CN101770597A - Passive information-protecting shield card - Google Patents
Passive information-protecting shield card Download PDFInfo
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- CN101770597A CN101770597A CN201010102637A CN201010102637A CN101770597A CN 101770597 A CN101770597 A CN 101770597A CN 201010102637 A CN201010102637 A CN 201010102637A CN 201010102637 A CN201010102637 A CN 201010102637A CN 101770597 A CN101770597 A CN 101770597A
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- card
- protecting shield
- passive information
- frequency
- shield card
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Abstract
The invention discloses a passive information-protecting shield card, comprising an LC circuit layer and two printing surfaces, the LC circuit relying on additional medium capacitor completely absorbs the electromagnetic waves when receiving the electromagnetic waves of specific frequency from a card reader, therefore, the protected non-contact feature card can not realize coupling through spatial high-frequency alternating magnetic field according to electromagnetic induction principle, and can not realize the transfer of energy and the exchange of data. The passive information-protecting shield card provided by the invention mainly solves the problem that the card is stolen and swiped and cracked maliciously under unknown circumstances, can completely absorb the electromagnetic waves of specific frequency from the card reader within the feature work scope, and is convenient to carry and use. The card has passed various strength torsion tests, and ensures the service life and reliability of the card body.
Description
Technical field
The present invention relates to physical field, smart card manufacturing technology, particularly a kind ofly absorb electromagnetic wave to reach passive information protection card with electromagnetic screen feature by the LC loop.
Background technology
Along with the continuous development of information industry, the IC-card of various not contact-carryings has replaced traditional modes of payments and ticket to use gradually, and extensively has been each field use because use and characteristics such as easy to carry.But along with increasing of various functional area IC-cards, user's number of cards also increases thereupon, for management has brought inconvenience, also steals the brush smart card and cracks smart card and brought channel for social illegal group malice.
At present, traditional mode is to increase the cutting ferrule with shielding characteristic on the card body, but a large amount of cards is after increasing cutting ferrule, and the thickness of card body constantly increases, be not easy to management more, simultaneously, the user must take out card in use at every turn from cutting ferrule, put back to again after using up, use-pattern is comparatively loaded down with trivial details, therefore, uses the user of this cutting ferrule uncommon in the market.
Summary of the invention
The object of the present invention is to provide a kind of passive information-protecting shield card, guarantee in daily card is used, for life brings safe and convenient.
Described this passive information-protecting shield card mainly is made up of a LC loop layer and two printing surfaces.
Described this passive its principle of information-protecting shield card is the LC loop that relies on additional agents electric capacity when the characteristic frequency electromagnetic wave that receives from card reader; absorb this kind electromagnetic wave fully; make the contactless function card that is protected; can't realize coupling by the spatial high-frequency alternating magnetic field according to the law of electromagnetic induction, can't realize the transmission of energy and the exchange of data.
Described this passive information-protecting shield card feature work frequency adaptation international standard non-contact IC card frequency of operation.
Its manufacturing process and routine contact-carrying IC-card antenna implant not closely similar, by locating, sunken cord, lamination, pre-laminated, lamination, cutting this six part and form.
The present invention is achieved in that a kind of manufacturing of passive information-protecting shield card, may further comprise the steps:
1, location (technology location)
Guaranteeing under the consistent situation in each work top location,, imbed the foundation of location as sunken cord location and dielectric capacitance of road, back in the hole of a 2mm*1.2mm of PVC material upper punch that will sunken cord.
2, sunken cord
With the junction of dielectric capacitance according to the continuous line segment of dielectric capacitance size design, antenna is implanted and is finished by line burying machine, ultrasonic generator is housed on the line burying machine, antenna utilizes hyperacoustic vibrations when implanting, the energy that ultrasound wave is produced is sent on the tiny metal bar on the head of sunkening cord, make the core top layer of need implanting antenna softening, the line apparatus of telling on the line burying machine spues metal wire and is mounted to softening core top layer and fixing simultaneously.Under the control of program, metal wire is just sunken cord back and forth in the chip junction like this, and dielectric capacitance is aimed at the hole of 2mm*1.2mm on the PVC core, in the spot welding mode, antenna is connected encapsulation with dielectric capacitance.Wherein the thickness of metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design.The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.
3, lamination
In the spot welding mode that PVC sandwich layer and 2 to 5 layers of core of packaged dielectric capacitance are superimposed stapled together, wherein, the encapsulation medium capacitor layers covers at least 1 layer of PVC packed layer, and purpose is to influence lamination in order to prevent dislocation between lamination process medium capacitance damage and the core.
4, pre-laminated
The core that superimposed bookbinding is finished is at 115-140 ℃ of temperature, 30-40Kg pressure, hot-forming under 1100 second time; At temperature 7-17 ℃, 60-80Kg pressure, the cooling of colding pressing under 1050 second time, these part semi-manufacture are LC loop layer.
5, lamination
With in the middle of LC loop layer is placed on, the upper and lower printing surface that covers as required carries out hot pressing then and colds pressing, and colds pressing after the first hot pressing.In 120-145 ℃ of temperature, 35-55Kg pressure, hot pressing under 1200 second time; Be pressed into big opening at temperature 9-16 ℃, 60-100Kg pressure, after colding pressing under 1100 second time.
6, cutting
The big little card that on cutting machine, cuts into many size conforms international standards of opening that lamination is finished, wherein, LC loop layer, the frequency of operation of feature work frequency adaptation international standard non-contact IC card.
This passive information-protecting shield card has mainly solved the problem that card is stolen brush and cracked by malice under not clear situation; it is in the feature work scope; can absorb characteristic frequency electromagnetic wave fully from card reader; this card is by various intensity torsion tests; and can cover the rub resistance diaphragm on the surface by demand, improve the serviceable life and the reliability of card body greatly.
Embodiment
Further specify the present invention below in conjunction with instantiation:
A kind of passive information-protecting shield card of the present invention mainly is made of a LC loop layer and two printing surfaces, and its manufacturing mainly contains the location, sunkens cord, lamination, pre-laminated, lamination, cut this six operations:
First operation is location (technology location), guaranteeing under the consistent situation in each work top location, at the circular hole that is of a size of 2mm*1.2mm of PVC material upper punch that will sunken cord, sunkens cord as the road, back and to locate and dielectric capacitance is imbedded the foundation of location.
Second operation is to sunken cord, with the junction of dielectric capacitance according to the continuous line segment of dielectric capacitance size design, antenna is implanted and is finished by line burying machine, ultrasonic generator is housed on the line burying machine, antenna utilizes hyperacoustic vibrations when implanting, the energy that ultrasound wave is produced is sent on the tiny metal bar on the head of sunkening cord, makes the core top layer that needs to implant antenna softening, and the line apparatus of telling on the line burying machine spues metal wire and is mounted to softening core top layer and fixing simultaneously.Under the control of program, metal wire is just sunken cord back and forth in the chip junction like this, and dielectric capacitance is aimed at the aperture of 2mm*1.2mm on the PVC core, in the spot welding mode, antenna is connected encapsulation with dielectric capacitance.Wherein the thickness of metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design.The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.
The 3rd operation is lamination, in the spot welding mode that PVC sandwich layer and 2 to 5 layers of core of packaged dielectric capacitance are superimposed stapled together, wherein, the encapsulation medium capacitor layers, cover at least 1 layer of PVC packed layer, purpose is to influence lamination in order to prevent dislocation between lamination process medium capacitance damage and the core.
The 4th operation is pre-laminated, and the core that superimposed bookbinding is finished is at 115-140 ℃ of temperature, 30-40Kg pressure, hot-forming under 1100 second time; At temperature 7-17 ℃, 60-80Kg pressure, the cooling of colding pressing under 1050 second time, these part semi-manufacture are LC loop layer.
The 5th operation is lamination, and with in the middle of LC loop layer is placed on, the upper and lower printing surface that covers as required carries out hot pressing then and colds pressing, and colds pressing after the first hot pressing.In 120-145 ℃ of temperature, 35-55Kg pressure, hot pressing under 1200 second time; Be pressed into big opening at temperature 9-16 ℃, 60-100Kg pressure, after colding pressing under 1100 second time.
The 6th operation is cutting, the big little card that on cutting machine, cuts into many size conforms international standards of opening that lamination is finished, wherein, LC loop layer, the frequency of operation of feature work frequency adaptation international standard non-contact IC card.
Claims (4)
1. a passive information-protecting shield card mainly is made up of a LC loop layer and two printing surfaces.
2. as the manufacture method of the described a kind of passive information-protecting shield card of right 1, by locating, sunken cord, lamination, pre-laminated, lamination, cutting this six parts operation and form.
3. as right 1 described a kind of passive information-protecting shield card; it is further characterized in that; it is in the feature work scope; the LC loop that relies on additional agents electric capacity is when the characteristic frequency electromagnetic wave that receives from card reader; absorb this kind electromagnetic wave fully; make the contactless function card that is protected, can't realize coupling by the spatial high-frequency alternating magnetic field, can't realize the transmission of energy and the exchange of data according to the law of electromagnetic induction.
4. as right 1 described a kind of passive information-protecting shield card, it is further characterized in that, described this passive information-protecting shield card feature work frequency adaptation international standard non-contact IC card frequency of operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010102637A CN101770597A (en) | 2010-01-29 | 2010-01-29 | Passive information-protecting shield card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010102637A CN101770597A (en) | 2010-01-29 | 2010-01-29 | Passive information-protecting shield card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101770597A true CN101770597A (en) | 2010-07-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010102637A Pending CN101770597A (en) | 2010-01-29 | 2010-01-29 | Passive information-protecting shield card |
Country Status (1)
| Country | Link |
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| CN (1) | CN101770597A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960167A (en) * | 2016-01-11 | 2017-07-18 | 深圳市创新佳电子标签有限公司 | A kind of shield card with defencive function |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484343A (en) * | 2002-09-19 | 2004-03-24 | 上海浦江智能卡系统有限公司 | Method for mfg. double-interface card with implanted antenna |
| CN201242762Y (en) * | 2008-05-05 | 2009-05-20 | 中兴通讯股份有限公司 | Electronic label |
-
2010
- 2010-01-29 CN CN201010102637A patent/CN101770597A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484343A (en) * | 2002-09-19 | 2004-03-24 | 上海浦江智能卡系统有限公司 | Method for mfg. double-interface card with implanted antenna |
| CN201242762Y (en) * | 2008-05-05 | 2009-05-20 | 中兴通讯股份有限公司 | Electronic label |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960167A (en) * | 2016-01-11 | 2017-07-18 | 深圳市创新佳电子标签有限公司 | A kind of shield card with defencive function |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100707 |