CN1483569A - Package process for non-contact modified polyester othylene (PET-G) matevial - Google Patents
Package process for non-contact modified polyester othylene (PET-G) matevial Download PDFInfo
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- CN1483569A CN1483569A CNA021370591A CN02137059A CN1483569A CN 1483569 A CN1483569 A CN 1483569A CN A021370591 A CNA021370591 A CN A021370591A CN 02137059 A CN02137059 A CN 02137059A CN 1483569 A CN1483569 A CN 1483569A
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Abstract
The present invention relates to a non-contact modified polyester ethylene (PET-G) material packaging process, belonging to the intelligent card making technology, consisting of punching, embedding dine, filling, welding, lamination, pressing and cutting. Said PET-G material is harmless for environment, easy to decompose, wear-resistant, heat-resistant, cold-resistant, and can raise the service life of card.
Description
Technical field
The present invention relates to the smart card manufacturing technology, relate in particular to non-contact modified polyester ethene (PET-G) material packaging technology.
Background technology
The packaging technology that contactless IC card is commonly used has polyvinyl chloride (PVC) material and modified poly ester ethene (PET-G) material, by locate, sunken cord, operation compositions such as encapsulation, lamination, cutting.Constantly perfect along with manufacturing card, the PVC material now has been widely used in the manufacturing card, but because its anti-twist property is poor, useful life is short, and shortcoming such as pollute the environment, and has retrained its development prospect from now on.
Summary of the invention
The object of the present invention is to provide a kind of noncontact PET-G material packaging technology, it by punching, sunken cord, load, welding, lamination, lamination, cut these a few step operations and form.Since many drawbacks limit of PVC material its development, and the fabrication material has relatively high expectations to its high-temperature stability, therefore adopted the packaging technology of noncontact PET-G material.The PET-G material belongs to the thermoplastic polyester material, compares with other materials to have better heat-resisting and cold resistance, and satisfactory mechanical property in-20 ℃ ~+90 ℃ temperature range, and also its corrosion resistance is strong, is a kind of feature of environmental protection material.
The present invention is achieved like this, and a kind of noncontact PET-G material packaging technology may further comprise the steps:
1. punching
Non-contact modular general reference contactless ic module, be implanted in the middle of the card base, and module itself has certain thickness, its gross thickness comprises metal base thick and molding thickness, this just need go out corresponding hole by module size with sandwich layer, covers on the chip to remedy the influence of chip thickness so that chip is filled in the hole or with core with holes.
2. sunken cord
Sunkening cord is under the control of program, and the landfill metal wire is to play the effect of antenna on the PET-G of punching core, and the position that metal wire is buried underground is according to card sizes, between two parties or up and down, the left-right symmetric design, and the outer ring in punching (module hole).
3. load
Filling is the several fixing working point that sets in advance mechanical arm, promptly the IC module hole that will load in the work space of a whole page is fixed as several X, Y coordinate points, automatically module is filled on fixing X, the Y coordinate points at mechanical arm under the control of program.
4. welding
Welding is to act on the welding tip by immediate current, produce the insulating barrier thawing of high temperature with metal wire, and metal part strong bonded metal wire is local and module, make metal wire and chip conducting form the loop, thus the signal that the reception read write line sends and send answer signal.
5. lamination
Adopt the PET-G material that is complementary with module metal tape base and molding thickness to remedy the influence of module thickness, prevent from the process of lamination, to influence the effect of lamination, and multilayer PET-G core is fixed together with electric welding machine or electric iron spot welding owing to the dislocation between the core.
6. lamination
Lamination is an of paramount importance link in the whole PET-G material production process, and it is divided into hot pressing and colds pressing, and colds pressing after the first hot pressing, and hot pressing temperature is that 105 ℃-120 ℃, pressure are that 40-50 kilogram, time are 1200 seconds; The temperature of colding pressing is that 7 ℃-17 ℃, pressure are that 70-80 kilogram, time are 1000 seconds.Be in the same place the multilayer core is melt bonded with just colding pressing by hot pressing.
7. cutting
Big open card cuts into many size conforms international standards on cutting machine little card with what lamination was finished.
The PET-G material is harmless to social environment as environment-friendly materials, decomposes easily, according to its heat-resisting, cold-resistant and nonabradable characteristic, makes it be convenient to long-time collection simultaneously, has improved the useful life of card greatly.Adopt the bending and the torque characteristic of the non-contact card of PET-G material can both reach the ISO quality standard, on the make have certain operability, the development prospect of the fabrication industry in future is had very big influence.
Embodiment
Further specify the present invention below in conjunction with concrete example.
The first step operation of noncontact PET-G material packaging technology is punching, the contactless ic module is implanted in the middle of the card base, and module itself has certain thickness, its gross thickness is about 0.40mm, this thickness comprises metal base thick and molding thickness, metal tape base thickness range is 0.09mm-0.1mm, the molding thickness range is 0.277mm-0.29mm, base thick is 0.09mm in the present embodiment, molding thickness is 0.28mm, this just need go out corresponding hole by module size with sandwich layer, covers on the chip to remedy the influence of chip thickness so that chip is filled in the hole or with core with holes.The second step operation is to sunken cord, sunkening cord is under the control of program, and landfill plays the metal wire of antenna effect on the PET-G of punching core, and the position that metal wire is buried underground is according to card sizes, between two parties or up and down, the left-right symmetric design, the outer ring in punching (module hole).Three-procedure is to load, and the IC module hole that will load in the work space of a whole page is fixed as several X, Y coordinate points, automatically module is filled on fixing X, the Y coordinate points at mechanical arm under the control of program.The 4th step operation is welding, welding is to act on the welding tip by immediate current, produce the insulating barrier thawing of high temperature with metal wire, and the local gasification of metal wire made it metal part strong bonded with module, make metal wire and chip conducting form the loop, thereby receive the signal that read write line sends and send answer signal.The 5th step operation is a lamination, adopt the PET-G material that is complementary with module metal tape base and molding thickness to remedy the influence of module thickness, prevent from the process of lamination, to influence the effect of lamination, and 3 layers of PET-G core are fixed together with electric welding machine or electric iron spot welding owing to the dislocation between the core.The 6th step operation is a lamination, and lamination is an of paramount importance link in the whole PET-G material production process, and it is divided into hot pressing and colds pressing, and colds pressing after the first hot pressing, and hot pressing temperature is that 120 ℃, pressure are that 45 kilograms, time are 1200 seconds; The temperature of colding pressing is that 12 ℃, pressure are that 75 kilograms, time are 1000 seconds.Be in the same place the multilayer core is melt bonded with just colding pressing by hot pressing.The final step operation is cutting, big open a card to cut into many size conforms international standards on cutting machine be that length is that 85.47mm, width are that 53.92mm, thickness are the little card of 0.72mm, fillet R=3.00mm what lamination was finished.
Claims (4)
1. a non-contact modified polyester ethene (PET-G) material packaging technology is characterized in that concrete steps are as follows:
A) punching: non-contact modular is implanted in the middle of the card base, and sandwich layer is gone out corresponding hole by module size;
B) sunken cord: by program control, landfill metal wire on modified poly ester ethene (PET-G) core of punching;
C) load: set in advance the several fixing working point of mechanical arm, promptly the IC module hole that will load in the work space of a whole page is fixed as several X, Y coordinate points, automatically module is filled on fixing X, the Y coordinate points at mechanical arm under the control of program;
D) welding: act on the welding tip by immediate current, produce high temperature the insulating barrier of metal wire is melted, and the local gasification of metal wire is made it metal part strong bonded with module, make metal wire and chip conducting formation loop;
E) lamination: modified poly ester ethene (PET-G) material that employing and module metal tape base and molding thickness are complementary remedies the influence of module thickness, and multilayer PET-G core is fixed together with electric welding machine or electric iron spot welding;
F) lamination: lamination is divided into hot pressing and colds pressing, and at first carries out hot pressing, and next is colded pressing;
F-1) hot pressing temperature is that 105 ℃-120 ℃, pressure are that 40-50 kilogram, time are 1200 seconds;
F-2) temperature of colding pressing is that 7 ℃-17 ℃, pressure are that 70-80 kilogram, time are 1000 seconds.
2. a kind of according to claim 1 non-contact modified polyester ethene (PET-G) material packaging technology, it is further characterized in that, the non-contact modular general reference contactless ic module in the described step a), its thickness comprises metal base thick and molding thickness.
3. a kind of according to claim 1 non-contact modified polyester ethene (PET-G) material packaging technology, it is further characterized in that, the position that metal wire is buried underground in the described step b) is according to card sizes, between two parties or up and down, the left-right symmetric design, and the outer ring in punching (module hole).
4. a kind of according to claim 1 non-contact modified polyester ethene (PET-G) material packaging technology, it is further characterized in that the big card that lamination is finished can cut into the little card of many size conforms international standards on cutting machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021370591A CN1483569A (en) | 2002-09-19 | 2002-09-19 | Package process for non-contact modified polyester othylene (PET-G) matevial |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021370591A CN1483569A (en) | 2002-09-19 | 2002-09-19 | Package process for non-contact modified polyester othylene (PET-G) matevial |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1483569A true CN1483569A (en) | 2004-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021370591A Pending CN1483569A (en) | 2002-09-19 | 2002-09-19 | Package process for non-contact modified polyester othylene (PET-G) matevial |
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| CN (1) | CN1483569A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424721C (en) * | 2006-11-22 | 2008-10-08 | 凤凰微电子（中国）有限公司 | Method for fabricating and packaging chips and elements to smart card with plastic package technique |
| CN101083877B (en) * | 2007-06-22 | 2010-10-13 | 北京德鑫泉物联网科技股份有限公司 | Multi-head buried welding integration machine and its method for buried welding |
-
2002
- 2002-09-19 CN CNA021370591A patent/CN1483569A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424721C (en) * | 2006-11-22 | 2008-10-08 | 凤凰微电子（中国）有限公司 | Method for fabricating and packaging chips and elements to smart card with plastic package technique |
| CN101083877B (en) * | 2007-06-22 | 2010-10-13 | 北京德鑫泉物联网科技股份有限公司 | Multi-head buried welding integration machine and its method for buried welding |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |