CN221448965U - Server device and cooling system thereof - Google Patents

Abstract

The application discloses server equipment and a cooling system thereof, and relates to the technical field of liquid cooling heat exchange. The cooling system utilizes the height difference of the compressor and the fluorine pump, so that the air suction port of the compressor only has air, the liquid inlet of the fluorine pump only has liquid, the situation that liquid impact occurs due to liquid return of the compressor and cavitation occurs due to liquid shortage of the fluorine pump can be avoided, the heat exchange efficiency is improved, and meanwhile, the cooling system can cancel the liquid storage tank, so that the system structure is simplified, and the problems of difficult space arrangement and high complexity are solved.

Description

Server device and cooling system thereof

Technical Field

The application relates to the technical field of liquid cooling heat exchange, in particular to a cooling system. The application also relates to a server device with the cooling system.

Background

At present, with the increase of the power density of a server chip, the existing common air cooling heat exchange mode cannot meet the heat exchange requirement of the chip, and liquid cooling is used as an efficient heat exchange and energy-saving alternative scheme to gradually replace the existing air cooling technology.

In the existing system, the liquid cooling technology mainly adopts a cold plate type liquid cooling mode, the cold plate type liquid cooling mode mainly adopts a liquid cooling plate, the liquid cooling plate performs cold-heat exchange with a chip with high heat productivity of a server and the like, and heat is rapidly transferred to the outside of the cabinet through a heat exchange system connected with the liquid cooling plate.

In the process of implementing the present utility model, the inventor finds that at least the following problems exist in the prior art:

Because the heat exchange system of the liquid cooling plate is required to be laid out and installed in a small space and connected through multiple pipelines, the problems of difficult space arrangement and high complexity are brought, and meanwhile, the situations of liquid return, liquid shortage of a fluorine pump and the like of a compressor are difficult to avoid, so that the heat exchange efficiency is reduced, and the efficiency cannot be maximized.

Therefore, it is necessary for those skilled in the art to provide a cooling system capable of preventing the liquid return of the compressor and the shortage of the fluorine pump at a proper time.

Disclosure of utility model

The application aims to provide a cooling system which can solve the problems of liquid return of a compressor and liquid shortage of a fluorine pump. It is a further object of the present application to provide a server device comprising the cooling system described above.

In order to achieve the above purpose, the application provides a cooling system, which comprises a cabinet-level heat exchange structure and a hierarchical heat exchange structure, wherein the cabinet-level heat exchange structure is arranged in a cabinet, the cabinet-level heat exchange structure comprises a compressor, a fluorine pump and a refrigeration module, the compressor is arranged at the top in the cabinet, the fluorine pump is arranged at the bottom in the cabinet, and the refrigeration module supplies cold to the hierarchical heat exchange structure.

In some embodiments, the refrigeration module comprises a first evaporator, ventilation openings are formed in two side surfaces, away from each other, of the cabinet, the first evaporator is arranged on the side surface where at least one ventilation opening is located, and the first evaporator is a coil type evaporator.

In some embodiments, one of two sides of the cabinet, which are far away from each other, is an air outlet, the other side is an air inlet, the air outlet is provided with a plurality of air draft fans, and the first evaporator is arranged on the side where the air inlet is located or the side where the air outlet is located.

In some embodiments, the refrigeration module further includes a second evaporator connected in parallel with the first evaporator, the second evaporator is disposed at a top portion in the cabinet, and the second evaporator is a plate-change evaporator.

In some embodiments, the compressor further comprises a plug frame housing, and the compressor and the second evaporator are arranged in the plug frame housing.

In some embodiments, a partition is disposed in the plug frame housing, the partition divides the interior space of the plug frame housing into a first shell cavity and a second shell cavity, the second evaporator is disposed in the first shell cavity, and the compressor is disposed in the second shell cavity.

In some embodiments, a condenser is further included, the condenser being disposed in the second housing cavity, or the condenser being disposed outside of the cabinet.

In some embodiments, the hierarchical heat exchange structure comprises a plurality of liquid cooling cold plates attached to the heat source device on the cabinet, the plurality of liquid cooling cold plates are connected in series or in parallel with each other, and each liquid cooling cold plate exchanges heat through the second evaporator.

The application also provides server equipment, which comprises the cooling system and a cabinet, wherein the cabinet is formed by enclosing a bottom plate, a top plate and a plurality of side plates, a compressor is arranged on the top plate, and a fluorine pump is arranged on the bottom plate.

In some embodiments, a cooling tower apparatus is also included for providing cooling to the hierarchical heat exchange structure.

With respect to the background art, the cooling system provided by the embodiment of the application comprises a cabinet-level heat exchange structure and a hierarchical heat exchange structure which are arranged in a cabinet. The cabinet-level heat exchange structure comprises a compressor, a fluorine pump and a refrigeration module, wherein the compressor is arranged at the top in the cabinet, the fluorine pump is arranged at the bottom in the cabinet, and the refrigeration module supplies cold to the hierarchical heat exchange structure so that the hierarchical heat exchange structure dissipates heat of a heat source device on the cabinet. In this way, the compressor provides power for the refrigeration cycle, the compressor sucks low-temperature low-pressure refrigeration gas, the high-temperature high-pressure refrigeration gas is discharged after compression, the fluorine pump pumps the condensed refrigeration liquid, the refrigeration liquid enters the refrigeration module to complete refrigeration of the working parts under the action of the fluorine pump, and the refrigeration liquid after refrigeration is converted into the refrigeration gas again and enters the compressor, so that the refrigeration cycle can be realized. In this embodiment, the top in the rack is located to the compressor, the bottom in the rack is located to the fluorine pump, adopt such setting mode, utilize the gas to upwards walk, and the principle that liquid walked down, on the one hand, utilize the difference in height of compressor and fluorine pump, make the induction port of compressor only gaseous, the inlet of fluorine pump only liquid, can avoid appearing the compressor and appear returning the liquid and take place the condition that liquid beating, fluorine pump lack of liquid and take place the cavitation, thereby improve heat transfer efficiency, on the other hand, because the fluorine pump sets up the bottom in the rack, make the fluorine pump can not lack of liquid, thereby make cooling system can cancel the liquid storage pot, thereby simplify the system architecture, solve the problem that space arrangement is difficult and the complexity is high.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a cooling system in an embodiment of the application;

FIG. 2 is a schematic diagram showing a first evaporator and a second evaporator of a cooling system connected in parallel according to an embodiment of the present application;

Fig. 3 is a schematic diagram of a series connection of a first evaporator and a second evaporator of a cooling system according to an embodiment of the present application.

Wherein:

1-cabinet, 2-compressor, 3-condenser, 4-fluorine pump, 5-refrigeration module, 51-first evaporimeter, 52-second evaporimeter, 521-evaporating channel, 522-condensing channel, 6-expansion valve, 7-circulating pump, 8-water knockout drum, 9-liquid cooling cold plate, 10-water collector, 11-induced draft fan, 12-bypass valve.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The present application will be further described in detail below with reference to the drawings and detailed description for the purpose of enabling those skilled in the art to better understand the aspects of the present application.

The terms "upper end, lower end, left side, right side" and the like are defined based on the drawings of the specification.

Referring to fig. 1, 2 and 3, a cooling system according to an embodiment of the present application includes a cabinet level heat exchange structure and a hierarchical heat exchange structure disposed in a cabinet 1. Wherein, cabinet level heat transfer structure includes compressor 2, fluorine pump 4 and refrigeration module 5, and the top in cabinet 1 is located to compressor 2, and the bottom in cabinet 1 is located to fluorine pump 4, and refrigeration module 5 supplies cold to hierarchical heat transfer structure to make hierarchical heat transfer structure dispel the heat to working element (or heat source device) on the cabinet 1.

In this way, the compressor 2 provides power for the refrigeration cycle, the compressor 1 sucks low-temperature low-pressure refrigerant gas, after compression, discharges high-temperature high-pressure refrigerant gas, the fluorine pump 4 sucks the refrigerant liquid formed after condensation, the refrigerant liquid enters the refrigeration module 5 to complete refrigeration of the working components under the action of the fluorine pump 4, and the refrigerant liquid after refrigeration is converted into the refrigerant gas again and enters the compressor 2, so that the refrigeration cycle can be realized.

In this embodiment, the top in cabinet 1 is located to compressor 2, the bottom in cabinet 1 is located to fluorine pump 4, adopt such setting mode, owing to the gas is upwards walked, and the principle that liquid walked down, on the one hand, utilize the difference in height of compressor 2 and fluorine pump 4 for the induction port of compressor 2 only is gaseous, and the inlet of fluorine pump 4 only is liquid, can avoid appearing that compressor 2 appears returning the liquid and take place the condition that liquid beating, and fluorine pump 4 appears the lack of liquid and take place the cavitation, thereby improve heat exchange efficiency, on the other hand, because the fluorine pump sets up the bottom in the cabinet, make the fluorine pump can not lack of liquid, thereby make cooling system can cancel the liquid storage pot, thereby simplify the system architecture, solve the problem that space arrangement is difficult and the complexity is high.

Furthermore, the cooling system comprises a condenser 3. The condenser 3 may be provided inside or outside the cabinet 1.

Specifically, the air outlet of the compressor 2 is connected with the inlet of the condenser 3, the outlet of the condenser 3 is connected with the inlet of the fluorine pump 4, the outlet of the fluorine pump 4 is connected with the inlet of the refrigeration module 5, and the outlet of the refrigeration module 5 is connected with the air inlet of the compressor 2.

In this way, the compressor 2 and the fluorine pump 4 provide power for the refrigeration cycle, the compressor 2 sucks low-temperature low-pressure refrigerant gas, after compression, discharges high-temperature high-pressure refrigerant gas, and the condenser 3 converts the refrigerant gas into refrigerant liquid, so that the refrigerant liquid is continuously supplied to the fluorine pump 4, under the action of the fluorine pump 4, the refrigerant liquid enters the refrigeration module 5 to complete refrigeration of working components, and the refrigerant liquid after refrigeration is converted into refrigerant gas again and enters the compressor 2, so that the refrigeration cycle can be realized.

Referring to fig. 2, the refrigeration module 5 includes a first evaporator 51, ventilation openings are disposed on two opposite sides of the cabinet 1, and the first evaporator 51 is disposed on a side of the cabinet where at least one ventilation opening is located.

That is, two ventilation openings on two sides of the cabinet 1 away from each other may alternatively be provided with the first evaporator 51, or the first evaporator 51 may be provided at both ventilation openings.

In some embodiments, one of two sides of the cabinet 1 away from each other is an air outlet, the other side is an air inlet, the air inlet is used for supplying external air into the cabinet 1 to dissipate heat of working components in the cabinet 1, and the air outlet is used for supplying the air after heat dissipation to leave the cabinet 1.

Further, the air outlet is provided with a plurality of exhaust fans 11, and the first evaporator 51 is arranged on the side surface where the air inlet is located or the side surface where the air outlet is located.

In this way, the air draft fan 11 provides power, so that the external air enters from the air inlet and is blown out from the air outlet, and in the process from entering the cabinet 1 to blowing out the cabinet 1, the external air exchanges heat through the first evaporator 51 arranged on the side surface where the air inlet is located or the side surface where the air outlet is located, so that the heat dissipation efficiency can be greatly improved.

Of course, the first evaporator 51 is a coil evaporator according to actual needs.

It can be seen that the heat exchange efficiency of the rack server apparatus can be further lifted by the combined refrigeration of the coil evaporator and the suction fan 11. Meanwhile, the heat of auxiliary devices in the rack server equipment and the heat leakage of the liquid cooling plate or the main chip can be taken away through the exhaust fan 11.

In some embodiments, the refrigeration module 5 further includes a second evaporator 52, the second evaporator 52 being connected in parallel with the first evaporator 51, the second evaporator 52 being disposed at the top within the cabinet 1.

Specifically, the first evaporator 51 and the second evaporator 52 are connected in parallel between the fluorine pump 4 and the compressor 2, and the outlet of the fluorine pump 4 is connected to the inlet of the first evaporator 51 and the outlet of the second evaporator 52 via a pipeline, and the outlet of the first evaporator 51 and the outlet of the second evaporator 52 are connected to the inlet of the compressor 2 via pipelines, respectively.

In this way, the compressor 2 sucks the low-temperature and low-pressure refrigerant gas from the first evaporator 51 and the second evaporator 52, discharges the high-temperature and high-pressure refrigerant gas after compression, the condenser 3 converts the refrigerant gas into refrigerant liquid, so as to continuously supply the refrigerant liquid to the fluorine pump 4, the refrigerant liquid respectively enters the first evaporator 51 and the second evaporator 52 under the action of the fluorine pump 4, so that the corresponding working components are refrigerated, and the refrigerant liquid after the refrigeration work in the evaporators 51 and the second evaporator 52 is converted into refrigerant gas again and enters the compressor 2.

Of course, the second evaporator 52 is a plate-change evaporator according to actual needs.

It will be appreciated that the first evaporator 51 may be used to perform cooling and heat exchange on a high heat density device (such as a CPU, GPU, etc.) in the server apparatus, and the second evaporator 52 may be used as an auxiliary heat exchange device to perform cooling and heat exchange on an auxiliary device (such as a switch chip, etc.) in the server apparatus.

In order to facilitate controlling the flow of refrigerant into the first evaporator 51 and the second evaporator 52, the branch where the evaporator 51 is located and the branch where the second evaporator 52 is located are provided with expansion valves 6, and the expansion valves 6 are used for controlling the flow of refrigerant of the corresponding branches.

When the high heating density device and the auxiliary device in the server equipment are subjected to heat exchange, the flow of the refrigerating fluid entering the first evaporator 51 and the second evaporator 52 is required to be controlled according to the heat exchange requirements of the high heating density device and the auxiliary device, so that the expansion valves 6 are respectively arranged on the branch where the first evaporator 51 is positioned and the branch where the second evaporator 52 is positioned, the flow of the refrigerating fluid entering the first evaporator 51 and the second evaporator 52 is respectively controlled, the cold source can be reasonably utilized, and the utilization rate of the cold source is improved.

In some embodiments, referring to fig. 3, the refrigeration module 5 includes a first evaporator 51 and a second evaporator 52 connected in series, the second evaporator 52 is disposed at the top of the cabinet 1, and the first evaporator 51 is disposed at the side of the cabinet 1.

Specifically, the first evaporator 51 and the second evaporator 52 are connected in series between the fluorine pump 4 and the compressor 2, the outlet of the fluorine pump 4 is connected to the inlet of the second evaporator 52, the outlet of the second evaporator 52 is connected to the inlet of the first evaporator 51, and the outlet of the first evaporator 51 is connected to the inlet of the compressor 2.

In this way, the compressor 2 sucks the low-temperature low-pressure refrigerant gas from the first evaporator 51, discharges the high-temperature high-pressure refrigerant gas after compression, and the condenser 3 converts the refrigerant gas into the refrigerant liquid, so as to continuously supply the refrigerant liquid to the fluorine pump 4, and under the action of the fluorine pump 4, the refrigerant liquid firstly enters the second evaporator 52 to exchange heat, then enters the first evaporator 51 to exchange heat, so as to refrigerate corresponding working components, and the refrigerant liquid after the refrigeration work is completed in the first evaporator 51 is converted into the refrigerant gas again and enters the compressor 2.

In this embodiment, the first evaporator 51 may be used to perform cooling and heat exchange on a high heat density device (such as a CPU, GPU, etc.) in the server apparatus, and the second evaporator 52 may be used as an auxiliary heat exchange device to perform cooling and heat exchange on an auxiliary device (such as a switch chip, etc.) in the server apparatus.

In order to facilitate the installation of the components in the cabinet-level heat exchange structure, the cooling system further comprises a plug-in frame shell, and the compressor 2 and the second evaporator 52 are arranged in the plug-in frame shell.

Specifically, a partition board is arranged in the plug frame shell, the partition board divides the internal space of the plug frame shell into a first shell cavity and a second shell cavity, the second evaporator 52 is arranged in the first shell cavity, the compressor 2 is arranged in the second shell cavity, and meanwhile, the condenser 3 can also be arranged in the second shell cavity.

Further, the second evaporator 52 has an evaporation passage 521 and a condensation passage 522, and the cold of the evaporation passage 521 can be transferred to the condensation passage 522 to cool down the refrigerant in the condensation passage 522 and condense it.

In some embodiments, the hierarchical heat exchange structure includes a plurality of liquid cooling plates 9, the plurality of liquid cooling plates 9 are attached to a heat source device on the cabinet 1, the plurality of liquid cooling plates 9 are connected in series or in parallel, and each liquid cooling plate 9 exchanges heat through the second evaporator 52.

Specifically, the hierarchical heat exchange structure further includes a circulation pump 7, a water separator 8, and a water collector 10. Wherein, the outlet of the circulating pump 7 is connected with the inlet of the water separator 8, each outlet of the water separator 8 is respectively connected with the inlet of each liquid cooling plate 9, each outlet of each liquid cooling plate 9 is respectively connected with each inlet of the water collector 10, the outlet of the water collector 10 is connected with the inlet of the condensing channel 522, and the outlet of the condensing channel 522 is connected with the inlet of the circulating pump 7.

In this way, after the heat generated by the main chip in the server apparatus is absorbed by the refrigerant in the liquid cooling plates 9, the refrigerant flows into the condensation channel 522 of the second evaporator 52 through the water collector 10 under the power of the circulation pump 7, exchanges heat with the evaporation channel 521 of the second evaporator 52, and the cooled refrigerant is distributed to each liquid cooling plate 9 through the water separator 8 to absorb heat, thereby completing the refrigeration cycle.

The second evaporator 52 takes heat away through the outdoor unit of the condenser 3, the liquid cooling plate 9 is attached to a device with high heat, and the refrigerant in the liquid cooling plate 9 can be water.

In some embodiments, the cooling system further comprises a bypass valve 12, the bypass valve 12 being connected in parallel with the compressor 2.

Of course, the bypass valve 12 may be a one-way check valve connected to the inlet and outlet ends of the compressor 2, as desired, so that the one-way check valve may be used to bypass the compressor 2 during certain operating conditions.

The server device provided by the application comprises a cabinet 1 and the cooling system described in the embodiment.

The cabinet 1 is formed by enclosing a bottom plate, a top plate and a plurality of side plates, the compressor 2 is mounted on the top plate, and the fluorine pump 4 is mounted on the bottom plate.

The server apparatus further includes a cooling tower apparatus for providing cooling to the hierarchical heat exchange structure.

It should be noted that in this specification relational terms such as first and second are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.

The server apparatus and the cooling system thereof provided by the present application are described in detail above. The principles and embodiments of the present application have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the inventive arrangements and their core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.

Claims (10)

1. The utility model provides a cooling system, its characterized in that, including setting up cabinet level heat transfer structure and the hierarchical heat transfer structure in rack (1), cabinet level heat transfer structure includes compressor (2), fluorine pump (4) and refrigeration module (5), top in rack (1) is located to compressor (2), fluorine pump (4) are located bottom in rack (1), refrigeration module (5) to hierarchical heat transfer structure supplies cold.

2. The cooling system according to claim 1, wherein the refrigeration module (5) comprises a first evaporator (51), ventilation openings are formed in two sides of the cabinet (1) away from each other, the first evaporator (51) is arranged on the side where at least one ventilation opening is located, and the first evaporator (51) is a coiled evaporator.

3. A cooling system according to claim 2, characterized in that one of the two sides of the cabinet (1) which are far away from each other is an air outlet, the other side is an air inlet, the air outlet is provided with a plurality of air draft fans (11), and the first evaporator (51) is arranged on the side where the air inlet is located or on the side where the air outlet is located.

4. The cooling system according to claim 2, wherein the refrigeration module (5) further comprises a second evaporator (52) connected in parallel with the first evaporator (51), the second evaporator (52) being provided at the top inside the cabinet (1), and the second evaporator (52) being a plate-change evaporator.

5. The cooling system of claim 4, further comprising a plug frame housing, wherein said compressor (2), said second evaporator (52) are disposed within said plug frame housing.

6. The cooling system of claim 5, wherein a partition is disposed within the plug frame housing, the partition dividing the plug frame housing interior space into a first shell cavity and a second shell cavity, the second evaporator (52) being disposed in the first shell cavity, the compressor (2) being disposed in the second shell cavity.

7. The cooling system according to claim 6, further comprising a condenser (3), said condenser (3) being provided in said second housing cavity or said condenser (3) being provided outside said cabinet (1).

8. A cooling system according to claim 4, wherein the hierarchical heat exchange structure comprises a plurality of liquid cooling plates (9) attached to heat source devices on the cabinet (1), the plurality of liquid cooling plates (9) are connected in series or in parallel with each other, and each liquid cooling plate (9) exchanges heat through the second evaporator (52).

9. Server apparatus comprising a cooling system according to any of claims 1-8 and said cabinet (1), said cabinet (1) being formed by a bottom plate, a top plate and a number of side plates, said compressor (2) being mounted to said top plate, said fluorine pump (4) being mounted to said bottom plate.

10. The server apparatus of claim 9, further comprising a cooling tower apparatus for cooling the hierarchical heat exchange structure.