CN1389770A - Method of utilizing power supply to raise heat dissipating effect - Google Patents
Method of utilizing power supply to raise heat dissipating effect Download PDFInfo
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- CN1389770A CN1389770A CN 01118538 CN01118538A CN1389770A CN 1389770 A CN1389770 A CN 1389770A CN 01118538 CN01118538 CN 01118538 CN 01118538 A CN01118538 A CN 01118538A CN 1389770 A CN1389770 A CN 1389770A
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- power supply
- supply unit
- heat
- host shell
- heat dissipating
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Abstract
This invention relates to a method of increasing heat radiation effect by a power supplier containing setting air intake and exhaust element separately at the front and back and heat conducted element at the side of the powr supplier. The heat conducted element should be close to CPU inside of the main frame case and the exhaust is close to the exhaust hole at the back of the case when the supplier is mounted inside of the main frame case. The heat conducted element absorbs heat from CPU, the air intake element absorbs cold air to the power supplier to the heat conducted element and the exhaust element exhausts hot air from the power supplier and the main frame case to get the aim of increasing heat radiation effect from computer host.
Description
The present invention system provides a kind of method of utilizing power supply to raise heat dissipating effect, particularly utilize and originally just need to be located at the power supply unit of host shell inside as media, at power supply unit air inlet element, expulsion element and heat conducting element are set, make host shell inside by heat that CPU produced except some is got rid of by the cooling system of host shell itself, after another part heat is then absorbed by the heat conducting element that is located at power supply unit, by the inlet and outlet element hot-air is assisted again and discharge, with the radiating efficiency of further lifting host shell.
General host computer enclosure interior all can be provided with central processing unit (CentralProcess Unit is hereinafter to be referred as CPU) on motherboard, and CPU can produce heat when running, and arithmetic speed is faster, and the heat that is produced is higher; Especially the CPU in the network server is owing to must handle a large amount of data, and the household PC that the heat that it produced is more general is much higher; The heat of host shell inside will influence the performance of CPU, even cause burning if can not in time get rid of, and therefore, computermaker is all very paid attention to the radiating efficiency of main frame.
Fig. 1 has shown the primary structure and the radiating mode of known general servomechanism main frame inside; It ties up to and is provided with motherboard D in the host shell B, motherboard D is provided with CPU E, in host shell B, be provided with power supply unit A in addition, power supply unit A rear is provided with fan A1, socket A2 and switch A3, after in power supply unit A is assembled in host shell B, be to make the vent port of fan A1 corresponding to host shell B rear.Its fan A1 that is located at power supply unit A is used for getting rid of this heat that is produced of power supply unit A; Again since the inner space of each unit host shell of large-scale network server owing to be subjected to the restriction of specific standard size, add the most link slots that are located on the motherboard and almost taken the panel at host shell rear, unnecessary fan can't be set again, thereby only can utilize the fan A1 that is located at the power supply unit rear as main heat dissipation element, it can't further promote radiating effect.
In order to make large-scale network server main frame can further promote heat-sinking capability, way traditionally is except the fan that utilizes power supply unit at present, at the rear of host shell one group of fan is set also in addition and comes auxiliary heat dissipation.
But based on aforementioned general network server host shell specification restriction, desire to add one group of fan actual difficulty is obviously arranged in searching space, the rear of host shell, therefore, known mode of ameliorating shown in Figure 2, it is the inboard that power supply unit A is installed in host shell B, that is allow and keeping suitably space between the rear panel of the rear of power supply unit A and host shell B, so that can on host shell B rear panel, coordinate one group of fan B1 corresponding to the inclined to one side side position of power supply unit A, and between the rear panel of the side of power supply unit A and host shell B, a dividing plate C is set, utilize this dividing plate C to separate fan A1 and B1 lays respectively at two zones, the heat that makes CPU E be produced can be discharged by fan B1, and the heat that power supply unit A is produced is then discharged by fan A1; Even also hole C1 can be set at dividing plate C, allow a part of heat that CPU E produced can allow also fan A1 is auxiliary to discharge heat radiation by hole C1.
Yet, aforementioned with power supply unit toward host shell internal displacement and set-up mode has caused the another one problem also, can there be a segment distance in the switch A3 and the socket A2 that promptly are located at power supply unit A with the vent port at host shell B rear, very inconvenience when just having caused the user to engage with socket A2 at operating switch A3 and with power-line plug thus.
Therefore, the present invention is to overcome the existing heat radiation defective of aforementioned conventional servomechanism host computer housing.
First purpose of the present invention is providing a kind of method of utilizing power supply to raise heat dissipating effect, it ties up to power supply unit and is provided with expulsion element and heat conducting element at least, and then power supply unit is located at host shell when inner, allow heat conducting element near CPU to absorb heat by CPU was produced, and the heat that is absorbed is existed in the power supply unit, utilize expulsion element then the hot-air in the power supply unit to be discharged power supply unit and host shell simultaneously again, to promote the radiating effect of host shell.
Second purpose of the present invention is providing a kind of method of utilizing power supply to raise heat dissipating effect, it can coordinate air inlet element, expulsion element and heat conducting element at power supply unit further simultaneously, after by heat conducting element heat that CPU produced being imported power supply unit inside, import cold air by air inlet element again heat conducting element is cooled off, then the hot-air of power supply unit inside is discharged outside power supply unit and the host shell simultaneously simultaneously by expulsion element.
Based on this, the method for utilizing power supply to raise heat dissipating effect provided by the invention, the place ahead and the rear that tie up to power supply unit are provided with air inlet element and expulsion element respectively, and at the side of power supply unit heat conducting element are set; When power supply unit is assembled in host shell inside, system makes its heat conducting element near the CPU in the host shell, expulsion element is then near the vent port behind the host shell, heat conducting element absorbs from the heat that CPU produced, again by air inlet element with in the cold air inspiration power supply unit with the cooling heat conducting element, by expulsion element the hot-air of power supply unit inside is discharged outside power supply unit and the host shell simultaneously then, reach the purpose that promotes the host computer radiating effect.
Other purpose of the present invention and function will be more clear after cooperating following accompanying drawing and being described further.
Fig. 1 has the host shell of power supply unit to get rid of the floor map of the mode of heat for showing known combination.
Fig. 2 has the host shell of power supply unit to get rid of the floor map of the mode of heat for showing known combination.
Fig. 3 is provided with expulsion element and heat conducting element for demonstration the present invention at power supply unit, and power supply unit is assembled in host shell inside with auxiliary floor map of heat being discharged the outer mode of host shell.
Fig. 4 is provided with air inlet element, expulsion element and heat conducting element and power supply unit is assembled in host shell inside with auxiliary floor map of heat being discharged the mode outside the host shell at power supply unit for showing the present invention.
Fig. 5 is the stereographic map of the structure of demonstration power supply unit of the present invention.
Fig. 6 is located at the embodiment partial perspective view on CPU next door for showing power supply unit of the present invention.
Fig. 7 can be set as the embodiment section plan as power supply unit shell some for showing heat conducting element of the present invention.
Among the figure:
(1) power supply unit (11) front panel
(111) slotted eye (12) rear panel
(2) air inlet element (3) expulsion element
(4) host shell (41) vent port
(5) CPU (6) heat conducting element
(7) conduit (A) power supply unit
(A1) fan (A2) socket
(A3) switch (B) host shell
(B1) fan (B2) vent port
(C) dividing plate (C1) hole
(D) motherboard (E) CPU
Consult Fig. 3, Fig. 5 and shown in Figure 6, the method of utilizing power supply to raise heat dissipating effect provided by the present invention, its first kind of embodiment, tie up to the set rear panel 12 in power supply unit 1 rear one or a plurality of expulsion element 3 are set, front panel 11 more is provided with plural slotted eye 111 for the cross-ventilation inside and outside the power supply unit 1; A side then is provided with heat conducting element 6 in the inside of power supply unit 1, and this heat conducting element 6 can be to utilize a plurality of undersized individual compositions, or one group of large-sized independent part; The preferred embodiment of described heat conducting element 6 is to adopt the metal material manufacturing with high thermal conductivity coefficient to form, and has the outstanding fin of plural number, to increase its heat absorption and area of dissipation; Moreover, this fin direction is set, preferably adopt horizontality ground and be provided with so that air can be from the place ahead of power supply unit toward the rear smoothly by each fin absorbing heat, and then be beneficial to discharging hot gas.
The present invention system is assembled in host shell 4 when inner with power supply unit 1, makes heat conducting element 6 near the CPU5 that are located in the host shell 4, and expulsion element 3 is then near the vent port 41 at host shell 4 rears; Therefore, the heat that is produced when CPU operates can be absorbed by heat conducting element 6 apace, and during expulsion element 3 running, the hot-air of power supply unit 1 inside directly can be extracted out outside the host shell 4, and when extracting hot-air out, cold air can enter from the slotted eye 111 of power supply unit 1 front panel 11 in the power supply unit 1 to absorb the heat of heat conducting element 6.The preferred embodiment in the present invention of aforesaid expulsion element 3 is to adopt fan.
In the time of may producing higher heat if there is network server to adopt the CPU of greater number, another embodiment of the present invention shown in Figure 4 also can solve this kind problem.Fig. 4 has shown that another structure of the present invention is its can be in power supply unit 1 the place ahead set front panel 11 and the set rear panel 12 in rear is provided with one or a plurality of air inlet element 2 and expulsion element 3 respectively, and front panel 11 more is provided with plural slotted eye 111 for the inside and outside cross-ventilation of power supply unit 1; Side at power supply unit 1 then is provided with aforesaid heat conducting element 6.It utilizes heat conducting element 6 to absorb from heat that CPU5 produces, and air inlet element 2 is when turning round simultaneously with expulsion element 3, can utilize air inlet element 2 that cold air is sucked power supply unit 1 inside with cooling heat conducting element 6, by expulsion element 3 simultaneously discharged power supply unit 1 and host shell 4 outside at power supply unit 1 inner formed hot-air this moment again, and its radiating effect is more remarkable.Preferred embodiment is to adopt fan among the present invention of aforesaid air inlet element 2 and expulsion element 3.
Aforementioned lifting heat dissipating method of the present invention, because its power supply unit 1 is vent port 41 positions that expulsion element 3 almost are located at host shell 4, thereby can directly hot gas be guided out outside the host shell 4, and the switch and the socket that are located at power supply unit still can allow the user use easily, more can not influence the application of host shell volume inside, that is reach best radiating effect in limited host shell inner space.
And for example shown in Figure 7, heat conducting element 6 of the present invention, also can be designed to L shaped shape, and then the orthogonal two panels of utilizing this L shaped shape is directly as the some of the top and side panel of power supply unit shell, and the vertical panel medial surface one at this L shaped shape extends out the fin that plural number is level, uses the heat-conducting effect that reaches identical.
By aforementioned method of the present invention, because having the heat conducting element of high heat transfer character, its utilization absorbs the heat that CPU produces, fit into again, expulsion element discharges power supply unit and host computer housing with heat, thereby can efficiently the heat of host shell 4 inside be discharged, reach the purpose that promotes radiating efficiency.
The above person only is in order to explain preferred embodiment of the present invention; be not that the attempt tool is to do any pro forma restriction to the present invention; so, all have in that identical invention spirit is following do relevant any modification of the present invention or change, all must be included in protection scope of the present invention.
Claims (7)
1. the method for a sharp power supply to raise heat dissipating effect, be expulsion element to be set at the rear of power supply unit, and the side at power supply unit is provided with heat conducting element, when described power supply unit is assembled in host shell inside, make this heat conducting element near the CPU in the host shell, expulsion element is then near the vent port at host shell rear, absorb the heat that CPU produced by described heat conducting element, described expulsion element is then discharged the hot-air of power supply unit inside outside the power supply unit host shell simultaneously.
2. according to the described method of utilizing power supply to raise heat dissipating effect of claim 1, it is provided with air inlet element in the place ahead of power supply unit further.
3. according to the described method of utilizing power supply to raise heat dissipating effect of claim 1, wherein, described heat conducting element is arranged on the sidewall of power supply unit inside.
4. according to the described method of utilizing power supply to raise heat dissipating effect of claim 1, wherein, this air inlet element is a fan.
5. according to the described method of utilizing power supply to raise heat dissipating effect of claim 1, wherein, this air inlet element is a fan.
6. according to claim 1, the 2 or 3 described methods of utilizing power supply to raise heat dissipating effect, wherein, this heat conducting element is a metal fins.
7. according to the described method of utilizing power supply to raise heat dissipating effect of claim 6, wherein, the heat conducting element that this has fin is that its fin is arranged on described power supply unit side with being the level of state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01118538 CN1196051C (en) | 2001-05-31 | 2001-05-31 | Method of utilizing power supply to raise heat dissipating effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01118538 CN1196051C (en) | 2001-05-31 | 2001-05-31 | Method of utilizing power supply to raise heat dissipating effect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1389770A true CN1389770A (en) | 2003-01-08 |
| CN1196051C CN1196051C (en) | 2005-04-06 |
Family
ID=4663258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01118538 Expired - Fee Related CN1196051C (en) | 2001-05-31 | 2001-05-31 | Method of utilizing power supply to raise heat dissipating effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1196051C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861085A (en) * | 2009-04-02 | 2010-10-13 | 索尼计算机娱乐公司 | Electronic equipment |
| CN102404978A (en) * | 2010-08-02 | 2012-04-04 | 富士电机株式会社 | Electronic device |
| CN109843028A (en) * | 2019-04-02 | 2019-06-04 | 淮海工学院 | Wireless sensor network node safety device |
-
2001
- 2001-05-31 CN CN 01118538 patent/CN1196051C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861085A (en) * | 2009-04-02 | 2010-10-13 | 索尼计算机娱乐公司 | Electronic equipment |
| US8243445B2 (en) | 2009-04-02 | 2012-08-14 | Sony Computer Entertainment Inc. | Electronic apparatus |
| CN101861085B (en) * | 2009-04-02 | 2013-08-14 | 索尼计算机娱乐公司 | Electronic apparatus |
| CN102404978A (en) * | 2010-08-02 | 2012-04-04 | 富士电机株式会社 | Electronic device |
| CN109843028A (en) * | 2019-04-02 | 2019-06-04 | 淮海工学院 | Wireless sensor network node safety device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1196051C (en) | 2005-04-06 |
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