CN100359999C - Chip cooling device - Google Patents
Chip cooling device Download PDFInfo
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- CN100359999C CN100359999C CNB031097081A CN03109708A CN100359999C CN 100359999 C CN100359999 C CN 100359999C CN B031097081 A CNB031097081 A CN B031097081A CN 03109708 A CN03109708 A CN 03109708A CN 100359999 C CN100359999 C CN 100359999C
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- condenser
- cold
- evaporator
- producing medium
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Abstract
The present invention relates to a chip cooling device which comprises an evaporator, a condenser and a refrigerant flowing pipe, wherein the evaporator can absorb heat generated from a printed circuit board by liquid refrigerant and can evaporate the refrigerant into gas; the condenser can change the refrigerant flowing out of the evaporator into liquid; the refrigerant flowing pipe is arranged between the evaporator and the condenser. The cooling device of the present invention makes use of a heat pipe principle to cool the heat generated from a central processing unit or the printed circuit board, and the condenser and the evaporator in the device are made of the injection of plastic materials. Therefore, the product cost can be reduced, the device is especially not limited by a narrow space of the inner central processing unit or the printed circuit board, so the present invention has the advantages of simple arrangement and little space occupation. In addition, the device only makes use of the evaporation process and the condensation process of the refrigerant to cool the heat generated from the central processing unit or the printed circuit board, and therefore, the present invention can avoid noise caused by compressor drive in the existing cooling devices.
Description
Technical field
The present invention relates to a kind of chip cooling device, particularly relate to a kind of chip cooling device that utilizes heat pipe principle to cool off central processing unit or printed circuit board (PCB).
Background technology
In order to improve user's quality of life, now the electronic product that uses all is provided with multiple function, and is to make these functional utilizations get up easier and adorned in the said goods by means of central processing unit and can carry out the PC of calculation process or printed circuit board (PCB) etc.But, when using the various function of the said goods according to user's needs, can produce a large amount of heat during the changes of function of the high-speed computation processing of central processing unit or printed circuit board (PCB) on it, and this heat is to utilize the cooling device that forms freeze cycle to cool off, and existing is that example describes this cooling procedure in detail with the printed circuit board (PCB).Fig. 1 is that the chip cooling device system of prior art constitutes schematic diagram.As shown in Figure 1, the cooling device 100 of this prior art is compressed into the compressor 110 of high temperature and high pressure gaseous refrigerant by the cold-producing medium that the heat that has absorbed printed circuit board (PCB) 50 generations then can be flashed to the gaseous state low-temp low-pressure; Will be in compressor 110 refrigerant compressed carry out making it to become in the condensation condenser 120 of normal temperature high voltage liquid state by thermolysis; The normal temperature high voltage cold-producing medium of condensation in the condenser 120 reduced pressure become to be fit to the expansion valve 140 that evaporator 150 carries out heat exchange; Constitute by the evaporator 150 that the heat that absorbs printed circuit board (PCB) 50 and produce flashes to gaseous state with being installed in printed circuit board (PCB) 50 upper ends and making through the cold-producing medium of expansion valve 140 decompression.When printed circuit board (PCB) 50 generations were hot, this heat can be passed to the evaporator of installing on it 150, and the cold-producing medium of inflow evaporator 150 then can absorb this heat and flow to compressor 110 after flashing to the low-temp low-pressure gaseous state after expansion valve 140 decompressions.At this moment, being compressed into the high temperature and high pressure gas state in compressor 110 after, the low-temp low-pressure gaseous refrigerant of inflow compressor 110 flows to condenser 120, the cold-producing medium that flow in the condenser 120 flows to expansion valve 140 after being condensed into the normal temperature high voltage liquid condition in heat radiation around it, and the heat of being distributed towards periphery by condenser 120 then discharges to the outside under the fan 130 that is arranged at condenser 120 1 sides drives.As mentioned above, the normal temperature high voltage liquid refrigerant that flow to expansion valve 140 is to carry out heat exchange smoothly and reduce pressure into low-pressure state for the heat that produces with printed circuit board (PCB) 50 in evaporator 150, flow to cold-producing medium in the evaporator 150 like this and flow into once more after converting the low-temp low-pressure gaseous state to having absorbed the heat that produces from printed circuit board (PCB) 50 in the compressor 110 and be compressed into high-temperature high-pressure state, cool off printed circuit board (PCB) 50 repeatedly by above-mentioned this process.But, thisly when forming freeze cycle, can cool off in the chip cooling device 100 of printed circuit board (PCB) 50, compressor 110, condenser 120, expansion valve 140 and evaporator 150 too occupy the space are set, thereby make and chip cooling device 100 is set has a lot of restrictions, particularly there is very loaded down with trivial details problem in the chip cooling device 100 of this structure near being arranged on the narrow printed circuit board (PCB) of surrounding space 50, and, in order to be arranged in the narrow space around the printed circuit board (PCB) 50 and should to be made into small-scale structure with forming essential elements compressor 110 in the above-mentioned freeze cycle, but so not only very difficult, but also the manufacturing cost and the product cost of making light duty compressor 110 are increased considerably.And the not shown motor that light duty compressor 110 is installed in it when compressing can produce noise, and this noise not only can be made troubles to the consumer, but also can influence each parts of electronic product and produce fault.
Summary of the invention
In order to address the above problem, chip cooling device provided by the invention is to utilize the cold-producing medium that passes through in evaporator to absorb the heat that is produced by printed circuit board (PCB), and the pressure official post cold-producing medium that produces when relying on the cold-producing medium gasification flows to condenser, by the thermolysis that flow to the condenser inner refrigerant cold-producing medium circulated once more repeatedly to evaporator then and makes with the heating tube principle of cooling printed circuit board (PCB).
Chip cooling device provided by the invention comprises that the cold-producing medium that can utilize the liquefy by the condensation of condenser absorbs the heat that produces from printed circuit board (PCB) and makes cold-producing medium flash to the evaporator of gaseous state; Make the condenser of its liquefy when can carry out condensation by thermolysis from the cold-producing medium that evaporator flows out; And be installed between evaporator and the condenser and evaporator capable of circulation and condenser in produce the refrigerant flow tube of the cold-producing medium of phase change by evaporation process and condensation process.
Chip cooling device provided by the invention is to utilize heat pipe principle to cool off the heat that is produced by central processing unit or printed circuit board (PCB), and, condenser in this chip cooling device and evaporator are to carry out injection moulding with plastic material and form the simple structure of mutual one, thereby utilize the cooling device of refrigerating circulation system to compare with prior art to have the advantage that can significantly reduce product cost, the restriction that dress can produce the narrow space of the central processing unit of big calorimetric or printed circuit board (PCB) in particularly this device was not subjected to, thereby can make its setting easier, and occupation space is little.In addition, chip cooling device of the present invention only utilizes the evaporation process of cold-producing medium and condensation process to cool off the heat that produces on central processing unit or the printed circuit board (PCB), thereby can prevent the noise problem that caused by driven compressor in the refrigerating plant of prior art.
Description of drawings
Below in conjunction with the drawings and specific embodiments chip cooling device of the present invention is elaborated.
Fig. 1 is that the chip cooling device system of prior art constitutes schematic diagram.
Fig. 2 is a chip cooling device three-dimensional structure diagram of the present invention.
Fig. 3 is the cutaway view of evaporator in the chip cooling device of the present invention.
Fig. 4 is the cutaway view of condenser in the chip cooling device of the present invention.
Fig. 5 is another embodiment stereochemical structure cutaway view of chip cooling device of the present invention.
Fig. 6 is a chip cooling device working state schematic representation of the present invention.
Embodiment
As Fig. 2, Fig. 3 and shown in Figure 4, chip cooling device 1 of the present invention by utilize can from printed circuit board (PCB) 50 absorb the heat-absorbing action of cold-producing medium the evaporator 10 of heat and when producing gasification the depended on pressure difference flow to condenser 20, produce condensation by the thermolysis that flow into condensation part 20 inner refrigerants then and the heating tube principle that circulates repeatedly to evaporator 10 is again cooled off printed circuit board (PCB) 50.Be that example describes still now to utilize chip cooling device 1 of the present invention to cool off printed circuit board (PCB) 50.Chip cooling device 1 of the present invention is to utilize heat pipe principle to replace utilizing the refrigerating circulation system that is made of compressor 110, condenser 120, expansion valve 140 and evaporator 150 to cool off the prior art mode of the printed circuit board (PCB) 50 that can produce a large amount of heats.Promptly as shown in Figure 2, chip cooling device 1 of the present invention is installed in the upper end of printed circuit board (PCB) 50, and it comprises and can utilize by the condensation of condenser 20 cold-producing medium of liquefy to absorb the heat that produces from printed circuit board (PCB) 50 and make cold-producing medium flash to the evaporator 10 of gaseous state; Make the condenser 20 of its liquefy when the cold-producing medium that flows out from evaporator 10 can be carried out condensation by thermolysis; And be installed between evaporator 10 and the condenser 20 and evaporator 10 capable of circulation and the condenser 20 interior refrigerant flow tube 30 that produce the cold-producing medium of phase change by evaporation process and condensation process.As shown in Figures 2 and 3, evaporator 10 is by the shell 11 with hollow cube structure; Be arranged on the inside of shell 11 and have certain length, the cold-producing medium adverse current after the top that can make the cold-producing medium that has absorbed the heat that produces from printed circuit board (PCB) 50 and flashed to gaseous state rise to shell 11 then avoids evaporating when condenser 20 circulates through refrigerant flow tube 30 is to the refrigerant cycle ductor 12 of shell 11 bottoms; With link to each other with refrigerant flow tube 30 and can make the cold-producing medium inflow and outflow after condensation and the evaporation and constitute at cold-producing medium inflow entrance 13 and cold-producing medium flow export 14 that shell 11 1 sides connect to form.And as Fig. 2 and shown in Figure 4, condenser 20 is by the shell 21 with hollow cube structure; Integrally formed in shell 21, can be from evaporator 10 evaporation back and the cold-producing medium that flows into through refrigerant flow tube 30 carry out condensation by thermolysis, and the condenser pipe 22 that the heat of generation is shed around shell 21; With on the two sides of shell 21, connect a plurality of blow vents 23 that form and constitute for the cold-producing medium heat that sheds around shell 21 can be discharged to the outside.Particularly the bottom surface of condenser 20 is equipped with the heat that produces in the time of can making after the condensation of refrigerant that flows in the condenser 20 from the gaseous state liquefy and is discharged into the outside stainless steel or the conduction gonosome 24 of copper material as early as possible.In addition, evaporator 10, condenser 20 and refrigerant flow tube 30 are formed by the plastic material integrated through injection molding, and the cold-producing medium that flows in it is water or alcohol etc.
Fig. 5 is another embodiment stereochemical structure cutaway view of chip cooling device of the present invention.As shown in Figure 5, evaporator 10a, condenser 20a and the refrigerant flow tube 30a that is integral that can mutually combine has the structure that is separated from each other, be formed with cold-producing medium inflow pipe 15/25 that can flow into liquid state and gaseous refrigerant and the cold-producing medium effuser 16/26 that can flow out liquid state and gaseous refrigerant among evaporator 10a that particularly is separated from each other and the condenser 20a separately, the cold-producing medium inflow pipe 15/25 of evaporator 10a and condenser 20a and cold-producing medium effuser 16/26 can fit together mutually with refrigerant flow tube 30a.
Fig. 6 is a chip cooling device working state schematic representation of the present invention.As shown in Figure 6, when electronic product produces when hot owing to changes of function and calculation process make printed circuit board (PCB) 50, this heat sends the evaporator 10 that install printed circuit board (PCB) 50 upper ends to, this heat sends to again by refrigerant flow tube 30 and flow into the cold-producing medium that has been condensed into liquid state in the evaporator 10 subsequently, cold-producing medium absorbs and produces evaporation behind this heat and become gaseous state, and by be arranged in the evaporator 10 and have the refrigerant cycle ductor 12 of certain-length and the space between the evaporator shell 11 on rise, circulate to condenser 20 by refrigerant flow tube 30 then.Refrigerant cycle ductor 12 has the cold-producing medium adverse current that can the avoid evaporating effect to shell 11 bottoms.Flow into inside that condenser 20 interior cold-producing mediums by condenser pipes 22 with condenser 20 interior formation one flow to condenser casing 21 through refrigerant flow tube 30 this moment, and be condensed into liquid state from gaseous state, as mentioned above, the heat that produces during condensation of refrigerant in this process is to be discharged to the outside by connecting the blow vent 23 that forms on condenser casing 21 two sides by the fan 40 that is arranged on condenser 20 1 sides, but also can more promptly outwards discharge the interior heat of condenser 20 by the conduction gonosome 24 that is installed in condenser 20 bottom surfaces.Can flow to evaporator 10 by refrigerant flow tube 30 and in condenser 20, be condensed into liquid cold-producing medium, and then carry out heat exchange with the heat that produces from printed circuit board (PCB) 50, by this repeatedly cyclic process cool off printed circuit board (PCB) 50.Be equipped with in chip cooling device of the present invention is applicable to and utilize central processing unit to carry out the mainframe computer of calculation process or all electronic products of printed circuit board (PCB).
Claims (3)
1, a kind of chip cooling device, be installed in the upper end of printed circuit board (PCB) (50), it comprises and can utilize by the condensation of condenser (20) cold-producing medium of liquefy to absorb the heat that produces from printed circuit board (PCB) (50) and make cold-producing medium flash to the evaporator (10) of gaseous state; Make the condenser (20) of its liquefy when the cold-producing medium that flows out from evaporator (10) can be carried out condensation by thermolysis; And be installed between evaporator (10) and the condenser (20) and evaporator capable of circulation (10) and the interior refrigerant flow tube (30) that produces the cold-producing medium of phase change by evaporation process and condensation process of condenser (20); It is characterized in that: described evaporator (10) is by the shell with hollow cube structure (11); Be arranged on the inside of shell (11) and have certain length, the cold-producing medium adverse current after can avoiding evaporating is to the refrigerant cycle ductor (12) of shell (11) bottom; With link to each other with refrigerant flow tube (30) and can make the cold-producing medium inflow and outflow after condensation and the evaporation and constitute at cold-producing medium inflow entrance (13) and cold-producing medium flow export (14) that shell (11) one sides connect to form.
2, chip cooling device according to claim 1 is characterized in that: described condenser (20) is by the shell with hollow cube structure (21); Integrally formed in shell (21), can be from evaporator (10) evaporation back and the cold-producing medium that flows into through refrigerant flow tube (30) carry out condensation by thermolysis, and the condenser pipe (22) that the heat of generation is shed to shell (21) on every side; With on the two sides of shell (21), connect a plurality of blow vents (23) that form and constitute for the cold-producing medium heat that sheds on every side to shell (21) can be discharged to the outside.
3, chip cooling device according to claim 2 is characterized in that: the bottom surface of described condenser (20) is equipped with the heat that produces in the time of can making after the condensation of refrigerant that flows in the condenser (20) from the gaseous state liquefy and is discharged into the outside stainless steel or the heat carrier (24) of copper material as early as possible.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031097081A CN100359999C (en) | 2003-04-11 | 2003-04-11 | Chip cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031097081A CN100359999C (en) | 2003-04-11 | 2003-04-11 | Chip cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1536958A CN1536958A (en) | 2004-10-13 |
| CN100359999C true CN100359999C (en) | 2008-01-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031097081A Expired - Fee Related CN100359999C (en) | 2003-04-11 | 2003-04-11 | Chip cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100359999C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4381998B2 (en) * | 2005-02-24 | 2009-12-09 | 株式会社日立製作所 | Liquid cooling system |
| CN100450335C (en) * | 2006-05-12 | 2009-01-07 | 杭州电子科技大学 | Radiation cooling method for power device of refrigeration device |
| EP2661598B1 (en) * | 2012-02-21 | 2018-08-01 | Huawei Technologies Co., Ltd. | Cooling system and method for cooling a heat generating unit |
| CN103091361A (en) * | 2013-01-16 | 2013-05-08 | 重庆大学 | Ice chest device for field test of heat transfer coefficient with building envelope structure |
| CN113163683B (en) * | 2021-04-02 | 2023-05-30 | 西安易朴通讯技术有限公司 | Liquid cooling heat dissipation equipment, cabinet and system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5725049A (en) * | 1995-10-31 | 1998-03-10 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Capillary pumped loop body heat exchanger |
| US6227288B1 (en) * | 2000-05-01 | 2001-05-08 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional capillary system for loop heat pipe statement of government interest |
| CN1355415A (en) * | 2000-11-30 | 2002-06-26 | 国际商业机器公司 | Device and method for cooling heat source in high density chip carrier equipment |
| JP2002340489A (en) * | 2001-05-15 | 2002-11-27 | Hitachi Ltd | Loop type heat pipe |
| CN2543205Y (en) * | 2001-12-31 | 2003-04-02 | 南京赫特节能环保有限公司 | Separating phase-change radiator for electronic element and device and desk computer CPU chip |
-
2003
- 2003-04-11 CN CNB031097081A patent/CN100359999C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5725049A (en) * | 1995-10-31 | 1998-03-10 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Capillary pumped loop body heat exchanger |
| US6227288B1 (en) * | 2000-05-01 | 2001-05-08 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional capillary system for loop heat pipe statement of government interest |
| CN1355415A (en) * | 2000-11-30 | 2002-06-26 | 国际商业机器公司 | Device and method for cooling heat source in high density chip carrier equipment |
| JP2002340489A (en) * | 2001-05-15 | 2002-11-27 | Hitachi Ltd | Loop type heat pipe |
| CN2543205Y (en) * | 2001-12-31 | 2003-04-02 | 南京赫特节能环保有限公司 | Separating phase-change radiator for electronic element and device and desk computer CPU chip |
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| Publication number | Publication date |
|---|---|
| CN1536958A (en) | 2004-10-13 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080102 Termination date: 20140411 |