CN1503603A - Organic luminous panel, assembly and mfg method thereof - Google Patents
Organic luminous panel, assembly and mfg method thereof Download PDFInfo
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- CN1503603A CN1503603A CNA021522529A CN02152252A CN1503603A CN 1503603 A CN1503603 A CN 1503603A CN A021522529 A CNA021522529 A CN A021522529A CN 02152252 A CN02152252 A CN 02152252A CN 1503603 A CN1503603 A CN 1503603A
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Abstract
This invention relates to an organic illuminating panel including a base plate, several first electrodes, insulation layers, blocking layers, organic illumination layers and second electrodes, among which, the said first electrodes are formed on a first surface of the said base plate, the said insulation layer is negative photoresist crossly formed on the said first electrode, the said blocking layer is negative photoresist formed on each insulation layer, each organic illuminating layer is formed between the insulation layers and the second electrodes are formed on the illuminating layer between the blocking layers, organic illuminating components and manufacturing method are provided.
Description
Technical field
The present invention relates to a kind of luminescent panel, luminescence component and manufacture method thereof, particularly a kind of organic luminous panel, organic luminescent assembly and manufacture method thereof.
Background technology
The various communications that the information communication industry has become now main flow industry, particularly portable show the emphasis that product develops especially.And because flat-panel screens is a communication interface between people and the information, so its development particular importance that seems.The technology that is applied in flat-panel screens at present includes plasma display panel (Plasma Display), LCD (Liquid Crystal Display), inorganic electroluminescence display (Inorganic Electroluminescence Display), light-emitting diode (Light Emitting Diode), vacuum fluorescent display (Vacuum FluorescenceDisplay), field-emitter display (Field Emission Display) and electrochromics display (Electro-Chromic Display) or the like.
Compared to other flat-panel screens, organic luminous panel or organic luminescent assembly with its self-luminous, no visual angle, power saving, processing procedure is simple and easy, low-cost, operating temperature is extensive, the advantage of high answer speed and full-colorization or the like, make it have great shallow power, therefore be expected to become the main flow of flat-panel screens of future generation.
Organic luminous panel or organic luminescent assembly are the assemblies that a kind of self luminous characteristic of utilizing organic functional material (organic functional materials) reaches display effect, and its ray structure is made of pair of electrodes and organic functional material layer.Between electric current is by transparent anode and metallic cathode, make electronics and electric hole in the organic functional material layer in conjunction with and when producing exciton, just can make the organic functional material layer according to its properties of materials, and produce the mechanism of giving out light of different colours.
In full-colorization of organic luminous panel processing procedure, it is to utilize insulating barrier to separate the picture element of organic luminous panel that existing organic luminous panel static matrix drives (PMOLED, Passive Matrix OLED) technology, and utilizes the negative electrode between barrier layer separation picture element; Barrier layer is separated into strip with negative electrode according to the circuit conduction orientation when organic material and negative electrode evaporation, the contraposition problem in the time of can exempting the evaporation negative electrode reaches the purpose of simplifying the organic luminous panel processing procedure.
Please refer to shown in Figure 1ly, existing organic luminous panel 1 comprises a substrate 11, several first electrodes 12, several insulating barriers 13, several barrier layers 14, several organic luminous layers 15, and several second electrodes 16.
These first electrodes 12 are formed at respectively on the surface of this substrate 11.These insulating barriers 13 are formed by positive photoresistance, are formed on these first electrodes 12 with these first electrodes 12 respectively interlacedly.These barrier layers 14 are formed by negative photoresistance, are formed at respectively on each insulating barrier 13.Each organic luminous layer 15 is formed at respectively between the insulating barrier 13.And each second electrode 16 is formed at respectively on this organic luminous layer 15, and between barrier layer 14.
Know this operator when making these insulating barriers 13 and these barrier layers 14, have coating eurymeric photoresistance on this substrate 11 of these first electrodes 12, through soft roasting, exposure, develop, hard roasting these insulating barriers 13 of back formation.Coating minus photoresistance on these insulating barriers 13 more afterwards is through soft roasting, exposure, develop, form these barrier layers 14 after the hard step such as roasting.Yet, because these insulating barriers 13 and these barrier layers 14 are made with eurymeric photoresistance and minus photoresistance respectively, it is to have a little problem: one, after baking firmly for the second time, because both thermal coefficient of expansion differences are, have a little displacement phenomenon when easily causing on these barrier layers 14 are formed at these insulating barriers 13 and cause the inaccurate problem of contraposition; They are two years old, also because the variance factor on this material, adhering to of 14 of these insulating barriers 13 and these barrier layers is not good, after product uses a period of time, the situation generation that easily has these barrier layers 14 then to locate deterioration with these insulating barriers 13 even peel off, and then producing the not good problem of production reliability, this two be the bottleneck place that promotes for yield on the processing procedure at present.
From the above, seeking effectively to solve above-mentioned two shortcomings, is one of important topic that promotes current full-colorization of organic electroluminescence display panel technology.
Summary of the invention
At the problems referred to above, the purpose of this invention is to provide a kind of barrier layer of avoiding and be shifted, prevent that barrier layer and insulating barrier from producing organic luminous panel, organic luminescent assembly and the manufacture method of peeling off thereof.
And feature of the present invention to be insulating barrier and barrier layer all make with the minus photoresistance, when preventing effectively that according to this barrier layer is formed on the insulating barrier, the problem that the contraposition that is caused because of the different displacement phenomenons that produce of thermal coefficient of expansion is forbidden or peeled off.
For reaching above-mentioned purpose, the invention provides a kind of organic luminous panel, it comprises a transparency carrier, several first electrodes, several insulating barriers, several barrier layers, reaches several organic luminous layers.Several first electrodes are formed at respectively on the surface of this transparency carrier; Several insulating barriers are formed on these first electrodes with these first electrodes respectively for negative photoresistance interlacedly; Several barrier layers are formed at respectively on each insulating barrier for negative photoresistance; Each organic luminous layer is formed between the insulating barrier respectively; Second electrode is formed at respectively on this organic luminous layer, and between barrier layer.
In addition, the invention provides a kind of organic luminescent assembly, it comprises a transparency carrier, one first electrode, several insulating barriers, several barrier layers, an organic luminous layer, reaches one second electrode.First electrode is formed on the surface of this substrate; These insulating barriers are formed on this first electrode with this first electrode respectively for negative photoresistance interlacedly; These barrier layers are formed at respectively on each insulating barrier for negative photoresistance; Organic luminous layer is formed between the insulating barrier; This second electrode is formed on this organic luminous layer, and between barrier layer.
Again, the invention provides a kind of organic luminescent assembly manufacture method, it comprises an insulating barrier and barrier layer forms program, an organic luminous layer forms program, reaches one second electrode formation program.In insulating barrier and barrier layer formation program, be formed with in one that coating forms one first negative photoresist layer on the transparency carrier of one first electrode; Again this first negative photoresist layer is exposed afterwards; Coating forms one second negative photoresist layer on first negative photoresist layer again; Again this second negative photoresist layer is exposed; Develop again afterwards.On this first electrode, form several insulating barriers and the barrier layer that is constituted by this first negative photoresist layer and second negative photoresist layer according to this respectively.In organic luminous layer formation program, between two insulating barriers, form an organic luminous layer.In the second electrode formation program, between two barrier layers, and on this organic luminous layer, form one second electrode.
From the above, because insulating barrier and barrier layer all make with the minus photoresistance, therefore can avoid the barrier layer displacement and prevent that barrier layer and insulating barrier generation from peeling off.In view of the above, more can prevent because the not good problem of the different production reliability that causes of both materials.
Description of drawings
Fig. 1 is existing organic luminous panel schematic perspective view;
Fig. 2 is an organic luminous panel schematic perspective view of the present invention;
Fig. 3 is the generalized section of organic luminescent assembly of the present invention;
Fig. 4 is the flow chart of organic illuminating element manufacture method of the present invention;
Fig. 5 is the flow chart illustration that insulating barrier in shown in Figure 4 and barrier layer form program;
Fig. 6 is another flow chart illustration that insulating barrier in shown in Figure 4 and barrier layer form program;
Fig. 7 is another flow chart of organic luminescent assembly manufacture method of the present invention.
Symbol description among the figure
1 organic luminous panel
11 substrates
12 first electrodes
13 insulating barriers
14 barrier layers
15 organic luminous layers
16 second electrodes
2 organic luminous panels
21 substrates
22 first electrodes
23 insulating barriers
24 barrier layers
25 organic luminous layers
26 second electrodes
3 organic luminescent assemblies
Embodiment
Hereinafter with reference to Fig. 2 organic luminous panel according to preferred embodiment of the present invention is described.
Please refer to shown in Figure 2ly, comprise a transparency carrier 2l, several first electrodes 22, several insulating barriers 23, several barrier layers 24, several organic luminous layers 25 according to the organic luminous panel 2 of preferred embodiment of the present invention, and several second electrodes 26.
In the present embodiment, this transparency carrier 21 can be a glass substrate or a plastic base or a flexible base, board, at this, plastic base and flexible base, board can be a Merlon (polycarbonate, PC) substrate, a polyester (polyester, PET) substrate, a cyclenes copolymer (cyclic olefin copolymer, COC) substrate, a crome metal compound base material-cyclenes copolymer (metallocene-based cyclic olefin copolymer, mCOC) substrate or a slim glass (Thin Glass).
This transparent electrode layer 22 is formed on the surface of this transparency carrier 21, and in embodiments of the invention, this transparent electrode layer 22 is formed on this transparency carrier 21 with the sputter (sputtering) or the mode of ion plating (ionplating).The material of this electrode layer 22 is the metal oxide of a conduction, and wherein the metal oxide of this conduction can be tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO), and its thickness is generally more than 500 .
These insulating barriers 23 are arranged on these first electrodes 22, and each insulating barrier 23 and these first electrode, 22 interlaced configurations, in order to form several picture elements.These barrier layers 24 are formed at respectively on these insulating barriers 23, in order to separate the negative electrode between picture element.In this enforcement, the material of these insulating barriers 23 and barrier layer 24 can be any negative photoresistance, and it is the mixture of Propylene glycol monomethyl ether acetate and Novolak resin, Polyhydroxystyrene type resin or Photoacid generator and Crosslinking agent for example.And the developer solution of development usefulness is an alkaline-based developer.
Each organic luminous layer 25 is formed at respectively between the insulating barrier 23.These second electrodes 26 are formed at respectively on this organic luminous layer 25, and between barrier layer 24.
In addition, organic luminous panel of the present invention more can include a sealing body (not being shown in figure), this sealing body with these first electrodes 22, these insulating barriers 23, these barrier layers 24, these organic luminous layers 25, and these second electrodes 26 coat, and driving fit is on this transparency carrier 21.
Below, with Fig. 3 organic luminescent assembly according to preferred embodiment of the present invention is described.Because the formation of the organic luminescent assembly of preferred embodiment of the present invention is roughly identical with above-mentioned organic luminous panel, so its figure number is all continued to use.In addition, for avoiding giving unnecessary details, in present embodiment, will omit the detailed description of the constitutive requirements of organic luminescent assembly.
As shown in Figure 3, the organic luminescent assembly 3 of preferred embodiment of the present invention comprises a transparency carrier 21, one first electrode 22, two insulating barriers 23, two barrier layers 24, an organic luminous layer 25 at least, reaches one second electrode 26.This first electrode 22 is formed on the surface of this transparency carrier 21.These insulating barriers 23 are formed on this first electrode 22 with this first electrode 22 respectively for negative photoresistance interlacedly.These barrier layers 24 are formed at respectively on each insulating barrier 23 for negative photoresistance.This organic luminous layer 25 is formed between two insulating barriers 23.This second electrode 26 is formed on this organic luminous layer 25, and between two barrier layers 24.In addition, organic luminescent assembly of the present invention more can include a sealing body (not being shown in figure), this sealing body with this first electrode 22, these insulating barriers 23, these barrier layers 24, this organic luminous layer 25, and these second electrodes 26 coat, and driving fit is on this transparency carrier 21.
Below, with Fig. 4～Fig. 7 organic luminescent assembly manufacture method according to preferred embodiment of the present invention is described.
As shown in Figure 4, organic luminescent assembly manufacture method of the present invention comprises an insulating barrier and barrier layer formation program P1, organic luminous layer formation program P2, reaches one second electrode formation program P3.
Form among the program P1 in insulating barrier and barrier layer, as shown in Figure 5, be formed with in one that coating forms one first negative photoresist layer (S10) on the transparency carrier of one first electrode; Afterwards again to this first negative photoresist layer expose (S20); Coating forms one second negative photoresist layer (S30) on first negative photoresist layer again; Again to this second negative photoresist layer expose (S40); Afterwards again to first negative photoresist layer and second negative photoresist layer develop (S50).On this first electrode, form several insulating barriers and the barrier layer that is constituted by this first negative photoresist layer and second negative photoresist layer according to this respectively.Again, as shown in Figure 6, form among the program P1, after forming first negative photoresist layer, can carry out soft roasting (S11) this first negative photoresist layer in this insulating barrier and barrier layer; And after forming second negative photoresist layer, can carry out soft roasting (S31), thereby quicken this first negative photoresist layer and the curing of second negative photoresist layer this second negative photoresist layer.
Form among the program P2 in organic luminous layer, between two insulating barriers, form an organic luminous layer.Form among the program P3 in second electrode, between two barrier layers, and on this organic luminous layer, form one second electrode.
In addition, as shown in Figure 7, organic luminescent assembly manufacture method of the present invention more can comprise a sealing body and form program P4.Form among the program P4 in sealing body, with a sealing body driving fit on transparency carrier so that with first electrode, insulating barrier, barrier layer, organic luminous layer, and second electrode coat.
From the above, because these insulating barriers of the present invention and these barrier layers all formed with negative photoresistance, so, when baking firmly, do not have in the prior art the different displacement phenomenons that cause of thermal coefficient of expansion between these insulating barriers and these barrier layers because of both.Moreover, in the present invention, these insulating barriers are all formed with the negative photoresistance of identical material with these barrier layers, so, adhesive force between the two is preferable, so,, have preferable production reliability with respect to making for the situation of these insulating barriers and these barrier layers with positive and negative photoresistance respectively in the prior art.In addition, more because the present invention all makes these insulating barriers and these barrier layers with negative photoresistance, make and only need a developing operation in the organic luminescent assembly processing procedure, and also omitted the cleaning action prior art is coated with negative photoresistance after having made the insulating barrier of positive photoresistance before, effectively reach the effect of simplifying processing procedure, more can reduce the pollution of environment.
In sum, the present invention not only can effectively solve the existing in prior technology problem, more can reduce the step and the cost of processing procedure, and have environmental benefit concurrently.
Above-mentioned only is illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the scope of claims its equivalent modifications of carrying out or change.
Claims (14)
1. an organic luminous panel is characterized in that, comprises:
One substrate;
Several first electrodes are formed at respectively on the surface of this substrate;
Several insulating barriers are negative photoresistance, and it is formed on these first electrodes with these first electrodes respectively interlacedly;
Several barrier layers for negative photoresistance, are formed at respectively on each insulating barrier;
Several organic luminous layers, each organic luminous layer is formed between the insulating barrier respectively; And
Several second electrodes, each second electrode is formed at respectively on this organic luminous layer, and between barrier layer.
2. organic luminous panel as claimed in claim 1, it is characterized in that, this organic luminous panel more comprises a sealing body, this sealing body with these first electrodes, these insulating barriers, these barrier layers, these organic luminous layers, and these second electrodes coat, and driving fit is on this substrate.
3. organic luminous panel as claimed in claim 1 is characterized in that, this substrate is a glass substrate.
4. organic luminous panel as claimed in claim 1 is characterized in that, this substrate is a flexible base, board.
5. organic luminous panel as claimed in claim 1 is characterized in that, this first electrode is the metal oxide electrode layer of conduction.
6. an organic luminescent assembly is characterized in that, comprises:
One transparency carrier;
One first electrode is formed on the surface of this substrate;
Several insulating barriers are negative photoresistance, and it is formed on this first electrode with this first electrode respectively interlacedly;
Several barrier layers for negative photoresistance, are formed at respectively on each insulating barrier;
One organic luminous layer is formed at respectively between two insulating barriers; And
One second electrode is formed on this organic luminous layer, and between barrier layer.
7. organic luminescent assembly as claimed in claim 6, it is characterized in that, this organic luminescent assembly more comprises a sealing body, this sealing body with this first electrode, this insulating barrier, this barrier layer, this organic luminous layer, and this second electrode coat, and driving fit is on this transparency carrier.
8. organic luminescent assembly as claimed in claim 6 is characterized in that, this first electrode is the metal oxide electrode layer of conduction.
9. an organic luminescent assembly manufacture method is characterized in that, comprises:
One insulating barrier and barrier layer form program, and it is formed with in one, and coating forms one first negative photoresist layer on the substrate of one first electrode; This first negative photoresist layer is exposed; Coating forms one second negative photoresist layer on first negative photoresist layer again; This second negative photoresist layer is exposed; And develop, on this first electrode, form respectively according to this with this first electrode interlaced, and several insulating barriers and the barrier layer that are constituted by this first negative photoresist layer and second negative photoresist layer;
One organic luminous layer forms program, forms an organic luminous layer between insulating barrier; And
One second electrode forms program, between barrier layer, and forms one second electrode on this organic luminous layer.
10. organic luminescent assembly manufacture method as claimed in claim 9, it is characterized in that, this organic illuminating element manufacture method more comprises a sealing body and forms program, its with a sealing body driving fit on this substrate, with this first electrode, this insulating barrier, this barrier layer, this organic luminous layer, and second electrode coat.
11. organic luminescent assembly manufacture method as claimed in claim 9 is characterized in that, in this insulating barrier and barrier layer formation program, after forming first negative photoresist layer, more this first negative photoresist layer is carried out soft roasting; And after forming second negative photoresist layer, more this second negative photoresist layer is carried out soft roasting.
12. organic luminescent assembly manufacture method as claimed in claim 9 is characterized in that, this substrate is a glass substrate.
13. organic luminescent assembly manufacture method as claimed in claim 9 is characterized in that, this substrate is a flexible base, board.
14. organic luminescent assembly manufacture method as claimed in claim 9 is characterized in that, this first electrode is the metal oxide electrode layer of conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021522529A CN1503603A (en) | 2002-11-21 | 2002-11-21 | Organic luminous panel, assembly and mfg method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021522529A CN1503603A (en) | 2002-11-21 | 2002-11-21 | Organic luminous panel, assembly and mfg method thereof |
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| CN1503603A true CN1503603A (en) | 2004-06-09 |
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| CNA021522529A Pending CN1503603A (en) | 2002-11-21 | 2002-11-21 | Organic luminous panel, assembly and mfg method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997089A (en) * | 2009-08-07 | 2011-03-30 | 三菱重工业株式会社 | Apparatus and method for manufacturing an organic light emitting panel |
| CN101496192B (en) * | 2006-07-25 | 2012-04-25 | Lg化学株式会社 | Method of manufacturing organic light emitting device and organic light emitting device manufactured by using the method |
| CN102724780A (en) * | 2004-09-13 | 2012-10-10 | 株式会社半导体能源研究所 | Light emitting device |
-
2002
- 2002-11-21 CN CNA021522529A patent/CN1503603A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724780A (en) * | 2004-09-13 | 2012-10-10 | 株式会社半导体能源研究所 | Light emitting device |
| CN101496192B (en) * | 2006-07-25 | 2012-04-25 | Lg化学株式会社 | Method of manufacturing organic light emitting device and organic light emitting device manufactured by using the method |
| CN101997089A (en) * | 2009-08-07 | 2011-03-30 | 三菱重工业株式会社 | Apparatus and method for manufacturing an organic light emitting panel |
| CN101997089B (en) * | 2009-08-07 | 2013-03-27 | 三菱重工业株式会社 | Apparatus and method for manufacturing an organic light emitting panel |
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