CN1399140A - BGA tester on circuit board - Google Patents
BGA tester on circuit board Download PDFInfo
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- CN1399140A CN1399140A CN 01124709 CN01124709A CN1399140A CN 1399140 A CN1399140 A CN 1399140A CN 01124709 CN01124709 CN 01124709 CN 01124709 A CN01124709 A CN 01124709A CN 1399140 A CN1399140 A CN 1399140A
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Abstract
A test device for integrated circuit chip installed on the circuit board includes: one upper assembly; one lower assembly; and several guide pins extending from the upper surface of the lower assembly. The circuit board is aligned along the guide pins and installed on the lower assembly and the upper assembly is aligned along the guide pins so that the circuit board is installed between the two assembleis. A rotable shaft is set and penetrated through the upper assembly to connect the two assemblies together. A rotable knob located in the upper assembly makes the lower assembly move towards the circuit board by its rotation so as to connect the IC chip and test pins in the lower assembly. The test device may be easily installed in the circuit board to result in accurate test result.
Description
The application's relevant documents
The application requires the provisional application No.60/203 of submission on May 12nd, 2000,664 right of priority.
Invention field
The present invention relates to the BGA exerciser on the test unit, particularly circuit board of integrated circuit (IC) chip such as bead grid battle array chip (BGA, ball gridarray).Exerciser (hereinafter referred to as " test unit ") comprises assembly and following assembly, and assembly and following assembly connect each other by the circuit board that is installed between assembly and the following assembly on this.This circuit board comprises wants underproof bga chip, and the electric connection between test unit and the bga chip is achieved by rotational motion, and this rotational motion makes that the detection test pin of assembly is resisted against on the bga chip linearly down.
Background of invention
The test of integrated circuit such as bead grid battle array chip (BGA) is passed through to adopt the test unit realization of ripe title in the art.The BGA test unit generally includes a cover that is installed on the load circuit plate, and this load circuit plate and test electron equipment have interface.The load circuit plate normally the integrated circuit from BGA to the circuit board of test electron device transmission test signal.
The method in the past that test unit is installed on the load circuit plate comprises through hole technology and surface mounting technique.In mounted on surface connected, test unit comprised test pad, and along with BGA is resisted against on the test pad with to load circuit plate transmission test signal, test pad contacts with the bead of BGA bottom surface.With the problem of mounted on surface test unit structurally associated be, the height of the bead of BGA bottom surface may be different, and the good electric connection between each bead and the test pad can not be guaranteed all the time.Second problem relevant with mounted on surface is that in case test pad is subjected to the pollution of bead, the whole test device just must be changed.
The through hole technology that test unit is installed on the load circuit plate is included in the through hole that gets out on the load circuit plate, so that pass, and with the contacting of hole in the load circuit plate test signal is transmitted to the load circuit plate by the test pin with the contacted spring-loaded contact pin of bead on the BGA.The problem relevant with through hole engineering test apparatus structure be, it is crooked easily or damage to pass the upwardly extending test pin of load circuit plate, and this may have a negative impact to test findings.In order to prevent this problem, between test unit and load circuit plate, a sleeve can be set, pass the test pin that the load circuit plate extends with protection.The result who introduces sleeve is the length that needs to increase the test pin in the test unit, and this test to high speed integrated circuit has produced problem again.In order to pay attention to this problem, introduced spring probe, yet lack, and needs constantly to change the life-span with spring probe of short stroke with short stroke.In addition, in test unit, adopt spring probe to from BGA to the load circuit plate transmission test signal problem that also may have a resistance.
Therefore, need a kind of test unit of new BGA assembly, it can reduce the problem in the test unit of prior art.Particularly, need a kind of new test unit, it can easily be installed on the circuit board, and produces result accurately.
Summary of the invention
The present invention relates to be used for to the integrated circuit (IC) chip exerciser (hereinafter referred to as " test unit ") on the circuit board tested of bead grid battle array (BGA) chip particularly.Test unit of the present invention has been eliminated the relevant issues of the test unit of many prior aries, particularly, and in the problem and the uncertain problem of test findings that chip are installed in the shortage control in the test unit process.
Test unit of the present invention comprises assembly and following assembly.Comprise and want the circuit board of underproof bga chip to be installed between assembly and the following assembly.Following assembly has pilot pin, and this pilot pin assembly that makes progress extends, and like this, any circuit board with the mating holes that mates mutually with the shape of pilot pin can be installed in down on the assembly.Compare with many existing test units, test unit of the present invention has versatility, and existing test unit has " clam shell " formula close mechanism, only is used for the circuit board that has identical dimensional characteristic with the test unit that will be used to test.In addition, test unit of the present invention has unique close mechanism, adopts rotational motion to make test unit be in inserting state and released state.Particularly, adopted chuck component, the rotation by an axle makes in the assembly other plate draw over to one's side together, and like this, last assembly and following assembly can correctly be fixed together.
Test unit of the present invention has also improved the test accuracy, and method is by rotational motion the test pin of test unit to be fixed on the bga chip.Test unit of the present invention has can turn round button, and by turning round the rotation of button, last assembly and following assembly are drawn over to one's side linearly to together, have effective electric connection until several detection test pins and bga chip.The problem of previous methods has been eliminated in this in check contraction, and in method in the past, the test pin is tending towards being damaged, and has Unpredictability with contacting of pin of test, has therefore produced insecure result.
To brief description of drawings
Fig. 1 is the partial cross-sectional side view according to test unit of the present invention;
Fig. 2 a and 2b are the partial cross-sectional side view of test unit as shown in Figure 1, show non-activation point of assembling and assembling activation point respectively;
Fig. 3 is the decomposition diagram of assembly on the part of test unit as shown in Figure 1;
Fig. 4 is the whole decomposition diagram of going up assembly of test unit as shown in Figure 1; With
Fig. 5 is the following assembly of test unit as shown in Figure 1 and the decomposition diagram of the last assembly under the assembled state.
Describe in detail
Test unit 10 of the present invention is used for the integrated circuit (IC) chip that is installed on the circuit board 50 is tested.In the embodiment of a recommendation, test unit 10 is used for the bead grid battle array chip (BGA, ball grid array) 51 that is installed on the circuit board 50 is tested.Yet test unit 10 equally also can be used for other integrated circuit (IC) chip is tested.For the sake of clarity, this detailed description only limits to be installed in the bga chip 51 on the circuit board 50.
Fig. 1,2a, 2b show the test unit 10 in bga chip 51 processs of the test on the whole.Test unit 10 comprises assembly 8 and following assembly 9.When bga chip 51 was tested, circuit board 50 was placed between assembly 8 and the following assembly 9.Following assembly 9 has several upwardly extending pilot pins 14, has by the circuit board 50 in hole to place along pilot pin 14, is seated in down on the assembly until circuit board 50.Particularly, be provided with 4 pilot pins 14 by square pattern.Pilot pin 14 passes circuit board 50 and extends, and last assembly 8 is along pilot pin 14 alignment, and pilot pin 14 passes the hole of assembly, is seated on the circuit board 50 until last assembly.Last assembly 8 is connected by the chuck component 16 that is arranged in the assembly with following assembly 9.Chuck component 16 is used for last assembly 8 and following assembly 9 compressed together, or the last assembly 8 and the following assembly 9 that are connected are separated from each other.When last assembly 8 was connected with following assembly 9, test unit 10 was called as " inserting state ", and when last assembly 8 was separated with following assembly 9, test unit 10 was called as " released state ".
But chuck component 16 comprises upper grip plate 16a, several chucks 16b, lower chuck plate 16c and revolving shaft 16d.The upper grip plate is positioned at the vertical top of lower chuck plate 16c, and upper grip plate and lower chuck plate have several holes, but chuck 16b and revolving shaft 16d are inserted in these holes.Chuck 16b is arranged between upper grip plate 16a and the lower chuck plate 16c on the whole.But revolving shaft 16d vertically is passed in the hole of upper grip plate and lower chuck plate, but part revolving shaft 16 extends to upper grip plate 16a top, contacts with the lower chuck plate simultaneously.When but chuck 16b and revolving shaft 16d were inserted in upper grip plate and the lower chuck plate, upper grip plate 16a and lower chuck plate 16c along continuous straight runs roughly were parallel to each other, but and chuck 16b and revolving shaft 16d vertically roughly are parallel to each other.
Can guide lower chuck plate 16c into upper grip plate 16a but clockwise direction is rotated revolving shaft 16d, thus chuck 16b be pressed to pilot pin 14, thereby between upper grip plate and lower chuck plate, form firm connection.Under this location status, test unit is called as inserting state.Rotation counterclockwise can make chuck component 16 lax, makes chuck 16b be in the top of pilot pin 14 thus, makes test unit recover released state.
In order to test bga chip 51, need the effective electric connection between the detection test pin 60 of bga chip 51 and following assembly 9.But can turn round button 17 be arranged on the whole revolving shaft 16d around, and be positioned at the top of upper grip plate 16a, clockwise direction is rotated and can be turned round button 17 and can upwards guide assembly down into assembly, thereby produces the electric connection of necessity.After the test of bga chip 51 was finished, circuit board 50 was removed from test unit 10, and the operation of employing is same as above, and just sequence of operation is opposite.
As shown in Figure 5, the major part of last assembly 8 is accommodated in the modular framework 7, and this framework 7 comprises top board 21, header board 30, back plate 29, two side plates 28 and base plates 34.Side plate 28, header board 30 and back plate 29 are connected by several pins 31.In the embodiment of a recommendation, each plate of the framework 7 of composition moduleization is stable by aluminium or other virtually any size, big, the machinable material of intensity is made.
As shown in Figure 3, flanged pilot pin 18 passes top board 21, is installed on this top board by several threaded fasteners 22.When but revolving shaft passes the hole at flanged pilot pin center, but flanged pilot pin 18 is used for the linear bearing of revolving shaft 16d.In addition, flanged pilot pin 18 has external thread, can turn round button 17 and be screwed onto on this external thread.Particularly, flanged pilot pin 18 is made by phosphor-copper, but also can adopt any other to be suitable for the material of this purpose.
But revolving shaft 16d passes packing ring 19, can turn round button 17, packing ring 20, the central recess of flanged pilot pin 18 and the hole of the accurate setting in the upper grip plate 16a.But revolving shaft can be made by any suitable material, and this material is corrosion-resistant, gauling etc., is stainless steel as sclerosis.But upper grip plate 16a is fastened on the revolving shaft 16d by several snap ring fasteners 23.In addition, between upper grip plate 16a and snap ring fastener 23, be provided with several packing rings 24.Particularly, packing ring 19,24 is made by black delrin, but also can adopt any suitable low-friction material.
Particularly, the upper grip plate 16a of last assembly 8 has 7 accurately holes of location, but these holes are suitable for holding 4 chuck 16b, 2 pins 25 and revolving shaft 16d.2 pins 25 are pressed into upper grip plate 16a, pass flanged pilot pin 18 and top board 21, and are resisted against the root that can turn round button 17.Such structure is connected in chuck component 16 and can turns round on the button 17, moves with respect to the upright position direct proportion that can turn round button 17 thereby cause chuck component 16, and this can turn round button 17 and be screwed onto on flanged pilot pin 18.
As shown in Figure 4, lower chuck plate 16c also has 7 accurately holes of location, but these holes are suitable for holding 4 chuck 16b, 2 drill bushings 26 and revolving shaft 16d.But the threaded portion of revolving shaft 16d is contained in the screw of lower chuck plate 16c by screw thread.But clockwise direction is rotated revolving shaft 16d lower chuck plate 16c is moved up, guide upper grip plate 16a into, cause chuck 16b to be compressed between upper grip plate 16a and the lower chuck plate 16c, thereby make test unit 10 be in " inserting state ".As mentioned above, will make chuck component 16 lax, and make test unit 10 be in " released state " thus but counterclockwise rotate revolving shaft 16d.
About following assembly 9, have been noted that the location of circuit board 50 on following assembly 9 is by finishing circuit board 50 along pilot pin 14 settings.Circuit board 50 has mating holes, and these mating holes and pilot pin 14 mate mutually.In the embodiment of a recommendation, circuit board 50 is manufactured to go out 4 mating holes, and assembly 9 has 4 pilot pins down.Yet, should be noted that and down can adopt any amount of pilot pin 14 (for example 3 pilot pins) in the assembly, as long as the manufactured mating holes that goes out number of matches of circuit board 50.
As shown in Figure 5, detecting plate 11 is assemblies of the top of following assembly 9.Detecting plate 11 can face circuit board 50 the surface, this surface is regarded as end face, and an other side is regarded as the bottom surface.Detecting plate 11 has counterbore, and in this hole, pilot pin 14 extends up through the bottom surface of detecting plate, and like this, the head of pilot pin 14 is concordant with this bottom surface.Pilot pin 14 extends through the end face of detecting plate 11, thereby makes the mating holes of circuit board 50 be arranged on the top of pilot pin.Detecting plate 11 also has the array of accurate boring, in this array of accurately holing several detection test pins 60 is installed.
Each detection test pin 60 comprises cylindrical body and a pair of inserted link, and a spring has been installed in the inside of cylindrical body, and inserted link partly places the inside of each end of body, and this inserted link extends out from each end of body.The inserted link of each end of body of detection test pin 60 is compressing spring by this way, makes detection test pin 60 be considered to " spring loading ".When detection test pin 60 detecting plate 11 be pressed into one desirable apart from the time, the inserted link of each detection test pin 60 all extends the end face and the bottom surface of detecting plate 11.Extend the inserted link of end face and contact, and the inserted link of an other end of detection test pin 60 contacts with analyzing card 13 with bga chip 51 on being installed in circuit board 50.Analyzing card 13 is connected with suitable monitoring equipment (not shown), and this monitoring equipment demonstrates test findings.
Below next-door neighbour's detecting plate 11, space bar 12 is installed, like this, the bottom surface of the upper surface of space bar 12 next-door neighbour detecting plate 11.Space bar 12 has a window 12a who mills out on this space bar 12, the analyzing card 13 of next-door neighbour's space bar 12 belows is come out.Particularly, analyzing card 13 has several gold and refers to 13a, and this gold refers to that 13a is the part of analyzing card, and this analyzing card contacts with detection test pin 60, is used to receive the signal by the transmission of detection test pin.Space bar 12 can guarantee that the suitable distance between detecting plate 11 and the analyzing card 13 is maintained.Detecting plate 11, space bar 12 and analyzing card 13 are connected with packing ring 35 by several screws 36.In case detecting plate, space bar and analyzing card are connected, detection test pin 60 and gold refer to that 13a contacts, and can transmit the signal from bga chip 51.
Novel feature of the present invention relates to the locator meams and the method for the bga chip of testing 51 in test unit 10.Because circuit board 50 and following assembly 9 reach the connected mode that goes up assembly 8, and the in check contact that produces between detection test pin 60 and bga chip 51, test unit 10 provides more reliability and accuracy.In addition, because compact dimensions and in light weight is compared with traditional test unit, test unit 10 shows higher efficient and dirigibility.
Adopting pilot pin 14 that circuit board 50 is installed in down makes test unit 10 can be used for any circuit board that has corresponding to the mating holes of pilot pin 14 on the assembly 9.The method of this test bga chip 51 has been eliminated many problems of traditional test unit of employing " clam shell " formula close mechanism.The aligning of circuit board 50 and test unit 10 is accurate and consistent.Clam shell " the formula close mechanism only is used for having with test unit the circuit board of identical dimensional characteristic, with this clam shell " the formula close mechanism is different, test unit 10 of the present invention can be used for the circuit board of virtually any size.In addition, test unit 10 adopts rotational motion that circuit board 50 is connected with following assembly 9, and this mode can not tested pin 60 by damage detection, and can guarantee exactly bga chip 51 to be tested.
Required contact makes to rotate by employing and is changed to straight-line unique design and realizes between bga chip 51 and the detection test pin 60.Last assembly and following assembly are in " inserting state " and " released state " by chuck component 16, but adopt turning handle upper grip plate and the lower chuck plate of revolving shaft 16d compressed together, and this causes chuck 16b to be pressed into pilot pin 14.Last assembly 8 and following assembly 9 are furthered mutually, produce contact by the rotation that can turn round button 17 between detection test pin 60 and bga chip 51.Most of traditional test units are realized linear movement by cam, vacuum or air pressure.Yet, adopt to rotate and realize that linear mode has many advantages, comprise having improved mechanical advantage (moment), have, can guarantee effective electric connection because compression is subjected to being controlled at accurately between test unit 10 and the bga chip 51 than traditional test unit part still less.
Describe the present invention and explain by preferred embodiment; however, should be appreciated that the present invention is not limited thereto; and can in protection scope of the present invention, change and revise, protection scope of the present invention is limited by appended claims.
Claims (15)
1. test unit that the integrated circuit (IC) chip that is installed on the circuit board is tested, it comprises:
Assembly on one;
Assembly once;
Several pilot pins, it is from the upper surface extension of assembly down, and wherein, circuit board is aimed at along pilot pin, and so that circuit board is installed in down on the assembly, last assembly is aimed at along pilot pin, and like this, circuit board is installed between assembly and the following assembly;
But a revolving shaft penetrates the assembly setting, when circuit board is installed between assembly and the following assembly, but should last assembly and following assembly be linked together revolving shaft;
One can turn round button, and it is positioned in the assembly, and when it rotated, this can turn round button and along rectilinear direction following assembly be moved to circuit board, to produce electric connection between the test pin that is positioned at assembly down at integrated circuit (IC) chip and several.
2. test unit as claimed in claim 1, wherein, last assembly comprises:
One chuck component, but it has upper grip plate, several chuck and revolving shaftes between upper grip plate and lower chuck plate in the vertical direction of lower chuck plate, but revolving shaft passes upper grip plate and the setting of lower chuck plate;
But can turn round button round revolving shaft, and be positioned at the top of upper grip plate; With
Flanged pilot pin, it has external thread and hole, wherein, can turn round button and be screwed onto on the external thread of flanged pilot pin, but revolving shaft passes the hole of flanged pilot pin.
3. test unit as claimed in claim 2, wherein, following assembly comprises:
One detecting plate, it has counterbore, and wherein, pilot pin extends up through the bottom surface of detecting plate, and extends through the end face of detecting plate;
Several pilot pins are installed the through hole that passes in the detecting plate, and wherein, each test needle set has the cylindrical body bar, and a spring has been installed in the inside of cylindrical body, and inserted link is arranged on each end of body; Inserted link extends the end face and the bottom surface of detecting plate; With
One analyzing card, it is arranged on the below of detecting plate, and wherein, analyzing card contacts with the test pin.
4. test unit as claimed in claim 1 wherein, has 4 pilot pins.
5. method of in test unit integrated circuit (IC) chip being tested, it comprises the following steps:
Make the circuit board that comprises integrated circuit (IC) chip aim at several pilot pins, this pilot pin extends from the upper surface of the following assembly of test unit;
Make the last assembly alignment pilot pin of test unit, like this, circuit board is installed between assembly and the following assembly;
Rotation is arranged on the axle in the assembly, and assembly is resisted against on the pilot pin;
Rotation is arranged on the button in the assembly, and the assembly linearity is moved up, and like this, is arranged on down several test pin and integrated circuit (IC) chip electric connections in the assembly; With
From testing pin to outside monitoring equipment transmission test signal.
6. method as claimed in claim 5, wherein, last assembly comprises a chuck component, but it has upper grip plate, several chuck and revolving shaftes between upper grip plate and lower chuck plate in the vertical direction of lower chuck plate, but revolving shaft passes upper grip plate and the setting of lower chuck plate.
7. method as claimed in claim 6 wherein, is rotated the axle that is arranged in the assembly, and chuck is resisted against on the pilot pin.
8. method as claimed in claim 6, wherein, the button that is arranged in the assembly is screwed onto on flanged pilot pin, and flanged pilot pin makes described axle pass the center of flanged pilot pin.
9. method as claimed in claim 6, wherein, following assembly comprises:
One detecting plate, it has counterbore, and wherein, pilot pin extends up through the bottom surface of detecting plate, and extends through the end face of detecting plate;
Several pilot pins are installed the through hole that passes in the detecting plate, and wherein, each test needle set has the cylindrical body bar, and a spring has been installed in the inside of cylindrical body, and inserted link is arranged on each end of body; Inserted link extends the end face and the bottom surface of detecting plate; With
One analyzing card, it is arranged on the below of detecting plate, and wherein, analyzing card contacts with the test pin.
10. method as claimed in claim 6, wherein, test signal transfers to external monitoring equipment by the analyzing card in the following assembly, and analyzing card contacts with the test pin and receives from the next signal of test pin transmission.
11. the test unit that the integrated circuit (IC) chip that is installed on the circuit board is tested, this test unit have last assembly and following assembly, this test unit comprises:
Circuit board is positioned at parts between assembly and the following assembly;
In the last assembly rotational motion is converted to linearly moving parts, it connects goes up assembly and following assembly, and circuit board is positioned between assembly and the following assembly;
On the last assembly rotational motion is converted to linearly moving parts, it makes between several test pins that are positioned at down assembly and the integrated circuit (IC) chip and produces electric connection.
12. test unit as claimed in claim 11, wherein, the parts that circuit board is positioned between assembly and the following assembly comprise several pilot pins, and this pilot pin is from the upper surface extension of assembly down; , circuit board is aimed at along pilot pin, is installed in down on the assembly with circuit board, and last assembly is aimed at along pilot pin.
13. test unit as claimed in claim 12, wherein,
Last assembly comprises:
One chuck component, but it has upper grip plate, several chuck and revolving shaftes between upper grip plate and lower chuck plate in the vertical direction of lower chuck plate, but revolving shaft passes upper grip plate and the setting of lower chuck plate;
Can turn round button, but it is round revolving shaft, and is positioned at the top of upper grip plate; With
Flanged pilot pin, it has external thread and hole, wherein, can turn round button and be screwed onto on the external thread of flanged pilot pin, but revolving shaft passes the through hole of flanged pilot pin; With
Following assembly comprises:
One detecting plate, it has counterbore, and wherein, pilot pin extends up through the bottom surface of detecting plate, and extends through the end face of detecting plate;
Several pilot pins are installed the through hole that passes in the detecting plate, and wherein, each test needle set has the cylindrical body bar, and a spring has been installed in the inside of cylindrical body, and inserted link is arranged on each end of body; Inserted link extends the end face and the bottom surface of detecting plate; With
One analyzing card, it is arranged on the below of detecting plate, and wherein, analyzing card contacts with the test pin.
14. test unit as claimed in claim 13, wherein, in the last assembly rotational motion being converted to linearly moving parts is axles, and when this axle rotated, this upwards pulled to the upper grip plate to the lower chuck plate, and chuck is resisted against on the pilot pin.
15. test unit as claimed in claim 13, wherein, on the last assembly rotational motion being converted to linearly moving parts is buttons, when this button rotates, this button handle assembly down upwards pulls to linearly at last assembly, to produce electric connection between test pin and integrated circuit (IC) chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011247096A CN100376896C (en) | 2001-07-26 | 2001-07-26 | BGA tester on circuit board |
| HK03104127A HK1051896A1 (en) | 2001-07-26 | 2003-06-11 | BGA on-board tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011247096A CN100376896C (en) | 2001-07-26 | 2001-07-26 | BGA tester on circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1399140A true CN1399140A (en) | 2003-02-26 |
| CN100376896C CN100376896C (en) | 2008-03-26 |
Family
ID=4665791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011247096A Expired - Fee Related CN100376896C (en) | 2001-07-26 | 2001-07-26 | BGA tester on circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100376896C (en) |
| HK (1) | HK1051896A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1979194B (en) * | 2005-12-05 | 2010-05-19 | 费恩金属有限公司 | Electrical test apparatus for testing an electrical test piece and corresponding method |
| CN101221191B (en) * | 2007-01-12 | 2012-07-25 | 深圳富泰宏精密工业有限公司 | Porous workpiece checking device |
| CN103207361A (en) * | 2012-01-11 | 2013-07-17 | 海洋王（东莞）照明科技有限公司 | Light-emitting diode (LED) testing device |
| CN103579890A (en) * | 2012-07-18 | 2014-02-12 | 纬创资通股份有限公司 | Automatic aligning device |
| CN106980083A (en) * | 2017-05-17 | 2017-07-25 | 重庆艾申特电子科技有限公司 | A kind of circuit board resistance detection fixture |
| CN114137315A (en) * | 2021-11-25 | 2022-03-04 | 苏州无双医疗设备有限公司 | Contact resistance test device and use method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4683423A (en) * | 1985-10-30 | 1987-07-28 | Precision Monolithics, Inc. | Leadless chip test socket |
| US5127837A (en) * | 1989-06-09 | 1992-07-07 | Labinal Components And Systems, Inc. | Electrical connectors and IC chip tester embodying same |
| US5397245A (en) * | 1993-10-29 | 1995-03-14 | Texas Instruments Incorporated | Non-destructive interconnect system for semiconductor devices |
| US6104203A (en) * | 1995-05-16 | 2000-08-15 | Trio-Tech International | Test apparatus for electronic components |
| US5741141A (en) * | 1995-12-11 | 1998-04-21 | Texas Instruments Incorporated | Non-destructive interconnect system for semiconductor devices and a carrier assembly for use therewith |
| US6084421A (en) * | 1997-04-15 | 2000-07-04 | Delaware Capital Formation, Inc. | Test socket |
| US6064214A (en) * | 1997-12-19 | 2000-05-16 | Hewlett-Packard Company | Perimeter trace probe for plastic ball grid arrays |
-
2001
- 2001-07-26 CN CNB011247096A patent/CN100376896C/en not_active Expired - Fee Related
-
2003
- 2003-06-11 HK HK03104127A patent/HK1051896A1/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1979194B (en) * | 2005-12-05 | 2010-05-19 | 费恩金属有限公司 | Electrical test apparatus for testing an electrical test piece and corresponding method |
| CN101221191B (en) * | 2007-01-12 | 2012-07-25 | 深圳富泰宏精密工业有限公司 | Porous workpiece checking device |
| CN103207361A (en) * | 2012-01-11 | 2013-07-17 | 海洋王（东莞）照明科技有限公司 | Light-emitting diode (LED) testing device |
| CN103579890A (en) * | 2012-07-18 | 2014-02-12 | 纬创资通股份有限公司 | Automatic aligning device |
| CN103579890B (en) * | 2012-07-18 | 2015-09-23 | 纬创资通股份有限公司 | Automatic contraposition device |
| CN106980083A (en) * | 2017-05-17 | 2017-07-25 | 重庆艾申特电子科技有限公司 | A kind of circuit board resistance detection fixture |
| CN114137315A (en) * | 2021-11-25 | 2022-03-04 | 苏州无双医疗设备有限公司 | Contact resistance test device and use method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1051896A1 (en) | 2003-08-22 |
| CN100376896C (en) | 2008-03-26 |
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