CN1344015A - 半导体芯片安装设备 - Google Patents

半导体芯片安装设备 Download PDF

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CN1344015A
CN1344015A CN01132884A CN01132884A CN1344015A CN 1344015 A CN1344015 A CN 1344015A CN 01132884 A CN01132884 A CN 01132884A CN 01132884 A CN01132884 A CN 01132884A CN 1344015 A CN1344015 A CN 1344015A
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light
picture
taking device
semiconductor chip
optical sensor
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CN1206715C (zh
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尤金·曼哈特
陈勤
托马斯·冈瑟
费力克斯·刘
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Besi Switzerland AG
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Abstract

半导体芯片安装设备,包括带取片器(6)的焊头(5),取片器(6)设有抽真空吸抓和输送半导体芯片的纵向钻孔(9)。为了检测取片器(6)是否吸住半导体芯片(7),在取片器(6)的纵向钻孔(9)中设有反射面形成的体(15),无半导体芯片(7)时取片器在光源(10)上通过时,将从下边来的光偏转进入取片器(6)的纵向钻孔(9)并进入水平平面(17),取片器(6)位于让光源(10)的偏转光通过的位置。设在焊头(5)上的至少一个光学元件(19、19.1、19.2)使从取片器(6)侧向出射的偏转光的至少一部分聚焦在光传感器(18)上。

Description

半导体芯片安装设备
技术领域
本发明涉及半导体芯片安装设备。
技术背景
半导体芯片的安装中，用所谓的裸片键合器作自动组装机，它用焊头取片器在第1位置抓取要安装的半导体芯片，并把芯片放到第2位置的衬底上。焊头有带真空吸咀的取片器，在芯片输送过程中，用取片器固定芯片。已开发出各种测试仪来检测是否成功地拾取半导体芯片。用第1测试仪，在焊头中在真空吸咀上端设有光传感器，取片器在从第1位置到衬底的路径上通过光源，取片器上无半导体芯片时，光传感器中产生光感应脉冲。由于空间原因，还没开发出体积最小的可能执行各功能的焊头的测试仪。
已知的另一测试仪中，半导体芯片在输送中通过光障。该测试仪的缺点是光障必须准确地调节到输送高度。
由于半导体芯片与裸片夹弹性头取片器之间的密封通常很差。因此，当已拾取半导体芯片而吸咀密闭时，真空吸咀的真空强度要很大，测试只部分合适。
发明内容
本发明的目的是开发一种测试仪，它能可靠地测试半导体芯片是否位于取片器上，而无须调节。
本发明半导体芯片的安装设备包括：有带取片器的焊头，取片器设有抽真空吸抓和输送半导体芯片的纵向钻孔；光源和光传感器，用于检测取片器是否吸住半导体芯片，在没有半导体芯片时从光源发射的光是否进入取片器的纵向钻孔到达光传感器，来其特征是，取片器的纵向钻孔中设反射面构成的体，它偏转从下面进入取片器的纵向钻孔的光到水平平面；取片器位于光源发射的光通过的位置；至少一个光学元件设在焊头上将从取片器侧向出现的偏转光的至少一部分汇聚在光传感器上。
用测试仪完成提出的任务，测试仪有从光源发射的光，在无半导体芯片时，由径向垂直于取片器的纵向钻孔的光偏转元件偏转从取片器的纵向钻孔通过的光，并将其引入光传感器进行检测。而且，为了尽可能地将大部分横侧出现的光偏转到光传感器上，测试仪最好设有反光器。
以下在附图的基础上更详细说明本发明的实施例，图中没有尺度。
图1是用于半导体芯片的安装设备，它有带取片器的焊头；
图2是设有按本发明的测试仪的焊头的横截面图；
图3是测试仪第1实施例的平面图；
图4是取片器的详细图；
图5是测试仪的第2实施例；
图6是产生平行光束的光源。
实施方式
图1示出了理解本发明的半导体芯片安装设备所必须已知的部件，例如，已由欧洲专利申请EP-932111所公开的部件。设备包括所谓的取片和放置系统1，它能按两个直角坐标方向2、3移动，具有能按垂直方向4升起和下降的焊头5，焊头5有取片器6，取片器6把半导体芯片7从第1位置A输送到将芯片7放到衬底8上的第2位置B。
取片器6有纵向钻孔9。通过钻孔9可以抽真空，以吸住半导体芯片7。焊头6按从位置A到位置B的路径通过牢固设置的光源10的上方。贴到取片器6上的半导体芯片7通过光源10上方时，没有从光源10发射的光通过纵向钻孔9。若取片器6上没有半导体芯片7时，光源10发射的光通过纵向钻孔9。
图2是有取片器6的和有测试仪的焊头5的横截面图。测试仪检测无半导体芯片7时由光源发射的通过纵向钻孔9的光。取片器6能相对于焊头5按垂直方向4移动，并按它的纵轴转动。取片器6包括不透光的上部11和下部12。用能使光源10发射的光透过的连接件13把上部11和下部12连在一起。连接件13插入上部11和下部12中的纵向钻孔9中。连接件13有带反射尖端16以纵向钻孔9的对称轴14为中心的体15。反射尖端16相对于纵向钻孔9的纵轴14是旋转地对称。形成尖端16的表面与垂直方向4成45°角的圆锥形，使从光源10发射的光从下面进入纵向钻孔9的光在尖端16反射进水平平面17，并随后从取片器16射出。光传感器18安装在焊头5上，用于测试后面射出的光，并至少一个光学元件19，用于使水平面17中出现的光偏转和/或聚焦在光传感器8上。为了清楚地画出，只指出对称的光学元件；有关它的位置和延伸的详细情况可从图3和5中看到。光传感器18例如是光电二极管或光晶体管。
第1实施例中，光学元件19是椭圆形反光体，它的反射尖端16位于椭圆的一个焦点20中(图3)，光传感器18位于椭圆的另一焦点21中(图3)。按此方式，水平平面17中的光偏转到光传感器18上而与它在水平平面17上所取的方向无关。
图3示出了通过水平平面17的部分中的椭圆形反射体19′、反射尖端16和光传感器18。图中还画出了椭圆的两个焦点20到21，以及在尖端16偏转的光的不同光来路径22。椭圆反射体19′不是全闭合的，其原因是，在反射体上反射的光必须从前面落在光传感器18上。用椭圆反射体能使侧面光的80％左右汇聚在光传感器18上。
图4示出第2实施例，它有两个光学元件19.1和19.2，以使水平平面17中反射的光引入到光传感器18上。第1光学元件19.1是把尖端16上偏转的光的一部分聚焦在光传感器18上的透镜。透镜的数值孔径是尽可能大。用0.5的数字式光栅、孔径角为60°，水平平面17中的光的17％左右引入光传感器18。对称轴14穿过透镜焦点20。光传感器18位于透镜焦点21中。第2光学元件是几乎为圆柱形的反射体，在其圆周处的角也是60°左右，它反射回落在它上面的光，使通过透镜的光到达光传感器18。反射体应使光反射通过本体15的尖端并到达透镜。由于本体15的尖端16引起的影，应计入的某些光损失约为10-40％。可用例如有抗反射涂层的双非球面形透镜。
第3实施例中，测试仪只包括第1光学元件19.1，即第2实施例中的透镜，但没有第2光学元件19.2，即反射体。但是，这只允许尖16偏转的光的很少一部分在光传感器18聚焦。
光源10发射的并通过纵向钻孔9的光有一定的光束宽度。光传感器18的光敏面积在垂直方向应足够大，以便收集尽可能是光源10发射的全部原始光。当主体15的反光尖端16和/或反射体适合光源10发射的光束23的特性时(图5)，光传感器18垂直方向4的延伸可缩短。
例如，如果用没有附加光学元件的通用的发光二极管作光源，之后，它发射的光束不会平行运行，而是发散。
形成本体15的尖端16的表面最好是凹形，如图5所示，便于使本体15上反射的光束26按垂直方向在光传感器18上聚焦。用第1实施例，曲率一方面要适合光束23的发射，另一方面要适合从本体15至光传感器18的光束路径的长度(见图3)。用第2实施例，一方面曲率要适合光束23的发散，另一方面，曲率要适合于直接到达光传感器18的光束的光束路径的长度，或者，曲率要适合经反射体间接到达光传感器18的光束的光束路径长度。该实施例中，形成本体15的尖端16的表面最好是曲面，使离开本体15的尖端16的反射光束是平行光束26。该例的优点是，能改变在本体15上反射后直接到达光传感器18的光束的光束路径长度，使其与只是在反射体上反射后到达光传感器18的光束的光束路径长度无差别。
另一种可能是，如图6所示。用发射几乎是平行光束23的光的光源10。这种光源10包括例如，发光二极管24和透镜25，使发光二极管24位于透镜25的焦点。本体15的反射面最好是圆锥尖，使平行入射光束组成的光23离开本体15时也是平行束光26。但是，本体15的反射面也可是曲面，使光垂直聚焦在光传感器18上。
所述的实施例中，用镜面抛光的铝构成反射体。
为了避免外部光引起误差，光学元件或元件19和光传感器18最好装在不透光的壳中。最好用已知的锁相技术调制光源10发射的光。此外，光源最好以脉冲模式工作。即，当取片器6通过光源10时，它只短期转换。按脉冲模式，施加比连续工作中电流大的电流，以提高测试灵敏度。
由于尖端16旋转对称，所以测试结果与取片器6的实际转动位置无关。
已上已说明了本发明的实施例和应用。但本行业的技术人员会发现，在不脱离本发明原理的范围内，除了上述内容外还会有许多改进。本发明除了权利要求书及其等效元件所规定的发明精神之外，上述实施例不构成对发明的限制。

Claims (6)

1.一种半导体芯片的安装设备，有带取片器(6)的焊头(5)，取片器(6)设有抽真空吸抓和输送半导体芯片(7)的纵向钻孔(9)；光源(10)和光传感器(18)，用于检测取片器(6)是否吸住半导体芯片(7)，在没有半导体芯片(7)时从光源(10)发射的光是否进入取片器(6)的纵向钻孔(9)到达光传感器，来其特征是，取片器(6)的纵向钻孔(9)中设反射面构成的体(15)，它偏转从下面进入取片器(6)的纵向钻孔(9)的光到水平平面(17)；取片器(6)位于光源(10)发射的光通过的位置；至少一个光学元件(19；19.1，19.2)设在焊头(5)上将从取片器(6)侧向出现的偏转光的至少一部分汇聚在光传感器(18)上。
2.按权利要求1的设备，其特征是，光学元件(19)是椭圆形反射体，反射本体(15)的反射面设在椭圆反射体的第1焦点(20)中，光传感器(18)设在椭圆的第2焦点(21)中。
3.按权利要求1的设备，其特征是，光学元件(19.1)是透镜，和第2光学元件(19.2)以反射镜形式存在。
4.按权利要求1的设备，其中，光学元件(19.1)是透镜，光传感器(18)设在透镜的焦点(21)上。
5.按权利要求1至4之一的设备，其特征是，光学元件或光学元件(19)和光传感器(18)装在不透光的壳中。
6.按权利要求1至5之一的设备，其特征是，还设有透镜(25)，以产生几乎是平行光束(23)的光束，由此，光源(24)设在透镜(25)的焦点上。
CNB011328843A 2000-09-13 2001-09-12 半导体芯片安装设备 Expired - Fee Related CN1206715C (zh)

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SG95672A1 (en) 2003-04-23
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TW535250B (en) 2003-06-01
US20020031423A1 (en) 2002-03-14
HK1044853A1 (zh) 2002-11-01

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