CN1347151A - Package structure of CCD pick-up chip - Google Patents
Package structure of CCD pick-up chip Download PDFInfo
- Publication number
- CN1347151A CN1347151A CN 00129666 CN00129666A CN1347151A CN 1347151 A CN1347151 A CN 1347151A CN 00129666 CN00129666 CN 00129666 CN 00129666 A CN00129666 A CN 00129666A CN 1347151 A CN1347151 A CN 1347151A
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- China
- Prior art keywords
- chip
- pick
- substrate
- ccd
- upside
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Solid State Image Pick-Up Elements (AREA)
Abstract
A package structure of CCD pick-up chip is characterized by that a flip-chip bonding technique is used, in which the transparent glass is directly used as substrate, or the BT substrate, metal cap substrate, 1Metal PI Substrate, or Cavity down substrate is used. Its advantage is thin thickness.
Description
The present invention relates to a kind of CCD pick-up chip encapsulating structure, mainly be to be purpose with the thickness that reduces this CCD (charge coupled cell Charge Coupled Device) pick-up chip encapsulation module, utilize upside-down mounting chip (Flip Chip) joining technique, and directly two-way mirror is encapsulated as substrate (Substrate) making circuit; Or make slim CCD pick-up chip encapsulation module with the upside-down mounting chip joining technique various different substrates (BTsubstrate, Metal Cap Substrate, 1 Metal PI Substrate, Gavity DownSubstrate) of arranging in pairs or groups.
At present, do not belong at the non-CCD of the most advanced technology of video camera (charge coupled cell charge CoupIed Device) with the solid-state image element application, and in development so far, can be applicable to medical treatment respectively, industry, education, computerized information, traffic, fields such as general management, and generally as shown in Figure 1 in the structure of this traditional C CD encapsulation module 1 ', substrate 12 ' on a lead frame 11 ' sticks on pick-up chip 2 ' on the substrate 12 ' with routing Wire Bond method earlier, and the high barrier dam that rises is set around pick-up chip 2 ', 3 ', and at barrier 3 ' loam cake upper glass 4 ', make glass 4 ' and pick-up chip 2 ' every a suitable distance, go up shaping so that make capture track P see through glass 4 ' back at pick-up chip 2 ', at last, entire module is hardened with printed circuit PCB5 ' with lead frame 11 ' close.
Above-mentioned traditional C CD encapsulation module 1 ', because structural design is limit, the height of entire module is reduced, thus, utilize the microminiature application scenario at some, as extra small industrial introscope, digital camera ... Deng, encapsulation module that promptly must extra small height could effectively be dwindled this module area.
Main purpose of the present invention provides a kind of package structure of CCD pick-up chip, it uses a novel production process, adopt upside-down mounting chip encapsulation technology, substrate in conjunction with highly design reduces the height of whole CCD encapsulation module widely, makes some be applied to extra small height, light-weighted commercialization successfully is achieved.
The object of the present invention is achieved like this: mainly be to do the encapsulation of upside-down mounting chip by a pick-up chip and a substrate that highly designs to engage, its structure A is: its charge coupled cell CCD encapsulation module mainly is directly to produce circuit on the bottom surface of glass, and do upside-down mounting chip encapsulation with pick-up chip and combine, close circuit with the tin chou again and combine as circuit with printed circuit board (PCB).
Wherein be to insert between glass circuit and the pick-up chip, and still can pass transparent gross rubber or special chemical material and enter pick-up chip through the capture track of this glass with transparent gross rubber or special chemical material.
Purpose of the present invention also can be achieved in that it mainly is to make the structure B that the encapsulation of upside-down mounting chip engages by a pick-up chip with a substrate that highly designs: earlier with the BT of center drilling or the bonding glass of end face of Metal Cap substrate; Simultaneously produce proper circuit earlier at this BT or Metal Cap substrate bottom surface, again pick-up chip is bonded into charge coupled cell CCD encapsulation module with circuit on upside-down mounting chip bonding method and this BT or the Metal Cap substrate, again the whole CCD encapsulation module is engaged with printed circuit board (PCB) with the tin ball.
Wherein be to insert between BT or Metal Cap substrate and the pick-up chip with transparent gross rubber or special chemical material.
Purpose of the present invention can also be achieved in that it mainly is to make upside-down mounting chip package bonding structure C by the substrate that a pick-up chip and highly designs: elder generation is with the bonding glass of end face of the PI substrate of center drilling; Simultaneously produce proper circuit earlier, again pick-up chip is bonded into charge coupled cell CCD encapsulation module with upside-down mounting chip bonding method and this PI substrate, again the whole CCD encapsulation module is engaged with printed circuit board (PCB) with the tin ball at this PI base plate bottom.
Wherein be to insert between this PI substrate and the pick-up chip with transparent gross rubber or special chemical material.
Purpose of the present invention can be achieved in that it mainly is to make upside-down mounting chip package bonding structure D by the substrate that a pick-up chip and highly designs again: earlier with the bonding glass of end face upper notch of an Open Side Down substrate, on the following recess of Open Side Down substrate, engage a pick-up chip again with upside-down mounting chip bonding method, touch group to form charge coupled cell CCD encapsulation, this CCD encapsulation module is engaged with printed circuit with the tin ball.
Wherein Open Side Down between substrate and the pick-up chip is to insert with transparent gross rubber or special chemical material, and still can pass transparent gross rubber or special chemical material and enter pick-up chip through the capture track of this glass.
Be to be connected wherein with lead frame with the associated methods of printed circuit board (PCB), and should Open Side Down be to insert between substrate and the pick-up chip with transparent gross rubber or special chemical material.
Following conjunction with figs. describes technology contents of the present invention, characteristics and effect in detail:
Fig. 1 is the conventional art schematic diagram of charge coupled cell CCD encapsulation module.
Fig. 2 is that pick-up chip of the present invention engages schematic diagram with the upside-down mounting chip of glass substrate.
Fig. 3 is the another enforcement illustration that pick-up chip of the present invention engages with glass substrate upside-down mounting chip.
Fig. 4 is that pick-up chip of the present invention engages schematic diagram with the upside-down mounting chip of BT or Metal substrate.
Fig. 5 is another enforcement illustration that pick-up chip of the present invention engages with the upside-down mounting chip of BT or Metal substrate.
Fig. 6 is that pick-up chip of the present invention engages schematic diagram with the upside-down mounting chip of one deck alloy PI substrate.
Fig. 7 is the another enforcement illustration that pick-up chip of the present invention engages with the upside-down mounting chip of one deck alloy PI substrate.
To be pick-up chip of the present invention engage schematic diagram with upside-down mounting chip under shed substrate ((Solder) engages pcb board with the tin ball) to Fig. 8.
Fig. 9 another enforcement illustration that to be pick-up chip of the present invention engage with upside-down mounting chip under shed substrate ((Solder) engages pcb board with the tin ball).
Figure 10 is a pick-up chip of the present invention and engage schematic diagram under shed substrate ((lead) engages pcb board with lead frame) upside-down mounting chip.
Figure 11 is pick-up chip of the present invention and the another enforcement illustration that engages under shed substrate ((Lead) engages pcb board with lead frame) upside-down mounting chip.
The present invention is a kind of charge coupled cell CCD pick-up chip encapsulating structure, mainly be to do the encapsulation of upside-down mounting chip by a pick-up chip and a substrate that highly designs to engage, structure wherein can be following several forms: structure A (as shown in Figure 2): this charge coupled cell CCD encapsulation module 1 mainly is directly to produce circuit 121 and do upside-down mounting chip encapsulation with pick-up chip 11 to combine on the bottom surface of glass 12, combines as circuit with tin ball 13 combined circuits 121 and printed circuit board (PCB) 16 again.
Another structure A1 of the present invention (as shown in Figure 3): the charge coupled cell CCD encapsulation module 1 that is same as said structure A, be to insert between glass 12 circuit 121 and the pick-up chip 11 wherein with transparent gross rubber 14 or special chemical material 15, make whole CCD encapsulation module 1 more firm, and still can pass transparent gross rubber 14 or special chemical material 15 and enter pick-up chip 11 through the capture track P of this glass 12.
Another structure B of the present invention (as shown in Figure 4) is: earlier with the BT of center drilling or the bonding glass 22 of end face of Metal Cap substrate 23; Simultaneously produce proper circuit 231 earlier at this BT or Metal Cap substrate 23 bottom surfaces, again pick-up chip 21 is bonded into CCD encapsulation module 2 with circuit 231 on upside-down mounting chip bonding method and this BT or the Metal Cap substrate 23, more whole charge coupled cell CCD encapsulation module 2 is engaged with printed circuit board (PCB) 27 with tin ball 24.
Another structure B1 of the present invention (as shown in Figure 5): with the charge coupled cell CCD encapsulation module 2 of above-mentioned structure B, wherein be to insert between BT or Metal substrate 28 and the pick-up chip 21, make capture track P through this glass 22 still can pass transparent gross rubber 25 or special chemical material 26 and enter pick-up chip 21 with transparent gross rubber 25 or special chemical material 26.
Another structure C of the present invention (as shown in Figure 6) is: elder generation is with the bonding glass 32 of end face of the PI substrate 33 of center drilling; Simultaneously produce proper circuit earlier, again pick-up chip 31 is bonded into CCD encapsulation module 3 with upside-down mounting chip bonding method and this PI substrate 33, again whole CCD encapsulation module 3 is engaged with printed circuit board (PCB) 37 with tin ball 34 in these PI substrate 33 bottoms.
Another structure C 1 of the present invention (as shown in Figure 7): with the charge coupled cell CCD encapsulation module 3 of above-mentioned structure C, wherein be to insert between PI substrate 38 and the pick-up chip 31, make capture track P through this glass 32 still can pass transparent gross rubber 35 or special chemical material 36 and enter pick-up chip 31 with transparent gross rubber 35 or special chemical material 36.
A structure D (as shown in Figure 8) more of the present invention is: earlier with the end face upper notch 431 bonding glass 42 of an Open Side Down substrate 43, on the following recess 432 of Open Side Down substrate 43, engage a pick-up chip 41 again with upside-down mounting chip bonding method, to form a charge coupled cell CCD encapsulation module 4, this CCD encapsulation module 4 is engaged with printed circuit board (PCB) 48 with tin ball 44.
Another structure D1 of the present invention (as shown in Figure 9): with the charge coupled cell CCD encapsulation module 4 of above-mentioned structure D, wherein Open Side Down between substrate 43 and the pick-up chip 41 is to insert with transparent gross rubber 46 or special chemical material 47, makes capture track P through this glass 42 still can pass transparent gross rubber 46 or special chemical material 47 and enters pick-up chip 41.
A structure E (as shown in figure 10) more of the present invention is: be same as said structure D, the associated methods with printed circuit board (PCB) 48 wherein is to be connected with lead frame 45.
Another structure E1 of the present invention (as shown in figure 11): with the CCD encapsulation module 4 of above-mentioned structure E, wherein Open Side Down between substrate 43 and the pick-up chip 41 is to insert with transparent gross rubber 46 or special chemical material 47.
Claims (9)
1, a kind of package structure of CCD pick-up chip, it is characterized in that: mainly be to do the encapsulation of upside-down mounting chip by a pick-up chip and a substrate that highly designs to engage, its structure A is: its charge coupled cell encapsulation module mainly is directly to produce circuit on the bottom surface of glass, and do upside-down mounting chip encapsulation with pick-up chip and combine, close circuit with the tin chou again and combine as circuit with printed circuit board (PCB).
2, package structure of CCD pick-up chip as claimed in claim 1, it is characterized in that: wherein be to insert between glass circuit and the pick-up chip, and still can pass transparent gross rubber or special chemical material and enter pick-up chip through the capture track of this glass with transparent gross rubber or special chemical material.
3, a kind of package structure of CCD pick-up chip is characterized in that: mainly be to make the structure B that the encapsulation of upside-down mounting chip engages by a pick-up chip with a substrate that highly designs: earlier with the BT of center drilling or the bonding glass of end face of Metal Cap substrate; Simultaneously produce proper circuit earlier at this BT or Metal Cap substrate bottom surface, again pick-up chip is bonded into charge coupled cell CCD encapsulation module with circuit on upside-down mounting chip bonding method and this BT or the Metal Cap substrate, again the whole CCD encapsulation module is engaged with printed circuit board (PCB) with the tin ball.
4, package structure of CCD pick-up chip as claimed in claim 3 is characterized in that: wherein be to insert with transparent gross rubber or special chemical material between BT or Metal Cap substrate and the pick-up chip.
5, a kind of package structure of CCD pick-up chip is characterized in that: mainly be to make upside-down mounting chip package bonding structure C by the substrate that a pick-up chip and highly designs to be: elder generation is with the bonding glass of end face of the PI substrate of center drilling; Simultaneously produce proper circuit earlier, again pick-up chip is bonded into the charge coupled cell encapsulation module with upside-down mounting chip bonding method and this PI substrate, again the whole CCD encapsulation module is engaged with printed circuit board (PCB) with the tin ball at this PI base plate bottom.
6, package structure of CCD pick-up chip as claimed in claim 5 is characterized in that: wherein be to insert with transparent gross rubber or special chemical material between this PI substrate and the pick-up chip.
7, a kind of package structure of CCD pick-up chip, it is characterized in that: mainly be to make upside-down mounting chip package bonding structure D by the substrate that a pick-up chip and highly designs to be: earlier with the bonding glass of end face upper notch of an Open Side Down substrate, on the following recess of Open Side Down substrate, engage a pick-up chip again with upside-down mounting chip bonding method, touch group to form charge coupled cell encapsulation, this CCD encapsulation module is closed with tin ball and printed circuit board (PCB).
8, package structure of CCD pick-up chip as claimed in claim 7, it is characterized in that: wherein Open Side Down between substrate and the pick-up chip is to insert with transparent gross rubber or special chemical material, and still can pass transparent gross rubber or special chemical material and enter pick-up chip through the capture track of this glass.
9, package structure of CCD pick-up chip as claimed in claim 7, it is characterized in that: be to be connected wherein with lead frame with the associated methods of printed circuit board (PCB), and should Open Side Down be to insert between substrate and the pick-up chip with transparent gross rubber or special chemical material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00129666 CN1347151A (en) | 2000-10-10 | 2000-10-10 | Package structure of CCD pick-up chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00129666 CN1347151A (en) | 2000-10-10 | 2000-10-10 | Package structure of CCD pick-up chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1347151A true CN1347151A (en) | 2002-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00129666 Pending CN1347151A (en) | 2000-10-10 | 2000-10-10 | Package structure of CCD pick-up chip |
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| Country | Link |
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| CN (1) | CN1347151A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100390968C (en) * | 2003-02-19 | 2008-05-28 | 日本电气硝子株式会社 | Cover glass for semiconductor package and method for producing same |
| CN101406039B (en) * | 2006-03-22 | 2011-03-16 | 罗伯特·博世有限公司 | Method for assembling a camera module, and camera module |
| CN107665876A (en) * | 2016-07-27 | 2018-02-06 | 华邦电子股份有限公司 | Packaging body substrate, its manufacture method and packaging body |
| WO2021190141A1 (en) * | 2020-03-26 | 2021-09-30 | 苏州晶方半导体科技股份有限公司 | Packaging structure for chip and packaging method therefor |
-
2000
- 2000-10-10 CN CN 00129666 patent/CN1347151A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100390968C (en) * | 2003-02-19 | 2008-05-28 | 日本电气硝子株式会社 | Cover glass for semiconductor package and method for producing same |
| CN101406039B (en) * | 2006-03-22 | 2011-03-16 | 罗伯特·博世有限公司 | Method for assembling a camera module, and camera module |
| CN107665876A (en) * | 2016-07-27 | 2018-02-06 | 华邦电子股份有限公司 | Packaging body substrate, its manufacture method and packaging body |
| WO2021190141A1 (en) * | 2020-03-26 | 2021-09-30 | 苏州晶方半导体科技股份有限公司 | Packaging structure for chip and packaging method therefor |
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