CN1585573A - Planar display device and its manufacture - Google Patents
Planar display device and its manufacture Download PDFInfo
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- CN1585573A CN1585573A CNA2004100582456A CN200410058245A CN1585573A CN 1585573 A CN1585573 A CN 1585573A CN A2004100582456 A CNA2004100582456 A CN A2004100582456A CN 200410058245 A CN200410058245 A CN 200410058245A CN 1585573 A CN1585573 A CN 1585573A
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- adhesive linkage
- panel display
- wiring
- display apparatus
- supporting substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Abstract
To prevent the wiring disorder of a draw-out wiring of a flat panel display device caused by corrosion or a migration phenomenon. The flat panel display device 10 has a sealed space 4 in which a display function part is arranged, formed on a supporting base plate 1 by sticking the supporting base plate 1 and a sealing member 2 through an adhesion layer 3, and a draw-out wiring 5 drawn outside the sealed space 4 through the adhesion layer 3, forming a prescribed wiring pattern on the supporting base plate 1 outside the sealed space 4. The vicinity of the adhesion layer 3 of the draw-out wiring 5 is covered by a cover layer 6, and a lamination part A is formed by superposing the adhesion layer 3 and the cover layer 6. The width W of the lamination part A is made thicker than the thicknesses d1, d2 of the adhesion layer 3 or the cover layer 6, and the thickness D of the lamination part A is made at least thicker than the thickness d2 of the cover layer 6.
Description
Technical field
The present invention relates to a kind of panel display apparatus and manufacture method thereof.
Background technology
In recent years, as the display part of various electronic equipments or be configured in the display unit of indoor and outdoor, panel display apparatus is extensively adopted in beginning.As this panel display apparatus, liquid crystal indicator (LCD:Liquid Crystal display), plasma display system (PDP:PlasmaDisplay Panel), organic EL (electroluminescence) display unit, field emission display unit various products such as (FED:Field Emission Display) have been developed.
Though the displaying principle of these panel display apparatus is different, all has the structure that on supporting substrate, forms seal cavity.The effect in sealing space is according to the displaying principle of each display unit and difference, but forms in seal cavity on the Presentation Function portion this point, and each display unit has common structure.Therefore, these panel display apparatus have following same structure: form the lead-out wiring that the electrode that formation is formed on the Presentation Function portion in the seal cavity is drawn out to outside the seal cavity and connects drive circuit on supporting substrate.
On the other hand, minitype high-performanceization or the raising display performance of these panel display apparatus in order to realize electronic equipment, advance, correspondingly have to carry out the graph thinning and the densification of the electrode and the lead-out wiring of Presentation Function portion to colorize, high-resolution direction.At this moment,,, have to select the specific electrodes material, but as the material of lead-out wiring, selecting low electrical resistant material as much as possible is very important to improving display performance in order to ensure good display performance as the electrode that constitutes Presentation Function portion.
Generally, use aluminium (Al) or chromium (Cr) series material, but, require to use lower silver (Ag) or the silver alloy of resistance along with the propelling of the graph thinning of wiring as low-resistance wiring material.But the Ag series material is compared easy corrosion with Al or Cr, for example in the example in the past of patent documentation 1 record, utilizes the laminated body of the layer that has the layer that is made of Ag or Ag alloy and be made of Cu or Cu alloy to form lead-out wiring.
Patent documentation 1 spy opens the 2003-58079 communique
As above-mentioned example in the past, lead-out wiring is formed double-decker, form Cu series metal layer on the top layer, can prevent the deterioration that the corrosion of the layer that constitutes because of the Ag series material causes thus.But, when the Ag series material is used for the wiring material of high-density wiring, not only exist the problem of deterioration, but also exist the problem that transport phenomena takes place.Lasting existence along with this transport phenomena; metal is moved at supporting substrate from the bottom or the sidepiece of the wiring that contacts with the supporting substrate that is made of insulating material; cause and being connected of adjacent wire; form protective layer so only rely on the top layer, can not prevent that the wiring that causes because of this transport phenomena is bad.
Bad for fear of the wiring that causes because of this transport phenomena, can think that the insulating material that utilize to be difficult for the produces migration whole covering of will connect up is an effective method.; on supporting substrate, have in the panel display apparatus of seal cavity; by adhesive linkage seal member is bonded in and forms seal cavity on the supporting substrate; the end of sealing parts is installed into its part sometimes and covers on the lead-out wiring of drawing from adhesive linkage; so in this case; can not the lead-out wiring that be positioned at below this end be covered fully, after drawing, produce at lead-out wiring easily and cover bad position (extending part of lead-out wiring) from adhesive linkage.
Promptly, in the lead-out wiring of the panel display apparatus that constitutes by Ag low series resistance material that carries out high-density wiring, adhering state according to seal member, behind the adhesive linkage lead-out wiring of the outer rim that forms seal cavity, form the state that wiring is exposed, have because of the corrosion deterioration or be easy to generate the bad problem of wiring that causes because of transport phenomena etc.
Summary of the invention
The present invention will address this is that as a problem.Promptly, the objective of the invention is to, lead-out wiring at panel display apparatus, after drawing, cover fully from the adhesive linkage of the outer rim that forms seal cavity, thereby the formation high-density wiring, even when using Ag low series resistance material, it is bad also can not produce the wiring that causes because of the corrosion deterioration or because of transport phenomena etc., and, provide a kind of high meticulous and difficult generation wiring bad panel display apparatus thus.
In order to achieve the above object, panel display apparatus of the present invention and manufacture method thereof possess the structure of the following invention at least.
Panel display apparatus of the present invention is, by using bonding supporting substrate of adhesive linkage and seal member, on described supporting substrate, form seal cavity, and in the sealing space, form Presentation Function portion, it is characterized in that, have: lead-out wiring, be drawn out to outside the described seal cavity by described adhesive linkage from the electrode that constitutes described Presentation Function portion, on the supporting substrate of described seal cavity outside, form the wiring figure of regulation; And cover layer, be located near the described at least adhesive linkage of this lead-out wiring, cover described lead-out wiring, described adhesive linkage and described tectal laminate portion have been formed overlapping, the width of this laminate portion is more than or equal to described adhesive linkage or described tectal thickness, and the thickness of described laminate portion is at least more than or equal to described tectal thickness.
The manufacture method of panel display apparatus of the present invention, be used for making by using bonding supporting substrate of adhesive linkage and seal member, on described supporting substrate, form seal cavity, and in the sealing space, form the panel display apparatus of Presentation Function portion, it is characterized in that, for being drawn out to outside the described seal cavity by described adhesive linkage from the electrode that constitutes described Presentation Function portion, and the lead-out wiring of the wiring figure that formation is stipulated on the supporting substrate outside described seal cavity, near described adhesive linkage, form the cover layer that covers this lead-out wiring, described adhesive linkage and described tectal laminate portion have been formed overlapping, the width that makes this laminate portion is more than or equal to described adhesive linkage or described tectal thickness, and the thickness that makes described laminate portion is at least more than or equal to described tectal thickness.
Description of drawings
Fig. 1 is the feature structure key diagram partly of the panel display apparatus of expression an embodiment of the present invention.
Fig. 2 is the key diagram of manufacture method of the panel display apparatus of explanation embodiment of the present invention.
Fig. 3 is the panel display apparatus of explanation other execution modes of the present invention and the key diagram of manufacture method thereof.
Fig. 4 is the key diagram of the organic EL display unit of expression embodiments of the present invention.
Among the figure: 1 ... support component; 2 ... seal member; 3 ... adhesive linkage; 4 ... seal member; 5 ... lead-out wiring; 6 ... cover layer; A ... laminate portion; W ... the width of laminate portion; D1 ... the thickness of adhesive linkage; D2 ... tectal thickness; D ... the thickness of laminate portion; S ... bonding region.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Fig. 1 is the feature structure key diagram partly of the panel display apparatus of expression one embodiment of the present invention.In the figure, panel display apparatus 10 forms seal cavity 4 thus by adhesive linkage 3 bonding supporting substrate 1 and seal members 2 on supporting substrate 1, and forms the illustrated Presentation Function of omission portion at seal cavity 4.
And, lead-out wiring 5 is drawn out to seal cavity 4 outsides from the electrode that constitutes the illustrated Presentation Function of omission portion by adhesive linkage 3, on the supporting substrate 1 of seal cavity 4 outsides, form the wiring figure of regulation, and the cover layer 6 that covers lead-out wiring 5 be located at lead-out wiring 5 adhesive linkage at least 3 near.In addition, the laminate portion A that formation is formed by stacking adhesive linkage 3 and cover layer 6, the width W of this laminate portion A forms more than or equal to the thickness d 1 of adhesive linkage 3 or the thickness d 2 of cover layer 6, and the thickness D of laminate portion A forms at least the thickness d 2 more than or equal to cover layer 6.Special in the execution mode of Fig. 1, laminate portion A forms by the Outboard Sections superimposed layer cover layer 6 at adhesive linkage 3.
As this panel display apparatus 10, can be used as the display part of electronic equipments such as mobile phone, personal computer, digital camera, also can be used as display unit and be configured in indoor and outdoor separately.
And, as the Presentation Function portion that is formed at seal cavity 4, constitute by display panels, organic EL display panel, PDP, FED etc., for example, under situation about being made of display panels, seal cavity 4 becomes the space of filling liquid crystal material, under situation about constituting by organic EL display panel, seal cavity 4 becomes organic EL and the exhausted space of outer air bound, and under situation about being made of PDP, seal cavity 4 becomes the space that forms discharge cell.
According to panel display apparatus 10 with this feature, be provided with the laminate portion A that adhesive linkage 3 and cover layer 6 are formed by stacking, so lead-out wiring 5 can not expose at least, can get rid of near the corrosion of the lead-out wiring 5 that the outboard end of seal member 2, is easy to generate or bad because of moving the wiring cause near adhesive linkage 3.Thus, make the wiring figure densification of lead-out wiring 5, realizing under the situation of graph thinning of each wiring, can use low electrical resistant material such as Ag and do not worry connecting up bad, so can guarantee the conduction of lead-out wiring 5 well, can improve the display performance of panel display apparatus 10.
At this moment, the size relationship of the thickness d 2 of the thickness d 1 of the width W of laminate portion A and adhesive linkage 3, cover layer 6 is W 〉=d1 or W 〉=d2.This generally is to be formed by different materials because of adhesive linkage 3 and cover layer 6, and the composition surface of laminate portion A becomes the joint between the different materials, but is difficult to guarantee enough bonding forces.Therefore, in order to ensure enough bonding forces and do not produce exposing of lead-out wiring, need form laminate portion A according to above-mentioned size relationship with enough width.
And the size relationship of the thickness D of laminate portion A and the thickness d 2 of cover layer 6 is D 〉=d2.This relation must realize by forming laminate portion A as shown in the figure; therefore; even the laminate portion of unlike material also can reliably completely cut off lead-out wiring 5 and outer gas, can fully guarantee the defencive function of relative moisture etc. thus near adhesive linkage 3 at least.
Fig. 2 is the key diagram of manufacture method of the panel display apparatus 10 of the above-mentioned execution mode of explanation.The manufacture method of present embodiment is to be used for making by adhesive linkage 3 bonding supporting substrate 1 and seal members 2, on described supporting substrate 1, form seal cavity 4 thus, and in the sealing space 4 manufacture methods that form to omit the panel display apparatus 10 of illustrated Presentation Function portion, for being drawn out to outside the seal cavity 4 by adhesive linkage 3 from the electrode that constitutes the illustrated Presentation Function of omission portion, and the lead-out wiring 5 of the wiring figure that formation is stipulated on the supporting substrate 1 of seal cavity 4 outsides, be formed near the cover layer 6 of the covering lead-out wiring 5 of adhesive linkage 3, the laminate portion A that formation is formed by stacking adhesive linkage 3 and cover layer 6, the width W of laminate portion A forms the thickness d 1 more than or equal to adhesive linkage 3 or cover layer 6, d2, and the thickness D of laminate portion A forms at least the thickness d 2 more than or equal to cover layer 6.Particularly, in execution mode shown in Figure 2, the formation of laminate portion A is after forming adhesive linkage 3, at the Outboard Sections superimposed layer cover layer 6 of adhesive linkage 3.
Below, be described in detail according to Fig. 2.Herein, be that example describes with following formation method, promptly, bonding by supporting substrate 1 and seal member 2 forms a plurality of seal cavities on supporting substrate 1, cut off at the position of setting seal member 2 in bonding back, but, be not limited thereto as embodiments of the present invention.
At first, in (a) of this figure, on supporting substrate 1, utilize the wiring figure of regulation to form lead-out wiring 5.The formation of lead-out wiring 5 can form in the operation identical with the electrode that constitutes Presentation Function portion, also can only form wiring figure 5 in addition.By this lead-out wiring 5 is directly drawn or it is connected with electrode from the electrode that constitutes Presentation Function portion, on supporting substrate 1, form figure.
To this, shown in this figure (b), the seal member 2 that has applied adhesive linkage 3 is bonded on the supporting substrate 1 Face to face.In seal member 2,, be formed for forming the sealing recess 2A of seal cavity 4, around it, apply adhesive linkage 3 with supporting substrate 1 facing surfaces.The coating zone outside at adhesive linkage 3 forms cut-out recess 2B., be illustrated in the example that seal member 2 sides form adhesive linkage 3 herein, but also can form adhesive linkage 3 at the bonding region of supporting substrate 1 side.
Shown in this figure (c), when bonding supporting substrate 1 and seal member 2, push supporting substrate 1 and seal member 2, so that adhesive linkage 3 is exuded to the outside.Thus, the 3a of the portion of oozing out with width of the width W that is equivalent to above-mentioned laminate portion A is formed on and cuts off with in the recess 2B.Cut off to form,, also can cut off well and be not subjected to the influence of adhesive linkage 3 at place of incision C even be formed with under this situation of oozing out the 3a of portion with recess 2B.
On supporting substrate 1, form adhesive linkage 3, utilize cut-out seal members 2 such as method of scoring being positioned at the place of incision C that cuts off with the end of recess 2B.Then, shown in this figure (d), utilize cover layer 6 to cover near the adhesive linkages 3 lead-out wiring 5, ooze out on the 3a of portion so that the end of cover layer 6 overlaps.And,, form laminate portion A by Outboard Sections superimposed layer cover layer 6 at adhesive linkage 3.At this moment,, can form the laminate portion A that width is W, and ooze out on the 3a of portion, and form the laminate portion A of above-mentioned thickness D by cover layer 6 is overlapped reliably by by width of guaranteeing to ooze out the 3a of portion noted earlier.
Fig. 3 is that the key diagram of explanation panel display apparatus of other execution modes of the present invention and manufacture method thereof (is given same-sign to the part identical with above-mentioned execution mode, and the clipped explanation.)。According to this execution mode, above-mentioned laminate portion A forms at the cover layer 6 superimposed layer adhesive linkages 3 of the bonding region S that forms adhesive linkage 3, be by after forming cover layer 6, carry out the formation of laminate portion A at the cover layer 6 superimposed layer adhesive linkages 3 of the bonding region S that forms adhesive linkage 3.
That is, shown in this figure (a), at first, the bonding region S that forms adhesive linkage 3 relatively as passing through bonding supporting substrate 1 and seal member 2 on supporting substrate 1 forms cover layer 6, so that end 6a enters its inboard.The width that is formed at the end 6a in the bonding region S herein forms the width W that is equivalent to above-mentioned laminate portion A.
Then, by bonding supporting substrate 1 and seal member 2,, form laminate portion A at the end of cover layer 6 6a superimposed layer adhesive linkage 3.Afterwards, the place of incision C in the outside of adhesive linkage 3 cuts off seal member 2.At this moment, not influenced by adhesive linkage 3, cut off, so there is no need to form the cut-out recess at seal member 2.
The panel display apparatus 10 of Xing Chenging is shown in this figure (c) like this, at the inboard laminate portion A with width W that forms of bonding region S, the size relationship of the thickness d 1 of width W, thickness D and the adhesive linkage of the laminate portion A of this moment or the thickness d 2 of cover layer 6 is W 〉=d1 or W 〉=d2, D 〉=d2.
Also can obtain the action effect identical according to this execution mode with above-mentioned execution mode.Promptly, be provided with the laminate portion A that adhesive linkage 3 and cover layer 6 are formed by stacking, so lead-out wiring 5 can not expose near adhesive linkage 3 at least, also can get rid of near the corrosion of the lead-out wiring 5 that the outboard end of seal member 2, is easy to generate or the wiring that causes because of migration bad.Thus, make the wiring figure densification of lead-out wiring 5, realizing under the situation of graph thinning of each wiring, can use low electrical resistant material such as Ag and do not worry connecting up bad, so can guarantee the conduction of lead-out wiring 5 well, can improve the display performance of panel display apparatus 10.
The wiring material of the lead-out wiring 5 in the respective embodiments described above be so long as low electrical resistant material can obtain above-mentioned effect, but preferably contain Ag, Al at least, Cu, Cr or from the metal or metal alloy that their alloy is selected more than one.No matter select which kind of wiring material, all near can get rid of adhesive linkage 3 wiring is bad, so the panel display apparatus of high reliability can be provided.
[embodiment]
Below, the organic EL display that forms organic EL display element as Presentation Function portion is described as embodiments of the invention.Fig. 4 is the key diagram of this organic EL display 20 of expression.
Basic structure by adhesive linkage 3 bonding supporting substrate 1 and seal members 2, forms seal cavity 4 thus, and forms the Presentation Function portion that is made of organic EL described later at seal cavity 4 as described in the above-mentioned execution mode on supporting substrate 1.
The Presentation Function portion that is made of organic EL has: be formed at the lower electrode 21 on the supporting substrate 1; Contain luminescent layer and be formed at organic material layer 23 on the lower electrode 21; Be formed on the upper electrode 24 on this organic material layer 23.In illustrated example, utilize insulating barrier 22 to divide lower electrode 21, the unit viewing area (20R, 20G, 20B) of organic EL is used in formation below lower electrode 21.And, drying part 25 is installed at the inner face of the seal member 2 that forms seal cavity 4.
And, lead-out wiring 5 connects the upper electrode 24 of Presentation Function portion, be drawn out to seal cavity 4 outsides by adhesive linkage 3, form the wiring figure of regulation on the supporting substrate 1 of seal cavity 4 outsides, the cover layer 6 that covers lead-out wiring 5 is located near the adhesive linkage at least 3 of lead-out wiring 5.And, forming the laminate portion A that adhesive linkage 3 and cover layer 6 are formed by stacking, the width W of this laminate portion A forms thickness d 1, the d2 more than or equal to adhesive linkage 3 or cover layer 6, and the thickness D of laminate portion A forms at least the thickness d 2 more than or equal to cover layer 6.
Herein, identical with the execution mode of Fig. 1, laminate portion A forms by the Outboard Sections superimposed layer cover layer 6 at adhesive linkage 3, and execution mode as shown in Figure 3 is such, also can be at the bonding region that forms adhesive linkage 3, at cover layer 6 superimposed layer adhesive linkages 3.
Can be set as follows as example of size, the width W of laminate portion A is 100～1000 μ m, and the thickness d 1 of adhesive linkage 3 is 10～100 μ m, and the thickness d 2 of cover layer 6 is 100～1000 μ m, and the thickness D of laminate portion A is about 1000 μ m.
Below, enumerate each inscape and manufacture method that concrete example illustrates the organic EL display 20 that embodiments of the invention relate to.
A. supporting substrate
As supporting substrate 1, preferably have the tabular or the laminar substrate of the transparency, its material can be used glass or plastics etc.
B. seal member
C. adhesive linkage
The bonding agent that forms adhesive linkage 3 can use bonding agents such as thermohardening type, chemosetting type (solvent pairs mixing), light (ultraviolet ray) curing type, and its material can use acrylic resin, epoxy resin, polyester, polyolefin etc.Preferred especially use does not need heat treated, is the high ultraviolet hardening epoxy resin adhesive of curable.
D. electrode
In the example of Fig. 4, lower electrode 21 as anode, as negative electrode,, but can be made as negative electrode or anode to upper electrode 24 to the either party in lower electrode 21, the upper electrode 24 in itself from lower electrode 21 side lamination hole transporting layer 23A, luminescent layer 23B, electron supplying layer 23C.As electrode material, anode is made of the material that work function is higher than negative electrode, can use the nesa coating of chromium (Cr), molybdenum (Mo), nickel (Ni), platinum metal films such as (Pt) or oxidized metal films such as ITO, IZO etc.And negative electrode is made of the material that work function is lower than anode, can use metal film, the polyaniline that has mixed of aluminium (Al), magnesium (Mg) etc. or noncrystalline semiconductors such as polyphenylacetylene, the Cr that has mixed
2O
3, NiO, Mn
2O
5Deng oxide.In addition, under the situation that described lower electrode 21, upper electrode 24 constitute by transparent material, reflectance coating is set in the electrode side opposite with the emitting side of light.
E. organic material layer
Organic material layer 23 as shown in Figure 4, it generally is the combining structure of hole transporting layer 23A, luminescent layer 23B, electron supplying layer 23C, also can distinguish overlapping setting not only multilayer hole transporting layer 23A, luminescent layer 23B, the electron supplying layer 23C of one deck, can also omit any one deck among hole transporting layer 23A and the electron supplying layer 23C, also can two-layerly all omit.In addition, can insert the organic material layer of hole injection layer, electron injecting layer etc. according to purposes.Described hole transporting layer 23A, luminescent layer 23B, electron supplying layer 23C can suitably select the material (can be macromolecular material or low molecular material) that in the past used.
In addition, as the luminescent material that forms luminescent layer 23B, can be the material that presents when singlet exciton state returns ground state luminous (fluorescence), also can be the material that presents when ternary exciton state returns ground state luminous (phosphorescence).
F. lead-out wiring
Lead-out wiring 5 as previously described, preferred low-resistance metal material, can be the material that contains more than at least a in Ag, Al, Cu, Cr or low resistive metal of from their alloy, selecting or the metal alloy, preferred especially APC, Ag-Pd alloy, Cr, Al etc.And, can utilize as metal oxide ITO, IZO by methods such as evaporation, sputter in the operation identical with lower electrode 21 with lead-out wiring 5 filmings, form by utilizing photoetching process to form figure.In addition, forming simultaneously under the situation of lead-out wiring 5 with lower electrode 21, can form ITO, IZO lamination the double-decker of low resistive metal of Ag or Ag alloy, Al, Cr etc.Perhaps, as the protective layer of Ag etc., the three-decker of the high material of the oxidative resistance of Cr, Cr, Ta etc. that can form lamination.
G. cover layer
H. drying part
Drying part 25 can use following drier to form: physical dryness agent such as zeolite, silica gel, carbon, carbon nano-tube; Chemical driers such as alkali metal oxide, metal halide, chlorine peroxide; In petroleum-type solvents such as toluene, dimethylbenzene, aliphat organic solvent, dissolved the drier of metal-organic complex; These desiccant particles are dispersed in drier in the adhesives such as the polyethylene, polyisoprene with transparency, poly-meat silicic acid vinyl acetate etc.
I. manufacture method (example)
At first, on glass substrate 1, will form film by methods such as evaporation, sputters, and utilize photoetching process etc. to form the pattern of desired shapes as the lower electrode 21 of the ITO of anode etc.Then, utilize insulating barrier 22 with the insulation of 21 of lower electrodes and dividing unit viewing area 20R, 20G, 20B, form organic material layer 23 with the wet process of printing processes such as cladding process, silk screen print method, gunite silk such as spin coating method, infusion process etc. or the dry process of vapour deposition method, laser transfer method etc.
And, as with the negative electrode that is formed with a plurality of band shapes of lower electrode 21 quadratures, form the upper electrode 24 of a plurality of metallic films, form matrix by lower electrode 21 and upper electrode 24.For upper electrode 24, be to utilize methods such as evaporation or sputter to form film.
At last, by adhesive linkage 3 adhering and sealing parts 2 and supporting substrate 1 and seal.This operation is: the particle diameter that mixes an amount of (about 0.1～0.5 weight %) in the ultraviolet hardening epoxy resin adhesive is the spacer 15A (preferred glass or plastic spacer) of 1～300 μ m, and use dispenser etc. is coated on the supporting substrate 1 it or the bonding region of seal member 2.Then, under inert atmospheres such as argon gas, bonding supporting substrate 1 and seal member 2.Afterwards, to adhesive linkage 3 irradiation ultraviolet radiations, bonding agent is solidified from supporting substrate 1 side (or seal member 2 sides).Like this, in the seal cavity 4 of seal member 2 and supporting substrate 1, to have enclosed the state sealing organic el element of inert gases such as argon gas.
Be described more specifically the formation operation of the organic material layer 23 in this manufacturing process below, formation about organic layer 23, as an example, each material of order lamination hole transporting layer 23A, luminescent layer 23B, electron supplying layer 23C etc. forms by evaporation.At this moment, when forming luminescent layer 23B, use the film forming mask, to constituent parts viewing area 20R, 20G, 20B, the branch that carries out luminescent layer according to a plurality of glow colors is coated with.Dividing when being coated with, the combined material film forming that will present the luminous organic material of RGB three colors or a plurality of organic materials is in the unit viewing area that belongs to RGB.,, use the same material film forming more than 2 times herein to a viewing area 20R of place unit, 20G, 20B, thus can the viewing area 20R of the unit of preventing, 20G, 20B take place into membrane portions.
J. variety of way of organic EL display etc.
As embodiments of the present invention, can carry out various design alterations without departing from the spirit and scope of the present invention.For example, type of drive as organic EL display 20, except that the passive drive mode that adopts banded lower electrode 21 and upper electrode 24, can adopt the active type of drive of utilizing TFT to drive each lower electrode 21 of dividing according to each viewing area 20R of unit, 20G, 20B.About the luminous form of organic EL, can be to emit mode from the luminous bottom of supporting substrate 1 side, also can be from emitting mode with the luminous top of the opposition side of supporting substrate 1.
And, the organic EL display 20 of embodiments of the present invention can be that monochromatic the demonstration also can be multicolor displaying, in order to realize multicolor displaying, certainly comprise that above-mentioned branch is coated with mode, can also be in the following ways: with colour filter or be combined to the mode (CF mode, CCM mode) of monochromatic light emitting functional layer such as white or blueness by the color conversion layer that fluorescent material forms; By the multicolor luminous modes (photobleaching mode) of realization such as light-emitting zone irradiation electromagnetic wave to monochromatic light emitting functional layer; With 2 looks or form the mode (SOLED (transparent stacker OLED) mode) etc. of a unit viewing area more than the unit viewing area of 2 looks vertical lamination.
The embodiments of the present invention and embodiment are owing to have above formation, so lead-out wiring for panel display apparatus, can just after drawing, the adhesive linkage of the outer rim that forms seal cavity cover fully immediately, even thereby forming high-density wiring, when using Ag low series resistance material, it is bad also can not produce the wiring that causes because of the corrosion deterioration or because of transport phenomena etc.Can provide a kind of high meticulous and difficult generation wiring bad panel display apparatus thus.
Claims (10)
1. a panel display apparatus by using bonding supporting substrate of adhesive linkage and seal member, forms seal cavity on described supporting substrate, and forms Presentation Function portion in the sealing space, it is characterized in that having:
Lead-out wiring is drawn out to outside the described seal cavity by described adhesive linkage from the electrode that constitutes described Presentation Function portion, forms the wiring figure of regulation on the supporting substrate of described seal cavity outside; With
Cover layer is located near the described at least adhesive linkage of this lead-out wiring, covers described lead-out wiring,
Formed described adhesive linkage and described tectal laminate portion overlapping, the width of this laminate portion is more than or equal to described adhesive linkage or described tectal thickness, and the thickness of described laminate portion is at least more than or equal to described tectal thickness.
2. panel display apparatus according to claim 1 is characterized in that, described laminate portion is to constitute by the described cover layer of Outboard Sections superimposed layer at described adhesive linkage.
3. panel display apparatus according to claim 1 is characterized in that, described laminate portion is to constitute by the described adhesive linkage of described cover layer superimposed layer in the bonding region that forms described adhesive linkage.
4. according to any described panel display apparatus in the claim 1～3, it is characterized in that, the wiring material of described lead-out wiring contain from Ag, Al, Cu, Cr or from their alloy selected go out at least a more than metal or metal alloy.
5. according to any described panel display apparatus in the claim 1～4, it is characterized in that, described Presentation Function portion is made of organic EL, and this organic EL is by being formed at lower electrode on the described supporting substrate, containing the organic material layer on the described lower electrode of being formed at of luminescent layer and the upper electrode that is formed on this organic material layer forms.
6. the manufacture method of a panel display apparatus, this panel display apparatus forms seal cavity by using bonding supporting substrate of adhesive linkage and seal member on described supporting substrate, and forms Presentation Function portion and form in the sealing space, being characterised in that of this method
For being drawn out to outside the described seal cavity by described adhesive linkage from the electrode that constitutes described Presentation Function portion, and the lead-out wiring of the wiring figure that formation is stipulated on the supporting substrate outside described seal cavity, near described adhesive linkage, form the cover layer that covers this lead-out wiring
Formed described adhesive linkage and described tectal laminate portion overlapping, the width that makes this laminate portion is more than or equal to described adhesive linkage or described tectal thickness, and the thickness that makes described laminate portion is at least more than or equal to described tectal thickness.
7. the manufacture method of panel display apparatus according to claim 6 is characterized in that, the formation of described laminate portion is after forming described adhesive linkage, forms described cover layer on the Outboard Sections of described adhesive linkage.
8. the manufacture method of panel display apparatus according to claim 6 is characterized in that, the formation of described laminate portion is after described cover layer forms, the described adhesive linkage of described cover layer superimposed layer in the bonding region that forms described adhesive linkage.
9. according to the manufacture method of any described panel display apparatus in the claim 6～8, it is characterized in that, the wiring material of described lead-out wiring contain from Ag, Al, Cu, Cr or from their alloy selected go out at least a more than metal or metal alloy.
10. according to the manufacture method of any described panel display apparatus in the claim 6～9, it is characterized in that, the formation of described Presentation Function portion, be by on described supporting substrate, forming lower electrode, on this lower electrode, form the organic material layer that contains luminescent layer, on this organic material layer, form upper electrode, thereby on described supporting substrate, form organic EL display element.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003208006A JP4399202B2 (en) | 2003-08-20 | 2003-08-20 | Manufacturing method of flat panel display device |
| JP2003208006 | 2003-08-20 | ||
| JP2003-208006 | 2003-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1585573A true CN1585573A (en) | 2005-02-23 |
| CN100426550C CN100426550C (en) | 2008-10-15 |
Family
ID=34364269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100582456A Active CN100426550C (en) | 2003-08-20 | 2004-08-20 | Planar display device and its manufacture |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4399202B2 (en) |
| KR (1) | KR101196127B1 (en) |
| CN (1) | CN100426550C (en) |
| TW (1) | TWI357282B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169263A (en) * | 2010-12-23 | 2011-08-31 | 友达光电股份有限公司 | Array substrate, substrate module and display panel |
| CN109273495A (en) * | 2018-09-21 | 2019-01-25 | 上海天马有机发光显示技术有限公司 | A kind of OLED display panel and display device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100771818B1 (en) * | 2006-04-24 | 2007-10-30 | 삼성전기주식회사 | A Liquid Lens Having Enhanced Sealing Structure |
| WO2007125747A1 (en) * | 2006-04-28 | 2007-11-08 | Panasonic Corporation | Plasma display panel |
| WO2011042944A1 (en) * | 2009-10-05 | 2011-04-14 | パイオニア株式会社 | Organic el panel and manufacturing method therefor |
| KR102511413B1 (en) * | 2015-12-15 | 2023-03-16 | 엘지디스플레이 주식회사 | Organic light emitting display device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000068046A (en) * | 1998-08-17 | 2000-03-03 | Matsushita Electric Ind Co Ltd | Electroluminescence device |
| JP2002033188A (en) * | 2000-07-17 | 2002-01-31 | Stanley Electric Co Ltd | Organic el display device |
| TW546857B (en) * | 2001-07-03 | 2003-08-11 | Semiconductor Energy Lab | Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment |
-
2003
- 2003-08-20 JP JP2003208006A patent/JP4399202B2/en not_active Expired - Lifetime
-
2004
- 2004-08-19 KR KR1020040065358A patent/KR101196127B1/en active IP Right Grant
- 2004-08-20 TW TW093125188A patent/TWI357282B/en not_active IP Right Cessation
- 2004-08-20 CN CNB2004100582456A patent/CN100426550C/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169263A (en) * | 2010-12-23 | 2011-08-31 | 友达光电股份有限公司 | Array substrate, substrate module and display panel |
| CN102169263B (en) * | 2010-12-23 | 2014-03-26 | 友达光电股份有限公司 | Array substrate, substrate module and display panel |
| CN109273495A (en) * | 2018-09-21 | 2019-01-25 | 上海天马有机发光显示技术有限公司 | A kind of OLED display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005063701A (en) | 2005-03-10 |
| KR20050020681A (en) | 2005-03-04 |
| TWI357282B (en) | 2012-01-21 |
| CN100426550C (en) | 2008-10-15 |
| KR101196127B1 (en) | 2012-10-30 |
| TW200509741A (en) | 2005-03-01 |
| JP4399202B2 (en) | 2010-01-13 |
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