CN1412819A

CN1412819A - Application of metal cover in IC preparation process

Info

Publication number: CN1412819A
Application number: CN 01136478
Authority: CN
Inventors: 林智富
Original assignee: Fanxuan System Science & Technology Co Ltd
Current assignee: Fanxuan System Science & Technology Co Ltd
Priority date: 2001-10-18
Filing date: 2001-10-18
Publication date: 2003-04-23

Abstract

The application of metal shading cover in preparation of IC includes the following steps: selecting a shading cover plate made of metal material, making said shading cover plate undergo the processes of photoresisting and exposure treatment to form a pattern, using dry etching or wet etching process to etch out said pattern on the metal shading cover plate, then placing the shading cover plate on the wafer, and making the wafer undergo the processes of etching, growing membrane and ion implantation until said preparation process is completed, taking out the wafer.

Description

Metal cover is in the application of IC preparation process

Technical field

The invention provides of the application of a kind of metal cover in the IC preparation process, will be in the past employed light shield changed metal cover into, and be applied in the IC preparation process to reach the effect identical with light shield, can reduce light shield number and complicated preparation process and can reduce cost.

Background technology

In the initial preparation process after entire I C finishes design, light shield is a most important ring, and so-called light shield is formula design shelves of design being finished IC internal circuit diagram or figure, converts the MEBS language shelves that can supply light shield equipment to read to.The making apparatus of light shield utilizes laser on the exposure machine or electron beam that IC internal circuit diagram or figure are beaten chromium layer at the quartz glass of light shield again, to show that at this layer IC makes required IC internal circuit diagram or figure, utilize technology such as etching that the circuit diagram part loss of chromium layer is fallen again.So repeat operation, the last every layer of preparation process light shield of IC all exposes until finishing, development, etching finish; To finish etched light shield then and deliver the wafer manufacturing processing, soon IC internal circuit diagram on the light shield or graph transfer printing so produce many IC to wafer.This light shield manufacture and process thereof are extremely numerous to be covered, and on the cost relative increase.

And metal cover of the present invention is positioned on the wafer for to make required figure at metallic plate; So can reduce the cost that uses and reduce the use light shield of light shield, more can reduce the relevant processes that prepare such as removing photoresistance.

In addition, different blocks and level are arranged in wafer, and each block and level all have different preparation process, and these different preparation process integrate will be extremely important.Wherein, the block that these are different and the major part of level need the preparation process and the shade of high-accuracy accuracy, (as integrating silicon wafer (system on chip, SOC) design must place embedded memory body logical circuit etc. the grid oxic horizon of the silica of different blocks, different-thickness; And for example capacitor need be planted in dynamic random access memory (DRAM) deep trench place.But to each block and the level of these different preparation process conditions, can use metal cover and cooperate photoresistance to make a pattern figure, carry out part block shade program with block and level to the preparation process of different condition.

Summary of the invention

Main purpose of the present invention, the number that is to reduce the light shade is to be reduced in the numerous program of covering in the middle of the IC preparation process, and can reach and the previous effect same of using more light shield, in the time of especially in the middle of the preparation process that does not need too high-accuracy accuracy, the metal cover plate is well-adapted.

Secondary objective of the present invention is to reduce the cost in the shade preparation process, and the program of making the part shade is summary also.

Metal cover of the present invention can reduce the reduction that the light shield number also can be dominated future market and cost in the application of IC preparation process.

Description of drawings

Now lift a preferred embodiment, and accompanying drawings is as follows:

Fig. 1 is the metal cover plate of handling through photoresistance, exposure and etching etc.

Fig. 2 places schematic diagram under the metal cover plate for wafer.

Fig. 3 is metal cover plate and the schematic diagram of wafer in preparation process.

The state of Fig. 4 for being presented after the wafer preparation process.

Fig. 5 is another metal cover plate schematic diagram.

Fig. 6 is the block schematic diagram of wafer.

Fig. 7 is positioned at the schematic diagram of metal cover plate below for the block of wafer.

Fig. 8 is metal cover plate and the schematic diagram of wafer in preparation process.Wherein:

10 metal cover plates, 11 figures

20 wafers, 21 blocks

30 metal cover plates, 31 figures

Embodiment

With selecting good metal cover plate 10 behind photoresistance and exposure formation one style figure, utilize dry ecthing or wet etching that figure 11 is eaten (as shown in Figure 1), and wafer 20 is positioned over the intact metal cover plate of etching 10 beneath (as shown in Figure 2).Then, again the two is carried out preparation process (as shown in Figure 3) such as etching, long film and ion implantation, see through the shade effect figure 11 is needed on the wafer 20.After whole process of preparation finishes, wafer 20 is taken out, promptly form the figure 11 (as shown in Figure 4) of metal cover plate 10 on the face of this wafer 20.

The metal cover plate also can use in part shade preparation process, and the part shade is done a shade program for the block on the wafer 20 21.

, to shown in Figure 8 wafer 20 is put to metal cover plate 30 belows as Fig. 5.Wherein, this mask plate also is earlier through photoresistance, exposure and etch processes, so also present another figure 31 on the face of this mask plate; Then wafer 20 and metal cover plate 30 are carried out part shade preparation process, preparation process such as then etching, long film and ion implantation will act on a certain block 21 of wafer 20 through metal cover plate 30, after preparation process finishes, wafer 20 are shifted out.In like manner, if when having remaining metal cover plate to make the part shade to all the other blocks on the wafer 20, as long as heavily cover once same preparation process again, this shows that the metal cover plate can satisfy the demand of finishing different part shade preparation process under different blocks.

Claims

1. a metal cover is in the application of IC preparation process, and it comprises: the mask plate that will select with after forming the one style figure, utilizes etching that figure is eaten through pre-treatments such as photoresistance, exposures again; With wafer be positioned over mask plate after etching is finished under, get started preparation process such as etching, long film and ion implantation, finish wafer is taken out up to preparation process.

2. metal cover as claimed in claim 1 is characterized in that in the application of IC preparation process the material of this mask plate is a metal material.

3. metal cover as claimed in claim 1 is characterized in that in the application of IC preparation process, utilizes dry ecthing that the figure on the mask plate is eaten.

4. metal cover as claimed in claim 1 is characterized in that in the application of IC preparation process, utilizes wet etching that the figure on the mask plate is eaten.

5. metal cover as claimed in claim 1 is characterized in that in the application of IC preparation process, in whole shade preparation process, no longer needs to see through light shield, reaches the manufacturing of IC.

6. metal cover as claimed in claim 2 is characterized in that in the application of IC preparation process, and this metal cover can use in high-accuracy, high accuracy shade preparation process, also can use in not needing high-accuracy, high accuracy shade preparation process simultaneously.