CN1490932A - Ceramic substrate with crystal resonator on its surface and manufacture thereof - Google Patents
Ceramic substrate with crystal resonator on its surface and manufacture thereof Download PDFInfo
- Publication number
- CN1490932A CN1490932A CNA031341527A CN03134152A CN1490932A CN 1490932 A CN1490932 A CN 1490932A CN A031341527 A CNA031341527 A CN A031341527A CN 03134152 A CN03134152 A CN 03134152A CN 1490932 A CN1490932 A CN 1490932A
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- Prior art keywords
- plate
- board
- ceramic
- base
- upper frame
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- 239000000919 ceramic Substances 0.000 title claims abstract description 59
- 239000013078 crystal Substances 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title description 9
- 239000010410 layer Substances 0.000 claims abstract description 21
- 238000005245 sintering Methods 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000002356 single layer Substances 0.000 claims abstract description 9
- 239000010453 quartz Substances 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000007599 discharging Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The ceramic base of surface mount crystal resonator, adhibits the plaque treated by ejecting glue and sintering, middle board, up ledge board, roof board with epoxy resin or low temperature glass to form the ceramic base having three or two layers. There are printed circuits in the surface of base board, middle board, and roof board. There are feet down leads, electric conductive adhesive or conductive pottery slice on the base board. Processing technics: single layer soft pottery slice through ejecting glue is sintered into hard pottery board., the adhebiting temperature for base board , middle board ,up ledge board, roof board or base board is 120-170 DEG C; the adhebiting temperature of the up ledge board, roof board is 290-350 DEG C. The middle empty cavity is filled with the quartz wafer, roof board packaging.
Description
Technical Field
The invention relates to a crystal resonator, an oscillator and a filter, in particular to the technical field of design and manufacture of a ceramic base for mounting the crystal resonator.
Background
At present, major crystal factories in countries and regions such as japan, korea, and taiwan are responsible for establishing exclusive and joint enterprises in China, and high-grade, miniaturized, and refined quartz crystal products are brought. And HC-49U, HC-49S produced by most enterprises in China is a metal base product. The products belong to low-grade products, are mainly produced by labor intensity, and have low efficiency and tiny profit; the production technology has no substantial breakthrough; the size of the toy is large, and the toy is mainly used for low-grade electronic products such as children toys, game machines, televisions and the like. The production core technology of ceramic bases of crystal resonators, oscillators and filters which are used for high-grade electronic products such as mobile phones, notebook computers, satellite communication equipment and the like and can be surface-mounted and require small occupied space is always mastered in the hands of Japan. China costs a great deal of dollars to import such pedestals each year. The production process adopted by the ceramic base is that two to three layers of softer green ceramic sheets are laminated together at 60 to 120 ℃ and 5 to 30Mpa, and then are subjected to glue removal and sintering to form the ceramic base. The defects are that the local thickness is not uniform after the cover plate is stacked, local shrinkage deformation is caused at a thick place under the same sintering condition, and air leakage is easy to occur after the cover plate is packaged. In addition, the lamination needs to be performed in a vacuum, and the production equipment is high in requirement. Poor temperature and pressure control tends to cause blistering, delamination, and cracking of the ceramic sheet. In a word, the processing technology has harsh conditions, complex equipment and low product percent of pass.
Disclosure of Invention
The invention relates to a ceramic base for a crystal resonator and the like which are surface mounted. The processing technology is that the soft single-layer ceramic sheet is first de-glued and sintered to form the hard ceramic sheet. And respectively bonding the three-layer hard ceramic plate to the two-layer hard ceramic plate to form a three-layer ceramic base and a two-layer ceramic base. The binder removal, sintering and bonding are all carried out under normal pressure conditions. Namely, the soft single-layer green ceramic chip printed with the conductive circuit is formed into a hard single-layer ceramic chip after glue discharging and sintering, and then three layers to two layers of the single-layer ceramic chip are respectively bonded together by using epoxy resin or low-temperature glass. Forming a three-to-two layer ceramic base. The advantages are that: due to single-layer sintering, the ceramic wafer is uniform in thickness and does not deform, the outer shape of the ceramic base formed in the way is flat, the local shrinkage phenomenon is avoided, and the cover plate is sealed without air leakage. And meanwhile, the phenomena of foaming, delamination and cracking do not exist. No import equipment is required. The production process of the single-layer green ceramic chip for glue discharging and sintering is about 16 hours, and the production process of glue discharging and pouring crystallization is 21 hours due to the thicker thickness of the common ceramic base, so that the time can be saved, and the production efficiency can be improved. Compared with the original metal shell seat, the height is reduced from 3-13 mm to 0.6-1.5 mm. Under the condition of the same frequency, the height is reduced by nearly 8-20 times. The method is suitable for high-grade electronic products such as mobile phones and notebook computers which occupy small space.
Drawings
The invention will be further explained with reference to the drawings
FIG. 1 is a schematic view of a three-layer ceramic base structure
FIG. 2 is a top view with the cover removed
FIG. 3 is a schematic view of a substrate structure
FIG. 4 is a schematic diagram of a middle plate structure
FIG. 5 is a schematic diagram of the upper frame structure
FIG. 6 is a schematic view of a two-layer ceramic base structure
FIG. 7 is a top view with the cover removed
FIG. 8 is a schematic view of a substrate structure
FIG. 9 is a schematic view of the structure of the upper frame plate
1-substrate 2-middle plate 3-upper frame plate 4-upper cover plate 5-through hole 6-conductive circuit 7-conductive circuit 8-footing lead 9, 10-through hole 11-conductive circuit 12-middle cavity
Detailed Description
The single-layer soft ceramic chip for processing the base plate, the middle plate, the upper frame plate and the upper cover plate is firstly subjected to glue removal and sintering to form hard ceramic chips, namely a base plate 1, a middle plate 2, an upper frame plate 3 and an upper cover plate 4. The thickness of the hard ceramic plate is 0.1-0.8 mm. And (3) bonding the substrate 1, the middle plate 2, the upper frame plate 3 and the upper cover plate 4 or bonding the substrate 1, the upper frame plate 3 and the upper cover plate 4 into three-layer and two-layer ceramic bases by using epoxy resin or low-temperature glass.
As shown in FIGS. 1 to 5: the three-layer base is composed of a ceramic substrate 1, a middle plate 2, an upper frame plate 3 and a ceramic cover plate 4, wherein the ceramic substrate 1, the middle plate 2, the upper frame plate 3 and the ceramic cover plate 4 are subjected to glue removal and different sintering shapes and have the thickness of 0.1-0.8 mm.
The surface of the substrate 1 is printed with a conductive circuit 7 and a bottom pin lead 8, and the through hole 5 is filled with conductive adhesive or a conductor ceramic chip.
The surface of the middle plate 2 is printed with a conductive circuit 6, and the through hole 9 is filled with conductive adhesive or a conductor ceramic chip.
The upper frame plate 3 has a conductive circuit 11 printed on the surface thereof, and the through holes 10 are filled with conductive paste or conductive tiles.
The assembly process comprises the following steps: the three-layer base is composed of a ceramic substrate 1 with the thickness of 0.1-0.8 mm, a middle plate 2, an upper frame plate 3 and a ceramic cover plate 4 or a two-layer base substrate 1, an upper frame plate 3 and an upper cover plate 4 shown in figures 6-9. The sheets are bonded together with epoxy resin or low temperature glass. Bonding the materials by using epoxy resin at the temperature of 120-170 ℃; bonding the glass with low-temperature glass under 290-350 conditions. The three or two layers of ceramic plates are bonded together to form a complete ceramic base. According to the size of the ceramic wafer, a ceramic base with various specifications of 3.2-11.5 mm in length, 2-8 mm in width and 0.6-2.0 mm in thickness can be manufactured. The middle cavity 12 is filled with a quartz wafer and finally encapsulated with the upper cover plate 4. The ceramic bases with different specifications are matched with the crystal resonators, the oscillators and the filters with corresponding specifications.
Claims (2)
1. A ceramic base of a surface-mounted crystal resonator is composed of a ceramic piece, a surface printed circuit of the ceramic piece, a bottom foot lead and a through hole filler, and is characterized in that a three-layer ceramic base is formed by bonding a hard ceramic piece substrate (1), a middle plate (2), an upper frame plate (3) and an upper cover plate (4) which are subjected to adhesive discharge and sintering by epoxy resin or low-temperature glass, a two-layer ceramic base is formed by bonding the substrate (1), the upper frame plate (3) and the upper cover plate (4) by epoxy resin or low-temperature glass,
wherein,
the surface of the substrate (1) is provided with a printing conductive circuit (7) and a bottom foot lead (8), the through hole (5) is filled with conductive adhesive or a conductor ceramic chip,
the surface of the middle plate (2) is provided with a printing conductive circuit (6), the through hole (9) is filled with conductive adhesive or a conductor ceramic chip,
the surface of the upper frame plate (3) is provided with a printing conductive circuit (11), the through hole (10) is filled with conductive adhesive or a conductor ceramic chip,
the middle cavity (12) is provided with a quartz plate and is encapsulated by an upper cover plate (4).
2. The processing technology of the ceramic base of the surface-mounted crystal resonator is characterized in that a single-layer soft ceramic chip for processing a base plate, a middle plate, an upper frame plate and an upper cover plate is subjected to glue removal and sintering to form a hard ceramic chip base plate (1), a middle plate (2), an upper frame plate (3) and an upper cover plate (4),
a conductive circuit (7) and a bottom foot lead (8) are printed on the surface of the substrate (1), conductive adhesive or a conductor ceramic chip is filled in the through hole (5),
a conductive circuit (6) is printed on the surface of the middle plate (2), conductive adhesive or a conductor ceramic chip is filled in the through hole (9),
conductive circuits (11) are printed on the surface of the upper frame plate (3), conductive glue or conductor tiles are filled in the through holes (10),
respectively bonding a substrate (1), a middle plate (2), an upper frame plate (3) and an upper cover plate (4) or bonding the substrate (1), the upper frame plate (3) and the upper cover plate (4) into three-layer and two-layer ceramic bases by using epoxy resin or low-temperature glass, wherein the bonding temperature of the epoxy resin is 120-170 ℃; the bonding temperature of the low-temperature glass is 290-350 ℃,
the middle cavity (12) is provided with a quartz chip and is packaged by an upper cover plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031341527A CN1294699C (en) | 2003-08-21 | 2003-08-21 | Ceramic substrate with crystal resonator on its surface and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031341527A CN1294699C (en) | 2003-08-21 | 2003-08-21 | Ceramic substrate with crystal resonator on its surface and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1490932A true CN1490932A (en) | 2004-04-21 |
| CN1294699C CN1294699C (en) | 2007-01-10 |
Family
ID=34154399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031341527A Expired - Fee Related CN1294699C (en) | 2003-08-21 | 2003-08-21 | Ceramic substrate with crystal resonator on its surface and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1294699C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101317335B (en) * | 2006-03-22 | 2012-04-11 | 三菱电机株式会社 | Transmitter/receiver |
| CN101719760B (en) * | 2009-12-04 | 2012-07-04 | 武汉盛华微系统技术股份有限公司 | Method for packaging SMT crystal resonator/oscillator by epoxy resin mold |
| CN102956508A (en) * | 2012-11-29 | 2013-03-06 | 中国电子科技集团公司第十三研究所 | Laminating process and positioning tool of ceramic packaging shell with boss structure |
| WO2014019548A1 (en) * | 2012-08-03 | 2014-02-06 | 深圳光启创新技术有限公司 | Harmonic oscillator and manufacturing method therefor, filter device and electromagnetic wave equipment |
| CN103944524A (en) * | 2014-04-28 | 2014-07-23 | 北京遥测技术研究所 | Ka frequency band frequency conversion module based on SMT packaging device |
| CN106209005A (en) * | 2016-08-01 | 2016-12-07 | 安徽贝莱电子科技有限公司 | A kind of production technology of quartz-crystal resonator base of ceramic |
| CN116455343A (en) * | 2023-05-15 | 2023-07-18 | 烟台明德亨电子科技有限公司 | Processing method of ceramic base for crystal oscillator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3152138B2 (en) * | 1995-12-14 | 2001-04-03 | 株式会社村田製作所 | Surface acoustic wave device |
| US20020097562A1 (en) * | 2000-12-18 | 2002-07-25 | Tdk Corporation | Electronic device and manufacturing same |
| CN2567873Y (en) * | 2002-07-05 | 2003-08-20 | 无锡南方电子有限公司 | Piezoelectric ceramic high-frequency plaster resonator |
| CN2648701Y (en) * | 2003-08-21 | 2004-10-13 | 倪永贵 | Surface pasting crystal resonator ceramic base |
-
2003
- 2003-08-21 CN CNB031341527A patent/CN1294699C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101317335B (en) * | 2006-03-22 | 2012-04-11 | 三菱电机株式会社 | Transmitter/receiver |
| CN101719760B (en) * | 2009-12-04 | 2012-07-04 | 武汉盛华微系统技术股份有限公司 | Method for packaging SMT crystal resonator/oscillator by epoxy resin mold |
| WO2014019548A1 (en) * | 2012-08-03 | 2014-02-06 | 深圳光启创新技术有限公司 | Harmonic oscillator and manufacturing method therefor, filter device and electromagnetic wave equipment |
| US9799941B2 (en) | 2012-08-03 | 2017-10-24 | Kuang-Chi Innovative Technology Ltd. | Harmonic oscillator and preparation method thereof, filtering device and electromagnetic wave device |
| CN102956508A (en) * | 2012-11-29 | 2013-03-06 | 中国电子科技集团公司第十三研究所 | Laminating process and positioning tool of ceramic packaging shell with boss structure |
| CN102956508B (en) * | 2012-11-29 | 2015-06-24 | 中国电子科技集团公司第十三研究所 | Laminating process and positioning tool of ceramic packaging shell with boss structure |
| CN103944524A (en) * | 2014-04-28 | 2014-07-23 | 北京遥测技术研究所 | Ka frequency band frequency conversion module based on SMT packaging device |
| CN103944524B (en) * | 2014-04-28 | 2017-05-31 | 北京遥测技术研究所 | A kind of Ka frequency range frequency-variable modules based on SMT encapsulation device |
| CN106209005A (en) * | 2016-08-01 | 2016-12-07 | 安徽贝莱电子科技有限公司 | A kind of production technology of quartz-crystal resonator base of ceramic |
| CN116455343A (en) * | 2023-05-15 | 2023-07-18 | 烟台明德亨电子科技有限公司 | Processing method of ceramic base for crystal oscillator |
| CN116455343B (en) * | 2023-05-15 | 2024-01-23 | 烟台明德亨电子科技有限公司 | Processing method of ceramic base for crystal oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1294699C (en) | 2007-01-10 |
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Granted publication date: 20070110 Termination date: 20120821 |