CN107153129B - Automatic press-fit test fixture for bolt type power semiconductor device - Google Patents
Automatic press-fit test fixture for bolt type power semiconductor device Download PDFInfo
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- CN107153129B CN107153129B CN201710451599.4A CN201710451599A CN107153129B CN 107153129 B CN107153129 B CN 107153129B CN 201710451599 A CN201710451599 A CN 201710451599A CN 107153129 B CN107153129 B CN 107153129B
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- plate
- adapter
- pole
- guide rod
- power semiconductor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to an automatic press-fitting test fixture for a bolt type power semiconductor device, which comprises a main mechanism frame, a K leading-out pole mechanism with adjustable pressure and a pressing mechanism for the bolt device. The device to be tested is heated by the heating plate, and the shell temperature of the device is monitored in real time by the thermocouple. The positions of the adjusting stud and the guide rod pull pin are adjusted according to devices with different heights so as to ensure that the electrodes of the bolt device A, K are reliably contacted at the same time; the press-fitting requirements of bolt devices with different shapes can be realized by replacing different adapters and positioning conductive blocks. The invention is applied to the full-dynamic test equipment of the bolt device at present, and can also be applied to other parameter tests and tests of the device.
Description
Technical Field
The invention relates to an automatic press-fit test fixture for a bolt type power semiconductor device, which can be used for automatically clamping different bolt type power semiconductor devices by matching with special adapters. The device can be applied to various test equipment of the bolt type power semiconductor device at present, and the device to be tested can be preheated and temperature controlled through the bottom plate heating system.
Background
At present, in the field of power semiconductor application, the application range of bolt type devices is wider and wider, and the external structures of the bolt type devices are also more and more. The cathode has the advantages of hexagonal external single screw thread type, square external four screw fixing type, extremely high cathode lead-out, low variety. Such devices are usually screwed or directly fastened to the heat sink and the extraction electrode in order to achieve good functional qualities thereof. In the prior art, in the reliability test of the device, the device is fixed on a heating plate through threads of the device to realize constant temperature or heat dissipation in the test process, but the fixing mode needs manual pre-tightening, the temperature of the surface of the device needs to be measured by using a handheld thermocouple point, and the cathode needs manual wiring and lead-out because of a plurality of types of appearance of the bolt type device. Therefore, the error of final test data is larger and the test efficiency is low due to inaccurate temperature acquisition of the surface of the device, and the device is very inconvenient in actual test.
Disclosure of Invention
The invention aims to provide an automatic press-fit test fixture for a bolt type power semiconductor device.
The technical scheme of the invention is as follows: the automatic press-fit test fixture for the bolt type power semiconductor device comprises a main mechanism frame, a pressure-adjustable K extraction pole mechanism and a pressing mechanism of the bolt device, wherein a K pole fixing vertical plate (20), a movable plate (18), a K pole fixing plate (4), an adjusting stud (3), a K extraction pole (2), an electrode spring (19) and a screw sleeve (21) form the pressure-adjustable K extraction pole mechanism, the K extraction pole (2) is in sliding fit with the adjusting stud (3), the electrode spring (19) is compressed between the adjusting stud (3) and the lower end of the K extraction pole (2), and the adjusting stud (3) is fixed on the K pole fixing plate (4) after being in threaded fit with the screw sleeve (21), wherein the K pole fixing plate (4) is an insulating piece; the K pole fixing plate (4), the K pole fixing vertical plate (20) and the movable plate (18) form a frame; the upper plate (27) of the adapter bracket, the vertical plate (28) of the adapter bracket, the bottom plate (29) of the adapter bracket, the upper plate (7) of the adapter and the lower plate (14) of the adapter form a pressing mechanism of a bolt device, the upper plate (27) of the adapter bracket, the two vertical plates (28) of the adapter bracket and the bottom plate (29) of the adapter bracket form an adapter bracket, and the frame can be inserted into a sliding groove of the movable plate (18) and positioned through an adapter pull pin (5); the adapter upper plate (7) and the adapter lower plate (14) are connected through screws to form an adapter, the upper plate (7) is an insulating piece, and the lower plate (14) is a steel piece; the adapter can be inserted into a sliding groove in the bottom plate (29) of the adapter bracket and positioned by the collision beads (15); the heating plate (9) is fixed on the lower insulating plate (23) through a screw (35) and a spring (31); 4 heating rods (36) are embedded in the heating plate (9); the thermocouple (11) penetrates through the spring (32) and is embedded into the heating plate (9), and the temperature collecting contact is upward and is used for collecting the shell temperature of the tested device; the positioning plate (12) is fixed on the heating plate (9) through a positioning pin (33), and the positioning conductive block (13) is positioned with the positioning plate (12) through the outer circle of the positioning conductive block; the A leading-out pole (22) is fixed on the heating plate (9) by an A leading-out pole fixing screw (34); the guide rod pull pin bracket (17) is in clearance fit with the guide rod (24) Kong Zhoujian, and can be clamped in a clamping groove of the guide rod (24) through the guide rod pull pin (16) to be used for lifting the whole movable plate (18); the linear bearing (6) and the movable plate (18) are in interference fit, so that the movable plate (18) can slide up and down freely; the lower insulating plate (23) is fixed with the lower fixing plate (10) through screws; the air cylinder (25) is inversely hung below the lower fixing plate (10) through a screw; the cylinder supporting plate (26) is used for connecting the cylinder (25) with the two guide rods (24), and the lower fixing plate (10) and the cylinder (25), the cylinder supporting plate (26), the guide rods (24), the movable plate (18), the linear bearing (6), the guide rod pull pins (16) and the guide rod pull pin brackets (17) form a main mechanism frame. The upper end of the guide rod (24) is provided with a guide rod spring (1).
An adjusting nut is arranged at the upper end of the K leading-out electrode (2).
Two adjusting nuts (30) are arranged at the upper ends of the two guide rods (24).
When the device (8) to be tested is not pressed, the upper surface of the thermocouple (11) is flush with the upper surface of the heating plate (9), so that mechanical collision damage to the thermocouple when the device (8) is taken and placed is avoided; when the device is in press-fit, 4 supporting springs (31) arranged in the heating plate (9) and a fastening spring (32) arranged at the bottom of the thermocouple (11) are in a compressed state, so that the thermocouple is ensured to be reliably contacted with a bottom shell of the device (8), and quick and accurate temperature response can be realized.
The invention can press the semiconductor device onto the heating plate according to different bolt type semiconductor devices, and the two poles of A, K can realize automatic connection. The K leading-out is made of copper, the upper end of the K leading-out is of a threaded structure and used for testing required electrical connection, and the lower end of the K leading-out is reliably contacted with the K electrode of the bolt device after press fitting. The electrode A is reliably contacted with the positioning conductive block, the heating plate and the electrode A. The left end hole structure of the a lead-out pole is used for testing the required electrical connection. The device to be tested is heated by the heating plate according to the requirement, and the shell temperature of the device is monitored in real time by the thermocouple. The reliable contact between the K lead-out electrode and the device and between the device and the positioning conductive block are ensured by adjusting the positions of the adjusting studs and the guide rod pull pins according to devices with different heights; the corresponding adapter and the positioning conductive block can be replaced according to devices with different shapes. The invention is applied to the full-dynamic test equipment of the bolt device at present, and can also be applied to other parameter tests and tests of the device.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is an enlarged schematic view of the thermocouple of fig. 1.
Fig. 3 is a schematic enlarged view of the heating plate of fig. 1.
Fig. 4 is a side view of fig. 1.
Fig. 5 is a partial schematic view of an adapter bracket.
Fig. 6 is a top view of fig. 5.
Fig. 7 is a cross-sectional view A-A of fig. 5.
Fig. 8 is a schematic view of a bolt device.
Detailed description of the preferred embodiments
The automatic press-fitting test fixture for the bolt type power semiconductor device comprises a main mechanism frame, a pressure-adjustable K extraction pole mechanism and a pressing mechanism of the bolt device, wherein the K extraction pole mechanism with adjustable pressure is composed of a K pole fixing vertical plate 20, a movable plate 18, a K pole fixing plate 4, an adjusting stud 3, a K extraction pole 2 and a screw sleeve 21, the K extraction pole 2 is in sliding fit with the adjusting stud 3, the adjusting stud 3 is fixed on the K pole fixing plate 4 after being in threaded fit with the screw sleeve 21, and the K pole fixing plate 4 is an insulating piece; the K pole fixing plate 4, the K pole fixing vertical plate 20 and the movable plate 18 form a frame; the adapter bracket upper plate 27 and the adapter bracket vertical plate 28, the adapter bracket bottom plate 29, the adapter upper plate 7 and the adapter lower plate 14 form a pressing mechanism of a bolt device, and the adapter bracket upper plate 27, the two adapter bracket vertical plates 28 and the adapter bracket bottom plate 29 form an adapter bracket (middle broken line frame part; see fig. 3), and the frame can be inserted into a sliding groove of the movable plate 18 and positioned by an adapter pull pin 5; the adapter upper plate 7 and the adapter lower plate 14 are connected through screws to form an adapter, the upper plate is an insulating piece, and the lower plate is a steel piece. The adapter can be inserted into a chute in the adapter bracket base 29 and positioned by the catch 15; the heating plate 9 is suspended on the lower insulating plate 23 by screws and springs; 4 heating rods 36 are embedded in the heating plate 9; the thermocouple 11 penetrates through the spring and is embedded into the heating plate 9, and the temperature collecting contact is upward and is used for collecting the shell temperature of the device 8 to be tested; the positioning plate 12 is fixed on the heating plate 9 through a positioning pin 33, and the positioning conductive block 13 is positioned with the positioning plate 12 through the outer circle of the positioning conductive block; the a-pole 22 is fixed to the heating plate 9 by a-pole fixing screws 34. The guide rod pull pin bracket 17 is in clearance fit with the guide rod 24 Kong Zhoujian, and can be clamped in a clamping groove of the guide rod 24 through the guide rod pull pin 16 to lift the whole movable plate 18; the linear bearing 6 is in interference fit with the movable plate 18, so that the movable plate can slide up and down freely; the lower insulating plate 23 is fixed with the lower fixing plate 10 by screws; the air cylinder 25 is hung under the lower fixing plate 10 upside down by a screw; the cylinder support plate 26 is used for connecting the cylinder 25 with the two guide rods 24. The lower fixed plate 10, the cylinder 25, the cylinder supporting plate 26, the guide rod 24, the movable plate 18, the linear bearing 6, the guide rod pull pin 16 and the guide rod pull pin bracket 17 form a main mechanism frame.
1. The design key point of the invention
1) Design of telescopic guide rod pressure mechanism
The lower fixing plate 10, the cylinder 25, the cylinder supporting plate 26, the guide rod 24, the guide rod spring 1, the movable plate 18, the linear bearing 6, the guide rod pull pin 16 and the guide rod pull pin bracket 17 form a main mechanism frame. Wherein the lower fixing plate 10 can be fixed on the operation table. The cylinder 25 is inversely fixed under the lower fixing plate 10. When the air cylinder 25 is pressed out, the air cylinder supporting plate 26 drives the two guide rods and the whole upper frame to move downwards. The structure has the advantages that the space on the operation table surface is completely opened, and a series of operation procedures are convenient for a tester.
2) Pressure-adjustable K-type lead-out electrode mechanism design
The K pole fixing vertical plate 20, the movable plate 18, the K pole fixing plate 4, the adjusting stud 3, the K leading-out pole 2, the electrode spring 19 and the screw sleeve 21 form a K leading-out pole mechanism with adjustable pressure. The natural height of the K extraction electrode 2 can be adjusted by rotating the adjusting stud 3; the pre-pressing length of the electrode spring 19 can be adjusted by rotating the nut at the upper end of the K leading-out electrode 2, so that the contact pressure between the K leading-out electrode 2 and the K electrode of the device can be adjusted.
3) Screw device hold-down mechanism design
Referring to fig. 3 and 4, the adapter bracket upper plate 27 and the adapter bracket vertical plate 28, the adapter bracket bottom plate 29, the adapter upper plate 7, and the adapter lower plate 14 constitute a pressing mechanism of the bolt device. Before press fitting, the positions of the guide rod pull pin 16 and the guide rod pull pin bracket 17 are adjusted to ensure that the upper end of the device 8 to be tested is not interfered with the lower end of the K lead-out electrode 2; the pre-pressing length of the guide rod springs can be adjusted by adjusting the adjusting nuts 30 at the uppermost ends of the two guide rods, so that the pressure of the upper plate 7 of the adapter pressed on the edge of the bolt of the tested device 8 can be adjusted, and the reliable contact of the device A pole is ensured.
4) Bolt device heating and device bottom shell sampling temperature scheme design
4 heating rods 36 and a thermocouple 11 are embedded in the heating plate 9, and an industrial controller connected with the outside can quickly heat up and reach a constant temperature when the device 8 to be measured is preheated. When the device 8 to be tested is not pressed, the thermocouple 11 and the supporting spring 31 of the heating plate 9 are in natural length, so that the upper surface of the thermocouple 11 is level with the upper surface of the heating body, and the mechanical collision damage to the thermocouple when the device 8 is taken and placed is avoided. When the device is in press-fit, the 4 supporting springs 31 (only 2 are shown in fig. 1) of the heating plate 9 and the fastening springs 32 of the thermocouple 11 are in compression, so that the thermocouple 11 is ensured to be reliably contacted with the bottom shell of the device 8. And further, quick and accurate temperature response can be realized.
2. Effect of practical use
The invention is applied to the full-dynamic test equipment of the power semiconductor. The test condition requires the AK of the tested device to be contacted very reliably, the device to be heated, certain voltage and current to be applied, the shell temperature of the device to be monitored in real time, and the whole test path to be isolated from other insulators. From the test results, the clamp well meets the test requirements. Due to the characteristic of automatic press fitting, the testing efficiency and accuracy are better ensured.
3. Conclusion(s)
The invention provides a novel efficient automatic press-fitting test fixture for testing a bolt type power semiconductor device. The method is applied to full-dynamic test equipment at present, and has good use effect. In view of the characteristics, the clamp can be applied to testing and testing other parameters of the bolt type power semiconductor device.
Claims (5)
1. The utility model provides an automatic pressure equipment test fixture of bolt formula power semiconductor device, includes main mechanism frame, pressure adjustable K draw forth utmost point mechanism, bolt device's hold-down mechanism, its characterized in that: the K pole fixing vertical plate (20), the movable plate (18), the K pole fixing plate (4), the adjusting stud (3), the K pole (2), the electrode spring (19) and the screw sleeve (21) form a K pole leading-out mechanism with adjustable pressure, the K pole leading-out plate (2) is in sliding fit with the adjusting stud (3), the electrode spring (19) is compressed between the adjusting stud (3) and the lower end of the K pole leading-out plate (2), and the adjusting stud (3) is fixed on the K pole fixing plate (4) after being in threaded fit with the screw sleeve (21), wherein the K pole fixing plate (4) is an insulating piece; the K pole fixing plate (4), the K pole fixing vertical plate (20) and the movable plate (18) form a frame; the upper plate (27) of the adapter bracket, the vertical plate (28) of the adapter bracket, the bottom plate (29) of the adapter bracket, the upper plate (7) of the adapter and the lower plate (14) of the adapter form a pressing mechanism of a bolt device, the upper plate (27) of the adapter bracket, the two vertical plates (28) of the adapter bracket and the bottom plate (29) of the adapter bracket form an adapter bracket, and the frame can be inserted into a sliding groove of the movable plate (18) and positioned through an adapter pull pin (5); the adapter upper plate (7) and the adapter lower plate (14) are connected through screws to form an adapter, the upper plate (7) is an insulating piece, and the lower plate (14) is a steel piece; the adapter can be inserted into a sliding groove in the bottom plate (29) of the adapter bracket and positioned by the collision beads (15); the heating plate (9) is fixed on the lower insulating plate (23) through a screw (35) and a spring A (31); 4 heating rods (36) are embedded in the heating plate (9); the thermocouple (11) penetrates through the spring B (32) and is embedded into the heating plate (9), and a temperature collecting contact is upward and is used for collecting the shell temperature of the tested device; the positioning plate (12) is fixed on the heating plate (9) through a positioning pin (33), and the positioning conductive block (13) is positioned with the positioning plate (12) through the outer circle of the positioning conductive block; the A leading-out pole (22) is fixed on the heating plate (9) by an A leading-out pole fixing screw (34); the guide rod pull pin bracket (17) is in clearance fit with the guide rod (24) Kong Zhoujian, and can be clamped in a clamping groove of the guide rod (24) through the guide rod pull pin (16) to be used for lifting the whole movable plate (18); the linear bearing (6) and the movable plate (18) are in interference fit, so that the movable plate (18) can slide up and down freely; the lower insulating plate (23) is fixed with the lower fixing plate (10) through screws; the air cylinder (25) is inversely hung below the lower fixing plate (10) through a screw; the cylinder supporting plate (26) is used for connecting the cylinder (25) with the two guide rods (24), and the lower fixing plate (10) and the cylinder (25), the cylinder supporting plate (26), the guide rods (24), the movable plate (18), the linear bearing (6), the guide rod pull pins (16) and the guide rod pull pin brackets (17) form a main mechanism frame.
2. The automatic press-fit test fixture for a bolted power semiconductor device of claim 1, wherein: the upper end of the guide rod (24) is provided with a guide rod spring (1).
3. The automatic press-fit test fixture for a bolted power semiconductor device of claim 1, wherein: an adjusting nut is arranged at the upper end of the K leading-out electrode (2).
4. The automatic press-fit test fixture for a bolted power semiconductor device of claim 1, wherein: two adjusting nuts (30) are arranged at the upper ends of the two guide rods (24).
5. The automatic press-fit test fixture for a bolted power semiconductor device of claim 1, wherein: when the device to be tested is not pressed, the upper surface of the thermocouple (11) is flush with the upper surface of the heating plate (9), so that the mechanical collision damage to the thermocouple (11) when the device is taken and placed is avoided; when the device is in press-fit, 4 supporting springs A (31) arranged in the heating plate (9) and a fastening spring B (32) arranged at the bottom of the thermocouple (11) are in a compressed state, so that the thermocouple (11) is ensured to be in reliable contact with the bottom shell of the device, and quick and accurate temperature response can be realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710451599.4A CN107153129B (en) | 2017-06-15 | 2017-06-15 | Automatic press-fit test fixture for bolt type power semiconductor device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710451599.4A CN107153129B (en) | 2017-06-15 | 2017-06-15 | Automatic press-fit test fixture for bolt type power semiconductor device |
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| CN107153129A CN107153129A (en) | 2017-09-12 |
| CN107153129B true CN107153129B (en) | 2023-05-16 |
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| CN201710451599.4A Active CN107153129B (en) | 2017-06-15 | 2017-06-15 | Automatic press-fit test fixture for bolt type power semiconductor device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110726913B (en) * | 2018-06-28 | 2021-04-06 | 株洲中车时代半导体有限公司 | Semiconductor device testing device |
| CN108549004A (en) * | 2018-07-03 | 2018-09-18 | 北京智创骏驰电气科技有限公司 | A kind of device testing apparatus |
| CN108732482B (en) * | 2018-07-09 | 2023-12-29 | 西安派瑞功率半导体变流技术股份有限公司 | High-power IGCT device test fixture sliding table positioning mechanism |
| CN109755140B (en) * | 2019-02-27 | 2023-10-17 | 西安派瑞功率半导体变流技术股份有限公司 | Universal automatic press-fitting mechanism for high-power semiconductor device |
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| CN102944706A (en) * | 2012-11-29 | 2013-02-27 | 西安电力电子技术研究所 | Adaptive power semiconductor module reliability test testing clamp |
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2017
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| CN102944706A (en) * | 2012-11-29 | 2013-02-27 | 西安电力电子技术研究所 | Adaptive power semiconductor module reliability test testing clamp |
| CN105157436A (en) * | 2015-08-07 | 2015-12-16 | 中国科学院宁波材料技术与工程研究所 | Rapid-heating heat treatment furnace |
| CN106298594A (en) * | 2016-08-18 | 2017-01-04 | 平高集团有限公司 | The press-loading apparatus of a kind of semiconductor valve string and pressing method |
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