CN1484343A - Method for mfg. double-interface card with implanted antenna - Google Patents
Method for mfg. double-interface card with implanted antenna Download PDFInfo
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- CN1484343A CN1484343A CNA021370621A CN02137062A CN1484343A CN 1484343 A CN1484343 A CN 1484343A CN A021370621 A CNA021370621 A CN A021370621A CN 02137062 A CN02137062 A CN 02137062A CN 1484343 A CN1484343 A CN 1484343A
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Abstract
A manufacturing method for dual interface card antenna implantation relates to an intelligent card manufacture technology similar to the conventional IC card antenna without contact implantation, composed of six parts: location, antenna bury, packing, prelamination, lamination and cut, among which, bury is an important process in the work , after ensuring channeling, the antenna is exposed for well conducting when adhering a dual interface antenna chip with the antenna.
Description
Technical field
The present invention relates to the smart card manufacturing technology, relate in particular to the manufacture method that a kind of double-interface card antenna is implanted.
Background technology
Contact-carrying IC-card antenna is not implanted has routine not to be with implantation of electric shock IC-card antenna and double-interface IC card antenna to implant two kinds usually.The former antenna and chip weld together; And double-interface IC card need be in antenna and the groove milling of chip junction.Routine not contact-carrying IC-card antenna also can be used as the use of double-interface IC card antenna.Adopt not contact-carrying IC-card antenna method for implantation groove milling of routine, if the groove milling degree of depth is deviation slightly, just the metal wire of 0.1mm might be milled disconnected, can't link to each other with two interfaces chip, during cutting, if the deviation of cutting position can make two lines of antenna amesiality, may have the single line section after the groove milling can't expose, when causing bonding pair of interface chip can't with the antenna conducting.The production difficulty of double-interface IC card antenna is big and output is lower.
Summary of the invention
The manufacture method that the object of the present invention is to provide a kind of double-interface card antenna to implant, guarantee in the production of double-interface card in enormous quantities, the groove milling aft antenna is exposed and continuous, and two interfaces chip and antenna are can conducting when bonding good, its manufacturing process and routine contact-carrying IC-card antenna implant not closely similar, by locate, sunken cord, lamination, pre-laminated, lamination, cutting this six parts composition.
The present invention is achieved in that the manufacture method that a kind of double-interface card antenna is implanted, and may further comprise the steps:
1. locate (technology location)
Guaranteeing under the consistent situation in each work top location, at two circular holes that are of a size of Φ 3mm of PVC material upper punch that will sunken cord, as the sunken cord foundation of location of road, back.
2. sunken cord
Be designed to the continuous line segment formed by the positive U and the U that falls according to module size in the junction of the antenna of double-interface card and IC module, antenna is implanted and is finished by line burying machine, supersonic generator is housed on the line burying machine, antenna utilizes hyperacoustic vibrations when implanting, the energy that ultrasonic wave is produced transmits the road and sunkens cord on the tiny metal bar on the head, make the core top layer of need implanting antenna softening, the line apparatus of telling that buries simultaneously on the first chance spues metal wire and is mounted to softening core top layer and fixing.Under the control of program, metal wire is just sunken cord with the U font back and forth in the chip junction like this, has increased the contact-making surface of two interfaces chip.Wherein the thickness of metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design.The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.
3. lamination
3 to 7 layers of core are superimposed stapled together, and purpose is to influence lamination in order to prevent to misplace between the core in the lamination process.
4. pre-laminated
The core that superimposed bookbinding is finished is at 115 ℃ of-125 ℃ of temperature, 30Kg-40Kg pressure, hot-forming under 1200 second time; In 7 ℃-17 ℃ of temperature, 60Kg-80Kg pressure, the cooling of colding pressing under 1000 second time.
5. lamination
In the middle of the PVC sandwich layer of finishing sunkening cord was placed on, the PVC material that upper and lower cladding thickness as required is the 0.80-0.84 millimeter carried out hot pressing then and colds pressing, and colds pressing after the first hot pressing.At 125 ℃ of-135 ℃ of temperature, 35Kg-55Kg pressure, carry out hot pressing under 1500 second time; Just be pressed into big opening at 9 ℃ of-16 ℃ of temperature, 60Kg-100Kg pressure, after colding pressing under 1200 second time.
The big little card that on cutting machine, cuts into many size conforms international standards of opening that lamination is finished.
Adopt being connected between chip that this kind manufacture method successfully solved the double-interface card sheet and the antenna, make two interface chips with antenna when bonding conducting improved the useful life and the reliability of double-interface card greatly well also by various intensity torsion tests.
Embodiment
Further specify the present invention below in conjunction with instantiation:
The first step operation of the manufacture method that the double-interface card antenna is implanted is location (technology location), guaranteeing under the consistent situation in each work top location, and at two circular holes that are of a size of Φ 3mm of PVC material upper punch that will sunken cord, the foundation of sunkening cord and locating as the road, back.The second step operation is to sunken cord, being designed to wide in the junction of the antenna of double-interface card and IC module according to module size is 5 continuous line segments of being made up of the positive U and the U that falls of 0.20mm for 2.0mm, gap, antenna is implanted and is finished by line burying machine, under the control of program, 0.1mm metal wire just sunken cord back and forth with the U font in the chip junction, increased the contact-making surface and the effective bonding area of two interfaces chip.Wherein the thickness of metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design.The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.Three-procedure is a lamination, and 3 layers of core are superimposed stapled together, and purpose is to influence lamination in order to prevent to misplace between the core in the lamination process.The 4th step operation is pre-laminated, and the core that superimposed bookbinding is finished is at 120 ℃ of temperature, 35Kg pressure, hot-forming under 1200 second time; In 12 ℃ of temperature, 75Kg pressure, the cooling of colding pressing under 1000 second time.The 5th step operation is a lamination, in the middle of the PVC sandwich layer of finishing sunkening cord was placed on, upper and lower cladding thickness as required was 0.82 millimeter a PVC material, carried out hot pressing then and colded pressing, elder generation colds pressing after the hot pressing, at 125 ℃ of temperature, 45Kg pressure, carry out hot pressing under 1500 second time; Just be pressed into big opening at 12 ℃ of temperature, 75Kg pressure, after colding pressing under 1200 second time.
The big little card that on cutting machine, cuts into many size conforms international standards of opening that lamination is finished.
Claims (4)
1. the manufacture method that the double-interface card antenna is implanted is characterized in that, said method comprising the steps of:
A) location (technology location): guaranteeing under the consistent situation in each work top location, at the polyvinyl chloride that will sunken cord (PVC) material upper punch circular hole, the foundation of sunkening cord and locating as the road, back;
B) sunken cord: line burying machine makes metal wire sunken cord back and forth with the U font in the chip junction under the control of program;
C) lamination: 3 to 7 layers of core are superimposed stapled together;
D) pre-laminated: with core that superimposed bookbinding is finished at 115 ℃ of-125 ℃ of temperature, 30Kg-40Kg pressure, hot-forming under 1200 second time; In 7 ℃ of-17 ℃ of temperature, 70Kg-80Kg pressure, the cooling of colding pressing under 1000 second time;
E) lamination: in the middle of the PVC sandwich layer finished of will sunkening cord was placed on, the PVC material that upper and lower cladding thickness as required is the 0.80-0.84 millimeter carried out hot pressing then and colds pressing, and colds pressing after the first hot pressing;
E-1) at 125 ℃ of-135 ℃ of temperature, 35Kg-55Kg pressure, carry out hot pressing under 1200 second time;
E-2) at 9 ℃ of-16 ℃ of temperature, 60Kg-100Kg pressure, cold pressing under 1500 second time;
2. the manufacture method that a kind of according to claim 1 double-interface card antenna is implanted, it is further characterized in that the circular hole in the described step a) is of a size of Φ 3mm, number is two.
3. the manufacture method that a kind of according to claim 1 double-interface card antenna is implanted, it is further characterized in that, the thickness of metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design in the described step b); The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.
4. the manufacture method that a kind of according to claim 1 double-interface card antenna is implanted, it is further characterized in that the big card that lamination is finished cuts into the little card of many size conforms international standards on cutting machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02137062 CN1252861C (en) | 2002-09-19 | 2002-09-19 | Method for mfg. double-interface card with implanted antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02137062 CN1252861C (en) | 2002-09-19 | 2002-09-19 | Method for mfg. double-interface card with implanted antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1484343A true CN1484343A (en) | 2004-03-24 |
| CN1252861C CN1252861C (en) | 2006-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02137062 Expired - Fee Related CN1252861C (en) | 2002-09-19 | 2002-09-19 | Method for mfg. double-interface card with implanted antenna |
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| CN (1) | CN1252861C (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101770597A (en) * | 2010-01-29 | 2010-07-07 | 上海浦江智能卡系统有限公司 | Passive information-protecting shield card |
| CN101976368A (en) * | 2010-09-21 | 2011-02-16 | 深圳市卡的智能科技有限公司 | Method for manufacturing IC (Integrated Circuit) card |
| CN102024176A (en) * | 2010-12-09 | 2011-04-20 | 武汉天喻信息产业股份有限公司 | Manufacturing method of double-interface smart card |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡系统有限公司 | Method for manufacturing intelligent card with double-interface chip |
| CN102073898A (en) * | 2010-12-22 | 2011-05-25 | 上海浦江智能卡系统有限公司 | Manufacturing method for dual-interface smart card INLAY |
| CN102169551A (en) * | 2011-01-27 | 2011-08-31 | 东莞锐发智能卡科技有限公司 | SIM (Subscriber Identity Module) card production method and equipment |
| CN105643963A (en) * | 2016-03-07 | 2016-06-08 | 苏州海博智能系统有限公司 | Processing method for card shell of intelligent card |
| CN109409486A (en) * | 2018-10-31 | 2019-03-01 | 江苏恒宝智能系统技术有限公司 | A kind of smart card and its processing method |
| CN114361048A (en) * | 2022-03-18 | 2022-04-15 | 深圳源明杰科技股份有限公司 | Metal bare wire medium material preparation method and metal bare wire medium material |
| WO2023186132A1 (en) * | 2022-04-01 | 2023-10-05 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101350073B (en) * | 2008-08-20 | 2010-06-23 | 北京握奇数据系统有限公司 | Method for producing double interfaces smart card, double interfaces smart card and antennae layer thereof |
-
2002
- 2002-09-19 CN CN 02137062 patent/CN1252861C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101770597A (en) * | 2010-01-29 | 2010-07-07 | 上海浦江智能卡系统有限公司 | Passive information-protecting shield card |
| CN101976368A (en) * | 2010-09-21 | 2011-02-16 | 深圳市卡的智能科技有限公司 | Method for manufacturing IC (Integrated Circuit) card |
| CN102024176A (en) * | 2010-12-09 | 2011-04-20 | 武汉天喻信息产业股份有限公司 | Manufacturing method of double-interface smart card |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡系统有限公司 | Method for manufacturing intelligent card with double-interface chip |
| CN102073898A (en) * | 2010-12-22 | 2011-05-25 | 上海浦江智能卡系统有限公司 | Manufacturing method for dual-interface smart card INLAY |
| CN102169551A (en) * | 2011-01-27 | 2011-08-31 | 东莞锐发智能卡科技有限公司 | SIM (Subscriber Identity Module) card production method and equipment |
| CN105643963A (en) * | 2016-03-07 | 2016-06-08 | 苏州海博智能系统有限公司 | Processing method for card shell of intelligent card |
| CN109409486A (en) * | 2018-10-31 | 2019-03-01 | 江苏恒宝智能系统技术有限公司 | A kind of smart card and its processing method |
| CN109409486B (en) * | 2018-10-31 | 2020-01-31 | 江苏恒宝智能系统技术有限公司 | smart cards and processing method thereof |
| CN114361048A (en) * | 2022-03-18 | 2022-04-15 | 深圳源明杰科技股份有限公司 | Metal bare wire medium material preparation method and metal bare wire medium material |
| WO2023186132A1 (en) * | 2022-04-01 | 2023-10-05 | 深圳源明杰科技股份有限公司 | Radio frequency antenna manufacturing method and radio frequency antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1252861C (en) | 2006-04-19 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shanghai Shenjian Railway Communication Signal Co. Ltd. Assignor: Shanghai Pujiang Intelligent Card System Co., Ltd. Contract fulfillment period: 2008.11.16 to 2013.11.15 Contract record no.: 2008310000297 Denomination of invention: Method for mfg. double-interface card with implanted antenna Granted publication date: 20060419 License type: Exclusive license Record date: 20081218 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.11.16 TO 2013.11.15; CHANGE OF CONTRACT Name of requester: SHANGHAI SHENJIAN RAILWAY COMMUNICATION SIGNAL CO. Effective date: 20081218 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060419 Termination date: 20200919 |
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| CF01 | Termination of patent right due to non-payment of annual fee |