CN220399496U - Universal test probe seat for semiconductor integrated circuit - Google Patents

Abstract

The utility model discloses a universal test probe seat for a semiconductor integrated circuit, which is characterized by comprising a test frame (1), supporting legs (9), a test clamping plate (2), a needle type test guiding device and two driving rods (6) symmetrically arranged at two ends of the test frame (1). According to the utility model, through the plurality of telescopic needle type test guiding devices, under the condition that manual extraction and extra flying leads are not needed, the multi-SITE synchronous analysis of the semiconductor integrated circuit which can be extracted normally and cannot be extracted normally can be realized, the secondary damage possibly introduced in the sample analysis process of the semiconductor integrated circuit is reduced, the destructive analysis of the semiconductor integrated circuit is more lossless and controllable, the imaging observation of the later analysis result of the semiconductor integrated circuit is ensured, and the problem that the secondary damage of the semiconductor integrated circuit is easy to cause in the conventional semiconductor integrated circuit test seat is well solved.

Description

Universal test probe seat for semiconductor integrated circuit

Technical Field

The utility model relates to the technical field of development of semiconductor integrated circuit test equipment, in particular to a universal test probe seat for a semiconductor integrated circuit.

Background

In the prior art, when the destructive failure analysis is performed on the semiconductor integrated circuit, the decapsulation treatment is performed on the surface of the device package, meanwhile, the voltage is applied to test after the device leading-out terminal flies, along with the rapid development of the current packaging technology and the wide application of high polymer materials, the semiconductor integrated circuit realizes great breakthrough in scale and packaging form, wherein the advanced packaging such as BGA, CSP, WLCSP is taken as the main direction.

To ensure accurate positioning of the failed region of the semiconductor integrated circuit during analysis, a series of analyses, i.e., destructive analyses, such as optical, electrical, or thermal, are performed after unsealing the failed device by the test socket. Most of the failure devices adopting the packaging technology such as BGA, CSP, WLCSP cannot be led out conventionally, and when part of ports of the failure devices are analyzed, flying leads are required to be added to complete the test, but secondary damage is easily caused to the failure devices when the flying leads are led out and connected, and the phenomenon that the interface is inclined after the failure devices are led out is unfavorable for later analysis, imaging and observation and the like can directly influence later destructive analysis results.

Therefore, since some advanced packaged semiconductor integrated circuits cannot be conventionally led out and there is a problem that secondary damage is easy to occur in the analysis process after the flying lead is led out, the failure analysis requirement of the advanced packaged semiconductor integrated circuits cannot be met, and a universal test probe seat capable of realizing effective analysis and test on the advanced packaged semiconductor integrated circuits and not damaging the device led out is required to be developed so as to meet the analysis requirement of the semiconductor integrated circuits.

Disclosure of Invention

The utility model aims to solve the problems in the destructive failure analysis process of the traditional semiconductor integrated circuit and provides a universal test probe seat for the semiconductor integrated circuit, which can realize effective analysis and test on an advanced packaged semiconductor integrated circuit and can not damage a device leading-out end.

The universal test probe seat for semiconductor integrated circuit includes test frame, four supporting legs set homogeneously on the test frame for supporting the test frame, two test clamping boards set movably on the test frame, several telescopic needle type test guide units distributed homogeneously on the test frame and below the test clamping boards, and two driving rods set symmetrically on two ends of the test frame; the plurality of needle type test guiding devices are oppositely arranged; the two driving rods are respectively connected with the test rack through threads; one of the two test clamping plates is movably connected with one of the two driving rods through a bearing seat, the other test clamping plate is movably connected with the other driving rod through the bearing seat, the driving rod is connected with a shaft core sleeve of the bearing seat and then extends into the test clamping plate, and the driving rod can rotate 360 degrees in the test clamping plate; the two test clamping plates together form a clamping table, and the test clamping plates can horizontally reciprocate under the drive of the driving rod.

As a preferable scheme of the utility model, the inner side surfaces of the two cross arms of the test rack are respectively provided with a chute, and the test clamping plate is arranged in the chute and can horizontally slide along the chute; the outer side surfaces of the two cross arms of the test frame are respectively provided with more than one external connecting hole, the upper arm surfaces of the two cross arms of the test frame are respectively provided with more than one rod sleeve mounting hole communicated with the external connecting holes, each external connecting hole and each rod sleeve mounting hole are internally provided with an insulating sleeve, and the inner sleeve arm of each insulating sleeve is provided with threads; the needle type test guiding device is arranged in the rod sleeve mounting hole and extends into the external hole; the two ends of the test frame are respectively provided with a threaded hole, and the driving rod is horizontally arranged in the threaded holes and is in threaded connection with the threaded holes; the number of the external holes and the rod sleeve mounting holes is the same as that of the needle type test guiding devices.

As a preferable scheme of the utility model, two adjacent ends of the two test clamping plates are respectively provided with a bearing table, and a placing cavity is formed between the two bearing tables; a sliding arm is arranged at the connecting end of the test clamping plate and the sliding groove, and the sliding arm is in sliding connection with the sliding groove; the bottom of the test clamping plate is provided with a cavity; the test clamping plate is horizontally provided with a through hole at one end far away from the bearing table, the through hole is communicated with the cavity, the bearing seat is arranged at the through hole of the test clamping plate, the inner shaft hole of the bearing seat is communicated with the through hole, and the driving rod penetrates through the through hole and stretches into the cavity; the bottom of the test clamping plate is also provided with a cover plate for sealing the cavity.

As a preferable scheme of the utility model, the driving rod consists of a clamping plate driving screw, a limiting driving screw and a shaft arm arranged between the clamping plate driving screw and the limiting driving screw; the clamping plate driving screw rod penetrates through the threaded hole and is in threaded connection with the threaded hole, the shaft arm is connected with the bearing seat, the limiting driving screw rod is located in the cavity of the testing clamping plate, a limiting block in threaded connection with the limiting driving screw rod is arranged on the limiting driving screw rod, and the limiting block can horizontally move in the cavity under the driving of the limiting driving screw rod.

As a preferable scheme of the utility model, one end of the clamping plate driving screw rod, which is positioned outside the test frame, is provided with a driving knob.

Further, the needle type test guiding device comprises a universal guiding seat, a universal rod which is movably arranged on the universal guiding seat and provided with a ball head, a test arm which is horizontally arranged on the universal rod and can transversely move, and a test guiding needle which is obliquely arranged on the front end of the test arm and can vertically move; the universal guide seat is arranged in the rod sleeve mounting hole, and the test guide needle can extend into a placing cavity formed between the two bearing tables.

Further, the universal guide seat comprises a universal rod sleeve, a pressure spring arranged in the universal rod sleeve and a universal rod sleeve nut in threaded connection with the universal rod sleeve; the universal rod sleeve is a double-head external thread hollow seat, one end of the universal rod sleeve is a conical thread head with a shrinkage opening, and the other end of the universal rod sleeve is provided with a power connection hole; one end of the universal rod sleeve, which is provided with the power connection hole, is arranged in the rod sleeve mounting hole, and the power connection hole is symmetrical with the external connection hole; the ball end of the universal rod is arranged in the conical threaded head with the shrinkage opening of the universal rod sleeve, and the universal rod can rotate and swing by 360 degrees.

As a preferable scheme of the utility model, the universal rod is horizontally provided with a test arm mounting hole, and the top of the universal rod is provided with a locking threaded hole communicated with the test arm mounting hole; the test arm is horizontally arranged in the test arm mounting hole and can move transversely, and a test arm positioning bolt used for fixing the test arm is arranged in the locking threaded hole.

As a preferable scheme of the utility model, one end of the test arm far away from the universal rod is provided with an inclined hole and a limiting hole communicated with the inclined hole; the test guide pin is arranged in the inclined hole and can move up and down, and a test guide pin fixing bolt for fixing the test guide pin is arranged in the limit hole.

Compared with the prior art, the utility model has the following advantages:

according to the utility model, through the plurality of telescopic needle type test guiding devices, under the condition that manual extraction and extra flying leads are not needed, the multi-SITE synchronous analysis of the semiconductor integrated circuit which can be extracted normally and cannot be extracted normally can be realized, the secondary damage possibly introduced in the sample analysis process of the semiconductor integrated circuit is reduced, the destructive analysis of the semiconductor integrated circuit is more lossless and controllable, the imaging observation of the later analysis result of the semiconductor integrated circuit is ensured, and the problem that the secondary damage of the semiconductor integrated circuit is easy to cause in the conventional semiconductor integrated circuit test seat is well solved.

Drawings

Fig. 1 is an overall construction diagram of the present utility model.

Fig. 2 is a transverse cross-sectional view of the present utility model.

Fig. 3 is a longitudinal cross-sectional view of the present utility model.

Fig. 4 is a bottom view of the present utility model.

FIG. 5 is a schematic view of the structure of the test rack of the present utility model.

FIG. 6 is a schematic structural view of a test strip of the present utility model.

Fig. 7 is a cross-sectional view of a test splint of the present utility model.

Fig. 8 is a schematic structural view of the driving rod of the present utility model.

Fig. 9 is an exploded view of the universal guide of the present utility model.

FIG. 10 is a schematic view of a test arm according to the present utility model.

The reference numerals in the drawings are 1-test rack, 1-chute, 1-2-threaded hole, 1-3-bar sleeve mounting hole, 1-4-external hole, 2-test clamp plate, 2-1-bearing table, 2-slide arm, 2-3-cavity, 2-4-through hole, 2-5-cover plate, 3-test arm, 3-1-inclined hole, 3-2-limit hole, 4-test lead, 5-universal bar sleeve nut, 6-driving rod, 6-1-clamp plate driving screw, 6-2-limit driving screw, 6-3-shaft lever, 7-bearing seat, 8-driving knob, 9-supporting leg, 10-limit block, 11-universal bar sleeve, 12-universal bar, 121-test arm mounting hole, 122-locking threaded hole, 13-test arm positioning bolt, 14-insulating sleeve, 15-pressure spring, 16-electric connection hole, 17-test lead fixing bolt.

Detailed Description

The present utility model will be described in further detail with reference to examples, but embodiments of the present utility model are not limited thereto.

Example 1

As shown in fig. 1 to 10, the universal test probe holder for semiconductor integrated circuits of the present utility model comprises a test frame 1, a support leg 9, a test clamping plate 2, a pin type test guiding device, and a driving rod 6. Specifically, the number of the supporting legs 9 is four, the four supporting legs 9 are uniformly arranged on the test frame 1, and the supporting legs 9 are used for supporting the test frame 1, so that the lower part of the test frame 1 has enough equipment installation and operation space. In actual installation, the supporting feet 9 are fixed on the test frame 1 through screws. The number of the test clamping plates 2 is two, the two test clamping plates 2 are movably arranged on the test frame 1, and the two test clamping plates 2 jointly form a clamping table. The pin type test guiding device is a plurality of telescopic guiding devices which are uniformly distributed on the test frame 1 and are positioned below the test clamping plate 2, namely, the pin type test guiding devices are uniformly distributed on the lower frame arm of the test frame 1, and the pin type test guiding devices are oppositely arranged, namely, the guiding ends of the pin type test guiding devices are opposite.

The number of the driving rods 6 is two, the two driving rods 6 are symmetrically arranged at two ends of the test frame 1, and the two driving rods 6 are respectively in threaded connection with the test frame 1. In actual installation, one of the two driving rods 6 is arranged at one end of the test frame 1, the other driving rod is arranged at the other end of the test frame 1, and the two driving rods 6 are mutually symmetrical. One of the two test clamping plates 2 is movably connected with one of the two driving rods 6 through a bearing seat 7, and the other test clamping plate 2 is movably connected with the other driving rod 6 through the bearing seat 7, namely, the two test clamping plates 2 are respectively provided with the bearing seat 7. During installation, the driving rod 6 is connected with the shaft core sleeve of the bearing seat 7 and then extends into the test clamping plate 2, the driving rod 6 can rotate 360 degrees in the test clamping plate 2, and the test clamping plate 2 can horizontally reciprocate under the driving of the driving rod 6.

As shown in fig. 5, the inner sides of the two cross arms of the test rack 1 are respectively provided with a chute 1-1, and the chute 1-1 is used as a running track of the test clamping plate 2, i.e. the test clamping plate 2 is installed in the chute 1-1 and can horizontally slide along the chute 1-1. The outer side surfaces of the two cross arms of the test frame 1 are respectively provided with more than one external connecting hole 1-4, the upper arm surfaces of the two cross arms of the test frame 1 are respectively provided with more than one rod sleeve mounting holes 1-3 communicated with the external connecting holes 1-4, and the number of the external connecting holes 1-4 and the number of the rod sleeve mounting holes 1-3 are the same as that of the needle type test guiding devices. When in use, the external connection hole 1-4 is used for connecting an external connection terminal of the electrical performance testing equipment, and the needle type test guiding device is arranged in the rod sleeve mounting hole 1-3 and extends into the external connection hole 1-4. For safety of use, an insulation sleeve 14 is arranged in each external connection hole 1-4 and each rod sleeve mounting hole 1-3, threads are arranged on an inner sleeve arm of the insulation sleeve 14, after an external connection wire head of the electrical performance testing equipment is in threaded connection with the insulation sleeve 14 arranged in the external connection hole 1-4, the external connection wire head of the electrical performance testing equipment is connected with a needle type test guiding device extending into the rod sleeve mounting holes 1-3, and the needle type test guiding device is used as a guiding device of the electrical performance testing equipment. The insulating sleeve 14 can effectively prevent the test seat from being electrified and ensure the accuracy of the test.

Wherein, two ends of the test frame 1 are respectively provided with a threaded hole 1-2. The driving rod 6 is horizontally installed in the threaded hole 1-2 and is in threaded connection with the threaded hole 1-2. When the test rack is used, the driving rod 6 can horizontally reciprocate on the test rack 1 by screwing the driving rod 6 clockwise and anticlockwise, namely the driving rod 6 can drive the test clamping plate 2 to horizontally reciprocate on the test rack 1.

As shown in fig. 6 and 7, two adjacent ends of the two test clamping plates 2 are respectively provided with a receiving table 2-1, and a placing cavity is formed between the two receiving tables 2-1 and is used for placing the semiconductor integrated circuit to be tested. When the semiconductor integrated circuit is used, the size of the placing cavity can be adjusted by screwing the two driving rods 6 clockwise and anticlockwise, namely, when the two driving rods 6 are screwed clockwise at the same time, the placing cavity is contracted, the semiconductor integrated circuit is clamped in the placing cavity, and when the two driving rods 6 are screwed anticlockwise at the same time, the placing cavity is expanded, and the semiconductor integrated circuit is taken. The connecting end of the test clamping plate 2 and the sliding groove 1-1 is provided with a sliding arm 2-2, and the sliding arm 2-2 is in sliding connection with the sliding groove 1-1. As shown in fig. 7, the bottom of the test clamping plate 2 is provided with a cavity 2-3. The test clamping plate 2 is horizontally provided with a through hole 2-4 at one end far away from the bearing table 2-1, the through hole 2-4 is communicated with the cavity 2-3, the bearing seat 7 is arranged at the through hole 2-4 of the test clamping plate 2, and the inner shaft hole of the bearing seat 7 is communicated with the through hole 2-4. When in installation, the driving rod 6 passes through the through hole 2-4 and stretches into the cavity 2-3. The bottom of the test clamping plate 2 is also provided with a cover plate 2-5 for sealing the cavity 2-3. The cover plate 2-5 is fixed on the test clamping plate 2 through screws.

As shown in fig. 8, the drive rod 6 is composed of a clamp plate drive screw 6-1, a limit drive screw 6-2, and a shaft arm 6-3. Specifically, the clamp plate driving screw 6-1 passes through the threaded hole 1-2 and is in threaded connection with the threaded hole 1-2. The shaft arm 6-3 is arranged between the clamping plate driving screw 6-1 and the limiting driving screw 6-2, and the shaft arm 6-3 is connected with the bearing seat 7, so that the driving rod 6 can rotate 360 degrees on the test clamping plate 2 under the action of the bearing seat 7. The limit driving screw 6-2 is positioned in the cavity 2-3 of the test clamping plate 2, a limit block 10 in threaded connection with the limit driving screw 6-2 is arranged on the limit driving screw 6-2, the limit block 10 can horizontally move in the cavity 2-3 under the driving of the limit driving screw 6-2, the limit block 10 is used for limiting the stroke of the test clamping plate 2, and meanwhile, the stroke of the driving rod 6 can be stopped. During production, the clamping plate driving screw rod 6-1, the limiting driving screw rod 6-2 and the shaft arm 6-3 are fixed into a whole in a welding mode.

When the two driving rods 6 are screwed anticlockwise simultaneously, the clamping plate driving screw 6-1 moves towards the outer side of the test frame 1, the two test clamping plates 2 simultaneously move towards the end part of the test frame 1, the distance between the two test clamping plates 2 is increased, at the moment, the limiting driving screw 6-2 drives the limiting block 10 to move towards one end of the test clamping plate 2, which is provided with the bearing table 2-1, and when the limiting block 10 in the two test clamping plates 2 is contacted with the cavity wall, close to the bearing table 2-1, of the cavity 2-3 of the test clamping plate 2, the distance between the two test clamping plates 2 is the largest, and at the moment, the driving rod 6 rotates to stop. When two driving rods 6 are screwed clockwise simultaneously, the clamping plate driving screw 6-1 moves inwards the test frame 1, the two test clamping plates 2 simultaneously move towards the center of the test frame 1, the distance between the two test clamping plates 2 is reduced, at the moment, the limiting driving screw 6-2 drives the limiting block 10 to move towards one end of the test clamping plate 2 with the bearing seat 7, and when the limiting block 10 in the two test clamping plates 2 is contacted with the cavity wall, close to the bearing seat 7, of the cavity 2-3 of the test clamping plate 2, the distance between the two test clamping plates 2 is minimum, and at the moment, the rotation of the driving rod 6 is stopped.

In order to facilitate the screwing of the driving rod 6, as shown in fig. 8, a driving knob 8 is provided at an end of the clamping plate driving screw 6-1 located outside the test rack 1. The driving knob 8 is sleeved on the driving screw rod 6-1 and is fixed with the driving screw rod 6-1 through threaded connection or screw fixation.

As shown in fig. 3, the pin type test guide device includes a universal guide seat, a universal rod 12, a test arm 3, and a test pin 4. Specifically, the universal guide seat is installed in the rod sleeve mounting hole 1-3, and the universal guide seat is in threaded connection with the rod sleeve mounting hole 1-3, and extends into the external connection hole 1-4. The universal rod 12 is movably arranged on the universal guide seat, the universal rod 12 is provided with a ball head, and the ball head end of the universal rod 12 is positioned in the universal guide seat. The test arm 3 is horizontally arranged on the gimbal rod 12 and can move laterally. The test pin 4 is obliquely provided on the front end of the test arm 3 and can move up and down. In use, the test pin 4 is able to extend into a cavity formed between the two sockets 2-1.

As shown in fig. 9, the gimbal rod 12 is horizontally provided with a test arm mounting hole 121, and the top of the gimbal rod 12 is provided with a locking screw hole 122 communicating with the test arm mounting hole 121. When the test arm 3 is mounted, the test arm is horizontally mounted in the test arm mounting hole 121 and can move transversely, and the test arm positioning bolt 13 for fixing the test arm 3 is arranged in the locking threaded hole 122.

As shown in fig. 10, an inclined hole 3-1 and a limiting hole 3-2 communicated with the inclined hole 3-1 are arranged on one end of the test arm 3 far away from the universal rod 12. When in installation, the test guide pin 4 is arranged in the inclined hole 3-1 and can move up and down, and a test guide pin fixing bolt 17 for fixing the test guide pin 4 is arranged in the limit hole 3-2.

As shown in fig. 9, the universal guiding seat includes a universal rod sleeve 11, a pressure spring 15, and a universal rod sleeve nut 5. Specifically, the universal rod sleeve 11 is a double-head external thread hollow seat, one end of the universal rod sleeve 11 is a conical thread head with a shrinkage opening, and the other end is provided with a power connection hole 16. One end of the universal rod sleeve 11 provided with the power connection hole 16 is installed in the insulating sleeve 14 in the rod sleeve installation hole 1-3 and extends into the external connection hole 1-4, and the power connection hole 16 and the external connection hole 1-4 are kept symmetrical after installation. In use, the external terminal of the electrical performance testing device is connected with the electrical connection hole 16 of the universal rod sleeve 11. The ball end of the universal rod 12 is mounted in a tapered threaded head of the universal rod sleeve 11 having a constricted mouth, and the universal rod 12 can rotate and oscillate 360 °. The pressure spring 15 is arranged in the universal rod sleeve 11, and when the universal rod sleeve 11 is specifically installed, one end of the pressure spring 15 is in contact with a preset positioning ring in the universal rod sleeve 11, and the other end of the pressure spring is in rolling connection with the ball end of the universal rod 12 through a partition plate. The universal rod sleeve nut 5 is sleeved on the universal rod sleeve 11 and is in threaded connection with the universal rod sleeve 11, and the universal rod sleeve nut 5 is used for adjusting the size of a shrinkage opening of the universal rod sleeve 11 so as to fix the ball end of the universal rod 12 and prevent the ball end of the universal rod 12 from falling off from the inside of the universal rod sleeve 11.

When the utility model is specifically used, the semiconductor integrated circuit to be tested is placed in a placing cavity formed between two test clamping plates 2, so that the leading-out face of the semiconductor integrated circuit to be tested is downward, and meanwhile, the driving rod 6 is screwed clockwise, so that the placing cavity is contracted to fix the semiconductor integrated circuit in the placing cavity. After the semiconductor integrated circuit to be tested is fixed, the universal rod 12 is rotated according to the lead-out position of the semiconductor integrated circuit to be tested, the test arm positioning bolt 13 is screwed, the test arm 3 can horizontally move so as to adjust the length of the test arm 3, meanwhile, the test lead fixing bolt 17 is screwed, the test lead 4 can vertically move so as to adjust the height of the test lead 4, the test lead 4 is contacted with the lead-out end of the semiconductor integrated circuit, if the lead-out end of the semiconductor integrated circuit cannot be led out conventionally, the test lead 4 is inserted into the lead-out opening of the semiconductor integrated circuit, the test lead 4 is contacted with the lead-out surface of the semiconductor integrated circuit, and the test lead fixing bolt 17 and the test arm positioning bolt 13 are locked. And after the external connector of the electrical performance testing equipment is connected with the universal rod sleeve 11 through the external connection hole 1-4, the test and installation are completed.

According to the above-mentioned installation back, alright through a plurality of telescopic needle test guiding device that set up, can be under the condition that need not the manual work and add the flying lead in addition, realize carrying out many SITE synchronous analysis to the semiconductor integrated circuit that can normally draw and unable normal drawing, reduced the secondary damage that the semiconductor integrated circuit sample analysis in-process probably introduced, make the destructive analysis of semiconductor integrated circuit more harmless, controllable, ensured the imaging observation of semiconductor integrated circuit later analysis result, fine solution current semiconductor integrated circuit test seat exists the problem that easily leads to semiconductor integrated circuit secondary damage.

As described above, the present utility model can be well implemented.

Claims (9)

1. The universal test probe seat for the semiconductor integrated circuit is characterized by comprising a test frame (1), four supporting legs (9) uniformly arranged on the test frame (1) and used for supporting the test frame (1), two test clamping plates (2) movably arranged on the test frame (1), a plurality of telescopic needle type test guiding devices uniformly distributed on the test frame (1) and positioned below the test clamping plates (2), and two driving rods (6) symmetrically arranged at two ends of the test frame (1); the plurality of needle type test guiding devices are oppositely arranged; the two driving rods (6) are respectively connected with the test rack (1) in a threaded manner; one of the two test clamping plates (2) is movably connected with one of the two driving rods (6) through a bearing seat (7), the other test clamping plate (2) is movably connected with the other driving rod (6) through the bearing seat (7), the driving rod (6) is connected with a shaft core sleeve of the bearing seat (7) and then extends into the test clamping plate (2), and the driving rod (6) can rotate in the test clamping plate (2) by 360 degrees; the two test clamping plates (2) together form a clamping table, and the test clamping plates (2) can horizontally reciprocate under the drive of the driving rod (6).

2. The universal test probe seat for the semiconductor integrated circuit according to claim 1, wherein the inner side surfaces of the two cross arms of the test frame (1) are respectively provided with a chute (1-1), and the test clamping plate (2) is arranged in the chute (1-1) and can horizontally slide along the chute (1-1); the outer side surfaces of the two cross arms of the test frame (1) are respectively provided with more than one external connecting hole (1-4), the upper arm surfaces of the two cross arms of the test frame (1) are respectively provided with more than one rod sleeve mounting hole (1-3) communicated with the external connecting holes (1-4), each external connecting hole (1-4) and each rod sleeve mounting hole (1-3) are internally provided with an insulating sleeve (14), and the inner sleeve arms of the insulating sleeves (14) are provided with threads; the needle type test guiding device is arranged in the rod sleeve mounting hole (1-3) and extends into the external hole (1-4); two ends of the test frame (1) are respectively provided with a threaded hole (1-2), and the driving rod (6) is horizontally arranged in the threaded hole (1-2) and is in threaded connection with the threaded hole (1-2); the number of the external connection holes (1-4) and the rod sleeve mounting holes (1-3) is the same as that of the needle type test guiding devices.

3. The universal test probe seat for the semiconductor integrated circuit according to claim 2, wherein two adjacent ends of the two test clamping plates (2) are respectively provided with a bearing table (2-1), and a placing cavity is formed between the two bearing tables (2-1); a sliding arm (2-2) is arranged at the connecting end of the test clamping plate (2) and the sliding groove (1-1), and the sliding arm (2-2) is in sliding connection with the sliding groove (1-1); the bottom of the test clamping plate (2) is provided with a cavity (2-3); the test clamp plate (2) is horizontally provided with a through hole (2-4) at one end far away from the bearing table (2-1), the through hole (2-4) is communicated with the cavity (2-3), the bearing seat (7) is arranged at the through hole (2-4) of the test clamp plate (2), an inner shaft hole of the bearing seat (7) is communicated with the through hole (2-4), and the driving rod (6) penetrates through the through hole (2-4) and stretches into the cavity (2-3); the bottom of the test clamping plate (2) is also provided with a cover plate (2-5) for sealing the cavity (2-3).

4. A universal test probe holder for semiconductor integrated circuits according to claim 3, wherein the drive rod (6) is composed of a clamp plate drive screw (6-1), a limit drive screw (6-2), and an axle arm (6-3) disposed between the clamp plate drive screw (6-1) and the limit drive screw (6-2); the clamping plate driving screw (6-1) penetrates through the threaded hole (1-2) and is in threaded connection with the threaded hole (1-2), the shaft arm (6-3) is connected with the bearing seat (7), the limiting driving screw (6-2) is located in the cavity (2-3) of the test clamping plate (2), a limiting block (10) in threaded connection with the limiting driving screw is arranged on the limiting driving screw (6-2), and the limiting block (10) can horizontally move in the cavity (2-3) under the driving of the limiting driving screw (6-2).

5. The universal test probe holder for semiconductor integrated circuits according to claim 4, wherein the clamping plate driving screw (6-1) is provided with a driving knob (8) at one end located outside the test frame (1).

6. The universal test probe holder for semiconductor integrated circuits according to claim 5, wherein the pin type test guide means comprises a universal guide holder, a universal rod (12) movably provided on the universal guide holder and having a ball head, a test arm (3) horizontally provided on the universal rod (12) and capable of being laterally moved, and a test guide pin (4) obliquely provided on a front end of the test arm (3) and capable of being moved up and down; the universal guide seat is arranged in the rod sleeve mounting hole (1-3), and the test guide needle (4) can extend into a placing cavity formed between the two bearing tables (2-1).

7. The universal test probe holder for semiconductor integrated circuits according to claim 6, wherein the universal guide holder comprises a universal rod sleeve (11), a pressure spring (15) arranged in the universal rod sleeve (11), and a universal rod sleeve nut (5) in threaded connection with the universal rod sleeve (11); the universal rod sleeve (11) is a double-head external thread hollow seat, one end of the universal rod sleeve (11) is a conical thread head with a shrinkage opening, and the other end of the universal rod sleeve is provided with a power connection hole (16); one end of the universal rod sleeve (11) provided with a power connection hole (16) is arranged in the rod sleeve mounting hole (1-3), and the power connection hole (16) is symmetrical with the external connection hole (1-4); the ball end of the universal rod (12) is arranged in a conical threaded head with a shrinkage opening of the universal rod sleeve (11), and the universal rod (12) can rotate and swing at 360 degrees.

8. The universal test probe seat for the semiconductor integrated circuit according to claim 7, wherein the universal rod (12) is horizontally provided with a test arm mounting hole (121), and the top of the universal rod (12) is provided with a locking threaded hole (122) communicated with the test arm mounting hole (121); the test arm (3) is horizontally arranged in the test arm mounting hole (121) and can move transversely, and a test arm positioning bolt (13) for fixing the test arm (3) is arranged in the locking threaded hole (122).

9. The universal test probe seat for the semiconductor integrated circuit according to claim 8, wherein an inclined hole (3-1) and a limiting hole (3-2) communicated with the inclined hole (3-1) are arranged on one end of the test arm (3) far away from the universal rod (12); the test guide pin (4) is arranged in the inclined hole (3-1) and can move up and down, and a test guide pin fixing bolt (17) for fixing the test guide pin (4) is arranged in the limit hole (3-2).