CN111816446A - Capacitor core easy to impregnate - Google Patents
Capacitor core easy to impregnate Download PDFInfo
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- CN111816446A CN111816446A CN202010726838.4A CN202010726838A CN111816446A CN 111816446 A CN111816446 A CN 111816446A CN 202010726838 A CN202010726838 A CN 202010726838A CN 111816446 A CN111816446 A CN 111816446A
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- Prior art keywords
- layer
- conductive adhesive
- base film
- passageway
- adhesive layer
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- 239000003990 capacitor Substances 0.000 title claims abstract description 36
- 239000010410 layer Substances 0.000 claims abstract description 78
- 239000012790 adhesive layer Substances 0.000 claims abstract description 40
- 239000010408 film Substances 0.000 claims abstract description 32
- 238000005507 spraying Methods 0.000 claims abstract description 23
- 239000011104 metalized film Substances 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000010931 gold Substances 0.000 claims abstract description 17
- 229910052737 gold Inorganic materials 0.000 claims abstract description 17
- 238000002955 isolation Methods 0.000 claims abstract description 10
- 238000004804 winding Methods 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 abstract description 21
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 238000005470 impregnation Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000007598 dipping method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000012745 toughening agent Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Abstract
The invention relates to the technical field of capacitors, in particular to an easily-impregnated capacitor core. The metal core comprises a core body, wherein two end faces of the core body are respectively provided with a conductive adhesive layer and a metal spraying layer. The core body is formed by winding two metalized films, each metalized film comprises a base film, a plurality of supporting bodies are arranged on one side of each base film, and a gap is formed between every two adjacent supporting bodies; the other side of the base film is provided with a metallization layer. One end of the metallization layer is flush with the end face of the base film, and the other end of the metallization layer is provided with an isolation layer. The conductive adhesive layer is provided with a plurality of fourth channels, fifth channels and through holes which penetrate through the upper surface and the lower surface of the conductive adhesive layer. The support body is provided with a plurality of first channels, second channels and third channels. According to the capacitor core, the supporting body is plated on one side of the base film, the channel is formed in the supporting body, and the core is easily well impregnated in the vacuum impregnation process; the end face of the core body is coated with the conductive adhesive layer, and then the gold spraying layer is sprayed on the conductive adhesive layer, so that the contact loss is low.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to an easily-impregnated capacitor core.
Background
The metallized film capacitor is a capacitor made of a core formed by winding a metallized film, has higher energy storage density than other types of capacitors under the same volume, and is very suitable for manufacturing high-energy-storage-density capacitors. However, under high voltage, especially under ac high voltage, the capacitor core needs to be strictly vacuum-impregnated, and since the core of the metallized film capacitor adopts a very high compression factor, generally above 0.98, during the winding process, the pressure between the metallized films is large, the gap is small, good impregnation is difficult to achieve, and the base film of the metallized film is easy to be broken down under high field strength. At present conventional capacitor core, the spraying gold layer is directly sprayed on the end surface of the core, but the spraying gold layer has lower density and is granular in microcosmic state, the spraying gold layer is in point contact with the metallization layer, the combination effect is poor, the contact resistance is large, and when the capacitor works in a pulse state with high field intensity, the spraying gold layer is easy to fall off due to overhigh temperature caused by excessive heating.
Disclosure of Invention
The technical problem to be solved by the invention is to provide an easily-dipped capacitor core aiming at the technical defects, wherein a support body is plated on one side of a base film, a channel is arranged on the support body, a gap is arranged between the adjacent support bodies, and the core is easily subjected to a good dipping effect in the vacuum dipping process; the end face of the core body is coated with the conductive adhesive layer, and then the gold spraying layer is sprayed on the conductive adhesive layer, so that the contact resistance is low.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the utility model provides an easy impregnated capacitor core, includes the core, two terminal surfaces of core are provided with conductive adhesive layer respectively, the outside of two conductive adhesive layers is provided with respectively spouts the gold layer, it has first lead wire and second lead wire to weld respectively on two spouts the gold layer. The core is formed by two metallized films winding, the metallized film includes the base film, one side of base film is equidistant to be provided with a plurality of supporters, is provided with the clearance between the adjacent supporter, manyThe support bodies form a support layer; and a metallization layer is arranged on the other side of the base film. The width of the middle of the support body is large, and the width of the two ends of the support body is small, and the width of any position of the support body meets the condition that W is equal to W12kL, where W is the width of any position of the support, L is the distance from this position to the middle position of the support, W1The width of the middle position of the support body is k which is 0.017-0.035. The one end on metallization layer flushes with this terminal surface of base film, the other end on metallization layer sets up the isolation layer, the metallization layer is the linear increase from the one end that is close to the isolation layer to the one end thickness that flushes with the base film. The two metallized films are wound in such a manner that the metallized layers are oriented in the same direction in the thickness direction and the separator layers are oriented in opposite directions in the width direction to form a core. The conductive adhesive layer is provided with a plurality of fourth channels and fifth channels which penetrate through the upper surface and the lower surface of the conductive adhesive layer and are distributed in a radial mode, the fourth channels penetrate through the center and the outer side face of the conductive adhesive layer, the fifth channels are located between every two adjacent fourth channels, the length of each fifth channel is shorter than that of each fourth channel, and one end of each fifth channel is communicated with the outer side face of the conductive adhesive layer; the fourth passageway is cut apart into a plurality of sectorial units that are with conductive adhesive layer, the position that is close to the central angle of sectorial unit is provided with the through-hole.
Further optimize this technical scheme, be provided with a plurality of first passageways that are parallel with base film length direction on the supporter, first passageway runs through the both sides of supporter, be provided with the second passageway parallel rather than the side on the supporter, be provided with the third passageway perpendicular with base film length direction on the supporter, the both ends of supporter are run through to the third passageway.
The technical scheme is further optimized, the conductive adhesive layer is prepared by coating and drying conductive adhesive, the substrate of the conductive adhesive is acrylate resin, and the filler of the conductive adhesive is one or more of aluminum powder, zinc powder or copper-plated silver powder. The conductive adhesive also comprises a solvent, a reactive diluent, a cross-linking agent, a toughening agent and other components.
Further optimizing the technical scheme, the gold spraying layer is made of zinc and is prepared by spraying zinc powder or zinc wires through flame.
Further optimize this technical scheme, the material of supporter is carborundum, silica, aluminium oxide or titanium dioxide.
Further optimizing the technical scheme, the isolation layer is made of silicon dioxide.
Compared with the prior art, the invention has the following advantages: 1. the core is easy to obtain good dipping effect in the vacuum dipping process, and the metalized film is not easy to be punctured; 2. the end face of the core body is coated with the conductive adhesive layer, and then the gold spraying layer is sprayed on the conductive adhesive layer, so that the contact resistance is low, and the large-current resistance is high.
Drawings
FIG. 1 is a schematic diagram of a capacitor core that is easily impregnated.
FIG. 2 is a schematic diagram of a conductive adhesive layer structure of an easily impregnated capacitor core.
Fig. 3 is an isometric view of a metallized membrane.
Fig. 4 is a schematic structural diagram of the support layer.
Fig. 5 is a schematic view of the positions of two metallized films when they are wound.
In the figure: 1. a base film; 2. a support body; 21. a first channel; 22. a second channel; 23. a third channel; 3. a metallization layer; 4. an isolation layer; 5. a gap; 6. a core body; 7. a conductive adhesive layer; 71. a fourth channel; 72. a fifth channel; 73. a through hole; 8. spraying a gold layer; 9. a first lead; 10. a second lead.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
The specific implementation mode is as follows: as shown in the figures 1-5 of the drawings,the utility model provides an easy impregnated capacitor core, includes core 6, two terminal surfaces of core 6 are provided with conductive adhesive layer 7 respectively, the outside of two conductive adhesive layers 7 is provided with respectively spouts golden layer 8, it has first lead 9 and second lead 10 to weld respectively on two gold layer 8 to spout. The core body 6 is formed by winding two metalized films, wherein each metalized film comprises a base film 1, each base film 1 is a polypropylene film or a polyvinylidene fluoride film, a plurality of supporting bodies 2 are arranged on one side of each base film 1 at equal intervals, and a gap 5 is formed between every two adjacent supporting bodies 2, so that impregnant can easily enter between every two adjacent metalized films, and the supporting bodies 2 form a supporting layer; the other side of the base film 1 is provided with a metallization layer 3. The width of the middle of the supporting body 2 is large, and the width of the two ends is small, and the width of any position of the supporting body 2 meets the requirement that W is equal to W12kL, where W is the width of the support body 2 at any position, L is the distance from this position to the middle position of the support body 2, W1The width k of the middle position of the support body 2 is 0.017-0.035, and the structure enables the impregnant to easily flow from two sides of the metallized film to the middle. The one end of metallization layer 3 flushes with this terminal surface of base film 1, the other end of metallization layer 3 sets up isolation layer 4, and isolation layer 4 is insulating material, metallization layer 3 is the linear increase from the one end that is close to isolation layer 4 to the one end thickness that flushes with base film 1, and this kind of structure makes along with the current density's increase metallization layer 3 water conservancy diversion ability strengthens gradually. The two metallized films are wound so that the metallized layers 3 face the same direction in the thickness direction and the separator 4 faces the opposite direction in the width direction to form the core 6. The conductive adhesive layer 7 is provided with a plurality of fourth channels 71 and fifth channels 72 which penetrate through the upper surface and the lower surface of the conductive adhesive layer 7 and are distributed in a radial shape, the fourth channels 71 penetrate through the center and the outer side surface of the conductive adhesive layer 7, the fifth channels 72 are positioned between every two adjacent fourth channels 71, the length of each fifth channel 72 is shorter than that of each fourth channel 71, and one end of each fifth channel 72 is communicated with the outer side surface of the conductive adhesive layer 7; the fourth channel 71 divides the conductive adhesive layer 7 into a plurality of fan-shaped units, and through holes 73 are formed in the positions, close to the central corners, of the fan-shaped units. The density of the conductive adhesive layer 7 is higher, the impregnant and the gas can not pass through the part with the conductive adhesive,during evacuation, the gas in the core 6 can be exhausted through the fourth channel 71, the fifth channel 72 and the through hole 73 and the metal-sprayed layer 8 with lower density, and during immersion, the impregnant can enter between each layer of the metallized film in the core 6 through the metal-sprayed layer 8, the fourth channel 71, the fifth channel 72 and the through hole 73.
The supporting body 2 is provided with a plurality of first channels 21 parallel to the length direction of the base film 1, the first channels 21 penetrate through two sides of the supporting body 2, the supporting body 2 is provided with second channels 22 parallel to the side edges of the supporting body, the supporting body 2 is provided with third channels 23 perpendicular to the length direction of the base film 1, and the third channels 23 penetrate through two ends of the supporting body 2. The impregnating agent can enter the core 6 sufficiently through the first, second and third channels 21, 22, 23 so that the space between each layer of metallized film is filled with the impregnating agent.
The conductive adhesive layer 7 is prepared by coating and drying conductive adhesive, the matrix of the conductive adhesive is acrylate resin, and the filler of the conductive adhesive is one or more of aluminum powder, zinc powder or copper-plated silver powder, so that the cost is low. The conductive adhesive also comprises a solvent, a reactive diluent, a cross-linking agent, a toughening agent and other components. Because the conductive adhesive has good fluidity and adhesiveness, the conductive adhesive layer 7 is combined with the metallization layer 3 more fully and tightly, and the contact resistance is lower. The capacitor core metal spraying layer in the prior art is directly sprayed on the end face of the core body 6, the metal spraying layer is granular in microcosmic state, is in point contact with the metallization layer, is poor in combination effect and large in contact resistance, and the end face of the metallization layer cannot be in full contact with the metal spraying layer, so that the current of a non-contact part can only flow to the metal spraying layer along a nearby contact part, and the current of the part is increased and is easy to burn.
The gold-sprayed layer 8 is made of zinc and is prepared by spraying zinc powder or zinc wires through flame. The material of the gold-sprayed layer 8 can also be zinc-tin alloy.
The support body 2 is made of silicon carbide, silicon dioxide, aluminum oxide or titanium dioxide, and has excellent electrical insulation and stability. Silicon carbide is preferred because of its better thermal conductivity.
The isolation layer 4 is made of silicon dioxide and has excellent insulating property and high-temperature resistance.
During vacuum impregnation, as shown in fig. 1 to 5, the air in the core body 6 can escape outwards along the first channel 21, the second channel 22 and the third channel 23 during vacuum pumping, then enter the gold-sprayed layer 8 through the fourth channel 71, the fifth channel 72 or the through hole 73, and finally escape through the pores of the gold-sprayed layer 8; during dipping, the dipping agent enters the fourth channel 71, the fifth channel 72 or the through hole 73 through the pores of the gold-sprayed layer 8, and then enters between the metalized films in the core body 6 along the first channel 21, the second channel 22 or the third channel 23, so that the dipping effect is good. In practical production, in order to obtain a good impregnation effect, the area of the fourth channel 71, the fifth channel 72 and the through hole 73 accounts for more than 30% of the total area of the conductive adhesive layer 7. The capacitor core is made into a cylindrical sample with phi 50 x 60 mm, a paraffin and PO oil mixture is used as an impregnant, the capacitor core is dried for 5 hours at the temperature of 85 +/-5 ℃ and the vacuum degree of 2.5Pa, then the core is impregnated for 60 minutes by the impregnant with the temperature of 85 +/-5 ℃, and the core is dissected, so that the core in the prior art is found to contain more island-shaped non-impregnated areas, but the core in the invention is not found to have non-impregnated areas, and the impregnation effect is better.
The heating of the capacitor is mainly influenced by the dielectric loss value of the capacitor, the dielectric loss mainly comprises polarization loss, metal loss and contact loss of a medium, the contact loss is main loss in a pulse power state, the contact loss mainly occurs at a joint part of the metal spraying layer at the end part and the metallization layer, the contact loss is large, the capacity of the capacitor for passing large current and charging and discharging is poor, and after the capacitor is subjected to large-current impact for many times, the metal spraying layer of the capacitor is separated from the thin film metallization layer, so that the capacitor fails. In the core of the invention, the conductive adhesive layer 7 is combined with the metallization layer 3 more fully and tightly, the contact resistance is lower, and although the density of the gold spraying layer 8 is poorer, the contact area of the gold spraying layer 8 and the conductive adhesive layer 7 is larger than the total area of the end face of the metallization layer 3, so the contact loss is smaller. Tests show that the capacitor core of the invention can bear more than 26% of the maximum current higher than the core in the prior art.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (6)
1. An easily impregnated capacitor core, comprising: the core comprises a core body (6), wherein two end faces of the core body (6) are respectively provided with a conductive adhesive layer (7), the outer sides of the two conductive adhesive layers (7) are respectively provided with a gold spraying layer (8), and a first lead (9) and a second lead (10) are respectively welded on the two gold spraying layers (8);
the core body (6) is formed by winding two metalized films, each metalized film comprises a base film (1), a plurality of supporting bodies (2) are arranged on one side of each base film (1) at equal intervals, each supporting body (2) forms a supporting layer, and a metalized layer (3) is arranged on the other side of each base film (1); the width of the middle of the support body (2) is large, and the width of the two ends of the support body is small, and the width of any position of the support body (2) meets the requirement that W is equal to W1-2kL, where W is the width of any position of the support body (2), L is the distance from this position to the middle position of the support body (2), W1The width of the middle position of the support body (2) is k which is 0.017-0.035; one end of the metallized layer (3) is flush with the end face of the base film (1), the other end of the metallized layer (3) is provided with an isolating layer (4), and the thickness of the metallized layer (3) is linearly increased from one end close to the isolating layer (4) to one end flush with the base film (1);
the utility model discloses a fan-shaped cell, including conductive adhesive layer (7), conductive adhesive layer (7) are provided with a plurality of fourth passageway (71) and the fifth passageway (72) that run through its upper and lower surface and be radial distribution, center and the lateral surface that conductive adhesive layer (7) were run through in fourth passageway (71), fifth passageway (72) are located between two adjacent fourth passageways (71), the length of fifth passageway (72) is shorter than the length of fourth passageway (71) and its one end communicates with the lateral surface of conductive adhesive layer (7), fourth passageway (71) are cut apart conductive adhesive layer (7) into a plurality of fan-shaped units, the position that is close to the central angle of fan-shaped unit is provided with through-hole (73).
2. An easily impregnable capacitor core according to claim 1, wherein: be provided with a plurality of first passageways (21) parallel with base film (1) length direction on supporter (2), first passageway (21) run through the both sides of supporter (2), be provided with second passageway (22) parallel rather than the side on supporter (2), be provided with third passageway (23) perpendicular with base film (1) length direction on supporter (2), third passageway (23) run through the both ends of supporter (2).
3. An easily impregnable capacitor core according to claim 1, wherein: the conductive adhesive layer (7) is prepared by coating and drying conductive adhesive, the matrix of the conductive adhesive is acrylate resin, and the filler of the conductive adhesive is one or more of aluminum powder, zinc powder or copper-plated silver powder.
4. An easily impregnable capacitor core according to claim 1, wherein: the gold spraying layer (8) is made of zinc.
5. An easily impregnable capacitor core according to claim 1, wherein: the support body (2) is made of silicon carbide, silicon dioxide, aluminum oxide or titanium dioxide.
6. An easily impregnable capacitor core according to claim 1, wherein: the isolation layer (4) is made of silicon dioxide.
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| CN202010726838.4A CN111816446B (en) | 2020-07-27 | 2020-07-27 | Capacitor core easy to impregnate |
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| CN202010726838.4A CN111816446B (en) | 2020-07-27 | 2020-07-27 | Capacitor core easy to impregnate |
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| CN111816446B CN111816446B (en) | 2021-08-24 |
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| CN210378765U (en) * | 2019-08-08 | 2020-04-21 | 安徽省宁国市海伟电子有限公司 | Special metallized film for dipping capacitor |
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