CN1503619A - Cooling device for IC block - Google Patents
Cooling device for IC block Download PDFInfo
- Publication number
- CN1503619A CN1503619A CNA021532117A CN02153211A CN1503619A CN 1503619 A CN1503619 A CN 1503619A CN A021532117 A CNA021532117 A CN A021532117A CN 02153211 A CN02153211 A CN 02153211A CN 1503619 A CN1503619 A CN 1503619A
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- condenser
- evaporator
- cold
- producing medium
- cooling device
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This invention relates to an IC block cooling device of CPU or PCB in electronic products including an evaporator absorbing heat generated from the PCB and gasifying the internal cold-producing medium, a freezing mixture connected with the evaporator and freezing the gasified cold-producing medium and its channel flow tubes connecting the evaporator and the freezing mixture to make the medium to circulate in phase transformation repeatedly. Advantage: this invented cooling device based on heat tube theory is set in highly operated CPU or PCB electronic products to replace the cooling device with drive structures.
Description
Technical field
What the present invention relates to is the integrated circuit block cooling device, particularly be the integrated circuit block cooling device of cooling CPU or PCB in the electronic product of built-in CPU (central processing unit) that carries out high-speed computation or PCB (printing circuit board).
Background technology
In order to improve user's life class, mostly the electronic product of producing is to carry out simultaneously the product of multiple function recently, and in order to carry out various functions simply, product has possessed the PC function of utilizing CPU (central processing unit) to carry out computing or built-in PCB (printing circuit board).
But,, when use carrying out the various function of product, need CPU to carry out the high-speed computation processing or pcb board carries out functional mapping, so produce a large amount of heats on CPU or the pcb board according to user's needs.At this moment, should utilize cooling device to cool off CPU or pcb board, be that example is described in detail existing cooling procedure below with the pcb board.
At first, the cooling device 100 to cooling pcb board 50 is described in detail.As shown in Figure 1, cooling device 100 comprises: absorb the heat that pcb board produces, the pressurizes refrigerant of the low-temp low-pressure of gaseous state is become the compressor 110 of cold-producing medium of the HTHP of gaseous state; Make the condenser 120 that becomes the liquid refrigerant of normal temperature high voltage in the process of cold-producing medium condensation that pressure in the compressor 110 raises by heat release; In order to make the cold-producing medium that in condenser 120, becomes the normal temperature high voltage state and evaporator 150 carry out heat exchange and reduce the expansion valve 140 of the pressure of cold-producing medium; Be arranged on the pcb board 50, utilize cold-producing medium to absorb the heat heat-absorbing action that pcb board 50 produces, its evaporator that becomes gaseous state 150 is constituted by expansion valve 140 decompressions.
Below, the cooling procedure of the cooling device 100 that as above constitutes is described;
As shown in Figure 1, when producing heat on the pcb board 50, its heat can be sent in the evaporator 150 on the pcb board 50, absorbs these heats by the cold-producing medium in expansion valve 140 decompressions and the inflow evaporator 150 and becomes the low-temp low-pressure state and flow to compressor 110.
The gaseous refrigerant that enters the low-temp low-pressure in the compressor 110 flows to condenser 120 at the gaseous refrigerant that this becomes HTHP, enter and carry out the liquid refrigerant that heat release becomes normal temperature high voltage behind the condenser 120 and flow to expansion valve 140, and cold-producing medium in condenser liberated heat by fan 130 rows of condenser 120 sides to the outside.
Enter the cold-producing medium of the normal temperature high voltage of expansion valve 140, in order to improve the efficient of the heat exchange of in evaporator 150, carrying out with pcb board, after becoming low-pressure state, as previously mentioned, absorb pcb board 50 generation heats and become the low-temp low-pressure state, flow into the gaseous refrigerant that becomes HTHP in the compressor 110 once more.In the process of carrying out above-mentioned circulation repeatedly, cool off pcb board.
But, form in the integrated circuit block cooling device 100 in the past of kind of refrigeration cycle cooling pcb board, compressor 110 in the cooling system, condenser 120, expansion valve 140, evaporator 150 occupy very big space, limited the cooling device that other are set thus, it is very complicated particularly cooling device 100 to be arranged on pcb board 50 process on every side; Particularly the overall dimension of the most important compressor 100 in the cooling system has only very for a short time, just can be installed on the pcb board 50.But the size difficulty that reduces compressor is huge, and the production cost of compressor 110 can improve much thus.
And when light duty compressor 110 compressed, the rotation of the motor (not shown) that it is built-in can produce very big noise, caused the discontented of consumer thus, and noise also can influence the operate as normal of other electronic components simultaneously, causes product bug easily.
Summary of the invention
The objective of the invention is to overcome the deficiency of above-mentioned technology, the heat that provides a kind of utilization to produce by CPU or PCB, in evaporator, move to the condensation part by pressure official post cold-producing medium in the vaporizing system cryogen, and make it carry out the heat release condensation in the condensation part to move to the evaporation part once more, utilize cyclic process repeatedly to cool off CPU or PCB, replace the existing cooling cycle system that constitutes by compressor, condenser, expansion valve, evaporator; And its casting is formed overall structure with synthetic resin, realize that cost reduces, and stands with the little integrated circuit block cooling device in space.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: a kind of integrated circuit block cooling device, and its structure comprises: the upper end that is positioned at pcb board can absorb the evaporator that heat that pcb board produces makes its inner cold-producing medium gasification; Be communicated with evaporator and can make the gasification condensation of refrigerant and the condenser of inflow evaporator once more; Connect evaporator and condenser and carry the refrigerant flow tube of between evaporator and condenser, carrying out phase transformation circulation movable passageway owing to pressure official post cold-producing medium repeatedly.
The invention has the beneficial effects as follows: the present invention is in the electronic product of built-in CPU (central processing unit) that carries out high-speed computation or pcb board (printing circuit board), principle according to heat pipe, the heat that utilization is produced by CPU or pcb board, vaporizing system cryogen in evaporator, because pressure official post cold-producing medium moves to condenser, and make it carry out the heat release condensation to move to evaporator once more at condenser, in the process that circulates repeatedly like this, cooling CPU or pcb board, install the existing utilization of replacement by compressor with this, condenser, expansion valve, the mode that the cooling cycle system that evaporator constitutes cools off has outstanding cooling effect.
The present invention adopts the synthetic resin casting to form overall structure, can be bigger with respect to existing cooling device reduce cost, how little the space no matter CPU or pcb board are set have, cooling device of the present invention can be set easily, with respect to the existing cooling system that constitutes by compressor, condenser, expansion valve, evaporator, can greatly reduce to be provided with the space thus.Particularly the present invention just utilizes evaporation process and the condensation process cooling CPU or the pcb board of cold-producing medium, does not have noise with existing comparing with the cooling device of driven compressor.
Description of drawings
Fig. 1 represents that existing integrated circuit block utilizes the chiller system figure of kind of refrigeration cycle cooling pcb board;
Fig. 2 represents integrated circuit block cooling device oblique view of the present invention;
Fig. 3 represents the sectional drawing of the evaporator among the present invention;
Fig. 4 represents the sectional drawing of the condenser among the present invention;
Fig. 5 represents an alternative embodiment of the invention figure;
Fig. 6 represents movement state diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are described in further detail:
The present invention is a kind of integrated circuit block cooling device, and its structure comprises: the upper end that is positioned at pcb board can absorb the evaporator 10 that heat that pcb board produces makes its inner cold-producing medium gasification; Be communicated with evaporator 10 and can make the gasification condensation of refrigerant and the condenser 20 of inflow evaporator 10 once more; Connect evaporator 10 and condenser 20 and carry the refrigerant flow tube 30 of between evaporator 10 and condenser 20, carrying out phase transformation circulation movable passageway owing to pressure official post cold-producing medium repeatedly.
Described evaporator 10 comprises the housing 11 that the hexahedron of hollow forms, and the cold-producing medium inflow entrance 13 and the flow export 14 that are communicated with refrigerant flow tube 30 are arranged on the housing 11; There is the cold-producing medium of the evaporation of making to rise to cold-producing medium adverse current that upside in the housing avoids evaporating through cold-producing medium flow export 14 when condenser 20 flows isolating cold-producing medium inflow entrance 13 and flow export 14 places to housing inner underside and refrigerant cycle conduit 12 with certain length.
Described condenser 20 comprises: the housing 21 that the hexahedron of hollow forms; In housing 21, have and become one with housing 21 and make cold-producing medium that in evaporator 10 evaporation flows into by refrigerant flow tube 30 at the exothermic condenser pipe 22 of condensation process; The a plurality of blow vents 23 that run through the two sides formation of housing 21.
Be provided with in the bottom surface of condenser 20 and can make one of them heat-conducting piece 24 of heat is discharged in the condenser 20 steel or copper material rapidly.
Described evaporator 10 and condenser 20, refrigerant flow tube 30 adopts the synthetic resin casting to become overall structure.
Integrated circuit block cooling device 1 of the present invention has utilized cold-producing medium to absorb in evaporator 10 in the heat gasification that pcb board 50 produces because pressure differential moves to condenser 20, condensation and inflow evaporator 10 once more after condenser 20 carries out heat release, the heat pipe principle that circulates repeatedly cooling pcb board.
Below, be example with pcb board 50, the cooling procedure of integrated circuit block cooling device is described.
The mode that the cooling cycle system that integrated circuit block cooling device 1 of the present invention replaces utilization in the past to be made of compressor 110, condenser 120, expansion valve 140, evaporator 150 cools off, principle according to heat pipe, the heat that utilizes pcb board 50 to produce, in evaporator 10, move to condenser 20 by pressure official post cold-producing medium in the vaporizing system cryogen, and make it after condenser 20 carries out the heat release condensation, move to evaporator 10 again, in the process that circulates repeatedly like this, pcb board 50 cools off.
Described integrated circuit block cooling device comprises as shown in Figure 2: be arranged on the upper end of pcb board 50, make the cold-producing medium of liquefy in condenser 20 absorb the evaporator 10 that heat that pcb board 50 produces becomes gaseous refrigerant;
Make from the condenser 20 of the cold-producing medium heat release condensation liquefy cold-producing medium of evaporator 10 inflows;
Be arranged between described evaporator 10 and the condenser 20, for cold-producing medium being circulated in evaporator 10 and condenser 20 and carry out phase change by evaporation process and condensation process, and the refrigerant flow tube 30 that becomes refrigerant flow channel constitutes.
Wherein, described evaporator 10 comprises as shown in Figures 2 and 3: the housing 11 that the hexahedron of hollow forms; Be arranged at and have certain length in the housing 11, and make the cold-producing medium of the heat of vaporization that absorbs pcb board 50 rise to the upside of housing 11, flow to the refrigerant flow tube 30 of condenser 20; Arrive the refrigerant cycle conduit 12 of housing 11 downsides for the cold-producing medium adverse current that avoids evaporating; Communicate with refrigerant flow tube 30, make the cold-producing medium discrepancy of condensation and evaporation and run through refrigerant inlet 13 and refrigerant outlet 14 formations that housing 11 sides form.
Simultaneously, described condenser 20 comprises as Fig. 2 and shown in Figure 4: the housing 21 that the hexahedron of hollow forms; In housing 21, form one with housing 21, make evaporator 10 in evaporation and the cold-producing medium that flows into by refrigerant flow tube 30 in the process of condensation to the exothermic condenser pipe 22 on every side of housing 21; For laterally, a plurality of blow vents 23 are arranged in the two sides of running through housing 21 with cold-producing medium liberated heat row; Particularly be provided with the heat-conducting piece 24 that to discharge exothermic steel in the process of cold-producing medium that enters in the condenser 20 or copper material rapidly in condensation in the bottom surface of condenser 20.
Fig. 5 represents an alternative embodiment of the invention figure, as shown in Figure 5, form integrally-built evaporator 10 and condenser 20, refrigerant flow tube 30 forms separable structure, particularly on evaporator 10a that can separate mutually and condenser 20a, form the cold-producing medium input pipe 15,25 of the cold-producing medium of importing liquid state and gaseous state and exported gaseous state and the cold-producing medium efferent duct 16,26 of the cold-producing medium of liquid state, make the cold-producing medium input pipe 15 of described evaporator 10a and condenser 20a, 25 and cold-producing medium efferent duct 16,26 and the mutual dismounting of refrigerant flow tube 30a.
Below, with reference to accompanying drawing the present invention is described in detail the effect of integrated circuit block:
Fig. 6 represents movement state diagram of the present invention.
Because when conversion of the function of electronic product and calculation process, the heat that produces on the pcb board 50, can be delivered to the evaporator 10 that is arranged on the pcb board upper end, and through in the liquid refrigerant inflow evaporator 10 of refrigerant flow tube 30, just absorb these heats and become gaseous state, after rising on refrigerant cycle conduit 12 in the evaporator 10 and the space between the evaporator housing 11, flow to condenser 20 by refrigerant flow tube 30 with certain-length.
The main effect of described refrigerant cycle conduit 12 is to make the cold-producing medium of the heat of vaporization that absorbs pcb board 50 rise to the upside of housing 11, flows to condenser 20 through refrigerant flow tube 30, and the cold-producing medium adverse current that avoids evaporating simultaneously is to the downside of housing 11.
The cold-producing medium that flow into condenser 20 through refrigerant flow tube 30 is emitted heat by the condenser pipe 22 in the condenser 20 around condenser housing 21, by the gaseous state liquefy, the cold-producing medium liberated heat is discharged into the outside by the fan 40 of condenser 20 sides by a plurality of blow vents 23 that run through the formation of condenser housing 21 both sides.The main effect of described fan 40 is to improve heat exchanger effectiveness, make described condenser 20 liberated heats be discharged to the outside, and the heat-conducting piece 24 that is arranged on condenser 20 bottom surfaces is emitted the heat transferred of condenser 20 rapidly by a plurality of blow vents 23 that run through condenser 20 two sides.
The cold-producing medium of liquefy enters in the evaporator 10 by refrigerant flow tube 30 once more in condenser 20, absorbs pcb board 50 liberated heats again, so the described pcb board of circulation cooling.
By above explanation as can be known, integrated circuit block cooling device of the present invention is applicable in all electronic products of those built-in CPU (central processing unit) that carry out high-speed computation or pcb board (printing circuit board).
Claims (6)
1. integrated circuit block cooling device is characterized in that its structure comprises: the upper end that is positioned at pcb board can absorb the evaporator (10) that heat that pcb board produces makes its inner cold-producing medium gasification; Be communicated with evaporator (10) and can make the gasification condensation of refrigerant and the condenser (20) of inflow evaporator (10) once more; Connect evaporator (10) and condenser (20) and carry the refrigerant flow tube (30) of between evaporator (10) and condenser (20), carrying out phase transformation circulation movable passageway owing to pressure official post cold-producing medium repeatedly.
2. according to the cooling device described in the claim 1, it is characterized in that described evaporator (10) comprises the housing (11) that the hexahedron of hollow forms, and has the cold-producing medium inflow entrance (13) and the flow export (14) that are communicated with refrigerant flow tube (30) on the housing (11); Locate to make the cold-producing medium of evaporation to rise to cold-producing medium adverse current that upside in the housing avoids evaporating through cold-producing medium flow export (14) when condenser (20) is mobile isolating cold-producing medium inflow entrance (13) and flow export (14) to housing inner underside and refrigerant cycle conduit (12) with certain length.
3. according to the cooling device described in the claim 2, it is characterized in that described condenser (20) comprising: the housing (21) that the hexahedron of hollow forms; In housing (21), have and become one with housing (21) and make evaporator (10) in the cold-producing medium of evaporation by refrigerant flow tube (30) inflow at the exothermic condenser pipe of condensation process (22); The a plurality of blow vents (23) that run through the two sides formation of housing (21).
4. according to the cooling device described in the claim 3, it is characterized in that being provided with and to make one of them heat-conducting piece (24) of heat is discharged in the condenser (20) steel or copper material rapidly in the bottom surface of condenser (20).
5. according to the cooling device described in claim 2 or 3, it is characterized in that described evaporator (10), condenser (20) and refrigerant flow tube (30) adopt the synthetic resin casting to become overall structure.
6. according to the cooling device described in claim 2 or 3, it is characterized in that evaporator (10) and condenser (20) form overall structure, refrigerant flow tube (30) forms separable structure with evaporator (10) and condenser (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021532117A CN100340145C (en) | 2002-11-26 | 2002-11-26 | Cooling device for IC block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021532117A CN100340145C (en) | 2002-11-26 | 2002-11-26 | Cooling device for IC block |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1503619A true CN1503619A (en) | 2004-06-09 |
| CN100340145C CN100340145C (en) | 2007-09-26 |
Family
ID=34235016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021532117A Expired - Fee Related CN100340145C (en) | 2002-11-26 | 2002-11-26 | Cooling device for IC block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100340145C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101103424B (en) * | 2004-11-16 | 2010-09-29 | Abb研究有限公司 | Insulating hollow body for a cooling high-voltage loadable element |
| CN105743326A (en) * | 2014-12-24 | 2016-07-06 | 丰田自动车株式会社 | stack unit |
| CN106655634A (en) * | 2016-12-16 | 2017-05-10 | 卧龙电气集团股份有限公司 | Novel sliding bearing self-lubricating motor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0231456B1 (en) * | 1985-12-13 | 1991-06-26 | Ascom Hasler AG | Process and device for the transfer of waste heat by at least one element of an electrical assembly |
| US6467295B2 (en) * | 2000-12-01 | 2002-10-22 | Lg Electronics Inc. | Refrigerated cooling apparatus for semiconductor device |
-
2002
- 2002-11-26 CN CNB021532117A patent/CN100340145C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101103424B (en) * | 2004-11-16 | 2010-09-29 | Abb研究有限公司 | Insulating hollow body for a cooling high-voltage loadable element |
| CN105743326A (en) * | 2014-12-24 | 2016-07-06 | 丰田自动车株式会社 | stack unit |
| CN105743326B (en) * | 2014-12-24 | 2018-09-11 | 丰田自动车株式会社 | Lamination unit |
| CN106655634A (en) * | 2016-12-16 | 2017-05-10 | 卧龙电气集团股份有限公司 | Novel sliding bearing self-lubricating motor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100340145C (en) | 2007-09-26 |
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Granted publication date: 20070926 Termination date: 20091228 |