CN101763523A - Method for manufacturing dual-frequency radio-frequency composite card - Google Patents
Method for manufacturing dual-frequency radio-frequency composite card Download PDFInfo
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- CN101763523A CN101763523A CN200910200809A CN200910200809A CN101763523A CN 101763523 A CN101763523 A CN 101763523A CN 200910200809 A CN200910200809 A CN 200910200809A CN 200910200809 A CN200910200809 A CN 200910200809A CN 101763523 A CN101763523 A CN 101763523A
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Abstract
The invention relates to a method for manufacturing a dual-frequency radio-frequency composite card. The card provides great convenience to living in daily application. The manufacturing process of the card is quite similar to the antenna implantation of the general noncontact IC card and is formed by positioning, wire embedding, stacking, pre-laminating, laminating and cutting. Two frequencies are provided, wherein one frequency exists in a winding layer chip with a working frequency at HF 13.56MHz and a working range of 0-10cm, and the other frequency exists in an electronic tag layer chip with a working frequency at UHF 915MHz and a working range of 0-10m. By adopting the manufacturing method, the problem that the dual-frequency card cannot be used for one-card multipurpose application is successfully solved. In the HF working range, the card can be used for one-card electronic payment, identity information storage, identity information authentication and the like; and in the UHF working range, the card can be used for remote electronic payment, logistics authentication and the like. The card passes all kinds of strength and torsion tests. Thereby, the actual service life and the reliability of the dual-frequency card are greatly improved.
Description
Technical field
The present invention relates to physical field and electronic tag, smart card manufacturing technology, relate in particular to a kind of manufacture method of bifrequency composite card.
Background technology
Once non-contact IC card on the market operated mainly under a kind of frequency, and along with various different operating frequencies, the widespread use of the IC-card of different operating distance in different field.
In the market, non-contact IC card is used for paying by mails more and identity information stores, and its frequency of operation is at 13.56MHz, and the work responding range is at 0-10cm; In addition, a kind of frequency of operation is arranged at the UHF of 915MHz (ultrahigh frequency) etching antenna electronic tag, now be widely used in purposes such as remote all-purpose card logistics payment more, people need to carry the IC-card that surpasses more than 2 often at one's side, to satisfy the different application demand, single appearance of answering recruitment C card of the compatible two or more frequencies of energy are more and more called in market more thus.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of dual-frequency radio-frequency composite card, guarantee in daily use, for life offers convenience, its manufacturing process and routine contact-carrying IC-card antenna implant not closely similar, by locating, sunken cord, lamination, pre-laminated, lamination, cutting this six part and form.
The present invention is achieved in that a kind of manufacture method of dual-frequency radio-frequency composite card, may further comprise the steps:
1, location (technology location)
Guaranteeing under the consistent situation in each work top location, be of a size of circular hole and a circular hole that is of a size of Φ 1mm of Φ 3mm, as the sunken cord foundation of location and the chip buried location of UHF of road, back in two of PVC material upper punches will sunkening cord.
2, sunken cord
Design continuous line segment at the antenna of bifrequency card and the junction of IC module according to module size, antenna is implanted and is finished by line burying machine, ultrasonic generator is housed on the line burying machine, antenna utilizes hyperacoustic vibrations when implanting, the energy that ultrasound wave is produced is sent on the tiny metal bar on the head of sunkening cord, make the core top layer of need implanting antenna softening, the line apparatus of telling on the line burying machine spues metal wire and is mounted to softening core top layer and fixing simultaneously.Under the control of program, metal wire is just sunken cord back and forth in the chip junction like this.Wherein the thickness of metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design.The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.
3, lamination
The electronic tag of packaged UHF chip is fixed on the one side of the PVC sandwich layer of packaged HF chip in the spot welding mode, wherein the UHF chip is aimed at the aperture of Φ 1mm on the PVC core, and it is 3 to 7 layers of core are superimposed stapled together, wherein, packaged chip and electronic tag layer, each covers at least 1 layer of PVC packed layer, and purpose is to influence lamination in order to prevent dislocation between damage of lamination process chips and the core.
4, pre-laminated
The core that superimposed bookbinding is finished is at 115-125 ℃ of temperature, 30-40Kg pressure, hot-forming under 1200 second time; At temperature 7-17 ℃, 60-80Kg pressure, the cooling of colding pressing under 1000 second time, these part semi-manufacture are INLAY.
5, lamination
With in the middle of the INLAY layer is placed on, the PVC material printing surface that upper and lower cladding thickness as required is 0.80-0.84mm, cladding thickness is not more than the hyaline membrane of 0.50mm more as required, carries out hot pressing then and colds pressing, and colds pressing after the first hot pressing.In 120-135 ℃ of temperature, 35-55Kg pressure, hot pressing under 1500 second time; Be pressed into big opening at temperature 9-16 ℃, 60-100Kg pressure, after colding pressing under 1200 second time.
6, cutting
The big little card that on cutting machine, cuts into many size conforms international standards of opening that lamination is finished.
Wherein, the wire winding layer chip, frequency of operation is HF 13.56MHz, working range is 0-10cm; Electronic tag layer chip, frequency of operation are UHF 915MHz, and working range is 0-10m.
Adopt this kind manufacture method successfully to solve the bifrequency card one card problems of using more, it can be used in the HF working range that all-purpose card is paid by mails and identity information storage, checking etc., in the UHF working range, can be used in remote E-Payment and logistics checking etc., this card has improved the physical life and the reliability of bifrequency card greatly by various intensity torsion tests.
Embodiment
Further specify the present invention below in conjunction with instantiation:
The first step operation of the manufacture method of dual-frequency radio-frequency composite card is location (technology location), guaranteeing under the consistent situation in each work top location, be of a size of circular hole and a circular hole that is of a size of Φ 1mm of Φ 3mm in two of PVC material upper punches will sunkening cord, as the sunken cord foundation of location of road, back.
The second step operation is to sunken cord, design continuous line segment at the antenna of bifrequency card and the junction of IC module according to module size, antenna is implanted and is finished by line burying machine, ultrasonic generator is housed on the line burying machine, antenna utilizes hyperacoustic vibrations when implanting, the energy that ultrasound wave is produced is sent on the tiny metal bar on the head of sunkening cord, makes the core top layer that needs to implant antenna softening, and the line apparatus of telling on the line burying machine spues metal wire and is mounted to softening core top layer and fixing simultaneously.Under the control of program, metal wire is just sunken cord back and forth in the chip junction like this.Wherein the thickness of metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design.The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.
The 3rd operation is lamination, the electronic tag of packaged UHF chip is fixed on the one side of the PVC sandwich layer of packaged HF chip in the spot welding mode, wherein the UHF chip is aimed at the aperture of Φ 1mm on the PVC core, and it is 3 to 7 layers of core are superimposed stapled together, wherein, packaged chip and electronic tag layer, each covers at least 1 layer of PVC packed layer, and purpose is to influence lamination in order to prevent dislocation between damage of lamination process chips and the core.
The 4th step operation is pre-laminated, and the core that superimposed bookbinding is finished is at 115-125 ℃ of temperature, 30-40Kg pressure, hot-forming under 1200 second time; At temperature 7-17 ℃, 60-80Kg pressure, the cooling of colding pressing under 1000 second time, these part semi-manufacture are INLAY.
The 5th step operation is a lamination, with in the middle of the INLAY layer is placed on, and the PVC material printing surface that upper and lower cladding thickness as required is 0.80-0.84mm, cladding thickness is not more than the hyaline membrane of 0.50mm more as required, carries out hot pressing then and colds pressing, and colds pressing after the first hot pressing.In 120-135 ℃ of temperature, 35-55Kg pressure, hot pressing under 1500 second time; Be pressed into big opening at temperature 9-16 ℃, 60-100Kg pressure, after colding pressing under 1200 second time.
The 6th step operation is cutting, the big little card that cuts into many size conforms international standards on cutting machine of opening that lamination is finished.
Claims (5)
1. the manufacture method of a dual-frequency radio-frequency composite card may further comprise the steps:
A) location (technology location): guaranteeing under the consistent situation in each work top location that punching on the PVC material that will sunken cord is sunken cord as the road, back and to be located and the foundation of the chip buried location of UHF.
B) sunken cord: line burying machine is under program is controlled, and metal wire is just sunken cord back and forth in the chip junction.
C) lamination: in the spot welding mode electronic tag is fixed on the one side of sandwich layer, and 3 to 7 layers of core are superimposed stapled together.
D) pre-laminated: with core that superimposed bookbinding is finished at 115-125 ℃ of temperature, 30-40Kg pressure, hot-forming under 1200 second time; At temperature 7-17 ℃, 60-80Kg pressure, the cooling of colding pressing under 1000 second time.
E) lamination: with in the middle of sandwich layer is placed on, the PVC material printing surface that upper and lower cladding thickness as required is 0.80-0.84mm, cladding thickness is not more than the hyaline membrane of 0.50mm more as required, carries out hot pressing then and colds pressing, and colds pressing after the first hot pressing.In 120-135 ℃ of temperature, 35-55Kg pressure, hot pressing under 1500 second time; At temperature 9-16 ℃, 60-100Kg pressure, cold pressing under 1200 second time.
F) cutting: big the opening that lamination is finished cuts into card on cutting machine.
2. as the manufacture method of a kind of dual-frequency radio-frequency composite card as described in the right 1, it is further characterized in that circular hole is of a size of Φ 3mm in the described step a), and number is 2, and is of a size of the circular hole of Φ 1mm, and number is 1.
3. as the manufacture method of a kind of dual-frequency radio-frequency composite card as described in the right 1, it is further characterized in that, the thickness of described step b) metal wire depends on the sunken cord number of turns of the shape and the coil of sunkening cord of use equipment, design.The number of turns of the shape of sunkening cord and the coil of sunkening cord has determined Q value, inductance L, capacitor C, the resistance R of coil.
4. as the manufacture method of a kind of dual-frequency radio-frequency composite card as described in the right 1, it is further characterized in that, the big little card that cuts into many size conforms international standards on cutting machine of opening that described step f) is finished lamination.
5. as the manufacture method of a kind of dual-frequency radio-frequency composite card as described in the right 1, it is further characterized in that, the wire winding layer chip, and frequency of operation is HF 13.56MHz, working range is 0-10cm; Electronic tag layer chip, frequency of operation are UHF915MHz, and working range is 0-10m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910200809A CN101763523A (en) | 2009-12-25 | 2009-12-25 | Method for manufacturing dual-frequency radio-frequency composite card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910200809A CN101763523A (en) | 2009-12-25 | 2009-12-25 | Method for manufacturing dual-frequency radio-frequency composite card |
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| Publication Number | Publication Date |
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| CN101763523A true CN101763523A (en) | 2010-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910200809A Pending CN101763523A (en) | 2009-12-25 | 2009-12-25 | Method for manufacturing dual-frequency radio-frequency composite card |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102930325A (en) * | 2011-08-09 | 2013-02-13 | 苏州工业园区迪隆科技发展有限公司 | Inlay, synthesis and processing process for contactless IC (Integrated Circuit) smart cards |
| CN103886356A (en) * | 2014-04-14 | 2014-06-25 | 公安部第三研究所 | Method for automatically producing double-frequency active tag cards |
| CN105856598A (en) * | 2016-05-04 | 2016-08-17 | 深圳源明杰科技股份有限公司 | Automatic card stacking machine and stacking technology |
| CN106203606A (en) * | 2016-08-22 | 2016-12-07 | 无锡品冠物联科技有限公司 | A kind of high durable PVC electronic tag and production technology thereof |
-
2009
- 2009-12-25 CN CN200910200809A patent/CN101763523A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102930325A (en) * | 2011-08-09 | 2013-02-13 | 苏州工业园区迪隆科技发展有限公司 | Inlay, synthesis and processing process for contactless IC (Integrated Circuit) smart cards |
| CN103886356A (en) * | 2014-04-14 | 2014-06-25 | 公安部第三研究所 | Method for automatically producing double-frequency active tag cards |
| CN105856598A (en) * | 2016-05-04 | 2016-08-17 | 深圳源明杰科技股份有限公司 | Automatic card stacking machine and stacking technology |
| CN105856598B (en) * | 2016-05-04 | 2018-05-08 | 深圳源明杰科技股份有限公司 | Automatic card folds a machine and folded Zhang Gong's skill |
| CN106203606A (en) * | 2016-08-22 | 2016-12-07 | 无锡品冠物联科技有限公司 | A kind of high durable PVC electronic tag and production technology thereof |
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Open date: 20100630 |