限公司 | Device and method for recovering tin on circuit board |
| CN105327934A (en) * | 2015-12-11 | 2016-02-17 | 珠海格力电器股份有限公司 | Waste circuit board element removing system and process |
| CN109249108A (en) * | 2018-10-22 | 2019-01-22 | 伟创力电子技术(苏州)有限公司 | Track Crashworthy plate device before reflow soldering |
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| CN100427273C (en) | 2008-10-22 |
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