CN1537318B - 磁场强度可调的溅射磁控管装置 - Google Patents
磁场强度可调的溅射磁控管装置 Download PDFInfo
- Publication number
- CN1537318B CN1537318B CN028151380A CN02815138A CN1537318B CN 1537318 B CN1537318 B CN 1537318B CN 028151380 A CN028151380 A CN 028151380A CN 02815138 A CN02815138 A CN 02815138A CN 1537318 B CN1537318 B CN 1537318B
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- Prior art keywords
- magnetic field
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (35)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0118803.6 | 2001-08-02 | ||
GBGB0118803.6A GB0118803D0 (en) | 2001-08-02 | 2001-08-02 | Adjustable magnet configuration and method for magnetron sputtering |
PCT/EP2002/003851 WO2003015124A1 (en) | 2001-08-02 | 2002-04-05 | Sputtering magnetron arrangements with adjustable magnetic field strength |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1537318A CN1537318A (zh) | 2004-10-13 |
CN1537318B true CN1537318B (zh) | 2011-01-12 |
Family
ID=9919640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN028151380A Expired - Fee Related CN1537318B (zh) | 2001-08-02 | 2002-04-05 | 磁场强度可调的溅射磁控管装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040178056A1 (zh) |
EP (1) | EP1412964B1 (zh) |
JP (1) | JP4250526B2 (zh) |
KR (1) | KR100860674B1 (zh) |
CN (1) | CN1537318B (zh) |
AT (1) | ATE515056T1 (zh) |
GB (1) | GB0118803D0 (zh) |
WO (1) | WO2003015124A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107889538A (zh) * | 2015-05-06 | 2018-04-06 | 攀时奥地利公司 | 用于管靶的连接件 |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040129561A1 (en) * | 2003-01-07 | 2004-07-08 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron magnetic array mid span support |
US8500975B2 (en) * | 2004-01-07 | 2013-08-06 | Applied Materials, Inc. | Method and apparatus for sputtering onto large flat panels |
KR20060026321A (ko) * | 2004-09-20 | 2006-03-23 | 삼성전자주식회사 | 플라즈마 처리 장치 및 그 제어 방법 |
US8470141B1 (en) * | 2005-04-29 | 2013-06-25 | Angstrom Sciences, Inc. | High power cathode |
US20070012558A1 (en) * | 2005-07-13 | 2007-01-18 | Applied Materials, Inc. | Magnetron sputtering system for large-area substrates |
EP1999292B1 (en) * | 2006-03-28 | 2014-01-22 | Sulzer Metaplas GmbH | Sputtering apparatus |
US20080047831A1 (en) * | 2006-08-24 | 2008-02-28 | Hendryk Richert | Segmented/modular magnet bars for sputtering target |
CN102027565B (zh) * | 2008-05-16 | 2013-03-06 | 梭莱先进镀膜股份有限公司 | 具有高硬度的可旋转溅射磁控管 |
US20100044222A1 (en) * | 2008-08-21 | 2010-02-25 | Guardian Industries Corp., | Sputtering target including magnetic field uniformity enhancing sputtering target backing tube |
KR101089372B1 (ko) * | 2008-10-13 | 2011-12-02 | (주)에스엔텍 | 원통형 스퍼터링 캐소드 및 이를 구비한 스퍼터링 장치 |
US20100230274A1 (en) * | 2009-03-12 | 2010-09-16 | Applied Materials, Inc. | Minimizing magnetron substrate interaction in large area sputter coating equipment |
CN101877300B (zh) * | 2009-04-30 | 2012-01-04 | 深圳市豪威薄膜技术有限公司 | 溅射磁控管装置 |
WO2011056581A2 (en) | 2009-10-26 | 2011-05-12 | General Plasma, Inc. | Rotary magnetron magnet bar and apparatus containing the same for high target utilization |
US20110155568A1 (en) * | 2009-12-29 | 2011-06-30 | Sputtering Components, Inc. | Indexing magnet assembly for rotary sputtering cathode |
US8951394B2 (en) | 2010-01-29 | 2015-02-10 | Angstrom Sciences, Inc. | Cylindrical magnetron having a shunt |
DE102010063685B4 (de) * | 2010-02-21 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Magnetronanordnung mit einem Hohltarget |
EP2553137B1 (en) * | 2010-03-31 | 2016-10-05 | Mustang Vacuum Systems, Inc. | Rotating magnetron sputtering cathode apparatus and method of depositing material with the same |
US20120048724A1 (en) * | 2010-08-31 | 2012-03-01 | Mcleod Paul S | Cylindrical Magnetron Sputter Source Utilizing Halbach Magnet Array |
DE102010046780A1 (de) * | 2010-09-28 | 2012-03-29 | Singulus Technologies Ag | Beschichten von Substraten mit einer Legierung mittels Kathodenzerstäubung |
KR101959742B1 (ko) * | 2011-01-06 | 2019-03-19 | 스퍼터링 컴포넌츠 인코포레이티드 | 스퍼터링 장치 |
US9093251B2 (en) | 2011-02-18 | 2015-07-28 | Toyota Motor Europe Nv/Sa | Sputtering magnetron assembly |
CN103184421A (zh) * | 2011-12-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 真空溅射靶磁芯 |
DE102012106403B4 (de) | 2012-07-17 | 2019-03-28 | VON ARDENNE Asset GmbH & Co. KG | Verfahren zum reaktiven Magnetronsputtern zur Beschichtung von Substraten |
LT2888755T (lt) * | 2012-08-24 | 2018-11-12 | Cardinal Cg Company | Dalelių pūtimo cilindriniu magnetronu aparatas |
WO2014039426A1 (en) | 2012-09-04 | 2014-03-13 | Sputtering Components, Inc. | Sputtering apparatus |
DE102012109424A1 (de) | 2012-10-04 | 2014-04-10 | Von Ardenne Anlagentechnik Gmbh | Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung |
US9476118B2 (en) * | 2012-12-10 | 2016-10-25 | Angstrom Sciences, Inc. | Adjustable shunt assembly for a sputtering magnetron and a method for adjusting such a shunt |
US20140209244A1 (en) * | 2013-01-25 | 2014-07-31 | Applied Materials, Inc. | Skew elimination and control in a plasma enhanced substrate processing chamber |
DE102013100974B4 (de) * | 2013-01-31 | 2015-03-12 | Von Ardenne Gmbh | Sputtermagnetron mit Magnetfeldbeeinflussung |
US9312108B2 (en) | 2013-03-01 | 2016-04-12 | Sputtering Components, Inc. | Sputtering apparatus |
US9418823B2 (en) * | 2013-03-01 | 2016-08-16 | Sputtering Components, Inc. | Sputtering apparatus |
DE102014110381A1 (de) * | 2014-07-23 | 2016-01-28 | Von Ardenne Gmbh | Magnetron-Anordnung, Beschichtungsanordnung und Verfahren zum Anpassen einer Magnetfeldcharakteristik einer Magnetron-Anordnung |
US9613777B2 (en) * | 2014-09-11 | 2017-04-04 | Varian Semiconductor Equipment Associates, Inc. | Uniformity control using adjustable internal antennas |
US11244815B2 (en) | 2017-04-20 | 2022-02-08 | Honeywell International Inc. | Profiled sputtering target and method of making the same |
CN109295430B (zh) | 2017-07-25 | 2022-07-12 | 索莱尔有限责任公司 | 用于调节管状磁控管的磁体系统的旋转角度的装置和方法 |
WO2021183729A1 (en) * | 2020-03-11 | 2021-09-16 | Intellivation Llc | Movable magnet array for magnetron sputtering |
US11728226B2 (en) * | 2020-08-14 | 2023-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Deposition system and method |
US11908669B2 (en) | 2021-01-08 | 2024-02-20 | Arizona Thin Film Research, LLC | Thermally controlled magnetic fields optimization system for sputter deposition processes |
CN113755808A (zh) * | 2021-09-28 | 2021-12-07 | 北海惠科半导体科技有限公司 | 磁控溅射装置及其控制方法 |
DE102021129521B3 (de) * | 2021-11-12 | 2023-03-30 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem, Sputtervorrichtung und Verfahren |
DE102021129524A1 (de) * | 2021-11-12 | 2023-05-17 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem und Sputtervorrichtung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5855744A (en) * | 1996-07-19 | 1999-01-05 | Applied Komatsu Technology, Inc. | Non-planar magnet tracking during magnetron sputtering |
US5873989A (en) * | 1997-02-06 | 1999-02-23 | Intevac, Inc. | Methods and apparatus for linear scan magnetron sputtering |
US6171461B1 (en) * | 1996-03-07 | 2001-01-09 | Mark A. Bernick | Sputtering cathode |
CN1297575A (zh) * | 1998-04-16 | 2001-05-30 | 辛瓦苛股份有限公司 | 磁控管中用于控制目标冲蚀和溅射的装置 |
Family Cites Families (7)
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JPS63125675A (ja) * | 1986-11-13 | 1988-05-28 | Matsushita Electric Ind Co Ltd | マグネトロンスパツタ装置 |
US5252194A (en) * | 1990-01-26 | 1993-10-12 | Varian Associates, Inc. | Rotating sputtering apparatus for selected erosion |
JP2835462B2 (ja) * | 1990-02-12 | 1998-12-14 | 信越化学工業株式会社 | スパッタ装置 |
JPH0463274A (ja) * | 1990-06-30 | 1992-02-28 | Mitsubishi Kasei Corp | マグネトロンスパッター装置 |
JP3879009B2 (ja) * | 1995-01-30 | 2007-02-07 | キヤノンアネルバ株式会社 | スパッタリングカソード |
US6264803B1 (en) * | 1997-02-07 | 2001-07-24 | Steven V. Morgan | Apparatus and method for sputtering |
JP3727849B2 (ja) * | 1998-12-21 | 2005-12-21 | 東京エレクトロン株式会社 | 磁石形態が可変のカソード |
-
2001
- 2001-08-02 GB GBGB0118803.6A patent/GB0118803D0/en not_active Ceased
-
2002
- 2002-04-05 KR KR1020047001349A patent/KR100860674B1/ko not_active IP Right Cessation
- 2002-04-05 US US10/485,703 patent/US20040178056A1/en not_active Abandoned
- 2002-04-05 CN CN028151380A patent/CN1537318B/zh not_active Expired - Fee Related
- 2002-04-05 JP JP2003519962A patent/JP4250526B2/ja not_active Expired - Fee Related
- 2002-04-05 WO PCT/EP2002/003851 patent/WO2003015124A1/en active Application Filing
- 2002-04-05 EP EP02727537A patent/EP1412964B1/en not_active Expired - Lifetime
- 2002-04-05 AT AT02727537T patent/ATE515056T1/de not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6171461B1 (en) * | 1996-03-07 | 2001-01-09 | Mark A. Bernick | Sputtering cathode |
US5855744A (en) * | 1996-07-19 | 1999-01-05 | Applied Komatsu Technology, Inc. | Non-planar magnet tracking during magnetron sputtering |
US5873989A (en) * | 1997-02-06 | 1999-02-23 | Intevac, Inc. | Methods and apparatus for linear scan magnetron sputtering |
CN1297575A (zh) * | 1998-04-16 | 2001-05-30 | 辛瓦苛股份有限公司 | 磁控管中用于控制目标冲蚀和溅射的装置 |
Non-Patent Citations (2)
Title |
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US 5855744 A,说明书第2、9-10、15栏,附图1-4、9-10、27-28. |
US 6171461 B1,全文. |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107889538A (zh) * | 2015-05-06 | 2018-04-06 | 攀时奥地利公司 | 用于管靶的连接件 |
CN107889538B (zh) * | 2015-05-06 | 2020-06-16 | 攀时奥地利公司 | 用于管靶的连接件 |
US10854436B2 (en) | 2015-05-06 | 2020-12-01 | Plansee Se | Connector piece for a tubular target |
Also Published As
Publication number | Publication date |
---|---|
US20040178056A1 (en) | 2004-09-16 |
KR20040028958A (ko) | 2004-04-03 |
GB0118803D0 (en) | 2001-09-26 |
KR100860674B1 (ko) | 2008-09-26 |
JP2004538368A (ja) | 2004-12-24 |
CN1537318A (zh) | 2004-10-13 |
EP1412964B1 (en) | 2011-06-29 |
EP1412964A1 (en) | 2004-04-28 |
ATE515056T1 (de) | 2011-07-15 |
JP4250526B2 (ja) | 2009-04-08 |
WO2003015124A1 (en) | 2003-02-20 |
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Owner name: SBIC LUXEMBOURG S.A.R.L. Free format text: FORMER OWNER: N. V. BEKAERT S.A. Effective date: 20120829 Owner name: SOLERAS ADVANCED COATINGS NV Free format text: FORMER OWNER: SBIC LUXEMBOURG S.A.R.L. Effective date: 20120829 |
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Effective date of registration: 20120829 Address after: Billy Chak Patentee after: Soleras Advanced Coatings BVBA Address before: Luxembourg Patentee before: SBIC Luxemburg Ltd. Effective date of registration: 20120829 Address after: Luxembourg Patentee after: SBIC Luxemburg Ltd. Address before: Weaver, Belgium Patentee before: NV BEKAERT S.A. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20170405 |