CN1331833A - Method for producing wound plastic film capacitor - Google Patents
Method for producing wound plastic film capacitor Download PDFInfo
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- CN1331833A CN1331833A CN99815028A CN99815028A CN1331833A CN 1331833 A CN1331833 A CN 1331833A CN 99815028 A CN99815028 A CN 99815028A CN 99815028 A CN99815028 A CN 99815028A CN 1331833 A CN1331833 A CN 1331833A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The method of the invention for producing wound plastic film capacitor is that, a thermally-adhesive resin layer (6) is laminated on one side of each of plastic films (1a, 2a, 1b, 2b). The one sides are the same sides (that is, the front sides or the back sides) of the plastic films (1a to 2b). Metallic layers (3, 4) are formed on the opposite side of each of the plastic films (1a, 1b) opposite to the one side where the thermally-adhesive resin layer (6) is laminated. The laminate is wound and heated to form a wound plastic film capacitor. The films are not separated from each other even though impregnation with an epoxy resin is not performed, and hence void discharge due to film separation can be prevented. Since no epoxy resin is needed, the productivity is enhanced and the material cost is reduced. The dielectric breakdown voltage of such a wound plastic film capacitor is almost equivalent to that of conventional types in which impregnation with epoxy resin is carried out. Similar effects are produced when the front sides and back sides are interchanged.
Description
Technical field
The present invention relates to the manufacture method of wound plastic film capacitor, in more detail, relate to the manufacture method of the wound plastic film capacitor that several plastic films will not rolling soak in epoxy resin etc.The manufacture method of such wound plastic film capacitor mainly is used in the high voltage source of cathode ray tube.
Background technology
Always, for wound plastic film capacitor (following be called for short sometimes " capacitor "),, often a plurality of electrostatic condensers are connected in series in the inside of capacitor in order to improve its withstand voltage properties.Fig. 7 represents an one example, and a plurality of electrode layers 3 that utilize vacuum deposition method to form at the back side of plastic film 1 keep length direction the state configuration respectively to insulate of predetermined space at film.These electrode layers 3 and the 4 relative configurations of two adjacent electrode layers, described electrode layer 4 are gone up with same method at another plastic film 1 ' and are formed.Lead-in wire 8 is drawn from the electrode layer at the two ends of plastic film 1 or 1 '.Such plastic film 1a and 1b are reeled simultaneously, make wound plastic film capacitor.
Fig. 8 represents the equivalent circuit of capacitor shown in Figure 7, lead-in wire be connected in series with between 8 capacitor element C1, C2 ..., C7, C8, each capacitor element C1, C2 ..., C7, C8 be applied in dividing potential drop V1, the V2 of the voltage Vs between 8 that goes between ..., V7, V8.On a capacitor element, apply under the situation of voltage Vs, capacitor element can not tolerate this high voltage, there are situations such as emission blast, damage to take place, utilize the method that like this voltage Vs is segmented on a plurality of capacitors, can improve the performance of the tolerance high pressure of capacitor.
But in order to ensure high pressure resistant, preferably there are not insulation defects such as pin hole in film inside to be used in the plastic film (following sometimes be called for short " film ") of this capacitor, is difficult but will eliminate insulation defect fully when making film.
Therefore, will not form many pieces of electrode layer does not have the plastic film of decorative pattern to be clipped between the plastic film that forms electrode layer, the withstand voltage decline that the insulation defects such as pin hole that utilize method compensation with these film overlaies to be present in film inside cause.Fig. 9 is the one example, clips 2 pieces of plastic films 5 and 5 ' that do not have decorative pattern between the plastic film 1 and 1 ' that forms electrode layer.
In this case, if it is many to be clipped in piece number of the plastic film that does not have decorative pattern 5 between the electrode layer, then can compensate the withstand voltage decline that the insulation defect place causes more, on the other hand, because the inefficiency of coiled film 1a etc. is clipped in the plastic film 1a of formation electrode layer and piece number of the plastic film that does not have decorative pattern 5 between the 1b and it seems with 3 pieces to suitable.
(being rolling) of reeling is thin film dipped in liquid-state epoxy resin.This dipping operation is also referred to as vacuum impregnation, the air that will be present between the film is driven out of, utilize the epoxy resin displacement of withstand voltage excellence, can be suppressed at the space discharge of the minim gap generation of the part (highfield part) that is present in the electric-field strength on the electrode layer in the minim gap (claiming such gap to be " air gap " below sometimes) that exists between the film with this.
But, at existing wound plastic film capacitor, particularly also apply high-tension high voltage therein with in the wound plastic film capacitor, in order to make the many pieces of plastic films of having reeled is to soak into epoxy resin fully between all film, must be under the low state of epoxy resin viscosity, for a long time film rolling be impregnated in the epoxy resin in high vacuum.Therefore, film rolling be impregnated in the big problem that operation in the epoxy resin has become to improve capacitor production efficiency.Again, in order to improve the wetting property of epoxy resin to film rolling, normally the capacitor with heating immerses in the epoxy resin, but because heating, the ring-opening polymerisation of epoxy resin is quickened, epoxy resin viscosity increases, and therefore can use the time of epoxy resin short, consequently the material cost height.
The present invention makes for addressing the above problem, its purpose is, provide need not epoxy resin impregnated coiling many pieces of plastic films, also can suppress contingent space discharge between the film, enhance productivity with this, reduce material cost, improve the manufacture method of the wound plastic film capacitor of withstand voltage properties and moisture resistance properties simultaneously.
Summary of the invention
The manufacture method of wound plastic film capacitor of the present invention, comprise with
At the front of plastic film 1 lamination thermal bonding resin bed 6, overleaf a plurality of electrode layers 3 of mutually insulated are formed at the 1st metallized film 1a on the length direction,
Only the 1st thin dielectric film 2a of the front of plastic film 5 lamination thermal bonding resin bed 6,
At plastic film 2 front lamination thermal bonding resin beds 6, overleaf a plurality of electrode layers 4 of mutually insulated are formed on the length direction the 2nd metallized film 1b and
Only at the 2nd thin dielectric film 2b of the front of plastic film 5 lamination thermal bonding resin bed 6,
The 1st thin dielectric film 2a is being clipped between the 1st metallized film 1a and the 2nd metallized film 1b, the 2nd metallized film 1b is clipped between the 1st thin dielectric film 2a and the 2nd thin dielectric film 2b, and reeled under the overlapped state of 2 adjoining in the longitudinal direction electrode layers that each electrode layer 3 of the 1st metallized film 1a and the 2nd metallized film 1b go up to form 4, make film rolling the coiling operation and
With the film rolling heating, utilize thermal bonding resin bed 6 with mutual bonding heat bonding operation between the 1st metallized film 1a, the 1st thin dielectric film 2a, the 2nd metallized film 1b and the 2nd all films of thin dielectric film 2b.
In the present invention, 6 fronts at all plastic films of thermal bonding resin bed form, therefore the cooling after the heating causes that the amount of contraction of each plastic film when the thermal bonding resin bed shrinks is little, even, also can suppress gap discharge effectively so many pieces of plastic films will not reeling impregnated in the epoxy resin.Also have, even, also can access identical effect front and reverse side exchange.In order to make amount of contraction as far as possible little, the thickness difference absolute value that preferably makes metallized film 1a, 1b and thin dielectric film 2a, 2b is less than 3 microns.
Particularly make temperature that the thermal bonding at the thermal bonding resin bed of the front of metallized film lamination occurs different with temperature in the thermal bonding appearance of the thermal bonding resin of the front of thin dielectric film lamination, can prevent more effectively that with this bonding incomplete situation of each film from taking place, this temperature difference is preferably more than 10 ℃.
If the maximum surface smoothness Rmax of each film is more than 0.5 micron, below 4.0 microns, then can access has the ability of bearing load fully when high temperature, and after the discharge the stable capacitor specific characteristics that capacitance descends can not take place yet repeatedly.
Summary of drawings
Below the present invention is described in detail.
Fig. 1 is the layer-by-layer state profile of 4 pieces of film 1a～2b in the manufacture method of film capacitor of the present invention.
Fig. 2 is the layer-by-layer state profile of 6 pieces of film 1a～2d in the manufacture method of film capacitor of the present invention.
Fig. 3 is the curve chart of relation of the amount of contraction of expression heating-up temperature and film.
Fig. 4 is the profile of layer-by-layer state of film in the manufacture method of the existing film capacitor of expression.
Fig. 5 is the film capacitor that the side utilizes resin to seal.
Fig. 6 is the profile of the layer-by-layer state of 6 pieces of film 1a～2d in the manufacture method of film capacitor of expression embodiment 1.
Fig. 7 is the profile of layer-by-layer state of film in the manufacture method of the existing film capacitor of expression.
Fig. 8 is the equivalent circuit diagram of film capacitor shown in Figure 7.
The picture top expression of all in this application accompanying drawings is positive, the expression back side, accompanying drawing picture below.
Detailed description of the invention
Below the present invention is described in detail.
The coiling operation
As shown in Figure 1, in the present invention at first with the 1st metallized film 1a, the 1st thin dielectric film 2a, the 2nd metallized film 1b and the overlapping in regular turn coiling of the 2nd thin dielectric film 2b.The 1st metallized film 1a is by forming thermal bonding resin bed 6 at the front lamination, and the plastic film 1 of going up a plurality of electrode layers 3 that form mutually insulated in the longitudinal direction overleaf constitutes.Equally, the 2nd metallized film 1b is also by forming thermal bonding resin bed 6 at the front lamination, and the plastic film 1 of going up a plurality of electrode layers 4 that form mutually insulated in the longitudinal direction overleaf constitutes.
In the film rolling of plastic film 1a～2b, preferably draw 2 lead-in wires 8 that are electrically connected with these electrode layers 4a respectively from the electrode layer 4a of the end of the length direction of the 2nd metallized film 1b in advance.In Fig. 1, draw 2 lead-in wires 8 from the electrode layer 4a of the end of the 2nd metallized film 1b, but 2 bar lead-in wire 8 can be drawn from the electrode layer 3a of the end of the length direction of the 1st metallized film 1a, also can draw 1 lead-in wire, and draw another lead-in wire 8 from the electrode layer 4a of the end of the length direction of the 2nd metallized film 1b from the electrode layer 3a of the end of the length direction of the 1st metallized film 1a.After the coiling operation, will go between between the 8 insertion films so that the method for lead-in wire 8 to be set, or the method that lead-in wire 8 is set in the film rolling side after the heat bonding operation neither not consider, but will be electrically connected the electrode layer and the lead-in wire of the length direction end of its film inconvenient in this way.Therefore, be electrically connected easy consideration, preferably before reeling, draw lead-in wire 8 from the length direction end of metallized film 1a or 1b in advance from electrode layer and lead-in wire.Also have, in this case, electrode layer 3a, 4a and lead-in wire 8 utilizations for example method such as welding are connected.
Relation between the 1st metallized film 1a and the 2nd metallized film 1b is described as follows, promptly as shown in Figure 1, the 1st thin dielectric film 2a is clipped, and 2 close mutually in the longitudinal direction electrode layers 4 of each electrode layer 3 of the 1st metallized film 1a and the last formation of the 2nd metallized film 1b are overlapped.The thin dielectric film that is clipped between the 1st metallized film 1a and the 2nd metallized film 1b is not limited to 1 piece, as shown in Figure 2, the situation that clips 2 pieces of thin dielectric film 2a, 2c is also arranged, but also be that 2 pieces of thin dielectric film 2a, 2c have thermal bonding resin 6 in its front respectively in this case.
The 1st thin dielectric film 2a that clips between the 1st metallized film 1a and the 2nd metallized film 1b is made of a plastic film 5 at front lamination thermal bonding resin bed 7a.Equally, the 2nd thin dielectric film 2b also is made of a plastic film 5 at front lamination thermal bonding resin bed 7b.
The plastics that constitute each plastic film 1,5 are thermoplastic plastic preferably, according to marked downly bought, chemical property, these reasons of stable mechanical performance, wherein more satisfactory is PETG, polypropylene, PEN, it would be desirable PETG.
The thermal bonding resin that constitutes thermal bonding resin bed 6 can be a thermosetting resin, it also can be thermoplastic resin, when using thermosetting resin, the film rolling of many pieces of plastic films will reeling not impregnated in the epoxy resin and can effectively the air between each film 1a～2b be driven away yet, can suppress the space discharge with this, from this reason, preferably use epoxy resin, phenolic resins, polyurethane resin, allyl resin, and silicones, wherein, discharge to suppress the space most effectively from the air that can drive away most effectively between each film 1a～2b, chemically, mechanically also stable reason is set out, then to use epoxy resin for the most desirable.And using under the situation of thermoplastic resin, according to top described identical reason, preferably using mylar or EVA is resin as the alkene (olefine) of main component.
With these films 1a～2b one-tenth roller shape (not shown) of overlapped coiling in regular turn, make film rolling.About 10 meters/minute～about 50 meters/minute of winding speeds.
The manufacture method of metallized film 1a, 1b is not particularly limited, have at the back side of plastic film 1 and be coated with shadow mask oil (masking oil) evaporation metal afterwards, then remove shadow mask oil shadow mask oil method, replace shadow mask oil with the belt and the plastic film 1 in hole with regulation, it is walked simultaneously, on one side the band evaporation coating method etc. of evaporation metal.Again, the means that form thermal bonding resin bed 6 on each plastic film 1,5 surface also are not particularly limited, have the thermal bonding resin dissolves in specified solvent, with make after the surface of this solution coat plastic film 1,5 its dry method with the same with metallized film direct with its thermal bonding resin evaporation to the method on plastic film 1,5 surfaces etc.
The heat bonding operation
Then film rolling is heat-treated, make thermal bonding resin bed 6 softening/fusing, so that each film 1a～2b is in addition bonding.At thermal bonding resin bed 6 is under the situation of thermosetting resin, material with resin, character also has relation, but thermal bonding resin bed 6 is to be in resin (the B level that the indeformable what is called of finger pressure " refers to touch hardening state " under the normal temperature before the heat bonding, each molecule of resin is in the state of two-dimentional combination), spend Celsius approximately 80 that heating made its fusing in 1 hour under the temperature of to about 100 degree (preferably about 100 degree), at thermal bonding resin bed 6 is under the situation of thermoplastic resin, though also because of the material of resin, character and variant, heating makes its softening or fusing under the temperature of to about 130 degree (preferably about 100 degree) but can spend Celsius approximately 80, so that each film 1a～2b is in addition bonding.
Like this heating with each film 1a～2b in addition bonding after, bonding plastic film is positioned over thermosetting resin hardened once again, can obtain wound plastic film capacitor.
In the present invention, with such Simple volume around film rolling heat treatment in addition, make the 6 softening/fusings of thermal bonding resin bed, with this that each film 1a～2b is bonding in addition, bonding by thermal bonding resin bed 6 between all film 1a～2b, the air that exists between each film 1a～2b is excluded when heat bonding.By means of this, even the film rolling epoxy resin-impregnated of many pieces of plastics will reeling etc. not also can suppress to be present in the gap discharge that takes place in the minim gap (air-gap) of part (highfield part) of the electric-field strength on the electrode layer.
Below this is elaborated.As shown in Figure 3, the plastic film of lamination thermal bonding resin bed 6 be heated 2 pieces of overlapping, overlapped plastic film 1a～2b bonding after in case cool off, the thermal bonding resin just shrinks, meanwhile, film 1a～2b also shrinks.On the other hand.Even do not have plastic film cooling after heating of lamination thermal bonding resin, do not have the plastic film of lamination thermal bonding resin to shrink so much yet.Again, even plastic film at a face superimposed layer thermal bonding resin, do not have under the situation of lamination metal layer (that is only under situation of the plastic film of a face lamination thermal bonding resin) at its another side, compare with the plastic film of its another side lamination metal layer, its amount of contraction is big.
Shown in Fig. 4 (a), make that only two pieces of plastic film 91a at a face superimposed layer thermal bonding resin bed 91a are relative, and 91a is relative with its thermal bonding resin bed, between the thermal bonding resin bed 91a of two pieces of relative like this plastic films 91, clip one piece only under the situation that the metallized film 92 that forms electrode layer 92a on the face of plastic film heats, because the cooling after the heating, thermal bonding resin 91a shrinks, the two pieces of plastic films 91 that clip metallized film 92 shrink, on the other hand, only on the metallized film 92 that forms electrode layer 92a on the face of one piece of plastic film owing to there is not lamination thermal bonding resin, so metallized film 92 and less shrinking.Like this, because the amount of contraction between each film 91,92 has very big difference, there is the tendency of peeling off between these films.
Use is also identical by the situation of the thin dielectric film (Fig. 4 (b)) that formation thermal bonding resin bed 93a on two faces of one piece of plastic film 93 obtains, owing on metallized film, there is not lamination thermal bonding resin, metallized film less shrinks, and the plastic film of two sides lamination thermal bonding resin has bigger contraction.
As mentioned above, under the situation that two pieces of overlapped plastic films are peeled off, gap discharge takes place, the withstand voltage properties of capacitor descends as a result, and in the present invention, any one piece of plastic film 1a～2b front (or back side) is lamination thermal bonding resin bed 6 all, and any one piece of plastic film 1a～2b back side (or positive) all do not have lamination thermal bonding resin bed 6, and to compare difference less big for the such capacitor of the amount of contraction of each plastic film 1a～2b and above-mentioned Fig. 4 when therefore the cooling after the heating caused the thermal bonding resin shrinkage.Therefore can think that these films are not easy to peel off each other.Like this, can think, compare that can not produce big peeling force between film, the result just can suppress gap discharge with existing capacitor.
Like this, reason is at all plastic film 1a～2b superimposed layer thermal bonding resin bed 6, simultaneously the face (being the front or the back side) of this thermal bonding resin bed 6 of lamination is done all identical faces of plastic film 1a～2b that is paired in, by means of this, even winding film not impregnated in the epoxy resin, also peeling off between the film can be prevented, the gap discharge that causes can be suppressed to peel off.Owing to do not need epoxy resin, can enhance productivity, can reduce cost simultaneously.Again, the wound plastic film capacitor that has with existing epoxy resin-impregnated of resulting wound plastic film capacitor has roughly the same withstand voltage properties.
In the present invention, film rolling is heated, and the resin of heating-up temperature and formation thermal bonding resin bed 6 also has relation, usually no matter be thermosetting resin, or thermoplastic resin, what heating-up temperature was more satisfactory is about more than 80 ℃, below 10 ℃, preferably about 100 ℃.Heating time is relevant with the resin that constitutes thermal bonding resin bed 6 too, but is approximately more than 30 minutes, below 2 hours, preferably about 1 hour.During heating to the film rolling applied pressure more satisfactory be 1kg/cm
2More than, 3kg/cm
2Below, preferably about 2kg/cm
2
The heating, the pressurization more satisfactory method be,
1. film rolling is clipped between the two boards method with warm wind;
2. film rolling is clipped between the two boards with heater to the film rolling heating, film rolling is positioned over method in the heater chamber;
3. film rolling is inserted the method for then placing in the cylinder of formations such as heated glass plate; And
4. film rolling is clipped between the metallic plate of preheating, being exerted pressure by metallic plate provides the method for heat simultaneously.If but the price of consideration heating, pressurised equipment, from considering that economically then method 4. is desirable.
About desirable thermal bonding resin:
At thermal bonding resin 6 is not have cementability under normal temperature, and under the situation of the resin that occurs thermal bonding more than 50 ℃, no matter the thermal bonding resin is thermosetting resin or thermoplastic resin, as described in following embodiment, can improve the rate of finished products of the capacitor that obtains.Such thermal bonding resin 6 can use the バ イ ロ Application 20SS and the 30SS of Toyo Boseki K. K.
Need make temperature that the thermal bonding of the thermal bonding resin bed 6 (below the Ref. No. with this thermal bonding resin bed 6 is designated as 61) of the front superimposed layer of the 1st metallized film 1a occurs different the reasons are as follows of temperature occur with a thermal bonding at the thermal bonding thermal bonding resin bed 6 (below the Ref. No. with this thermal bonding resin bed 6 is designated as 62) of the front lamination of the 1st thin dielectric film 2a.Here, for easy to understand, the appearance temperature that temperature specific heat adhesive resin layer 62 appears in the thermal bonding of supposing thermal bonding resin bed 61 is low,
In the thermal bonding operation, the heat that is delivered to thermal bonding resin bed 6 slowly makes the 6 softening and/or fusings of thermal bonding resin bed, but at first be the softening and/or fusings of thermal bonding resin bed 61 elder generations, with the 1st metallized film 1a that clips thermal bonding resin bed 61 and bonding by means of the 2nd thin dielectric film 2b that reels and the 1st metallized film 1a is overlapping.On the other hand, during this,, do not have bonding so clip the 1st metallized film 1a and the 1st thin dielectric film 2a of thermal bonding resin bed 62 because thermal bonding resin bed 62 is also not softening and/or fusing.Thereafter, further heating, in case heat transferred to thermal bonding resin bed 6, then thermal bonding resin bed 62 is softening finally and/or melt, the 1st metallized film 1a and the 1st thin dielectric film 2a that clip thermal bonding resin bed 62 are bonding.
Like this, utilize the method that the divided thin film stage is bonding, can prevent bonding incomplete situation between plastic film 1a～2b that the thermal contraction rate variance owing to many pieces of plastic film 1a～2b causes.By means of this, can guarantee between all plastic film 1a～2b, to have the adhering state of good homogeneous, air gap residual after the heat treatment is few.
It is desirable to more, it is roughly the same that temperature appears in the thermal bonding of the thermal bonding resin bed 6 of temperature that the thermal bonding of the thermal bonding resin bed 61 of the front superimposed layer of the 1st metallized film 1a occurs and the front superimposed layer of the 2nd metallized film 1b, and the thermal bonding of the thermal bonding resin bed 62 of the front superimposed layer of the 1st thin dielectric film 2a the thermal bonding of thermal bonding resin bed 6 that the front superimposed layer of temperature and the 2nd thin dielectric film 2b occurs temperature to occur roughly the same.In this case, at first be the softening earlier and/or fusing of thermal bonding resin bed 6 on the metallized film 1a, the 1st thin dielectric film 2a and the 2nd metallized film 1b are bonding., then heat thereafter, the then softening and/or fusing of the thermal bonding resin bed 6 on the thin dielectric film, the 2nd metallized film 1b and the 2nd thin dielectric film 2b are bonding.
Like this, it is different that utilization makes between thermal bonding resin bed 61 and the thermal bonding resin bed 62 thermal bonding temperature occur, being divided into two stages carries out bonding between the film, can more effectively prevent bonding incomplete situation between plastic film 1a～2b that the thermal contraction rate variance owing to many pieces of plastic film 1a～2b causes.By means of this, can further guarantee between all plastic film 1a～2b, to have the adhering state of good homogeneous, air gap residual after the heat treatment is few.
The thermal bonding of thermal bonding resin bed 6 recited above temperature difference occurs preferably about more than 10 ℃.Under the situation below 10 ℃, do not carry out bonding between the film stage by stage, and the bonding special effect of utilizing temperature difference to carry out stage by stage between the film can not be not fully exerted sometimes according to the transmission situation of the heat of thermal bonding resin bed 6.
Thickness about film:
Poor (absolute value) of the thickness of the thickness of metallized film 1a, 1b and thin dielectric film 2a, 2b is preferably below 3 microns.Surpass under 3 microns the situation in this difference, the bonding situation of each film 1a～2b degenerates, and the situation that at high temperature can not bear load or impact is arranged, or the situation that static capacity descends after repeated charge.This is considered to because the difference of the amount of contraction of the contraction that takes place after plastic film 1a～2b of causing of the heating elongation in the longitudinal direction in the heat treatment step and the heat treatment step is big, and the adhesive property decline of each plastic film 1a～2b causes.
About plastic film 1a～2b:
Preferably more than 0.5 micron below 4.0 microns, better is more than 1.0 microns to the maximum surface smoothness Rmax of plastic film 1a～2b, below 3.2 microns.Here, maximum surface smoothness Rmax is defined as the difference in height (thickness difference of film) that has on the surface between the part of the darkest part (recess, mountain valley) of depression on the film in small concavo-convex (mountain peak and mountain valley) and protuberance (protruding, mountain peak).Rmax utilizes the surface smoothness measurement mechanism of the commodity " サ one Off コ system " by name of Tokyo Precision Co., Ltd to measure.
Under the situation of maximum surface smoothness Rmax less than 0.5 μ m, the situation that at high temperature can not bear load is arranged, or the situation that static capacity descends after repeated charge.This can think because film surface is too smooth, and ubiquitous small recess of film surface and protuberance are not meshing with each other, and yet has the air gap after the heat bonding between film.On the other hand, can not bear load above also having at high temperature under 4.0 microns the situation at Rmax, or the situation that static capacity descends after repeated charge.This is can think because there are a large amount of small projections in film surface, and film surface is too thick, thereby can not get rid of the air gap of the microspike inside that is present on the plastic film reliably, also still has the air gap after the heat bonding between film.Thereby, in order to get rid of the air gap between the film, load when obtaining abundant withstand high temperatures, and static capacity does not descend yet after repeated charge, has stable capacitor specific characteristics, preferably the maximum surface smoothness Rmax of plastic film 1a～2b is more than 0.5 micron, below 4.0 microns.
In this scope, maximum surface smoothness Rmax less than 1.0 microns situation under, in the coiling operation, film 1a～2b is bad with take up roll (not shown) sliding condition of these films of reeling, and the situation that film 1a～2b snarls take up roll takes place sometimes.On the other hand, surpass under 3.2 microns the situation at maximum surface smoothness Rmax, film 1a～2b slides on take up roll excessively, and the situation that film crawls on take up roll takes place.Therefore, consider production efficiency, better is that maximum surface smoothness Rmax is more than 1.0 microns, below 3.2 microns.
Be different from maximum surface smoothness Rmax, the following describes the situation of most preferred embodiment shown in Figure 3, only promptly between the 1st metallized film 1a and the 1st thin dielectric film 2a, clip at the 3rd thin dielectric film 2c of plastic film 5c front lamination thermal bonding resin bed 7c the situation of the 4th thin dielectric film 2d that only between the 2nd metallized film 1b and the 2nd thin dielectric film 2b, clips again at plastic film 5 front lamination thermal bonding resin bed 7d.
That is to say, between the 1st metallized film 1a and the 2nd metallized film 1b, clip under the situation of two pieces of thin dielectric film 2a, 2b (or 2b, 2d), the maximum heat shrinkage of plastic film 1,5 that preferably constitutes each film 1a～2b is less than 3.0%, and the maximum collapse rate variance of overlapped two pieces of thin dielectric film 2a, 2c (or 2b, 2d) is less than 1.0%.Maximum contraction rate is defined as (L1-L2)/L1 * 100 (%), and here, L1 is the film length on the film length direction before the heating, and L2 be to the even heating 30 minutes length of film afterwards of this film under 150 C conditions.
The maximum heat of plastic film 1,5 shrinks that rate variance surpassed at 1.0% o'clock or the maximum heat of overlapped two pieces of thin dielectric film 2a, 2c (or 2b, 2d) was shunk rate variance above 1.0% o'clock, the situation of the load the when capacitor that obtains can not withstand high temperatures, or make the capacitor that obtains under the situation of coming and going between low temperature and the high temperature overlapped two pieces of films in the longitudinal direction size produce length difference, cause two pieces of films that the tendency of peeling off is arranged.
About sealing
The capacitor that utilizes method of the present invention to obtain remains untouched and uses the function also can bring into play as capacitor, but preferably after the heat bonding operation thermosetting resin with ultraviolet hardening resin or regulation the side of film rolling (capacitor that promptly obtains) is sealed.
Existing wound plastic film capacitor impregnated in the film rolling that obtains after coiling operation and the heat bonding operation in the epoxy resin.Therefore when after dipping, film rolling being taken out from epoxy resin, there is epoxy resin to hang down below the film rolling as shown in Figure 6.This sagging resin makes the size (particularly width) of the capacitor that finally obtains produce error sometimes.Because this error, sometimes in the shell that capacitor is packed into, the resin that the needs consideration is hung down portion is in the enclosure reserved corresponding space.
In the present invention, film rolling (capacitor that promptly obtains) not impregnated in the epoxy resin, therefore do not have the sagging generation of such resin.When the side of the capacitor that the present invention obtains need be sealed, preferably using vitrification point was more than the 80 C, and the line expansion factor is less than 1 * 10
-4The thermosetting resin of mm/mm C seals.Also can use uv-hardening resin to replace such thermosetting resin.
When the side of capacitor is sealed, as shown in Figure 5, must seal two sides.In this case, at first be make a side up, under the state down of another side, cast encapsulation thermosetting resin on the side above being positioned at, heating makes its sclerosis then.Then make capacitor Rotate 180, in another side up, a side state down is down equally to being positioned at the another side cast encapsulation thermosetting resin of upside, and heating makes its sclerosis then.Again, under the situation of using ultraviolet hardening resin,, have, the advantage of the sagging situation of resin also can not take place when being positioned at the below at Rotate 180 owing to can harden at short notice.
Using under the situation of vitrification point less than the thermosetting resin of 80 C, because the undercapacity of resin when the capacitor built-in electrical insulation takes place to destroy, has the capacitor side to discharge, the load in the time of can not withstand high temperatures or the situation of impact.Thereby, using under the situation of thermosetting resin preferably vitrification point more than 80 C.
Equally, using the line expansion factor to surpass 1 * 10
-4Under the situation of the thermosetting resin of mm/mm C, resin rubberization produces difference in size on the interface of the resin bed of capacitor main body and covering capacitor main body, and the situation of the tracking that happens occasionally defective insulations such as (tracking) is arranged.
Also have, the resin that the capacitor side is sealed can be a kind of, also can be from ultraviolet hardening resin, thermosetting resin more than the vitrification point 80 C and line expansion factor less than 1 * 10
-4Select to be used in combination in the thermosetting resin of mm/mm C.
In the above description, the front lamination thermal bonding resin bed 6 of plastic film 1a～2b has been described, and the situation of the electrode layer 3,4 that the back laminate metal of plastic film 1 constitutes, but can certainly be at the back laminate thermal bonding resin bed 6 of plastic film 1a～2b, and the electrode layer 3,4 that the front lamination metal of plastic film 1 constitutes.
The present invention will be described in more detail to utilize the following embodiment that is considered to best example of the present invention below.But following embodiment just is used in illustrative purpose under the situation of explaining the right claimed range, rather than is used in the purpose of qualification.
As shown in Figure 6, do not form on the length direction at polyethylene terephthalate 1 (calling " PET " in the following text) the film back side of decorative pattern and utilize shadow mask oil (masking oil) method AM aluminum metallization, form a plurality of aluminium electrodes 3,4 of mutually insulated with this.After making aluminium electrode 3,4, on the whole surface of PET film coated polyester be resin (from the trade name of Toyo Boseki K. K buying mixture) for the polyester based resin of " バ イ ロ Application 30SS/ バ イ ロ Application 20SS " afterwards, 140 ℃ of oven dry of about 80C～about 1 hour, with this thermal bonding resin bed 6 that constitutes by polyester based resin at the surperficial lamination of PET film 1, make metallized film 1a, 1b.Two electrode layer 4a from the end of the length direction of metallized film C draw lead-in wire 8 again.
In addition, only at the front of the PET film 5 that does not form decorative pattern and top described the same lamination by the thermal bonding resin bed 6 that polyester based resin constitutes, make thin dielectric film 2a～2d with this.And the thickness of thermal bonding resin 6 all is about 0.3 micron.
Then, as shown in Figure 6, in regular turn that metallized film 1a, thin dielectric film 2c, thin dielectric film 2a, metallized film 1b, thin dielectric film 2d and thin dielectric film 2b is overlapping and reel from upside, make the thermal bonding resin 6 of each film 1a～2d superimposed layer be positive (upside) during lamination.Also have, the rotary speed of the take up roll that uses during coiling is 1500rpm.Like this, with each film 1a～2d overlapping coiling, when reeling to obtain film rolling, each electrode layer 3 of the 1st metallized film 1a overlaps the 2nd metallized film 1b and goes up on two adjacent electrode layers 4, this electrode overlap length in the longitudinal direction is 300 millimeters.
The film rolling that obtains is positioned in the thermostat that is heated to 100 ℃～120 ℃, or with two metallic plate 2kg/cm that are heated to 100 ℃～120 ℃
2Pressure clip, pressurizeed about 20 minutes.With these thermal bonding resin bed 6 softening and fusings that polyester based resin is constituted, with bonding each plastic film 1a～2b.Enlarged photograph is taken to confirm to utilize between all plastic film 1a～2b the situation of thermal bonding resin bonding to the section between the thin layer in bonding back.
In order to make the 6 softening and fusings of thermal bonding resin bed, after heating was cooled off then about 100 ℃～120 ℃, all plastic film 1a～2b had some contractions, but the amount of contraction of each plastic film 1a～2b is more or less the same.Therefore do not produce big peeling force between metal and the film, do not peel off between the film.Thereby, be not easy to produce gap discharge, so withstand voltage also just not low.
Like this, adopt the manufacture method of web-like film capacitor of the present invention, the capacitor that obtains after heat treatment step is epoxy resin-impregnated not, but can access the identical or excellent more capacitor of the capacitor specific characteristics that obtains with epoxy resin-impregnated.
Also have, in present embodiment 1, the heat bonding temperature of using the thermal bonding resin is the polyester based resin of 30 ℃, 40 ℃, 50 ℃ and 60 ℃, the heat bonding temperature of thermal bonding resin is changed stage by stage, the relation of the rate of finished products when investigating it and reeling.It the results are shown in following table 1.
Table 1
| The thermal bonding resin | The heat bonding temperature (℃) | Rate of finished products during coiling (%) |
| Polyester based resin | ????30 | ????50 |
| ????40 | ????70 | |
| ????50 | ????100 | |
| ????60 | ????100 |
Rate of finished products during coiling is calculated with (rate of finished products=defective item/qualified product * 100%), and defective item is meant the wrinkling capacitor of film when reeling, and qualified product are meant the unruffled capacitor of film when reeling.
According to above-mentioned table 1, can be understood as under the heat bonding temperature is situation more than 50 ℃, that is thermal bonding is occurring more than 50 ℃, do not have at normal temperatures under the situation of thermal bonding, rate of finished products height during coiling, production efficiency height not only, and because between the original film of film a little less than the bonding force, operating winding is (that is not blocking) easily.
Also have, using at present embodiment 2 also is that the heat bonding temperature of thermal bonding resin is the epoxy resin of 30 ℃, 40 ℃, 50 ℃ and 60 ℃, and the heat bonding temperature of thermal bonding resin is changed stage by stage.It the results are shown in following table 2.
Table 2
| The thermal bonding resin | The heat bonding temperature (℃) | Rate of finished products during coiling (%) |
| Epoxy resin | ????30 | ????50 |
| ????40 | ????80 | |
| ????50 | ????100 | |
| ????60 | ????100 |
Rate of finished products during coiling and embodiment 1 the same calculating.
According to above-mentioned table 2, can be understood as the such thermosetting resin of epoxy resin also is, the heat bonding temperature is under the situation more than 50 ℃, that is thermal bonding is occurring more than 50 ℃, there are not under the situation of thermal bonding rate of finished products height during coiling, not only production efficiency height at normal temperatures, and because between the original film of film a little less than the bonding force, operating winding is (that is not blocking) easily.
Present embodiment is conceived to the thickness of film.
Embodiment 3-1
As shown in Figure 6, except adopting heating time 1 hour, with the embodiment 1 the same web-like film capacitor that makes.But here, the thickness of the 1st metallized film 1a and the 2nd metallized film 1b is 10 microns, the thickness of each thin dielectric film 2a～2d adopts 10 microns, and as shown in Figure 6, form 4 electrode layers 3 on the length direction of the 1st metallized film 1a, and on the length direction of the 2nd metallized film 1b, form these electrode layers 3 of 5 electrode layer 4, the 1 metallized film 1a and make two adjacent electrode layers 4 overlapped at the 2nd metallized film 1b.Total film thickness of resulting web-like film capacitor is 240 microns, and the electrostatic capacitance amount is 2700pf, and rated voltage is 30kV.
Embodiment 3-2
Except the thickness of metallized film 1a, 1b adopts 9 microns, the thickness of each thin dielectric film 2a～2d adopts 12 microns, and 3 electrode layers 3 of formation on the length direction of the 1st metallized film 1a, and beyond 4 electrode layers 4 of formation on the length direction of the 2nd metallized film 1b, the same web-like film capacitor made from embodiment 3-1.Total film thickness of resulting web-like film capacitor is 198 microns, and the electrostatic capacitance amount is 3000pf, and rated voltage is 25kV.
Comparative example 3-3
Except the thickness of each thin dielectric film 2a, 2b adopts 6 microns, the same web-like film capacitor made from embodiment 3-2.Total film thickness of resulting web-like film capacitor is 162 microns, and the electrostatic capacitance amount is 3000pf, and rated voltage is 20kV.
The number that the web-like film capacitor that obtains at embodiment 3-1,3-2 and comparative example 3-3 is taken place bonding unfavorable condition is counted, and simultaneously it is quickened high temperature load test, temperature cycling test and discharges and recharges test, to investigate its characteristic.In bonding bad generation number and every test, take out 6 capacitors respectively and investigate.
Quickening the high temperature load test is under 100 ℃ temperature, and 110% the voltage that applies rated voltage was tested in 1000 hours.
Temperature cycling test is to place to be heated to 100 ℃ of placements after 1 hour and to test repeatedly under such condition 100 times in 1 hour under-40 ℃ temperature.
Discharging and recharging test is to discharge and recharge 1000 times by 100% of rated voltage.
Bonding bad generation number, the investigation result of quickening high temperature load test, temperature cycling test and discharging and recharging test are shown in table 3.
Table 3
| Defective quantity (in 6) | ||||||
| Metallized film thickness (micron) | Thin dielectric film thickness (μ) | Bonding bad | Quicken high temperature load | Temperature cycles | Discharge and recharge | |
| Embodiment 3-1 | ????10 | ????10 | ????0 | ????0 | ????0 | ????0 |
| Embodiment 3-2 | ????9 | ????12 | ????0 | ????0 | ????0 | ????0 |
| Comparative example 3-3 | ????9 | 12 and 6 | ????2 | ????1 | ????1 | ????1 |
Can think according to table 3, if the absolute value of the thickness difference of the 1st metallized film 1a, 1b and thin dielectric film 2a, 2b is below 3 microns, then the situation of the loose contact between the film can not take place, and can obtain quickening high-temperature test, temperature cycling test and discharging and recharging the capacitor that the good quality of problem does not take place in the test.On the other hand, at comparative example 3-3, the tendency that has the loose contact situation to increase as can be seen.Its reason can think, because the thickness difference of film is more than 6 microns, the difference of film amount of contraction in the longitudinal direction is big after elongation on the film length direction in heat treatment step and the heat treatment step, so the cementability of each film descends.
Present embodiment is conceived to the Rmax of film 1.5.
Embodiment 4-1
As shown in Figure 3, except adopting heating time 1 hour, with the embodiment 1 the same web-like film capacitor that makes.But here, being to be that 0.4 micron the PET film product of (trade name (model) of polyester Co., Ltd. of Mitsubishi for " C-500 ") is made the 1st metallized film 1a, the 2nd metallized film 1b, thin dielectric film 2a and thin dielectric film 2b with Rmax, is 2.0 PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") making thin dielectric film 2c and thin dielectric film 2d with Rmax.
And the same with embodiment 3, the thickness of the 1st metallized film 1a and the 2nd metallized film 1b is 9 microns, and the thickness of thin dielectric film 2c, 2d is got 1 micron, and the thickness of thin dielectric film 2a, 2b is got 9 microns.Also have, on the length direction of the 1st metallized film 1a, form 4 electrode layers 3, and it is overlapped at these electrode layers 3 that form 5 electrode layer 4, the 1 metallized film 1a on the length direction of the 2nd metallized film 1b with two adjacent on the 2nd metallized film 1b electrode layers 4.Total film thickness of resulting web-like film capacitor is 240 microns, and the electrostatic capacitance amount is 2700pf, and rated voltage is 30kV.
During coiling, the same with embodiment 2, the relation of the rate of finished products the when Rmax of investigation film and coiling.
The web-like film capacitor that obtains and embodiment 3 are the same to quicken the high temperature load test and discharges and recharges test, investigates its characteristic.Equally with embodiment 1 in the present embodiment again investigate after the heat bonding operation between each film 1,5, whether have the air gap.
Embodiment 4-2
Except being that 0.5 micron PET film is made the 1st metallized film 1a and the 2nd metallized film 1b with Rmax, with Rmax is that 0.4 micron PET film is made thin dielectric film 2c and thin dielectric film 2d, with Rmax is that 2.0 PET film (trade name of SKC Limited (model) is the product of " TC-33 ") is made outside thin dielectric film 2a and the thin dielectric film 2b, the same capacitor made from embodiment 4-1, the capacitor of making provides test.
Below, to 4-8, utilize the same capacitor made from PET film of making of various film 1a～2d that test is provided from embodiment 4-3 with embodiment 4-1 with different Rmax, Rmax and result of the test are shown in following table 4.
Can be understood as according to following table 4, maximum surface smoothness Rmax less than 0.5 micron situation under, the load can not withstand high temperatures the time is arranged, or the situation that electrostatic condenser descends after repeated charge.Again Rmax greater than 4.0 microns situation under, the load can not withstand high temperatures the time is also arranged, or the situation that electrostatic condenser descends after repeated charge.Therefore, in order to utilize the air gap of getting rid of between the film to obtain fully to tolerate load when the high temperature, and the stable capacitor specific characteristics that electrostatic condenser does not also descend after the repeated charge, the maximum surface smoothness Rmax of plastic film 1a～2b is preferably more than 0.5 micron below 4.0 microns.
Table 4-1
| Embodiment | ????4-1 | ????4-2 | ????4-3 | ????4-4 | |
| Surface smoothness (Rmax) | | ????0.4 | ????0.5 | ????0.8 | ????1.0 |
| | ????0.4 | ????0.4 | ????0.8 | ????0.8 | |
| | ????2.0 | ????2.0 | ????2.0 | ????2.0 | |
| Rate of finished products during coiling (%) | ????62 | ????79 | ????98 | ????100 | |
| Rejection number | The number that has the air gap | ????3 | ????0 | ????0 | ????0 |
| Quicken high temperature load | ????2 | ????0 | ????0 | ????0 | |
| Discharge and recharge | ????2 | ????0 | ????0 | ????0 | |
| Overall merit | ????△ | ????○ | ????○ | ????◎ | |
Table 4-2
| Embodiment | ????4-5 | ????4-6 | ????4-7 | ????4-8 | |
| Surface smoothness (Rmax) | | ????3.2 | ????4.1 | ????4.5 | ????3.2 |
| | ????3.2 | ????4.1 | ????4.5 | ????3.2 | |
| | ????2.0 | ????2.0 | ????2.0 | ????4.5 | |
| Rate of finished products during coiling (%) | ????100 | ????99 | ????90 | ????93 | |
| Rejection number | The number that has the air gap | ????3 | ????0 | ????2 | ????1 |
| Quicken high temperature load | ????2 | ????0 | ????1 | ????1 | |
| Discharge and recharge | ????2 | ????0 | ????0 | ????0 | |
| Overall merit | ????◎ | ????○ | ????△ | ????△ | |
Also can be understood as according to table 4, the rate of finished products when reeling in order to make is 100%, enhances productivity to greatest extent, as long as Rmax is chosen to be more than 1.0 microns below 3.2 microns.
Present embodiment is conceived to the percent thermal shrinkage of film 1a～2d.
Embodiment 5-1
W as shown in Figure 3, with the embodiment 1 the same web-like film capacitor of obtaining.But here, with the maximum heat shrinkage is that 0.8% thickness is that 10 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made the 1st metallized film 1a and the 2nd metallized film 1b, is that 0.6% thickness is PET film (trade name (model) of polyester Co., Ltd. of Mitsubishi is the product of " C-500 ") making thin dielectric film 2a～2d of 9 microns with the maximum heat shrinkage.
Also have, in the present embodiment, on the length direction of the 1st metallized film 1a, form 4 electrode layers 3, and it is overlapped at these electrode layers 3 that form 5 electrode layer 4, the 1 metallized film 1a on the length direction of the 2nd metallized film 1b with two adjacent on the 2nd metallized film 1b electrode layers 4.Total film thickness of resulting web-like film capacitor is 240 microns, and the electrostatic capacitance amount is 2700pf, and rated voltage is 30kV.
Maximum contraction rate calculates according to (L1-L2)/L1 * 100 (%), and here, L1 is the length on the film length direction before the heating, and L2 be to the even heating 30 minutes length of film afterwards of this film under 150 C conditions.
The capacitor that obtains provides temperature cycling test and high temperature load test.And a capacitor is carried out temperature cycling test and high temperature load test.
Embodiment 5-2
Except being that 2.5% thickness is that 9 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made the 1st metallized film 1a and the 2nd metallized film 1b with the maximum heat shrinkage, with the maximum heat shrinkage is that 1.9% thickness is that 10 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made thin dielectric film 2c, 2d, with the maximum heat shrinkage is that 2.9% thickness is that 10 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made thin dielectric film 2a, outside the 2b, all the other are the same with embodiment 5-1, make the web-like capacitor.The capacitor that obtains is the same with embodiment 5-1 to carry out various tests.
Comparative example 5-3
Except being that 2.0% thickness is that 10 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made the 1st metallized film 1a and the 2nd metallized film 1b with the maximum heat shrinkage, with the maximum heat shrinkage is that 0.7% thickness is that 9 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made outside thin dielectric film 2a～2d, all the other are the same with embodiment 5-1, make the web-like capacitor.The capacitor that obtains is the same with embodiment 5-1 to carry out various tests.
Comparative example 5-4
Except being that 3.5% thickness is that 10 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made the 1st metallized film 1a and the 2nd metallized film 1b with the maximum heat shrinkage, with the maximum heat shrinkage is that 3.2% thickness is that 9 microns PET film (trade name (model) of eastern レ Co., Ltd. is the product of " Q50 ") is made outside thin dielectric film 2a～2d, all the other are the same with embodiment 5-1, make the web-like capacitor.The capacitor that obtains is the same with embodiment 5-1 to carry out various tests.The result of the test of embodiment 5-1, embodiment 5-2 and comparative example 5-3, comparative example 5-4 is shown in table 5.
Table 5
| Substandard product quantity | |||||
| Film | Thickness (micron) | The maximum heat shrinkage | Temperature cycling test | The high temperature load test | |
| Embodiment 5-1 | Metallized film | ????10 | ????1.7％ | 0/10 | 0/10 |
| Thin dielectric film | ????10 | ????1.5％ | |||
| Embodiment 5-2 | Metallized film | ????10 | ????1.9％ | 1/10 | 1/10 |
| Thin dielectric film | ????9 | ????2.5％ | |||
| Thin dielectric film | ????10 | ????2.9％ | |||
| Comparative example 5-3 | Metallized film | ????10 | ????2.0％ | 1/10 | 1/10 |
| Thin dielectric film | ????9 | ????0.7％ | |||
| Comparative example 5-4 | Metallized film | ????10 | ????3.5％ | 1/10 | 1/10 |
| Thin dielectric film | ????9 | ????3.2％ | |||
According to table 5, can be understood as, the maximum heat shrinkage of metallized film 1 or the maximum heat shrinkage of thin dielectric film 2 surpass 3%, or the difference of the maximum heat shrinkage of the maximum heat shrinkage of metallized film 1 and thin dielectric film 2 surpasses 1.0%, or the difference of the maximum heat shrinkage of overlapped two pieces of thin dielectric film 2a, 2c (2b, 2d) surpasses under 1.0% the situation, the load the when capacitor that obtains sometimes can not withstand high temperatures.
The side of the web-like film capacitor that embodiment 1 is obtained (Fig. 5 81,82) is with thermosetting resin (サ Application コ レ ジ Application Co., Ltd. product, trade name (model): SE1459) seal.At first, a side 81 up, another side 82 below state under, make its sclerosis to being heated 100 ℃ after the side 81 cast encapsulation thermosetting resins that are positioned at upside.Then, make another side 82 up, and side 81 down, under such state, make its sclerosis to being heated 120 ℃ after the another side 82 cast encapsulation thermosetting resins that are in upside equally capacitor Rotate 180.The Breadth Maximum of 100 web-like film capacitors that such side is sealed (ultimate range between the side, Fig. 5 apart from T) is measured.Measurement result is shown in following table 6.
Following table 6 can be understood as, in the present invention, compare with the existing products of flooding epoxy resin, it is sagging that product of the present invention does not produce the resin that produces when therefrom mentioning after the epoxy resin-impregnated, therefore the Breadth Maximum deviation of web-like film capacitor is in the scope of 40.5mm～42.5mm, and the size on the Width is high-precision.
Table 6
Embodiment 7
S' 95 ℃ uv-hardening resin (サ Application コ レ ジ Application Co., Ltd. product, trade name (model) " SUV ") and embodiment 6 the same sealing to the side of the web-like film capacitor that obtains by embodiment 1 (Fig. 5 81,82) with vitrification point.But when making the uv-hardening resin sclerosis, use the ultraviolet irradiation of 80W to replace heating to make its sclerosis.The measurement result and the above-mentioned table 6 of the Breadth Maximum of 100 web-like film capacitors that seal the side (ultimate range between the side, Fig. 5 apart from T) are roughly the same.
The web-like film capacitor that seal the side offers and quickens high temperature load test, high temperature load test, thermal shock test, thermal shock and high temperature load test.Also using vitrification point is that 120 ℃ thermosetting resin (サ Application コ レ ジ Application Co., Ltd. product, trade name (model) " SE1459 ") seals with top described the same side to the web-like film capacitor.Identical therewith, also using vitrification point is that 73 ℃ thermosetting resin (サ Application コ レ ジ Application Co., Ltd. product, trade name (model) " SR ") seals with top described the same side to the web-like film capacitor.Use the results are shown in following table 7.Also have, in respectively being shown in 6 capacitors are tested.
Table 7
| The number of (in 6) defective capacitor | ||||
| Vitrification point | The test of acceleration high temperature load | The high temperature load test | Thermal shock test | Thermal shock and high temperature load test |
| ????95℃ | 0 | 0 | 0 | 0 |
| ????120℃ | 0 | 0 | 0 | 0 |
| ????73 | 2 | 2 | 0 | 4 |
Can be understood as according to table 7, is under the situation of the thermosetting resin more than 80 ℃ using vitrification point, even destroy at the capacitor built-in electrical insulation, do not discharge in the side of capacitor yet, load or impact in the time of can withstand high temperatures.
Industrial applicability
Adopt the present invention, even the many pieces of plastic sheetings of reeling do not infiltrate with epoxy resin, also can be suppressed at contingent gap discharge between film, by means of this, can provide and to enhance productivity, reduce cost, improve simultaneously the preparation method of the wound plastic film capacitor of withstand voltage properties, moisture resistance properties etc.
Claims (26)
1. the manufacture method of a wound plastic film capacitor is characterized in that, comprise with
At the front of plastic film (1) lamination thermal bonding resin bed (6), overleaf a plurality of electrode layers (3) of mutually insulated are formed at the 1st metallized film (1a) on the length direction,
Only the 1st thin dielectric film (2a) of the front of plastic film (5) lamination thermal bonding resin bed (6),
At plastic film (2) front lamination thermal bonding resin bed (6), overleaf a plurality of electrode layers (4) of mutually insulated are formed on the length direction the 2nd metallized film (1b) and
Only at the 2nd thin dielectric film (2b) of the front of plastic film (5) lamination thermal bonding resin bed (6),
Described the 1st thin dielectric film (2a) is being clipped between described the 1st metallized film (1a) and described the 2nd metallized film (1b), described the 2nd metallized film (1b) is clipped between described the 1st thin dielectric film (2a) and described the 2nd thin dielectric film (2b), and each electrode layer (3) of described the 1st metallized film (1a) and described the 2nd metallized film (1b) are gone up under the overlapped state of adjoining in the longitudinal direction 2 electrode layers (4) of forming and are reeled, make film rolling the coiling operation and
With described film rolling heating, utilize described thermal bonding resin bed (6) with mutual bonding heat bonding operation between described the 1st metallized film (1a), described the 1st thin dielectric film (2a), described the 2nd metallized film (1b) and all films of described the 2nd thin dielectric film (2b);
Film rolling not impregnated in the epoxy resin.
2. the manufacture method of wound plastic film capacitor according to claim 1 is characterized in that,
Draw two leads (8) from the metal level (3a, 4a) of the end of the length direction of described the 1st metallized film (1a) or described the 2nd metallized film (1b).
3. the manufacture method of wound plastic film capacitor according to claim 2 is characterized in that,
Described thermal bonding resin (6) is the resin of non-cementability under the normal temperature, and has thermal bonding more than 50 ℃.
4. the manufacture method of wound plastic film capacitor according to claim 2 is characterized in that,
Thermal bonding resin bed (6 at the front lamination of described the 1st metallized film (1a); 61) temperature that thermal bonding occurs with only at the thermal bonding resin (6 of the front lamination of described the 1st thin dielectric film (2a); 62) the temperature difference that thermal bonding occurs,
In described heat bonding operation, in the thermal bonding resin bed (61) of the front lamination of the 1st metallized film (1a) and thermal bonding resin (62) only at the front lamination of the 1st thin dielectric film (2a), clip the film of a certain thermal bonding resin bed (6) that occurs thermal bonding at a lower temperature bonding after, the film that clips another thermal bonding resin bed (6) that occurs thermal bonding under higher temperature is by bonding.
5. the manufacture method of wound plastic film capacitor according to claim 4 is characterized in that,
Thermal bonding resin bed (6 at the front lamination of the 1st metallized film (1a); 61) temperature that thermal bonding occurs and thermal bonding resin (6 at the front lamination of the 2nd metallized film (1b); 61) temperature that thermal bonding occurs is roughly the same, and at the thermal bonding resin bed (6 of the front lamination of the 1st thin dielectric film (2a); 62) temperature that thermal bonding occurs and thermal bonding resin (6 at the front lamination of the 2nd thin dielectric film (2b); 62) temperature that thermal bonding occurs is roughly the same,
In described heat bonding operation, at the thermal bonding resin bed (6 of the front lamination of the 2nd metallized film (1b); 61) with only at the thermal bonding resin (6 of the front lamination of the 2nd thin dielectric film (2b); 62) in, clip the film of a certain thermal bonding resin bed (6) that occurs thermal bonding at a lower temperature bonding after, the film that clips another thermal bonding resin bed (6) that occurs thermal bonding under higher temperature is by bonding.
6. according to the manufacture method of claim 4 or 5 described wound plastic film capacitors, it is characterized in that, at the thermal bonding resin bed (6 of the front lamination of described the 1st metallized film (1a); 61) temperature that thermal bonding occurs with only at the thermal bonding resin (6 of the front lamination of described the 1st thin dielectric film (2a); The difference of the temperature that thermal bonding 62) occurs is greatly about more than 10 ℃.
7. the manufacture method of wound plastic film capacitor according to claim 2 is characterized in that, certain one deck at least of described thermal bonding resin bed (6) is made of epoxy resin.
8. the manufacture method of wound plastic film capacitor according to claim 2 is characterized in that, the thickness difference absolute value of described metallized film (1a, 1b) and described thin dielectric film (2a, 2b) is less than 3 microns.
9. the manufacture method of wound plastic film capacitor according to claim 2, it is characterized in that, the maximum surface smoothness Rmax in the front of the plastic film (2) of the plastic film (1) of described the 1st metallized film (1a), the plastic film (5) of described the 1st thin dielectric film (2a), described the 2nd metallized film (1b) and the plastic film (5) of described the 2nd thin dielectric film (2b) is more than 0.5 micron, below 4.0 microns.
10. the manufacture method of wound plastic film capacitor according to claim 2, it is characterized in that, only clip the 3rd thin dielectric film (2c) that the plastic film (5) at surperficial lamination thermal bonding resin bed (6) constitutes between the 1st metallized film (1a) and the 1st thin dielectric film (2a), and only between the 2nd metallized film (1b) and the 2nd thin dielectric film (2b), clip the 4th thin dielectric film (2d) that the plastic film (5) at surperficial lamination thermal bonding resin bed (6) constitutes, and (the maximum heat shrinkage in the longitudinal direction of 1a～2d) is less than 3.0% for all films, and the difference of the maximum heat shrinkage of the 1st thin dielectric film (2a) and the 3rd thin dielectric film (2c) less than the difference of 1.0%, the 2 thin dielectric film (2b) and the maximum heat shrinkage of the 4th thin dielectric film (2d) also less than 1.0%.
11. the manufacture method of wound plastic film capacitor according to claim 2 is characterized in that, after the heat bonding operation, utilizes vitrification point at the thermosetting resin more than 80 ℃ the side of film rolling to be sealed.
12. the manufacture method of wound plastic film capacitor according to claim 2 is characterized in that, after the heat bonding operation, utilizes the line expansion factor less than 1 * 10
-4Mm/mm ℃ thermosetting resin seals the side of film rolling.
13. the manufacture method of wound plastic film capacitor according to claim 2 is characterized in that, after the heat bonding operation, utilizes uv-hardening resin that the side of film rolling is sealed.
14. the manufacture method of a wound plastic film capacitor is characterized in that, comprises
Will be at the back laminate thermal bonding resin bed (6) of plastic film (1), in the front a plurality of electrode layers (3) of mutually insulated are formed at the 1st metallized film (1a) on the length direction,
Only the 1st thin dielectric film (2a) of the back laminate thermal bonding resin bed (6) of plastic film (5),
At plastic film (2) back laminate thermal bonding resin bed (6), in the front a plurality of electrode layers (4) of mutually insulated are formed on the length direction the 2nd metallized film (1b) and
Only at the 2nd thin dielectric film (2b) of the back laminate thermal bonding resin bed (6) of plastic film (5),
Described the 1st thin dielectric film (2a) is being clipped between described the 1st metallized film (1a) and described the 2nd metallized film (1b), described the 2nd metallized film (1b) is clipped between described the 1st thin dielectric film (2a) and described the 2nd thin dielectric film (2b), and each electrode layer (3) of described the 1st metallized film (1a) and described the 2nd metallized film (1b) are gone up under the overlapped state of adjoining in the longitudinal direction 2 electrodes (4) of forming and are reeled, make film rolling the coiling operation and
With described film rolling heating, utilize described thermal bonding resin bed (6) with mutual bonding heat bonding operation between described the 1st metallized film (1a), described the 1st thin dielectric film (2a), described the 2nd metallized film (1b) and all films of described the 2nd thin dielectric film (2b);
Film rolling not impregnated in the epoxy resin.
15. the manufacture method of wound plastic film capacitor according to claim 14 is characterized in that, draws two leads (8) from the metal level (3a, 4a) of the end of the length direction of the 1st metallized film (1a) or the 2nd metallized film (1b).
16. the manufacture method of wound plastic film capacitor according to claim 15 is characterized in that, described thermal bonding resin (6) is the resin of non-cementability under the normal temperature, and has thermal bonding more than 50 ℃.
17. the manufacture method of wound plastic film capacitor according to claim 15, it is characterized in that, the temperature that occurs in the thermal bonding of the thermal bonding resin bed (6,61) of the back laminate of the 1st metallized film (1a) is with only the temperature in the thermal bonding appearance of the thermal bonding resin bed (6,62) of the 1st thin dielectric film (2a) back laminate is different
In described heat bonding operation, clip the lower a kind of thermal bonding resin (6) of temperature appears in thermal bonding in the thermal bonding resin bed (6,61) of the back laminate of the 1st metallized film (1a) and the thermal bonding resin bed (6,62) in the 1st thin dielectric film (2a) back laminate only film by after bonding, clip thermal bonding and the film of the higher a kind of thermal bonding resin (6) of temperature occurs by bonding.
18. the manufacture method of wound plastic film capacitor according to claim 17 is characterized in that,
Thermal bonding resin bed (6 in the back laminate of the 1st metallized film (1a), 61) temperature that thermal bonding occurs and thermal bonding resin bed (6 in the back laminate of the 2nd metallized film (1b), 61) temperature that thermal bonding occurs is roughly the same, and thermal bonding resin bed (6 in the 1st thin dielectric film (2a) back laminate, the temperature of thermal bonding appearance 62) and thermal bonding resin bed (6 in the 2nd thin dielectric film (2b) back laminate, 62) temperature that thermal bonding occurs is roughly the same
In described heat bonding operation, clip the lower a kind of thermal bonding resin (6) of temperature appears in thermal bonding in the thermal bonding resin bed (6,61) of the back laminate of the 1st metallized film (1b) and the thermal bonding resin bed (6,62) in the 2nd thin dielectric film (2b) back laminate only film by after bonding, clip thermal bonding and the film of the higher a kind of thermal bonding resin (6) of temperature occurs by bonding.
19. the manufacture method according to claim 17 or 18 described wound plastic film capacitors is characterized in that, at the thermal bonding resin bed (6 of the back laminate of described the 1st metallized film (1a); 61) temperature that thermal bonding occurs with only at the thermal bonding resin (6 of the back laminate of described the 1st thin dielectric film (2a); The difference of the temperature that thermal bonding 62) occurs is greatly about more than 10 ℃.
20. the manufacture method of wound plastic film capacitor according to claim 15 is characterized in that, certain one deck at least of described thermal bonding resin bed (6) is made of epoxy resin.
21. the manufacture method of wound plastic film capacitor according to claim 15 is characterized in that, the thickness difference absolute value of described metallized film (1a, 1b) and described thin dielectric film (2a, 2b) is less than 3 microns.
22. the manufacture method of wound plastic film capacitor according to claim 15, it is characterized in that, the maximum surface smoothness Rmax at the back side of the plastic film (2) of the plastic film (1) of described the 1st metallized film (1a), the plastic film (5) of described the 1st thin dielectric film (2a), described the 2nd metallized film (1b) and the plastic film (5) of described the 2nd thin dielectric film (2b) is more than 0.5 micron, below 4.0 microns.
23. the manufacture method of wound plastic film capacitor according to claim 15, it is characterized in that, only clip the 3rd thin dielectric film (2c) of plastic film (5) formation of lamination thermal bonding resin bed (6) overleaf between the 1st metallized film (1a) and the 1st thin dielectric film (2a), and between the 2nd metallized film (1b) and the 2nd thin dielectric film (2b), only clip the 4th thin dielectric film (2d) of plastic film (5d) formation of lamination thermal bonding resin bed (6) overleaf, and (the maximum heat shrinkage of 1a～2d) is less than 3.0% for all films, and the difference of the maximum heat shrinkage of the 1st thin dielectric film (2a) and the 3rd thin dielectric film (2c) less than the difference of 0.5%, the 2 thin dielectric film (2b) and the maximum heat shrinkage of the 4th thin dielectric film (2d) also less than 1.0%.
24. the manufacture method of wound plastic film capacitor according to claim 15 is characterized in that, after the heat bonding operation, utilizes vitrification point at the thermosetting resin more than 80 ℃ the side of film rolling to be sealed.
25. the manufacture method of wound plastic film capacitor according to claim 15 is characterized in that, after the heat bonding operation, utilizes the line expansion factor less than 1 * 10
-4Mm/mm ℃ thermosetting resin seals the side of film rolling.
26. the manufacture method of wound plastic film capacitor according to claim 15 is characterized in that, after the heat bonding operation, utilizes uv-hardening resin that the side of film rolling is sealed.
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP364553/1998 | 1998-12-22 | ||
| JP36455398 | 1998-12-22 | ||
| JP369171/1998 | 1998-12-25 | ||
| JP36887998 | 1998-12-25 | ||
| JP36917198 | 1998-12-25 | ||
| JP368879/1998 | 1998-12-25 | ||
| JP876699 | 1999-01-18 | ||
| JP8766/1999 | 1999-01-18 | ||
| JP876799 | 1999-01-18 | ||
| JP8767/1999 | 1999-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1331833A true CN1331833A (en) | 2002-01-16 |
Family
ID=27518982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99815028A Pending CN1331833A (en) | 1998-12-22 | 1999-12-17 | Method for producing wound plastic film capacitor |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP3233158B2 (en) |
| KR (1) | KR20010099917A (en) |
| CN (1) | CN1331833A (en) |
| AU (1) | AU1687900A (en) |
| TW (1) | TW442805B (en) |
| WO (1) | WO2000038204A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102176372A (en) * | 2010-12-08 | 2011-09-07 | 广东四会互感器厂有限公司 | Cylindrical dry type high-voltage capacitor core |
| CN104916438A (en) * | 2015-05-10 | 2015-09-16 | 长兴华强电子有限公司 | High temperature and high pressure safety capacitor |
| CN106847500A (en) * | 2015-12-05 | 2017-06-13 | 佛山市南海区欣源电子有限公司 | A kind of resonant capacitor of copper coin water cooling |
| CN111816446A (en) * | 2020-07-27 | 2020-10-23 | 无锡鑫聚电子科技有限公司 | Capacitor core easy to impregnate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101106987B1 (en) * | 2010-03-08 | 2012-01-25 | 주식회사 뉴인텍 | A film capacitor |
| CN104900403A (en) * | 2015-06-25 | 2015-09-09 | 浙江七星电容器有限公司 | Double-faced metalized electrical membrane for capacitor |
| KR102387562B1 (en) * | 2020-06-01 | 2022-04-15 | 동의대학교 산학협력단 | Combination structure of multiple wafers equipped with digital capacitors and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154120A (en) * | 1984-12-27 | 1986-07-12 | 松下電器産業株式会社 | Capacitor |
| JPH0754781B2 (en) * | 1985-02-25 | 1995-06-07 | 松下電器産業株式会社 | Capacitor |
| JPS61194816A (en) * | 1985-02-25 | 1986-08-29 | 松下電器産業株式会社 | Capacitor |
| JPS6328022A (en) * | 1986-07-21 | 1988-02-05 | 松下電器産業株式会社 | Film capacitor |
-
1999
- 1999-12-17 KR KR1020017008020A patent/KR20010099917A/en not_active Application Discontinuation
- 1999-12-17 CN CN99815028A patent/CN1331833A/en active Pending
- 1999-12-17 WO PCT/JP1999/007089 patent/WO2000038204A1/en not_active Application Discontinuation
- 1999-12-17 AU AU16879/00A patent/AU1687900A/en not_active Abandoned
- 1999-12-17 JP JP2000590185A patent/JP3233158B2/en not_active Expired - Fee Related
- 1999-12-17 TW TW088122246A patent/TW442805B/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102176372A (en) * | 2010-12-08 | 2011-09-07 | 广东四会互感器厂有限公司 | Cylindrical dry type high-voltage capacitor core |
| CN104916438A (en) * | 2015-05-10 | 2015-09-16 | 长兴华强电子有限公司 | High temperature and high pressure safety capacitor |
| CN106847500A (en) * | 2015-12-05 | 2017-06-13 | 佛山市南海区欣源电子有限公司 | A kind of resonant capacitor of copper coin water cooling |
| CN111816446A (en) * | 2020-07-27 | 2020-10-23 | 无锡鑫聚电子科技有限公司 | Capacitor core easy to impregnate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW442805B (en) | 2001-06-23 |
| WO2000038204A1 (en) | 2000-06-29 |
| JP3233158B2 (en) | 2001-11-26 |
| AU1687900A (en) | 2000-07-12 |
| KR20010099917A (en) | 2001-11-09 |
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