CN1553512A - Image sensor mould set and producing method thereof - Google Patents

Image sensor mould set and producing method thereof Download PDF

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Publication number
CN1553512A
CN1553512A CNA031363776A CN03136377A CN1553512A CN 1553512 A CN1553512 A CN 1553512A CN A031363776 A CNA031363776 A CN A031363776A CN 03136377 A CN03136377 A CN 03136377A CN 1553512 A CN1553512 A CN 1553512A
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CN
China
Prior art keywords
several
adhesive body
sheet
upper strata
image sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA031363776A
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Chinese (zh)
Other versions
CN100350621C (en
Inventor
谢志鸿
吴志成
陈榕庭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kingpak Technology Inc
Original Assignee
Kingpak Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingpak Technology Inc filed Critical Kingpak Technology Inc
Priority to CNB031363776A priority Critical patent/CN100350621C/en
Publication of CN1553512A publication Critical patent/CN1553512A/en
Application granted granted Critical
Publication of CN100350621C publication Critical patent/CN100350621C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

The invention raises encapsulation reliability, stability, qualification rate and is for connecting lead wires conveniently. Image sensor includes parts: several upper layer and lower layer sheet metals arranged with gap and pilled lower surface of upper layer metal sheet on upper surface of lower layer sheet metal, sealing glue body forming a flange layer, image sensing chip, several lead wires connecting image sensing chip to upper surface of upper metal sheet, and euphotic layer, mirror base of forming container, and lens barrel for accommodating light hole and aspherical lens. The flange layer fixed on mirror base makes euphotic layer locate on one side of container. Manufacturing method includes steps: arranging the said metal sheets and sticking the said sheet metals by sealing glue body according to requirement; forming sealing glue body; setting up image sensing chip; providing connection of lead wires and installing euphotic layer; assembling mirror base and lens barrel.

Description

Image sensor module and manufacture method thereof
Technical field
The invention belongs to sensor module and manufacture method thereof, particularly a kind of image sensor module and manufacture method thereof.
Background technology
As shown in Figure 1, known image sensor 1 comprises substrate 10, flange layer 18, image sensing wafer 22, several wires 23 and photic zone 27.
Substrate 10 is to be made up of the sheet metal 12 of several spaces arrangements, and sheet metal 12 forms first plate 14 and second plate 16 of differing heights.
Flange layer 18 is to be formed at substrate 10 peripheries and bottom surface, and forms disposal area 20 with substrate 10, and top and the following of second plate 16 of first plate 14 of several sheet metals 12 exposed by flange layer 18 respectively.
Image sensing wafer 22 is to be arranged in flange layer 18 and the substrate 10 formed disposal areas 20.
Several wires 23 is to be electrically connected respectively between the top and image sensing wafer of several sheet metal 12 first plates 14.
Photic zone 27 is to be arranged on the flange layer 18, to cover image sensing wafer 22.
As shown in Figure 2, known image sensor module comprises microscope base 24, is provided with the lens barrel 34 of external screw thread 36, transparent area 38, aspherical lens 40, infrared ray filter glass 42 and image sensor 1.
Microscope base 24 is provided with upper surface 26, lower surface 28 reaches the accommodation chamber 30 that is connected lower surfaces 28 by upper surface 26, and the accommodation chamber 30 of microscope base 24 forms internal threads 32.
Lens barrel 34 is that the upper surface 26 by microscope base 24 is placed in the accommodation chamber 30, and with internal thread 32 screw locks of its external screw thread 36 with microscope base 24.
Transparent area 38, aspherical lens 40 and infrared ray filter glass 42 from top to bottom are arranged in the lens barrel 34; Image sensor 1 is by sticking together on the lower surface 28 of being fixed in microscope base 24 by its photic zone 27, and by adjusting the degree of depth that lens barrel 34 and microscope base 24 screw togather, the aspherical lens 40 of control lens barrel 34 and the focal length of image sensor 1.
Though known image sensor module can reach its creation purpose and effect, only, still there is following disappearance in it:
1, in the manufacturing, owing to need sheet metal 12 is bent into first plate 14 and second plate 16 of differing heights, will cause first plate 14 smooth inadequately, make in the bonding processing procedure that goes between, lead 24 can't successfully be followed on sheet metal 12, so that influence its yield.
Can't stamp out the bigger sheet metal of thickness 12 during 2, because of manufacturing, make second plate, 16 thinner thicknesses of sheet metal 12, so in soldering (SMT) process, scolding tin can't be in the side climbing of sheet metal 12 second plates 16, so that have influence on the stability that packaging body is fixed in printed circuit board (PCB).
Summary of the invention
The purpose of this invention is to provide a kind of image sensor module and manufacture method thereof that improves the reliable and stable degree of encapsulation, the bonding of being convenient to go between, improves the product yield.
Image sensor module of the present invention comprises that the lower metal sheet of arranging several spaces, upper strata sheet metal, adhesive body, image sensing wafer, several wires, photic zone, the formation that arrange several spaces connect the microscope base of room and is arranged at the interior lens barrel of microscope base room; Each lower metal sheet is provided with upper surface and lower surface; Each upper strata sheet metal is provided with upper surface and is stacked and placed on lower surface on the corresponding lower metal sheet upper surface; Adhesive body coats and sticks together several upper and lower layer sheet metals, and the upper surface of each upper strata sheet metal is exposed by adhesive body, and the lower surface of each lower metal sheet is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, so that itself and several upper strata sheet metal forms accommodation chamber; Image sensing wafer is arranged in the accommodation chamber; Several wires system is electrically connected image sensing wafer to the upper surface of several upper strata sheet metals; Photic zone is covered on the adhesive body flange layer to cover image sensing wafer; Microscope base room internal perisporium is provided with internal thread; The flange series of strata of adhesive body are fixed on the microscope base, and make the photic zone that is covered on the flange layer be positioned at a side of room; Lens barrel is provided with corresponding and the external screw thread of screw lock on the microscope base internal thread, forms the accommodation chamber that connects in the lens barrel, from top to bottom is provided with loophole and aspherical lens in accommodation chamber.
Image sensor module making method of the present invention comprises the steps:
Step 1
Provide several spaces to arrange and be respectively equipped with the lower metal sheet on upper and lower surface and provide several spaces to arrange and be respectively equipped with the upper strata sheet metal on upper and lower surface; The lower surface system of upper strata sheet metal is stacked on the lower metal sheet upper surface accordingly;
Step 2
Form adhesive body, several lower metal sheets and several upper strata sheet metals are sticked together in its coating, and the upper surface of each upper strata sheet metal is exposed by adhesive body, and the lower surface of each lower metal sheet is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, so that itself and several upper strata sheet metal forms accommodation chamber;
Step 3
Image sensing wafer is provided and is arranged in the accommodation chamber;
Step 4
Several wires is provided, and each lead is electrically connected on the upper surface of image sensing wafer and upper strata sheet metal;
Step 5
Photic zone is provided and is covered on the flange layer of adhesive body, so that image sensing wafer is enveloped;
Step 6
Provide to form the microscope base that connects room, the room internal perisporium is provided with internal thread; Microscope base is fixed for the flange layer of adhesive body, and makes the photic zone that is covered on the flange layer be positioned at a side of room;
Step 7
Provide to form the lens barrel that connects accommodation chamber, its periphery is provided with external screw thread, and loophole and aspherical lens from top to bottom are set in accommodation chamber; Lens barrel is arranged in the room of microscope base, and with its external screw thread screw lock on the internal thread of microscope base.
Wherein:
Contour correspondence is provided with the intermediate plate that is provided with for image sensing wafer between several upper strata sheet metals.
Adhesive body is industrial plastic material; Flange layer and adhesive body are one-body molded.
Photic zone is a transparent glass.
Be positioned at the aspherical lens below in the lens barrel accommodation chamber and be provided with the infrared ray filter glass.
In the step 1 between several upper strata sheet metals contour correspondence be provided with the intermediate plate that is provided with for image sensing wafer.
Adhesive body is industrial plastic material in the step 2; Flange layer and adhesive body are one-body molded.
Be positioned at the aspherical lens below in the step 7 in the lens barrel accommodation chamber and be provided with the infrared ray filter glass.
Since image sensor module of the present invention comprise several spaces arrange and be respectively equipped with the upper and lower layer sheet metal on upper and lower surface, the adhesive body that forms flange layer, image sensing wafer, electrical connection image sensing wafer to the upper surface of several upper strata sheet metals several wires, be covered on the photic zone on the flange layer, the microscope base that forms room and the lens barrel that formation is provided with loophole and aspherical lens accommodation chamber; Each upper strata sheet metal is stacked and placed on the corresponding lower metal sheet upper surface with its lower surface; The flange series of strata are fixed on the microscope base, and make photic zone be positioned at a side of room; Image sensor module making method of the present invention comprises provides several spaces to arrange and be respectively equipped with the upper and lower layer sheet metal on upper and lower surface, and the lower surface system of upper strata sheet metal is stacked on the lower metal sheet upper surface accordingly; Form adhesive body; Image sensing wafer is set; Several wires lead-in wire bonding is provided; Photic zone is set; Group is established microscope base and lens barrel.Stacked upper and lower layer sheet metal has evenness and bigger thickness preferably, therefore, be convenient to go between the bonding operation carrying out and can improve the encapsulation yield of product, and with its soldering on printed circuit board (PCB) the time, scolding tin can be climbed on the sheet metal of upper strata by the lower metal sheet, and packaging body more firmly is fixed on the printed circuit board (PCB).The not only reliable and stable degree of raising encapsulation, and the bonding of being convenient to go between, raising product yield, thus reach purpose of the present invention.
Description of drawings
Fig. 1, be known image sensor structure schematic sectional view.
Fig. 2, be provided with the image sensor modular structure schematic sectional view of known image sensor for group.
Fig. 3, for image sensor modular structure schematic sectional view of the present invention.
Fig. 4, be image sensor module making method step 1 of the present invention, two schematic diagrames.
Fig. 5, be image sensor module making method step 3 of the present invention, four, five schematic diagrames.
Embodiment
As shown in Figure 3, image sensor module of the present invention comprises the lower metal sheet of arranging several spaces 50, upper strata sheet metal 52, adhesive body 54, image sensing wafer 56, several wires 58, photic zone 60, microscope base 62 and the lens barrel 64 that arrange several spaces.
Several lower metal sheets 50 that arrange the space are for being respectively equipped with the flat board of upper surface 66 and lower surface 68.Lower surface 68 is in soldering (SMT) mode scolding tin 94 to be located on the printed circuit board (PCB) 70.
Several upper strata sheet metals 52 that arrange the space are for being respectively equipped with the flat board of upper surface 72 and lower surface 74.Lower surface 74 is to be stacked at accordingly on the upper surface 66 of lower metal sheet 50; 52 contour correspondences of several upper strata sheet metals are provided with intermediate plate 76.
Adhesive body 54 is industrial plastic material, several lower metal sheets 50, several upper strata sheet metals 52 and intermediate plate 76 are sticked together in its coating, and the upper surface 72 of each upper strata sheet metal 52 and the upper surface of intermediate plate 76 are exposed by adhesive body 54, the lower surface 68 of each lower metal sheet 50 is exposed by adhesive body 54; Adhesive body 54 forms flange layer 78 in upper surface 72 peripheries of several upper strata sheet metals 52, so that itself and several upper strata sheet metal 52 forms accommodation chamber 80.Flange layer 78 is one-body molded with adhesive body 54.
Image sensing wafer 56 is to be arranged on the intermediate plate 76, and is positioned at accommodation chamber 80.
Several wires 58 is to be electrically connected image sensing wafer 56 to the upper surface 72 of several upper strata sheet metals 52, and the signal of image sensing wafer 56 is passed on the upper strata sheet metal 52.
Photic zone 60 is a transparent glass, and it is to be covered on the flange layer 78 of adhesive body 54, in order to image sensing wafer 56 is enveloped, makes image sensing wafer 56 can see through photic zone 60 and receives the light signal.
Microscope base 62 forms the room 82 that connects, and room 82 internal perisporiums are provided with internal thread 84; The flange layer 78 of adhesive body 54 is to be fixed on the microscope base 62, and makes the photic zone 60 that is covered on the flange layer 78 be positioned at a side of room 82.
Lens barrel 64 is to be arranged in the room 82 of microscope base 62, it is provided with corresponding and the external screw thread 86 of screw lock on microscope base 62 internal threads 84, form the accommodation chamber 87 that connects in the lens barrel 64, and in lens barrel 64 accommodation chambers 87, from top to bottom be provided with loophole 88, aspherical lens 90 and infrared ray worry light microscopic sheet 92.
Image sensor module making method of the present invention comprises the steps:
Step 1
Several lower metal sheets 50 are provided
As shown in Figure 4, provide several spaces to arrange and be respectively equipped with the lower metal sheet 50 of upper surface 66 and lower surface 68.
Several upper strata sheet metals 52 are provided
As shown in Figure 4, provide several spaces to arrange and be respectively equipped with the upper strata sheet metal 52 of upper surface 72 and lower surface 74; Lower surface 74 is to be stacked at accordingly on the upper surface 66 of lower metal sheet 50, and is provided with an intermediate plate 76 in 52 contour correspondences of several upper strata sheet metals.
Step 2
Form adhesive body 54
As shown in Figure 4, with industrial plastic cement is that material forms the adhesive body 54 that several lower metal sheets 50, several upper strata sheet metals 52 and intermediate plate 76 are sticked together in coating by injection molding method, and the upper surface 72 of each upper strata sheet metal 52 and the upper surface of intermediate plate 76 are exposed by adhesive body 54, the lower surface 68 of each lower metal sheet 50 is exposed by adhesive body 54; Adhesive body 54 forms flange layer 78 in upper surface 72 peripheries of upper strata sheet metal 52, makes itself and several upper strata sheet metal 52 form accommodation chamber 80; Flange layer 78 is one-body molded with adhesive body 54.
Step 3
Image sensing wafer 56 is set
As shown in Figure 5, image sensing wafer 56 is arranged on the intermediate plate 76, and is positioned at accommodation chamber 80.
Step 4
The lead-in wire bonding
As shown in Figure 5, provide several wires 58, and each lead 58 is electrically connected on the upper surface 72 of image sensing wafer 56 and upper strata sheet metal 52, make being passed on the upper strata sheet metal 52 of image sensing wafer 56.
Step 5
Photic zone 60 is set
As shown in Figure 5, provide photic zone 60, it can be transparent glass, photic zone 60 is covered on the flange layer 78 of adhesive body 54, in order to image sensing wafer 56 is enveloped, makes image sensing wafer 56 can see through photic zone 60 and receives the light signal.
Step 6
Group is established microscope base 62
As shown in Figure 3, provide to form the microscope base 62 that connects room 82, room 82 internal perisporiums are provided with internal thread 84; Microscope base 62 is fixing for the flange layer 78 of adhesive body 54, and makes the photic zone 60 that is covered on the flange layer 78 be positioned at a side of room 82.
Step 7
Group is established lens barrel 64
As shown in Figure 3, provide to form the lens barrel 64 that connects accommodation chamber 87, its periphery is provided with external screw thread 86, loophole 88, aspherical lens 90 and infrared ray from top to bottom is set in accommodation chamber 87 considers light microscopic sheet 92; Lens barrel 64 is arranged in the room 82 of microscope base 62, and with its external screw thread 86 screw locks on the internal thread 84 of microscope base 62.
As mentioned above, the following advantage of tool of the present invention:
1, upper and lower layer sheet metal 52,50 is to have upper and lower surperficial 66,68,72,74 flat board by two to form and have evenness preferably, therefore, and the carrying out of the bonding operation of being convenient to go between and can improve the encapsulation yield of product.
2, upper and lower layer sheet metal 52,50 can constitute higher thickness, and therefore, with its soldering on printed circuit board (PCB) 70 time, scolding tin 94 can be climbed on upper strata sheet metal 52 by lower metal sheet 50, and packaging body more firmly is fixed on the printed circuit board (PCB) 70.

Claims (9)

1, a kind of image sensor module, it comprises the sheet metal several spaces arranged, coat stick together several sheet metals and in several sheet metal peripheries form flanges with several sheet metals form accommodation chambers adhesive body, be arranged at image sensing wafer in the accommodation chamber, is electrically connected image sensing wafer and sheet metal upper surface several wires, be covered on the adhesive body flange layer with the microscope base of the photic zone that covers image sensing wafer, formation perforation room and be arranged at lens barrel in the microscope base room; Microscope base room internal perisporium is provided with internal thread; The flange series of strata of adhesive body are fixed on the microscope base, and make the photic zone that is covered on the flange layer be positioned at a side of room; Lens barrel is provided with corresponding and the external screw thread of screw lock on the microscope base internal thread, forms the accommodation chamber that connects in the lens barrel, from top to bottom is provided with loophole and aspherical lens in accommodation chamber; It is characterized in that several upper and lower layer sheet metals that described several sheet metals are arranged by the space constitute; Each lower metal sheet is provided with upper surface and lower surface; Each upper strata sheet metal is provided with upper surface and is stacked and placed on lower surface on the corresponding lower metal sheet upper surface; Adhesive body coats and sticks together several upper and lower layer sheet metals, and the upper surface of each upper strata sheet metal is exposed by adhesive body, and the lower surface of each lower metal sheet is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, so that itself and several upper strata sheet metal forms accommodation chamber; Several wires system is electrically connected image sensing wafer to the upper surface of several upper strata sheet metals.
2, image sensor module according to claim 1 is characterized in that contour correspondence is provided with the intermediate plate that is provided with for image sensing wafer between described several upper strata sheet metals.
3, image sensor module according to claim 1 is characterized in that described adhesive body is industrial plastic material; Flange layer and adhesive body are one-body molded.
4, image sensor module according to claim 1 is characterized in that described photic zone is a transparent glass.
5, image sensor module according to claim 1 is characterized in that being positioned in the described lens barrel accommodation chamber aspherical lens below and is provided with the infrared ray filter glass.
6, a kind of image sensor module making method, it comprises the steps:
Step 1
The sheet metal that provides several spaces to arrange;
Step 2
Form and cover several sheet metals and form the adhesive body that constitutes the accommodation chamber flange layer;
Step 3
Image sensing wafer is provided and is arranged in the accommodation chamber;
Step 4
Several wires is provided, and each lead is electrically connected image sensing wafer and corresponding sheet metal;
Step 5
Photic zone is provided and is covered on the flange layer of adhesive body, so that image sensing wafer is enveloped;
Step 6
Provide to form the microscope base that connects room, the room internal perisporium is provided with internal thread; Microscope base is fixed for the flange layer of adhesive body, and makes the photic zone that is covered on the flange layer be positioned at a side of room;
Step 7
Provide to form the lens barrel that connects accommodation chamber, its periphery is provided with external screw thread, and loophole and aspherical lens from top to bottom are set in accommodation chamber; Lens barrel is arranged in the room of microscope base, and with its external screw thread screw lock on the internal thread of microscope base;
It is characterized in that described step 1 system provides several spaces to arrange and is respectively equipped with the lower metal sheet on upper and lower surface and provides several spaces to arrange and be respectively equipped with the upper strata sheet metal on upper and lower surface; Upper strata sheet metal lower surface system is stacked on the lower metal sheet upper surface accordingly; The adhesive body that step 2 provides coats and sticks together several lower metal sheets and several upper strata sheet metals, and the upper surface of the upper surface of each upper strata sheet metal is exposed by adhesive body, and the lower surface of each lower metal sheet is exposed by adhesive body; Adhesive body flange series of strata are formed at upper strata sheet metal upper surface periphery, and flange layer and several upper strata sheet metals form accommodation chamber; Each lead is electrically connected on the upper surface of image sensing wafer and upper strata sheet metal in the step 4.
7, image sensor module making method according to claim 6 is characterized in that in the described step 1 that contour correspondence is provided with the intermediate plate that is provided with for image sensing wafer between several upper strata sheet metals.
8, image sensor module making method according to claim 6 is characterized in that adhesive body is industrial plastic material in the described step 2; Flange layer and adhesive body are one-body molded.
9, image sensor module making method according to claim 6 is characterized in that being positioned in the lens barrel accommodation chamber in the described step 7 aspherical lens below and is provided with the infrared ray filter glass.
CNB031363776A 2003-06-03 2003-06-03 Image sensor mould set and producing method thereof Expired - Fee Related CN100350621C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB031363776A CN100350621C (en) 2003-06-03 2003-06-03 Image sensor mould set and producing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB031363776A CN100350621C (en) 2003-06-03 2003-06-03 Image sensor mould set and producing method thereof

Publications (2)

Publication Number Publication Date
CN1553512A true CN1553512A (en) 2004-12-08
CN100350621C CN100350621C (en) 2007-11-21

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100483655C (en) * 2005-09-09 2009-04-29 鸿富锦精密工业（深圳）有限公司 Producing process for digital camera module
CN100485893C (en) * 2005-09-09 2009-05-06 鸿富锦精密工业（深圳）有限公司 Producing process for video sensing chip packaging and structure
CN100531308C (en) * 2005-12-02 2009-08-19 鸿富锦精密工业（深圳）有限公司 Digit tode camera module group
CN100544007C (en) * 2005-11-16 2009-09-23 鸿富锦精密工业（深圳）有限公司 Encapsulation structure for image sensor
US7626160B2 (en) 2006-11-03 2009-12-01 Altus Technology Inc. Image sensing module with improved assembly precision
CN101271885B (en) * 2007-03-21 2010-06-09 鸿富锦精密工业（深圳）有限公司 Image sensor encapsulation and image taking device using the same
TWI415453B (en) * 2005-09-23 2013-11-11 Hon Hai Prec Ind Co Ltd Digital camera moudle assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001253547A1 (en) * 2000-05-23 2001-12-03 Atmel Corporation Integrated ic chip package for electronic image sensor die
KR100533166B1 (en) * 2000-08-18 2005-12-02 매그나칩 반도체 유한회사 CMOS image sensor having low temperature oxide for protecting microlens and method for fabricating the same
CN1152429C (en) * 2000-12-11 2004-06-02 胜开科技股份有限公司 packaged video image sensitive chip and peackaging method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100483655C (en) * 2005-09-09 2009-04-29 鸿富锦精密工业（深圳）有限公司 Producing process for digital camera module
CN100485893C (en) * 2005-09-09 2009-05-06 鸿富锦精密工业（深圳）有限公司 Producing process for video sensing chip packaging and structure
TWI415453B (en) * 2005-09-23 2013-11-11 Hon Hai Prec Ind Co Ltd Digital camera moudle assembly
CN100544007C (en) * 2005-11-16 2009-09-23 鸿富锦精密工业（深圳）有限公司 Encapsulation structure for image sensor
CN100531308C (en) * 2005-12-02 2009-08-19 鸿富锦精密工业（深圳）有限公司 Digit tode camera module group
US7626160B2 (en) 2006-11-03 2009-12-01 Altus Technology Inc. Image sensing module with improved assembly precision
CN101271885B (en) * 2007-03-21 2010-06-09 鸿富锦精密工业（深圳）有限公司 Image sensor encapsulation and image taking device using the same

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Granted publication date: 20071121