CN1442911A - 薄膜压电元件的制造方法和元件收纳夹具 - Google Patents
薄膜压电元件的制造方法和元件收纳夹具 Download PDFInfo
- Publication number
- CN1442911A CN1442911A CN03119824A CN03119824A CN1442911A CN 1442911 A CN1442911 A CN 1442911A CN 03119824 A CN03119824 A CN 03119824A CN 03119824 A CN03119824 A CN 03119824A CN 1442911 A CN1442911 A CN 1442911A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- piezoelectric element
- membrane piezoelectric
- anchor clamps
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- 239000010409 thin film Substances 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 239000012528 membrane Substances 0.000 claims description 115
- 239000000853 adhesive Substances 0.000 claims description 64
- 230000001070 adhesive effect Effects 0.000 claims description 64
- 230000001052 transient effect Effects 0.000 claims description 62
- 238000013316 zoning Methods 0.000 claims description 29
- 230000007797 corrosion Effects 0.000 claims description 22
- 238000005260 corrosion Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 13
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 52
- 230000015572 biosynthetic process Effects 0.000 description 21
- 239000007788 liquid Substances 0.000 description 14
- 235000014347 soups Nutrition 0.000 description 13
- 239000007767 bonding agent Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 5
- 239000000395 magnesium oxide Substances 0.000 description 5
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000005001 laminate film Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011007 installation qualification Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Moving Of The Head To Find And Align With The Track (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002057234 | 2002-03-04 | ||
JP057234/02 | 2002-03-04 | ||
JP057234/2002 | 2002-03-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1442911A true CN1442911A (zh) | 2003-09-17 |
CN1298060C CN1298060C (zh) | 2007-01-31 |
Family
ID=27800113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031198244A Expired - Fee Related CN1298060C (zh) | 2002-03-04 | 2003-03-04 | 薄膜压电元件的制造方法和元件收纳夹具 |
Country Status (2)
Country | Link |
---|---|
US (1) | US6964086B2 (zh) |
CN (1) | CN1298060C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112677221A (zh) * | 2021-01-29 | 2021-04-20 | 山东太辉包装有限公司 | 一种纸箱加工纸板清废夹持装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003301713A1 (en) * | 2002-10-29 | 2004-05-25 | Matsushita Electric Industrial Co., Ltd. | Switching apparatus, electric field applying method and switching system |
CN100399597C (zh) * | 2002-12-03 | 2008-07-02 | 松下电器产业株式会社 | 薄膜压电体元件和其制造方法以及使用其的驱动器 |
JP2006050592A (ja) * | 2004-07-06 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 圧電共振器及びその製造方法 |
JP2007109758A (ja) * | 2005-10-12 | 2007-04-26 | Mitsubishi Electric Corp | 化合物半導体素子の製造方法 |
CN102906891A (zh) | 2010-05-26 | 2013-01-30 | 日本碍子株式会社 | 压电元件的制造方法 |
KR101109231B1 (ko) * | 2010-07-08 | 2012-01-30 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 진동모터 |
JP7446964B2 (ja) * | 2020-09-29 | 2024-03-11 | 日本発條株式会社 | ディスク装置用サスペンションの製造方法と、製造装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6308405B1 (en) * | 1990-02-07 | 2001-10-30 | Canon Kabushiki Kaisha | Process for preparing an electrode substrate |
DE69123932T2 (de) * | 1990-10-18 | 1997-05-22 | Canon Kk | Herstellungsverfahren eines Tintenstrahldruckkopfes |
US5412865A (en) * | 1991-08-30 | 1995-05-09 | Murata Manufacturing Co., Ltd. | Method of manufacturing multilayer electronic component |
JPH05325274A (ja) | 1992-05-15 | 1993-12-10 | Canon Inc | 圧電変位素子、微小プローブ、及びこれらの製造方法、及びこれらを用いた走査型トンネル顕微鏡並びに情報処理装置 |
JPH06169006A (ja) * | 1992-06-10 | 1994-06-14 | Nec Corp | 半導体基板保持板 |
US5619234A (en) * | 1993-03-15 | 1997-04-08 | Kabushiki Kaisha Toshiba | Ink-jet recording apparatus which allows shifting or changing of ink position or direction |
US5983471A (en) * | 1993-10-14 | 1999-11-16 | Citizen Watch Co., Ltd. | Method of manufacturing an ink-jet head |
DE19500380C2 (de) * | 1994-05-20 | 2001-05-17 | Mitsubishi Electric Corp | Aktivmatrix-Flüssigkristallanzeige und Herstellungsverfahren dafür |
JP4220580B2 (ja) * | 1995-02-10 | 2009-02-04 | 三菱電機株式会社 | 半導体装置の製造装置 |
JP3529554B2 (ja) * | 1996-06-17 | 2004-05-24 | 独立行政法人 科学技術振興機構 | 電子素子の製造方法 |
DE19921230B4 (de) * | 1999-05-07 | 2009-04-02 | Giesecke & Devrient Gmbh | Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten |
JP4078760B2 (ja) * | 1999-07-23 | 2008-04-23 | 株式会社村田製作所 | チップ型電子部品の製造方法 |
JP3441429B2 (ja) | 2000-10-20 | 2003-09-02 | 松下電器産業株式会社 | 圧電体アクチュエータ、その製造方法、および圧電体アクチュエータの駆動方法 |
JP2002001974A (ja) * | 2000-06-26 | 2002-01-08 | Nec Corp | インクジェット式プリンタヘッド構造 |
CN1128470C (zh) * | 2000-09-01 | 2003-11-19 | 陈正明 | 晶片减薄后与载体分离的工艺方法及其装置 |
-
2003
- 2003-02-27 US US10/373,774 patent/US6964086B2/en not_active Expired - Lifetime
- 2003-03-04 CN CNB031198244A patent/CN1298060C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112677221A (zh) * | 2021-01-29 | 2021-04-20 | 山东太辉包装有限公司 | 一种纸箱加工纸板清废夹持装置 |
Also Published As
Publication number | Publication date |
---|---|
US20030173021A1 (en) | 2003-09-18 |
CN1298060C (zh) | 2007-01-31 |
US6964086B2 (en) | 2005-11-15 |
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Owner name: TDK CORP. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20140611 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140611 Address after: Tokyo, Japan, Japan Patentee after: TDK Corp. Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070131 Termination date: 20180304 |