CN1480992A - Technique for precision finishing two side of plane wafer in large size - Google Patents
Technique for precision finishing two side of plane wafer in large size Download PDFInfo
- Publication number
- CN1480992A CN1480992A CNA021328943A CN02132894A CN1480992A CN 1480992 A CN1480992 A CN 1480992A CN A021328943 A CNA021328943 A CN A021328943A CN 02132894 A CN02132894 A CN 02132894A CN 1480992 A CN1480992 A CN 1480992A
- Authority
- CN
- China
- Prior art keywords
- abrasive disk
- star wheel
- polishing
- grinding
- erratic star
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Grinding and polishing is carried out in planetary type grinding and polishing machine with sequence of grinding first then polishing in the invention. Before entering fine grinding, upper and lower abrasive discs are corrected. Thus, grinding is carried out for abrasive disc while cast iron wandering star wheel is between upper and lower abrasive disc. After grinding is completed, wafer is ground and polished while planet wheel with wafer inside is between upper and lower abrasive disc. It would be better that in a period time, the planet wheel is flipped once, and its rotation direction is changed once. After two sides of wafers are ground and polished, single side fine polishing is carried out in a polishing machine for single side. The method provides product with good surface smoothness, degree of parallelization and high processing rate.
Description
Technical field: technique for precision finishing two side of plane wafer in large size is the technique for precision finishing two side of plane wafer in large size method of optical element large-area planar crystal wafer being ground, polishing processing.
Background technology: existing to the two side of plane wafer in large Precision Machining, as when processing the large tracts of land germanium wafer, rectangle particularly, for example: 189mm * 106mm * 10mm, like this during the germanium of specification, traditional processing method, adopt the machine work of diaxon single face grinding and polishing, because long, wide oversize, cause and can not process separately, must make corresponding pad, and can only carry out the single face grinding and polishing, the dish lower wall is more bothersome on the process of installation workpiece, can only lean on people's experience and the quality that simple survey tool is grasped the depth of parallelism, will inevitably be less than the high-accuracy depth of parallelism, and working (machining) efficiency is low.
Summary of the invention:
Purpose of the present invention will solve high-efficient grinding polishing large-scale plane wafer exactly, and can guarantee the technical problem of the depth of parallelism, and a kind of technique for precision finishing two side of plane wafer in large size of batch is provided.
Technique for precision finishing two side of plane wafer in large size of the present invention, adopt planetary polisher lapper to carry out grinding and polishing, grind afterwards earlier and polish, it is characterized in that: before entering correct grinding, revise abrasive disk up and down, the cast iron erratic star wheel is placed on up and down between the abrasive disk abrasive disk ground, abrasive disk grind fully close after, the planetary gear (erratic star wheel) that wafer will be housed again is placed on up and down and grinds and polish between the abrasive disk.Owing to adopted planetary polisher lapper, can directly grind simultaneously or polish two side of plane wafer in large, between the abrasive disk abrasive disk is ground about particularly the cast iron erratic star wheel is placed on before correct grinding, can revise abrasive disk up and down well, make mill adapt to the depth of parallelism of process of lapping, so that to workpiece grinding and polishing process, can the fine depth of parallelism that is shaped as, and can guarantee that the continuous course of processing keeps consistency, can two-sidedly fast process qualified plane wafer in large.So preferably the cast iron erratic star wheel is placed on up and down and between the abrasive disk abrasive disk is ground, again the cast iron erratic star wheel being turned continuation is grinding abrasive disk between the abrasive disk up and down, can form better adaptability, more can the fine finishining of continuous high-efficient ground go out reaching unanimity property of the depth of parallelism.The cast iron erratic star wheel is placed on up and down and between the abrasive disk abrasive disk is ground a period of time, just stirs erratic star wheel one time, can proofread and correct the consistency of lower millstone repeatedly, and make the depth of parallelism of lower millstone higher.The cast iron erratic star wheel changes the erratic star wheel rotation direction during being placed on up and down between the abrasive disk abrasive disk being ground.In order to obtain higher surface smoothness under the prerequisite that can guarantee the depth of parallelism, preferably adopt planetary polisher lapper to carry out two-sided lapping polishing after, carry out the single face finishing polish being put into single side polishing machine.For fear of collapsing porcelain, before grinding and polishing, earlier chamfering is carried out in large tracts of land wafer corner in grinding and polishing process.Technique for precision finishing two side of plane wafer in large size of the present invention is compared with conventional machining process, has following advantage:
The first, upper and lower through the dish that grinds simultaneously to workpiece two sides grinding and polishing, can reach the very high depth of parallelism, substantially parallel degree＜10 second.
The second, adopt and two-sidedly to grind simultaneously and to polish, without retaining element, on put into when coiling, take out during lower wall and get final product, do not want glass backup plate and pad yet.Clean two procedures when bonding when having saved last coiling in the single-sided polishing and lower wall, saved the finishing of glass backup plate, saved a large amount of time, the difficulty and the labour intensity of operation are less.
Three, adopt the two-sided lapping polishing, as the germanium that is of a size of 189mm * 106mm * 10mm, can put one in the jig, and can put into 5 jigs in the dish, so just can process 5 simultaneously, improved output and efficient.
When four, adopting two-sided lapping and polishing, cylinder iron planetary gear grinds last lower millstone earlier, make to the two-sided good process repeatability of grinding and polishing, can overcome employee's individual operation factors to large extent, be convenient to the adjustment of technology and the stability of technology.
Embodiment:
Embodiment one, technique for precision finishing two side of plane wafer in large size, adopt planetary polisher lapper to carry out grinding and polishing, grind afterwards earlier and polish, it is characterized in that: before entering correct grinding, revise abrasive disk up and down, the cast iron erratic star wheel is placed on up and down between the abrasive disk abrasive disk ground, when abrasive disk is ground fully close after, the planetary gear (erratic star wheel) that wafer will be housed again is placed on up and down and grinds and polish between the abrasive disk.The cast iron erratic star wheel is placed on up and down between the abrasive disk abrasive disk ground, again the cast iron erratic star wheel is turned continuation and between the abrasive disk abrasive disk is being ground up and down.The cast iron erratic star wheel is placed on up and down and between the abrasive disk abrasive disk was ground 15-30 minute, just stirs erratic star wheel one time.The cast iron erratic star wheel changes the erratic star wheel rotation direction during being placed on up and down between the abrasive disk abrasive disk being ground.After adopting planetary polisher lapper to carry out two-sided lapping polishing, carry out the single face finishing polish being put into single side polishing machine.Before grinding and polishing, earlier chamfering is carried out in large tracts of land wafer corner.
Embodiment two, with the two-sided precise machining process of the germanium of 189mm * 106mm * 10mm
The first step: chamfering is at first carried out the protectiveness chamfering according to its eyeglass, and the protectiveness chamfering must be accomplished about 45 °, and chamfering also is difficult for excessive.
Second step: correct grinding generally can be not big especially because of the come thickness deviation of germanium material, and the grinding rate of big twin grinder is very fast, so can not adopt corase grind, directly enters correct grinding.Before correct grinding, must fix upper and lower abrasive disk, more satisfactory with the face shape of the germanium that guarantees to be ground out.In order to obtain very desirable two-sided lapping dish, to the confidential reasonable operation of carrying out of HD2M9-9S-11L type two-sided lapping, the cast iron erratic star wheel is put into, machined, grind for a long time, after grinding is closed fully dish, use standard jig, the aperture of seeing the cast iron erratic star wheel is judged the face shape of upper and lower dish, walks 200 when changeing at meter reading later on, stir erratic star wheel one time, come the face shape of align hone dish.If upper and lower dish when all being recessed circle, can change for the erratic star wheel rotation direction with the variable speed commutator apparatus that master driver is provided with, promptly change under the pleasure boat state, so the same dish direction of the sense of rotation of cast iron erratic star wheel unanimity.The speed of related movement of cast iron erratic star wheel and lower wall is strengthened, because abrasive disk is circular, the linear velocity at edge is greater than inner linear velocity, like this will many milled borders, so that high circle appears in lower wall, and then stir the cast iron erratic star wheel to obtain very desirable grinding card shape.We adopt the diamond dust of W7 to finish grind.Earlier jig is put into dish, put into germanium wafer then.Select for use and gently compress into row and grind, always be ground to desired size.
The 3rd step: just polish us and select for use chromium oxide to make polishing fluid.Use the twin polishing lathe of cleaning to polish.In circulating pump, put into polishing fluid, put into jig then, the careful eyeglass of putting into.Crawl control descends falls button, polishing disk in the landing soon.Impact eyeglass when preventing that polishing disk from descending, apart from the 20mm place, press " delay and fall " button, make its slow haptic lens at last dish and workpiece.After determining haptic lens, click and fall button soon, it is contacted fully after, just can start main frame, start sand pump, supply with polishing fluid.Last " rotational speed regulation " button of slowly regulating, when just beginning to polish, slower rotate of polishing disk do not conform to colliding with of causing to prevent part.Polish about half an hour, can lower wall if throw.
The 4th step: the surface smoothness of finishing polish in order to obtain, we can adopt and see on the classic method of coiling on the light aperture and coil.On the basis of just throwing, use the schmigel polishing fluid of 0.05u to carry out 45-50 minute smart the throwing, just can obtain very high fineness.
The large tracts of land germanium of making like this, not only surface smoothness is good, and the depth of parallelism is also quite high, and process velocity has also improved.
Claims (6)
1, a kind of technique for precision finishing two side of plane wafer in large size, adopt planetary polisher lapper to carry out grinding and polishing, grind afterwards earlier and polish, it is characterized in that: before entering correct grinding, revise abrasive disk up and down, the cast iron erratic star wheel is placed on up and down between the abrasive disk abrasive disk ground, abrasive disk grind fully close after, the erratic star wheel that wafer will be housed again is placed on up and down and grinds and polish between the abrasive disk.
2, as the said technique for precision finishing two side of plane wafer in large size of claim 1, it is characterized in that: the cast iron erratic star wheel is placed on up and down between the abrasive disk abrasive disk is ground, again the cast iron erratic star wheel is turned continuation and between the abrasive disk abrasive disk is being ground up and down.
3, as the said technique for precision finishing two side of plane wafer in large size of claim 2, it is characterized in that: the cast iron erratic star wheel is placed on up and down and between the abrasive disk abrasive disk is ground a period of time, just stirs erratic star wheel one time.
4, as claim 1 or 2 or 3 said technique for precision finishing two side of plane wafer in large size, it is characterized in that: the cast iron erratic star wheel changes the erratic star wheel rotation direction during being placed on up and down between the abrasive disk abrasive disk being ground.
5, as the said technique for precision finishing two side of plane wafer in large size of claim 1, it is characterized in that: after adopting planetary polisher lapper to carry out the two-sided lapping polishing, be put into single side polishing machine again and carry out the single face finishing polish.
6, as the said technique for precision finishing two side of plane wafer in large size of claim 1, it is characterized in that: before grinding and polishing, earlier chamfering is carried out in large tracts of land wafer corner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021328943A CN1315159C (en) | 2002-09-06 | 2002-09-06 | Technique for precision finishing two side of plane wafer in large size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021328943A CN1315159C (en) | 2002-09-06 | 2002-09-06 | Technique for precision finishing two side of plane wafer in large size |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1480992A true CN1480992A (en) | 2004-03-10 |
| CN1315159C CN1315159C (en) | 2007-05-09 |
Family
ID=34145359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021328943A Expired - Fee Related CN1315159C (en) | 2002-09-06 | 2002-09-06 | Technique for precision finishing two side of plane wafer in large size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1315159C (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100392818C (en) * | 2004-12-08 | 2008-06-04 | 中国电子科技集团公司第四十六研究所 | Method for processing chip capable of improving semiconductor chip geometric parameter |
| CN1814407B (en) * | 2005-02-04 | 2011-01-12 | 上海日进机床有限公司 | Method and device for grinding large-size workpiece |
| CN101973076A (en) * | 2010-10-15 | 2011-02-16 | 北京石晶光电科技股份有限公司济源分公司 | Precise technology for correcting cutting angles of quartz crystal wafers in large scale |
| CN104002227A (en) * | 2014-04-30 | 2014-08-27 | 深圳市大族激光科技股份有限公司 | Method for grinding stainless steel mirror surface |
| CN104551961A (en) * | 2013-10-23 | 2015-04-29 | 有研新材料股份有限公司 | Double-side polishing method of 12-inch silicon wafer |
| CN104924196A (en) * | 2014-03-20 | 2015-09-23 | 六晶金属科技（苏州）有限公司 | Method for grinding metal substrate for LED chip scale packaging |
| CN105980105A (en) * | 2014-01-29 | 2016-09-28 | 信越半导体株式会社 | Workpiece machining device and workpiece machining method |
| CN106584214A (en) * | 2016-11-09 | 2017-04-26 | 石长海 | Method of single-sided polishing large-size wafer |
| CN106625202A (en) * | 2016-11-02 | 2017-05-10 | 浙江蓝特光学股份有限公司 | Machining method and polishing clamp for wafer |
| CN108081034A (en) * | 2017-12-05 | 2018-05-29 | 江苏师范大学 | A kind of processing method of hexahedron light guide block optical device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106826465A (en) * | 2017-03-31 | 2017-06-13 | 德清阳瑞光学科技有限公司 | It is exclusively used in the Twp-sided polishing machine erratic star wheel of glass cylinder mirror processing |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
| TW383267B (en) * | 1999-03-19 | 2000-03-01 | United Microelectronics Corp | Chemical mechanical polishing method with planetary motion mechanism |
-
2002
- 2002-09-06 CN CNB021328943A patent/CN1315159C/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100392818C (en) * | 2004-12-08 | 2008-06-04 | 中国电子科技集团公司第四十六研究所 | Method for processing chip capable of improving semiconductor chip geometric parameter |
| CN1814407B (en) * | 2005-02-04 | 2011-01-12 | 上海日进机床有限公司 | Method and device for grinding large-size workpiece |
| CN101973076A (en) * | 2010-10-15 | 2011-02-16 | 北京石晶光电科技股份有限公司济源分公司 | Precise technology for correcting cutting angles of quartz crystal wafers in large scale |
| CN101973076B (en) * | 2010-10-15 | 2012-08-15 | 北京石晶光电科技股份有限公司济源分公司 | Precise technology for correcting cutting angles of quartz crystal wafers in large scale |
| CN104551961A (en) * | 2013-10-23 | 2015-04-29 | 有研新材料股份有限公司 | Double-side polishing method of 12-inch silicon wafer |
| CN105980105B (en) * | 2014-01-29 | 2017-12-01 | 信越半导体株式会社 | The processing unit (plant) of workpiece and the processing method of workpiece |
| US10434621B2 (en) | 2014-01-29 | 2019-10-08 | Shin-Etsu Handotai Co., Ltd. | Workpiece processing apparatus and workpiece processing method |
| CN105980105A (en) * | 2014-01-29 | 2016-09-28 | 信越半导体株式会社 | Workpiece machining device and workpiece machining method |
| CN104924196A (en) * | 2014-03-20 | 2015-09-23 | 六晶金属科技（苏州）有限公司 | Method for grinding metal substrate for LED chip scale packaging |
| CN104002227A (en) * | 2014-04-30 | 2014-08-27 | 深圳市大族激光科技股份有限公司 | Method for grinding stainless steel mirror surface |
| CN106625202A (en) * | 2016-11-02 | 2017-05-10 | 浙江蓝特光学股份有限公司 | Machining method and polishing clamp for wafer |
| CN106584214A (en) * | 2016-11-09 | 2017-04-26 | 石长海 | Method of single-sided polishing large-size wafer |
| CN108081034A (en) * | 2017-12-05 | 2018-05-29 | 江苏师范大学 | A kind of processing method of hexahedron light guide block optical device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1315159C (en) | 2007-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1315159C (en) | Technique for precision finishing two side of plane wafer in large size | |
| US5720649A (en) | Optical lens or lap blank surfacing machine, related method and cutting tool for use therewith | |
| CN201446471U (en) | Stone edging machine | |
| US5993295A (en) | Polishing of optical surface of an ophthalmic lens | |
| CN104044087A (en) | Copper disc for sapphire polishing and disc repair method thereof | |
| JP2745725B2 (en) | Electrolytic polishing / grinding method and apparatus | |
| CN110900312B (en) | Precise brush grinding and polishing process | |
| GB2360965A (en) | Grooved notch grinding pin for semiconductor wafers | |
| CN108058066A (en) | A kind of big method for processing surface of laser slab medium | |
| CN109531280B (en) | Blind hole machining process for glass panel | |
| US3353303A (en) | Art of edging | |
| CN108237442A (en) | A kind of processing technology of ultra-thin ceramic fingerprint recognition piece | |
| CN110977747A (en) | Fluid automatic sander | |
| JP2000153453A (en) | Glass substrate polishing method | |
| CN105500184B (en) | Workpiece carrier device and its adjusting method and workpiece milling apparatus | |
| JP2001150356A (en) | Mirror finish grinding wheel for grinder and mirror finish grinding method | |
| CN208231570U (en) | A kind of grinding pad conditioners | |
| CN202114611U (en) | Grinding equipment with a plurality of trimming devices | |
| US4837979A (en) | Polishing device | |
| JPH05285807A (en) | Super precision processing | |
| CN106363502A (en) | Polishing method for chamfering surfaces of ceramic panels and ceramic panels | |
| JPH07100737A (en) | Method for polishing semiconductor wafer | |
| CN211916489U (en) | Polishing driving device of automatic fluid polishing machine | |
| JPH10217076A (en) | Work method of disk substrate, work device and outer peripheral blade grinding wheel used in this work method | |
| CN211760714U (en) | Fluid automatic sander |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070509 Termination date: 20120906 |