CN1336021A - 制造一卷物品的方法和设备 - Google Patents
制造一卷物品的方法和设备 Download PDFInfo
- Publication number
- CN1336021A CN1336021A CN00802546A CN00802546A CN1336021A CN 1336021 A CN1336021 A CN 1336021A CN 00802546 A CN00802546 A CN 00802546A CN 00802546 A CN00802546 A CN 00802546A CN 1336021 A CN1336021 A CN 1336021A
- Authority
- CN
- China
- Prior art keywords
- article
- softness
- circuit
- carrier
- distributing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Wire Bonding (AREA)
- Continuous Casting (AREA)
- Rolls And Other Rotary Bodies (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (26)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99850020A EP1028483B1 (en) | 1999-02-10 | 1999-02-10 | Method and device for manufacturing a roll of antenna elements and for dispensing said antenna elements |
EP99850020.1 | 1999-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1336021A true CN1336021A (zh) | 2002-02-13 |
CN1322630C CN1322630C (zh) | 2007-06-20 |
Family
ID=8243751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008025460A Expired - Lifetime CN1322630C (zh) | 1999-02-10 | 2000-02-10 | 制造一卷物品的方法和设备 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1742294B8 (zh) |
JP (1) | JP2002536939A (zh) |
KR (1) | KR100698929B1 (zh) |
CN (1) | CN1322630C (zh) |
AT (2) | ATE392726T1 (zh) |
DE (1) | DE69933356T2 (zh) |
DK (1) | DK1028483T3 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200846250A (en) * | 2007-05-18 | 2008-12-01 | Pyroswift Folding Co Ltd | Manufacture method of tag-typed integrated soft circuit board and a structure thereof |
KR101025964B1 (ko) * | 2009-08-10 | 2011-03-30 | 삼성전기주식회사 | 안테나 패턴 프레임의 제조방법 및 제조장치 |
KR101531383B1 (ko) * | 2014-07-07 | 2015-06-24 | 주식회사 에이티앤씨 | 스티커형 안테나 제조방법 |
DE102023202844A1 (de) | 2023-03-28 | 2024-10-02 | Infineon Technologies Ag | Verfahren zum Herstellen eines Substratelements, Substratelement und Vorrichtung mit einem Substratelement |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2122967A (en) * | 1982-06-18 | 1984-01-25 | Gianuario Messina | A machine for applying self- adhesive protective labels on papers, cards and the like |
JPS62293737A (ja) * | 1986-06-13 | 1987-12-21 | Matsushita Electric Ind Co Ltd | 樹脂シ−トからの半導体小片取外し方法 |
US4843404A (en) * | 1986-09-29 | 1989-06-27 | Monarch Marking Systems, Inc. | Tag web of spiral conductors |
AU1712188A (en) * | 1987-04-27 | 1988-12-02 | Soundcraft, Inc. | Method for manufacture of and structure of a laminated proximity card |
CN1014481B (zh) * | 1988-07-13 | 1991-10-23 | 徐承先 | 热压镶嵌法制造印刷电路板 |
MY105514A (en) * | 1989-05-05 | 1994-10-31 | Gould Electronic Inc | Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing. |
US5391180A (en) * | 1991-08-05 | 1995-02-21 | United States Surgical Corporation | Articulating endoscopic surgical apparatus |
JPH05211184A (ja) * | 1991-12-10 | 1993-08-20 | Nec Corp | ダイボンディング装置 |
US5649350A (en) * | 1995-10-18 | 1997-07-22 | Ericsson Inc. | Method of mass producing printed circuit antennas |
DE19635232A1 (de) * | 1996-08-30 | 1998-03-05 | Siemens Ag | Verfahren und Vorrichtung zur plasmachemischen Zersetzung und/oder Vernichtung von Schadstoffen |
-
1999
- 1999-02-10 EP EP06019921A patent/EP1742294B8/en not_active Expired - Lifetime
- 1999-02-10 AT AT06019921T patent/ATE392726T1/de not_active IP Right Cessation
- 1999-02-10 AT AT99850020T patent/ATE341108T1/de not_active IP Right Cessation
- 1999-02-10 DK DK99850020T patent/DK1028483T3/da active
- 1999-02-10 DE DE69933356T patent/DE69933356T2/de not_active Expired - Lifetime
-
2000
- 2000-02-10 KR KR1020017009023A patent/KR100698929B1/ko not_active IP Right Cessation
- 2000-02-10 CN CNB008025460A patent/CN1322630C/zh not_active Expired - Lifetime
- 2000-02-10 JP JP2000599096A patent/JP2002536939A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20010101572A (ko) | 2001-11-14 |
ATE392726T1 (de) | 2008-05-15 |
JP2002536939A (ja) | 2002-10-29 |
EP1742294A2 (en) | 2007-01-10 |
EP1742294B1 (en) | 2008-04-16 |
KR100698929B1 (ko) | 2007-03-23 |
DE69933356D1 (de) | 2006-11-09 |
ATE341108T1 (de) | 2006-10-15 |
DK1028483T3 (da) | 2007-01-29 |
EP1742294B8 (en) | 2010-12-22 |
CN1322630C (zh) | 2007-06-20 |
DE69933356T2 (de) | 2007-05-10 |
EP1742294A3 (en) | 2007-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: AMC CENTURION AG Free format text: FORMER OWNER: ALLGON AG. Effective date: 20030710 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20030710 Address after: Swedish O Kersh Beria Applicant after: AMC Centurion AB Address before: Swedish O Kersh Beria Applicant before: Allgon AB |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LAIRD SCIENCE AND TECHNOLOGY( SHENZHEN ) CO., LTD. Free format text: FORMER OWNER: AMC SENT RYAN STOCK CO., LTD. Effective date: 20090821 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090821 Address after: Shenzhen City, Baoan District Fuyong street Chongqing Road Industrial Park Building second Fulda Patentee after: Laird Technology (Shenzhen) Co., Ltd. Address before: Swedish O Kersh Beria Patentee before: AMC Centurion AB |
|
ASS | Succession or assignment of patent right |
Owner name: TIANJIN LAIRD ELECTRONIC MATERIALS CO., LTD. Free format text: FORMER OWNER: LAIRD TECHNOLOGIES (SHENZHEN) LTD. Effective date: 20130609 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518103 SHENZHEN, GUANGDONG PROVINCE TO: 300457 HANGU, TIANJIN |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130609 Address after: The 300457 Tianjin economic and Technological Development Zone Taifeng Road No. 87 Hongtai Industrial Park C3&C4 building Patentee after: Tianjin Laird Electronic Materials Co., Ltd. Address before: 518103 Shenzhen City, Baoan District Fuyong street Chongqing Road Industrial Park Building second Fulda Patentee before: Laird Technology (Shenzhen) Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20070620 |
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CX01 | Expiry of patent term |