CN1548915A - 含钻石粉末的散热体 - Google Patents
含钻石粉末的散热体 Download PDFInfo
- Publication number
- CN1548915A CN1548915A CNA03131001XA CN03131001A CN1548915A CN 1548915 A CN1548915 A CN 1548915A CN A03131001X A CNA03131001X A CN A03131001XA CN 03131001 A CN03131001 A CN 03131001A CN 1548915 A CN1548915 A CN 1548915A
- Authority
- CN
- China
- Prior art keywords
- diamond powder
- radiator
- diamond
- powder
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 65
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 65
- 239000000843 powder Substances 0.000 title claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000005416 organic matter Substances 0.000 claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000003522 acrylic cement Substances 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 230000005855 radiation Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012261 overproduction Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB03131001XA CN100401006C (zh) | 2003-05-12 | 2003-05-12 | 含钻石粉末的散热体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB03131001XA CN100401006C (zh) | 2003-05-12 | 2003-05-12 | 含钻石粉末的散热体 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1548915A true CN1548915A (zh) | 2004-11-24 |
CN100401006C CN100401006C (zh) | 2008-07-09 |
Family
ID=34322754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB03131001XA Expired - Fee Related CN100401006C (zh) | 2003-05-12 | 2003-05-12 | 含钻石粉末的散热体 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100401006C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102954729A (zh) * | 2012-11-20 | 2013-03-06 | 无锡康柏斯机械科技有限公司 | 一种暖气片 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4378233A (en) * | 1981-07-24 | 1983-03-29 | Norton Company | Metal bonded grinding wheel containing diamond or CBN abrasive |
US5008737A (en) * | 1988-10-11 | 1991-04-16 | Amoco Corporation | Diamond composite heat sink for use with semiconductor devices |
US5451352A (en) * | 1992-02-03 | 1995-09-19 | Pcc Composites, Inc. | Method of forming a diamond composite structure |
JPH05347369A (ja) * | 1992-06-15 | 1993-12-27 | Seiko Epson Corp | 電子部品の樹脂封止 |
JPH08222669A (ja) * | 1995-02-10 | 1996-08-30 | Fuji Dies Kk | ヒートシンク及びその製法 |
-
2003
- 2003-05-12 CN CNB03131001XA patent/CN100401006C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102954729A (zh) * | 2012-11-20 | 2013-03-06 | 无锡康柏斯机械科技有限公司 | 一种暖气片 |
CN102954729B (zh) * | 2012-11-20 | 2016-01-20 | 无锡康柏斯机械科技有限公司 | 一种暖气片 |
Also Published As
Publication number | Publication date |
---|---|
CN100401006C (zh) | 2008-07-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: RITEDIA CORPORATION Free format text: FORMER OWNER: SONG JIANMIN Effective date: 20120618 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120618 Address after: Hsinchu County, Taiwan, China Patentee after: Laizuan Technology Co., Ltd Address before: China in Taiwan Taipei County town of Zhongshan Road No. 64 Patentee before: Song Jianmin |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080709 Termination date: 20150512 |
|
EXPY | Termination of patent right or utility model |