CN1457512A - 在网状载体上的热界面材料 - Google Patents
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Abstract
一种热界面,其包括网格框架,该网格框架具有涂覆在其上的导热界面材料。该热界面设置在热源和散热装置之间,其中导热材料优选为在该热源的温度下或在低于该热源的温度下熔化。
Description
技术领域
本发明涉及一种用于从电子装置中排出热量的设备和方法。本发明尤其涉及一种包括网格框架的热界面,该网格框架涂覆有热界面材料,其中被涂覆的网格框架设置在产热源和排热装置之间,产热源例如为微电子电路小片,而排热装置例如放热器或散热片。
背景技术
更高性能的、更低成本的、更小型化的集成电路部件以及集成电路的更大的排列密度是微电子和计算机工业的前进中的目标。当这些目标实现时,微电子电路小片变得更小。因此,在电路小片中的集成电路部件的功耗密度增大了,这又使得微电子电路小片的平均结温增大了。如果微电子电路小片的温度变得过高,微电子电路小片的集成电路可能会被损坏或破坏。
不同的设备和技术已被使用并正被使用,以便从微电子电路小片中排出热量。其中的一种散热技术涉及将散热装置装接到微电子电路小片上。图4示出了组件200,其包括微电子电路小片202(图中为倒装晶片),该电路小片通过多个焊球206物理地且电气地装接到载体基板204上。散热装置208的背面216通过热传导粘接剂或低温焊接部分214装接到微电子电路小片202的背面212上。散热装置可以是如现有技术的热管,或是由热传导材料构造的热导管,热传导材料例如为铜、铜合金、铝、和铝合金等。
然而,当微电子电路小片202工作时其温升到正常的工作温度,而当其不工作时保持室温,由于散热装置208和微电子电路小片202之间的热膨胀系数(“CTE”)不匹配,所以刚性的热传导粘接剂或低温焊接部分214的使用可能导致微电子电路小片202中的应力。由于CTE的不匹配而导致的应力将增大微电子电路小片202中的裂纹产生和扩展的可能性,这会导致微电子电路小片202的故障。此外,为了获得将低温焊接材料粘接到微电子电路小片背面212和散热装置背面216,金涂层将施加到两个表面上,这是非常昂贵的。
在图5所示的另一实施例中,插针格栅阵列式(“PGA”)微电子电路小片222置于安装在载体基板204上的插座224中,其中从PGA微电子电路小片222延伸出的插针226使得与插座224中的导电线228电接触。插座224又与载体基板204电接触(未示出)。散热装置208(在图中为带翅片的散热片,其具有多个翅片232),该散热装置使用弹簧夹234与微电子电路小片222保持接触,该弹簧夹横跨散热装置208并连接到插座224上。导电油脂236置于微电子电路小片202和散热装置208之间。该构形实际上消除了CTE不匹配带来的问题。
另外已知的是,图5中的导电油脂236可由相变材料或基体来代替。当冷却(例如室温)时,这种材料是大致固相的(浆状稠度)。当加热(到工作温度)时,相变材料变为大致的液相(油脂状稠度),以使得相变材料符合配合表面的表面不平度(而处于固相时相变材料不符合所有的翘曲)。因此,液相具有更好的接触特性,与固相相比这导致了更好的散热。这种材料中的一种是ThermflowTM T443,其包括在玻璃纤维载体(底板/底垫)中的相变材料,该载体可从美国的Chomerics,Woburn,MA获得。
然而,当微电子电路小片的尺寸或“覆盖区域”增大时,微电子电路小片和散热装置之间的接触面积将减小,这将减小可用于传导热量的面积。这样,随着微电子电路小片的尺寸的减小,从散热装置的热量散发的效率将降低。此外,当微电子电路小片的功率增大时,热源的温度上限将降低,或者周围温度的限制将升高。这样,必须检验每个热性能区域,以便获得任何可能的强化。一个这种区域是微电子电路小片和散热装置之间的界面。当微电子电路小片变小时,该界面的传热性能成为更大的因素。这样,现在可使用的导热粘合剂、油脂和相变材料通常迅速地成为散热的瓶颈。
因此,开发出用于在热源和散热装置的之间的界面处提高传热效率的技术和设备是有利的。
附图说明
尽管本说明书以特别指明的且清晰要求的本发明的权利要求书来结束,但是参照附图结合阅读本发明的以下描述可更容易地确定本发明的优点,在附图中:
图1是本发明的网格框架的实施形式的斜视图;
图2是本发明的涂覆有焊料材料的网格框架的实施形式的侧截面图;
图3是本发明的具有经涂覆的网格框架热界面的微电子组件的实施形式的侧截面图;
图4是现有技术的装接到微电子电路小片上的散热装置的侧截面图;和
图5是现有技术的夹持到PGA微电子电路小片上的散热装置的侧截面图。
具体实施方式
尽管附图示出了本发明的不同视图,但是这些附图不意味着用于以精确详细的方式来描述微电子组件。这些附图而是以清晰地体现出本发明理念的方式示出了微电子组件。此外,附图之间相同的部件由相同的附图标记来表示。
尽管本发明以微电子电路小片和微电子式的散热装置的形式来描述,但是本发明并不限于此。本发明可用作任何适用的热源和散热机构之间的界面。
图1示出了本发明的网格框架102。网格框架102由导热材料制成,该材料包括铝、铜、镍、和不锈钢等,但不限于这些材料。网格框架102优选为通过提供金属箔并经其设置切口/开孔来制成。该金属箔延伸/展开并被辊压平。然而,应当理解,可使用多个制造技术来制造网格框架102,这对于本领域的普通技术人员是显然的。此外,尽管在网格框架102中的开口104在图中是正方形的,但它们可以是取决于制造技术的任何形状,其包括三角形、矩形、圆形、椭圆形等,但不限于这些形状。
网格框架102随后被涂覆导热界面材料106。图2示出了网格框架102的截面图,该网格框架涂覆有导热界面材料106以形成涂覆过的网格框架108。导热界面材料106具有的熔点温度优选为处于或低于紧靠涂覆过的网格框架108的热源的温度。当然,应当理解,涂层的实际型面和厚度取决于选择的导热界面材料106和网格框架102的开口104的尺寸(见图1)。
图3示出了涉及本发明的一个实施例的微电子部件的组件110。该微电子部件的组件110包括微电子装置插件118,其包括微电子电路小片112,该电路小片装接到插入基板114的第一表面116上并与之电接触。借助于在微电子电路小片112上的触点124和在插入基板第一表面116上的触点126之间延伸的多个小焊球122,以实现该装接和电接触。插入基板第一表面的触点126借助于经插入基板114延伸的多个导电迹线(未示出)与在插入基板114的第二表面136上的触点134不连续地电接触。
微电子装置插件118与载体基板(例如母板)142的电接触借助于多个焊球144来实现,该焊球形成(软熔)在插入基板的第二表面的触点上134。焊球144在插入基板的第二表面的触点134和在载体基板142的第一表面148上的触点146之间延伸,以形成其间的电接触。
支承结构152包括框架154、支持板156、散热板158和多个保持装置(在图中为螺栓162和螺母164)。支持板156设置成邻接载体基板142的第二表面166。框架154设置成邻接载体基板的第一表面148并且至少部分地包围微电子装置插件118。
经涂覆的网格框架108设置在散热板158和微电子电路小片112之间。散热板158在框架154之上延伸。螺栓162经支持板156、框架154和散热板158延伸,并且由其上设有螺纹的螺母164来保持。散热板158由极佳的导热材料制成,该材料包括铝、铝合金、铜和铜合金,但不限于这些材料。散热板158散发出由微电子电路小片112产生的热量。当然,应当理解,例如夹子等的其它保持机构可作为支承结构152来使用。
在本发明的一个实施例中(再参照图2),网格框架102包括铜网,其具有约5密耳的线宽度172以及约1.5密耳的总厚度174。独立的网格(见图1和2)具有约50密耳的间隔176。应当注意,该网应当尽量的薄。
导热界面材料106如此选择,即,以使其在微电子电路小片112的正常工作温度下或在低于该温度下熔化。在本实施例中,导热界面材料是焊料(并且在下文中由附图标记106来表示),该焊料具有约60摄氏度的熔点温度。可能的焊料材料包括:具有约49%的Bi、约21%的In、约18%的Pb、以及约12%的Sn的铅焊料;和具有约51%的In、约32.5%的Bi、以及约16.5%的Sn的无铅焊料,但不限于这些材料。该示例性的铅焊料和无铅焊料均具有约60摄氏度的熔点温度。通过熔化焊料并将网格框架102浸在熔化的焊料106中,以使网格框架102涂覆有焊料106,以便使焊料106完全地涂覆在网格框架102上。当然,应当理解,对于本领域的普通技术人员明显的是,可使用多种技术来将焊料106涂覆在网格框架102上。经涂覆的网格框架108随后置于散热板158和微电子电路小片112之间,其中由支承结构152在其间产生正压力。
当微电子电路小片112通电启动时,其产生热量,以使其温度上升。这样,当微电子电路小片112的温度上升超过焊料106的熔点温度时,焊料106熔化并在微电子电路小片112和散热板158之间以紧密的且低热阻的方式接触,从而与微电子电路小片112和散热板158相配。这强化了从微电子电路小片112到散热板158的热传递。网格框架102机械地防止焊料106从微电子电路小片112与散热板158之间的界面耗散。通常认为,焊料的内聚力使熔化的焊料106保持在网格框架102上,而不是焊料粘接在网格框架上。当熔化的焊料106不浸润微电子电路小片112或不浸润散热板158时,在没有网格框架102的情况下熔化的焊料106趋向于完全地流出微电子电路小片112与散热板158之间的界面。
当微电子电路小片112冷却到焊料106的熔点温度以下时,焊料106凝固。焊料106的熔点温度优选为处于室温或高于室温(即约72摄氏度)。当焊料冷却时,在焊料106与微电子电路小片112之间或在焊料106与散热板158之间形成弱的粘附力。因此,不匹配的CTE(热膨胀系数)导致微电子电路小片112与散热板158的分离,由此消除由CTE不匹配而造成的应力。换言之,凝固后的焊料106与微电子电路小片和/或与散热板158分离。此外,不需要用于微电子电路小片112和/或散热板158的特殊的涂层。
将上述的带有铅焊料涂层(约49%的Bi、约21%的In、约18%的Pb、以及约12%的Sn)的网格框架(即1.5密耳的铜,间距为50密耳)与市场上可获得的ThermflowTM T443相比较,本发明的实施例显示出约0.3℃/W的低热阻,而ThermflowTM T443显示出约0.9℃/W的热阻。因此,本发明的实施例相比于ThermflowTM T443在导热方面具有明显优点。
虽然详细地描述了本发明的实施形式,应当理解,由后附的权利要求限定的本发明不限于以上描述的具体详细形式,在不脱离本发明的精神和范围的情况下可作出不同的变型。
Claims (25)
1.一种热界面,其包括:
网格框架;和
大致涂覆在所述网格框架上的导热焊料材料。
2.如权利要求1所述的热界面,其特征在于,所述网格框架包括导热材料。
3.如权利要求2所述的热界面,其特征在于,所述导热材料从包括铝、铜、镍和不锈钢的一组材料中选择。
4.如权利要求1所述的热界面,其特征在于,所述网格框架包括一平面的导热网,该网具有限定出大致正方形开口的网线。
5.如权利要求4所述的热界面,其特征在于,所述网线包括铜材料的线,其间距为50密耳,并且具有约5密耳的宽度和约1.5密耳的厚度。
6.如权利要求1所述的热界面,其特征在于,所述导热焊料材料包括约49%的Bi、约21%的In、约18%的Pb、以及约12%的Sn。
7.如权利要求1所述的热界面,其特征在于,所述导热焊料材料包括约51%的In、约32.5%的Bi、以及约16.5%的Sn。
8.一种装置组件,其包括:
热源;
散热装置;和
热界面,该热界面设置在所述热源和所述散热装置之间,其包括大致涂覆有导热焊料材料的网格框架。
9.如权利要求8所述的装置组件,其特征在于,所述导热焊料材料在所述热源的温度下或在低于所述热源的温度下熔化。
10.如权利要求8所述的装置组件,其特征在于,所述网格框架包括导热材料。
11.如权利要求10所述的装置组件,其特征在于,所述导热材料从包括铝、铜、镍和不锈钢的一组材料中选择。
12.如权利要求8所述的装置组件,其特征在于,所述网格框架包括一平面的导热网,该网具有限定出大致正方形开口的网线。
13.如权利要求12所述的装置组件,其特征在于,所述网线包括铜材料的线,其间距为50密耳,并且具有约5密耳的宽度和约1.5密耳的厚度。
14.如权利要求8所述的装置组件,其特征在于,所述导热焊料材料包括约49%的Bi、约21%的In、约18%的Pb、以及约12%的Sn。
15.如权利要求8所述的装置组件,其特征在于,所述导热焊料材料包括约51%的In、约32.5%的Bi、以及约16.5%的Sn。
16.一种微电子装置组件,其包括:
微电子电路小片;
散热装置;和
热界面,该热界面设置在所述热源和所述散热装置之间,其包括大致涂覆有导热焊料材料的网格框架。
17.如权利要求16所述的微电子装置组件,其特征在于,所述导热焊料材料在所述微电子电路小片的工作温度下或在低于所述微电子电路小片的工作温度下熔化。
18.如权利要求16所述的微电子装置组件,其特征在于,所述导热界面材料在室温下大致呈固体。
19.如权利要求16所述的装置组件,其特征在于,所述网格框架包括导热材料。
20.如权利要求16所述的微电子装置组件,其特征在于,所述导热材料从包括铝、铜、镍和不锈钢的一组材料中选择。
21.如权利要求16所述的微电子装置组件,其特征在于,所述网格框架包括一平面的导热网,该网具有限定出大致正方形开口的网线。
22.如权利要求21所述的微电子装置组件,其特征在于,所述网线包括铜材料的线,其间距为50密耳,并且具有约5密耳的宽度和约1.5密耳的厚度。
23.如权利要求16所述的微电子装置组件,其特征在于,所述导热焊料材料包括约49%的Bi、约21%的In、约18%的Pb、以及约12%的Sn。
24.如权利要求16所述的微电子装置组件,其特征在于,所述导热焊料材料包括约51%的In、约32.5%的Bi、以及约16.5%的Sn。
25.如权利要求16所述的微电子装置组件,其特征在于,其还包括支承结构,该支承结构包括在该散热装置和该微电子电路小片之间的正压力。
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US09/629,119 | 2000-07-31 | ||
US09/629,119 US6523608B1 (en) | 2000-07-31 | 2000-07-31 | Thermal interface material on a mesh carrier |
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CN1457512A true CN1457512A (zh) | 2003-11-19 |
Family
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US (1) | US6523608B1 (zh) |
EP (1) | EP1305828A2 (zh) |
CN (1) | CN1457512A (zh) |
AU (1) | AU2001277051A1 (zh) |
HK (1) | HK1052798A1 (zh) |
MY (1) | MY117451A (zh) |
WO (1) | WO2002011504A2 (zh) |
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Also Published As
Publication number | Publication date |
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MY117451A (en) | 2004-06-30 |
EP1305828A2 (en) | 2003-05-02 |
WO2002011504A2 (en) | 2002-02-07 |
AU2001277051A1 (en) | 2002-02-13 |
US6523608B1 (en) | 2003-02-25 |
WO2002011504A3 (en) | 2002-07-18 |
HK1052798A1 (zh) | 2003-09-26 |
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